System Lens Driver Series for Digital Still Cameras / Single-lens Reflex Cameras
7ch System Lens Drivers for
Digital Still Cameras / Single-lens Reflex Cameras
BD6757KN, BD6889GU
No.09014EAT04
●Description
BD6757KN and BD6889GU motor drivers provide 6 Full-ON Drive H-bridge channels and 1 Linear Constant-Current Drive
H-bridge channel. Stepping motors can be used for the auto focus, zoom, and iris, making it possible to configure a
sophisticated, high precision lens drive system. ROHM’s motor drivers are both compact, multifunctional, and enable
advanced features such as lens barrier and anti shock.
2) DMOS output allowing a range power supply: 2.0V to 8.0V (BD6757KN)
3) Low ON-Resistance Power MOS output:
Full-ON Drive block with 1.3Ω Typ. and Linear Constant-Current Drive block with 0.9Ω Typ. (BD6757KN, BD6889GU)
4) Built-in two digital NPN transistor circuits for photo-interrupter waveform shaping:
Input-dividing type with output pull-up resistance (BD6757KN)
5) Built-in four digital NPN transistor circuits for photo-interrupter waveform shaping:
Input-dividing type with output pull-up resistance (BD6889GU)
6) Built-in four digital PNP transistor circuits for photo-interrupter waveform shaping:
Input-dividing type with output pull-down resistance (BD6889GU)
7) Built-in voltage-regulator circuit for photo-interrupter (BD6889GU)
8) Built-in two-step output current setting switch for the Linear Constant-Current Drive block (BD6757KN)
9) 0.9V±2% high-precision reference voltage output
10) Constant-Current Drive block features phase compensation capacitor-free design
11) Built-in ±3% high-precision Linear Constant-Current Driver
12) Built-in charge pump circuit for the DMOS gate voltage drive(BD6757KN)
13) UVLO (Under Voltage Lockout Protection) function
14) Built-in TSD (Thermal Shut Down) circuit
15) Standby current consumption: 0μA (Typ.)
●Absolute Maximum Ratings
Parameter Symbol
BD6757KN BD6889GU
Limit
Unit
Power supply voltage VCC -0.5 to +7.0 -0.5 to +7.0 V
Motor power supply voltage VM -0.5 to +10.0 -0.5 to +7.0 V
Charge pump voltage VG 15.0 None V
Control input voltage VIN -0.5 to VCC+0.5 -0.5 to VCC+0.5 V
Power dissipation Pd 950
Operating temperature range Topr -25 to +75 -25 to +85 °C
1
※
980
2
※
mW
Junction temperature Tjmax +150 +150 °C
Storage temperature range Tstg -55 to +150 -55 to +150 °C
H-bridge output current Iout -800 to +800
※1 Reduced by 7.6mW/°C over 25°C, when mounted on a glass epoxy board (70mm 70mm 1.6mm).
※2 Reduced by 7.84mW/°C over 25°C, when mounted on a glass epoxy board (70mm 70mm 1.6mm).
※3 Must not exceed Pd, ASO, or Tjmax of 150°C.
3
※
-800 to +800
3
※
mA/ch
●Operating Conditions (Ta=-25 to +75°C(BD6757KN), -25 to +85°C(BD6889GU))
Parameter Symbol
BD6757KN
Limit
BD6889GU
Unit
Power supply voltage VCC 2.5 to 5.5 2.5 to 5.7 V
Motor power supply voltage VM 2.5 to 8.0 2.5 to 5.7 V
Control input voltage VIN 0 to VCC 0 to VCC V
H-bridge output current Iout -500 to +500
1 IN7B Control input pin ch7 B 27 IN2A Control input pin ch2 A
2 VM4 Motor power supply pin ch7 28 IN2B Control input pin ch2 B
3 IN7A Control input pin ch7 A 29 IN3A Control input pin ch3 A
4 GND Ground Pin 30 VM2 Motor power supply pin ch3 and ch4
5 VREF Reference voltage output pin 31 CP1 Charge pump capacitor connection pin 1
6 VLIMH Output current setting pin 1 ch7 32 CP2 Charge pump capacitor connection pin 2
7 VLIML Output current setting pin 2 ch7 33 CP3 Charge pump capacitor connection pin 3
8 LIMSW Output current setting selection pin ch7 34 CP4 Charge pump capacitor connection pin 4
9 VCC Power supply pin 35 VG Charge pump output pin
10 VM1 Motor power supply pin ch1 and ch2 36 VM3 Motor power supply pin ch5 and ch6
11 PS Power-saving pin 37 IN3B Control input pin ch3 B
12 IN6B Control input pin ch6 B 38 IN4A Control input pin ch4 A
13 IN6A Control input pin ch6 A 39 IN4B Control input pin ch4 B
14 IN5B Control input pin ch5 B 40 SI1 Digital transistor input pin 1
15 IN5A Control input pin ch5 A 41 SI2 Digital transistor input pin 2
16 OUT1A H-bridge output pin ch1 A 42 OUT5A H-bridge output pin ch5 A
17 OUT1B H-bridge output pin ch1 B 43 OUT5B H-bridge output pin ch5 B
18 OUT2A H-bridge output pin ch2 A 44 PGND2 Motor ground pin ch5 and ch6
19 OUT2B H-bridge output pin ch2 B 45 OUT6A H-bridge output pin ch6 A
20 PGND1 Motor ground pin ch1 to ch4 46 OUT6B H-bridge output pin ch6 B
21 OUT3B H-bridge output pin ch3 B 47 OUT7A H-bridge output pin ch7 A
22 OUT3A H-bridge output pin ch3 A 48 RNF Resistance connection pin for output current detection ch7
23 OUT4B H-bridge output pin ch4 B 49 OUT7B H-bridge output pin ch7 B
24 OUT4A H-bridge output pin ch4 A 50 SENSE Output current detection pin ch7
25 IN1A Control input pin ch1 A 51 SO2 Digital transistor output pin 2
26 IN1B Control input pin ch1 B 52 SO1 Digital transistor output pin 1
A1 N.C. - E1 RNF Resistance connection pin for output current detection ch7
A2 OUT6A H-bridge output pin ch6 A E2DSEL1 Selection pin for transistor output 1
A3 OUT6B H-bridge output pin ch6 B E3IN1A Control input pin ch1 A
A4 VM3 Motor power supply pin ch5 and ch6 E4IN1B Control input pin ch1 B
A5 PGND3 Motor ground pin ch5 and ch6 E5IN4B Control input pin ch4 B
A6 OUT5B H-bridge output pin ch5 B E6IN4A Control input pin ch4 A
A7 OUT5A H-bridge output pin ch5 A E7SO3N NPN transistor output pin 3
A8 N.C. - E8PGND2 Motor ground pin ch3 and ch4
B1 F1 SENSE Output current detection pin ch7
B2 DSW Enable input pin for transistor F2 VLIM
Output current setting ch7
B3 IN6A Control input pin ch6 A F3 IN2A Control input pin ch2 A
B4 IN6B Control input pin ch6 B F4 SI1 Digital transistor input pin 1
B5 SO4P PNP transistor output pin 4 F5 SI2 Digital transistor input pin 2
B6 SO4N NPN transistor output pin 4 F6 IN3A Control input pin ch3 A
B7 REG Regulator output pin for PI F7 IN3B Control input pin ch3 B
B8 OUT4A H-bridge output pin ch4 A F8 OUT3B H-bridge output pin ch3 B
C1 OUT7A H-bridge output pin ch7 A G1OUT7B H-bridge output pin ch7 B
C2 SW Regulator input pin for PI G2GND Ground pin
C3 DSEL2 Selection pin for transistor output 2 G3IN2B Control input pin ch2 B
C4 IN7A Control input pin ch7 A G4SO1P PNP transistor output pin 1
C5 SI4 Digital transistor input pin 4 G5SO1N NPN transistor output pin 1
C6 IN5A Control input pin ch5 A G6SO2P PNP transistor output pin 2
C7 PS Power-saving pin G7SO2N NPN transistor output pin 2
C8 OUT4B H-bridge output pin ch4 B G8OUT3A H-bridge output pin ch3 A
D1 VM4 Motor power supply pin ch7 H1N.C. D2 VCC Power supply pin H2OUT1A H-bridge output pin ch1 A
D3 VREF Reference voltage output pin H3OUT1B H-bridge output pin ch1 B
D4 IN7B Control input pin ch7 B H4PGND1 Motor ground pin ch1 and ch2
D5 IN5B Control input pin ch5 B H5VM1 Motor power supply pin ch1 and ch2
D6 SI3 Digital transistor input pin 3 H6OUT2B H-bridge output pin ch2 B
D7 SO3P PNP transistor output pin 3 H7OUT2A H-bridge output pin ch2 A
D8 VM2 Motor power supply pin ch3 and ch4 H8N.C. -
1) Power-saving function
When Low-level voltage is applied to PS pin, the IC will be turned off internally and the circuit current will be 0μA (Typ.).
During operating mode, PS pin should be High-level. (See the Electrical Characteristics; p.2/16 and p.3/16)
2) Motor Control input
(1) INxA and INxB pins
These pins are used to program and control the motor drive modes. The Full-ON drivers and the Linear Constant-Current
driver use IN/IN and EN/IN input modes, respectively. (See the Electrical Characteristics; p.2/16 and p.3/16, and I/O Truth
Table; p.10/16)
3) H-bridge
The 7-channel H-bridges can be controlled independently. For this reason, it is possible to drive the H-bridges
simultaneously, as long as the package thermal tolerances are not exceeded.
The H-bridge output transistors of the BD6757KN and BD6889GU consist of Power DMOS, with the charge pump step-up
power supply VG, and Power CMOS, with the motor power supply VM, respectively. The total H-bridge ON-Resistance on
the high and low sides varies with the VG and VM voltages, respectively. The system must be designed so that the
maximum H-bridge current for each channel is 800mA or below. (See the Operating Conditions; p.1/16)
4) Drive system of Linear Constant-Current H-bridge (BD6757KN: ch7 and BD6889GU: ch7)
BD6757KN (ch7) and BD6889GU (ch7) enable Linear Constant-Current Driving.
(1) Reference voltage output (with a tolerance of ±2%)
The VREF pin outputs 0.9V, based on the internal reference voltage. The output current of the Constant-Current Drive
block is controllable by connecting external resistance to the VREF pin of the IC and applying a voltage divided by the
resistor to the output current setting pins. (BD6757KN: VLIMH and VLIML pins, BD6889GU: VLIM pin) It is
recommended to set the external resistance to 1kΩ or above in consideration of the current capacity of the VREF pin,
and 20kΩ or below in order to minimize the fluctuation of the set value caused by the base current of the internal
transistor of the IC.
(2) Output current settings and setting changes (BD6757KN)
When the Low-level control voltage is applied to the LIMSW pin, the value on the VLIMH pin will be used as an output
current set value to control the output current. When the High-level control voltage is applied to the LIMSW pin, the
value on the VLIML pin will be used as an output current set value to control the output current. (See the Electrical
Characteristics; P.2/16)
(3) Output current detection and current settings
By connecting external resistor (0.1Ω to 5.0Ω) to the RNF pin of the IC, the motor drive current will be converted into
voltage in order to be detected. The output current is kept constant by shorting the RNF and SENSE pins and
comparing the voltage with the VLIMH or VLIML voltage (VLIM voltage in the case of the BD6889GU). To perform
output current settings more precisely, trim the external RNF resistance if needed, and supply a precise voltage externally to
the VLIMH or VLIML pin of the IC (VLIM pin in the case of the BD6889GU). In that case, open the VREF pin.
Output current valueIout[A] =
VLIMH[V] or VLIML[V]
RNF[Ω]
VLIM[V]
RNF[Ω]
(BD6889GU)
Select VLIMH when LIMSW is Low-level
Select VLIML when LIMSW is High-level
The output current is 400mA3% if 0.2V is applied to the VLIMH or VLIML pin (VLIM pin in the case of the
BD6889GU) and a 0.5Ω resistor is connected externally to the RNF pin.
If the VLIMH and VLIML pins (VLIM pin in the case of the BD6889GU) are shorted to the VCC pin (or the same voltage
level as the VCC is applied) and the SENSE and RNF pins are shorted to the ground, this channel can be used as a
Full-ON Drive H-bridge like the other six channels.
5) Charge pump (BD6757KN)
Each output H-bridge of the BD6757KN on the high and low sides consists of Nch DMOS. Therefore, the gate voltage VG
should be higher than the VM voltage to drive the Nch DMOS on the high side.
The BD6757KN has a built-in charge pump circuit that generates VG voltage by connecting an external capacitor (0.01μF
to 0.1μF).
If a 0.1μF capacitor is connected between: CP1 and CP2, CP3 and CP4, VG and GND
Then, VG pin output voltage will be: VM1 + (VCC 2)
If a 0.1μF capacitor is connected between: CP1 and CP2, VG and GND CP4 and VG pins are shorted, and CP3 pin is open
Then, VG pin output voltage will be: VM1 + VCC
The VM1 to VM4 respectively can be set to voltages different to one another. In order to ensure better performance, the
voltage differential between VG and VM must be 4.5V or higher, and the VG voltage must not exceed the absolute
maximum rating of 15V.
6) Digital transistor for photo-interrupter waveform shaping (BD6757KN and BD6889GU)
The BD6757KN, and BD6889GU build in two digital NPN transistor circuits, and eight digital NPN and PNP transistor
circuits for photo-interrupter waveform shaping, respectively. The sensor signal, for lens position detection, is reshaped
and output to the DSP. The input (SIx pin) is a dividing resistance type, and provided with NPN output (SOxN pin) pull-up
resistor and PNP output (SOxP pin) pull-down resistor. This is so that VCC, and GND voltage will be NPN output, and
PNP output, respectively, when the input is open. In the case of the BD6889GU, DSW, DSEL1, and DSEL2 pins can
control the switching of NPN and PNP transistor. The inputs are provided with input pull-down resistor. This is so that
GND voltage will be input, when these three pins are open. (See I/O Truth Table; P.12/16)
7) Voltage-regulator for photo-interrupter (BD6889GU)
The BD6889GU builds in voltage-regulator circuits for photo-interrupter. When High-level voltage is applied to SW pin,
the REG pin will be turned on. The input is provided with input pull-down resistor. This is so that REG pin will be turn off,
when the input is open.
●I/O Truth Table
BD6757KN and BD6889GU Full-ON Driver ch1 to ch6 I/O Truth Table
Drive mode
INPUT OUTPUT
INxA INxB OUTxA OUTxB
L L Z Z Standby
IN/IN
H L H L CW
L H L H CCW
H H L L Brake
L: Low, H: High, X: Don't care, Z: High impedance
At CW, current flows from OUTA to OUTB. At CCW, current flows from OUTB to OUTA.
BD6757KN and BD6889GU Linear Constant-Current Driver ch7 I/O Truth Table
Drive mode
INPUT OUTPUT
IN7A IN7B OUT7A OUT7B
L X Z Z Standby
EN/IN
H L H L CW
H H L H CCW
L: Low, H: High, X: Don't care, Z: High impedance
At CW, current flows from OUTA to OUTB. At CCW, current flows from OUTB to OUTA.
Iout: Current consumption of the VM pin on the drive channel
RON: Total ON-Resistance on the high and low drive channel
VM: Power supply voltage on the VM pin on the drive channel
VRNF: Voltage on the RNF pin on the drive channel
Rm: Resistance on the motor on the drive channel
While in operation, check that the junction temperature (Tjmax) of the IC will not be in excess of 150℃, in consideration
of formula (2), formula (3), the package power (Pd), and ambient temperature (Ta). If the junction temperature exceeds
150℃, the IC will not work as a properly. This can cause problems, such as parasitic oscillation and temperature leakage.
If the IC is used under such conditions, it will result in characteristic degradation and eventually fail. Be sure to keep the
junction temperature lower than 150℃.
2) Measurement Method of Junction Temperature
The junction temperature can be measured by the following method.
VIN
VIN
V
V
GND
GND
50μA
Fig.20 Tjmax Measurement Circuit Diagram
If the exact junction temperature is desired, it is necessary to measure the specific temperature characteristic of the
internal diode, of each IC.
●Notes for use
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when
use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.
2) Storage temperature range
As long as the IC is kept within this range, there should be no problems in the IC’s performance. Conversely, extreme
temperature changes may result in poor IC performance, even if the changes are within the above range.
3) Power supply pins and lines
None of the VM line for the H-bridges is internally connected to the VCC power supply line, which is only for the control
logic or analog circuit. Therefore, the VM and VCC lines can be driven at different voltages. Although these lines can be
connected to a common power supply, do not open the power supply pin but connect it to the power supply externally.
Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power
supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all
the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low
temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current
will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may
exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion
of a voltage clamp diode between the power supply and ground pins.
For this IC with several power supplies and a part consists of the CMOS block, it is possible that rush current may flow
instantaneously due to the internal powering sequence and delays, and to the unstable internal logic, respectively. Therefore,
give special consideration to power coupling capacitance, width of power and ground wirings, and routing of wiring.
Technical Note
By using the diode temperature characteristics of the control input pin, on a
channel that is not driven, the junction temperature X can be measured in a
pseudo manner.
The junction temperature X[℃] under certain conditions is expressed by formula
(4), provided that the temperature characteristic of the diode is -2 mV/℃
X[°C] = + 25[°C] ・・・・・・(4)
X: Junction temperature
a: The voltmeter V value at a junction temperature of 25℃ b: The voltmeter V value at a junction temperature of X℃
4) Ground pins and lines
Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND
at any time, regardless of whether it is a transient signal or not.
When using both small signal GND and large current MGND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and
voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6) Pin short and wrong direction assembly of the device
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins are
shorted together or are shorted to other circuit’s power lines.
7) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
8) ASO
When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO.
9) Thermal shutdown circuit
If the junction temperature (Tjmax) reaches 175°C, the TSD circuit will operate, and the coil output circuit of the motor will
open. There is a temperature hysteresis of approximately 20°C (BD6757KN Typ.) and 25°C (BD6889GU Typ.). The TSD
circuit is designed only to shut off the IC in order to prevent runaway thermal operation. It is not designed to protect the IC
or guarantee its operation. The performance of the IC’s characteristics is not guaranteed and it is recommended that the
device is replaced after the TSD is activated.
10) Testing on application board
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or
removing it from a jig or fixture, during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting and storing the IC.
11) Application example
The application circuit is recommended for use. Make sure to confirm the adequacy of the characteristics. When using
the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components
including static and transitional characteristics as well as dispersion of the IC.
12) Regarding input pin of the IC
This monolithic IC contains P
+
isolation and P substrate layers between adjacent elements to keep them isolated. P-N
junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example, the relation between each potential is as follows:
When GND > Pin A, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic diode and transistor.
Parasitic elements can occur inevitably in the structure of the IC. The operation of parasitic elements can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic elements
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
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Examples of application circuits, circuit constants and any other information contained herein
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