System Lens Driver Series for Digital Still Cameras / Single-lens Reflex Cameras
6ch System Lens Drivers
for Digital Still Cameras /
Single-lens Reflex Cameras
BD6373GW,BD6873KN,BD6753KV
No.09014EAT02
●Description
The BD6373GW motor driver provides 6 Full-ON Drive H-bridge channels. The BD6873KN motor driver provides 5 Full-ON
Drive H-bridge channels and 1 Linear Constant-Current Drive H-bridge channel, while the BD6753KV provides 4 Full-ON
Drive channels and 2 PWM Constant-Current Drive H-bridge channels.
Stepping motors can be used for auto focus, and either zoom or iris. A new drive type (lens barrier) is also available. Three types of drivers
for shutter are offered: a simple Full-ON type, a high-precision linear constant current type, or a high-efficiency PWM constant current type,
enabling selection of the ideal solution based on the application.
●Features
1) Subminiature 31PIN Wafer-level CSP (Chip Size Package): 2.6 x 2.6 x 0.85mm3 (BD6373GW)
2) DMOS output allowing a range power supply: 4.5V to 10.5V (BD6753KV; VM1), 2.0V to 10.5V (BD6753KV; VM2 to VM4)
3) Low ON-Resistance Power MOS output:
Full-ON Drive block with 1.2Ω Typ. (BD6373GW)
Full-ON Drive block with 1.2Ω Typ. and Linear Constant-Current Drive block with 1.0Ω Typ. (BD6873KN)
Full-ON Drive block with 1.2Ω Typ. and PWM Constant-Current Drive block with 1.2Ω Typ. (BD6753KV)
4) Serial interface 3-line bus control input (BD6753KV)
5) Built-in two-step output current setting switch for the Linear Constant-Current Drive block (BD6873KN)
6) Drive mode switching function
7) 1.2V±3% high-precision reference voltage output (BD6873KN)
8) Constant-Current Drive block features phase compensation capacitor-free design (BD6873KN)
9) Built-in ±3% high-precision Linear Constant-Current Driver (BD6873KN)
10) Built-in peak current control PWM Constant-Current Driver (BD6753KV)
11) Built-in charge pump circuit for the DMOS gate voltage drive (BD6753KV)
12) UVLO (Under Voltage Lockout Protection) function
13) Built-in TSD (Thermal Shut Down) circuit
14) Standby current consumption: 0μA Typ.
●Absolute Maximum Ratings
Parameter Symbol
BD6373GW BD6873KN BD6753KV
Limit
Unit
Power supply voltage VCC -0.5 to +6.5 0 to +7.0 -0.5 to +7.0 V
Motor power supply voltage VM -0.5 to +6.5 0 to +7.0 -0.5 to +12.5 V
Charge pump voltage VG - - 18.0 V
Control input voltage VIN -0.5 to VCC+0.5 0 to VCC -0.5 to VCC+0.5 V
Power dissipation Pd 940
1
※
950
2
※
112 5
3
※
mW
Operating temperature rangeTopr -25 to +85 -25 to +85 -25 to +75 °C
Junction temperature Tjmax +150 +150 +150 °C
Storage temperature range Tstg -55 to +150 -55 to +150 -55 to +150 °C
H-bridge output current Iout -800 to +800
※1 Reduced by 7.52mW/°C over 25°C, when mounted on a glass epoxy board (50mm x 58mm x 1.75mm; 8layers).
※2 Reduced by 7.6mW/°C over 25°C, when mounted on a glass epoxy board (70mm x 70mm x 1.6mm).
※3 Reduced by 9.0mW/°C over 25°C, when mounted on a glass epoxy board (70mm x 70mm x 1.6mm).
※4 Must not exceed Pd, ASO, or Tjmax of 150°C.
●Operating Conditions (Ta=-25 to +85°C(BD6373GW, BD6873KN), -25 to +75°C(BD6753KV))
Parameter Symbol
BD6373GW BD6873KN BD6753KV
Limit
Power supply voltage VCC 2.5 to 5.5 2.5 to 5.5 2.7 to 5.5 V
Motor power supply voltage VM 2.5 to 5.5 2.5 to 5.5
4.5 to 10.5 (VM1)
2.0 to 10.5 (VM2 to VM4)
Control input voltage VIN 0 to VCC 0 to VCC 0 to VCC V
Output current control input
voltage range
PWM signal input frequency FPWM - - 0 to 0.1 MHz
H-bridge output current Iout -500 to +500
Overall
Circuit current ICC - 1.0 1.9 mA no signal and no load
Control input (IN=ENABLExx, INPUTx, and BRAKEx)
High level input voltage VINH 2.0 - VCC V
Low level input voltage VINL 0 - 0.7 V
High level input current IINH 15 30 60 μA VINH=3V
Low level input current IINL -1 0 - μA VINL=0V
UVLO
UVLO voltage VUVLO 1.6 - 2.4 V
Full-ON Drive block (ch1 to ch6)
Output ON-Resistance 1 RON1 - 1.2 1.5 Ω
Output ON-Resistance 2 RON2 - 1.5 2.0 Ω
Io=±400mA on high and low sides In total
(VM=5V)
Io=±400mA on high and low sides In total
(VM=3V)
Turn on time ton - 0.55 1.95 μs RL=20Ω
Turn off time toff - 0.08 0.5 μs RL=20Ω
Rise time tr 0.1 0.15 1.0 μs RL=20Ω
Fall time tf - 0.03 0.2 μs RL=20Ω
Circuit current ICC - 1.2 2.3 mA PS=VCC with no signal and no load
Power-saving (PS)
High level input voltage VPSH 2.0 - - V
Low level input voltage VPSL - - 0.7 V
High level input current IPSH 15 30 60 μA VPS=3V
Low level input current IPSL -1 0 - μA VPS=0V
Control input (IN=IN1A to IN5B, SEL1 to 3, BRK1, EN1, IN6, and VLIMS)
High level input voltage VINH 2.0 - - V
Low level input voltage VINL - - 0.7 V
High level input current IINH 15 30 60 μA VINH=3V
Low level input current IINL -1 0 - μA VINL=0V
Pull-down resistance RIN 50 100 200 kΩ
UVLO
UVLO voltage VUVLO 1.6 - 2.4 V
Full-ON Drive block (ch1 to ch5)
Output ON-Resistance RON - 1.2 1.5 ΩIo=±400mA on high and low sides In total
Linear Constant-Current Drive block (ch6)
Output ON-Resistance RON - 1.0 1.25 ΩIo=±400mA on high and low sides in total
VREF output voltage VREF 1.16 1.20 1.24 V Iout=0~1mA
Output limit voltage VOL 194 200 206 mV RNF=0.5Ω, VLIM=0.2V
Circuit current ICC - 2.2 3.0 mAPS=VCC with no signal; CRx open
Power-saving (PS)
High-level input voltage VPSH 2.0 - - V
Low-level input voltage VPSL - - 0.7 V
High-level input current IPSH 25 50 100 μA VPSH=3.3V
Low-level input current IPSL -1 0 - μA VPSL=0V
Control input (IN=STROBE, CLK, DATA, and PWM1 to 6)
High-level input voltage VINH 2.0 - - V
Low-level input voltage VINL - - 0.7 V
High-level input current IINH 16.5 33 66 μA VINH=3.3V
Low-level input current IINL -1 0 - μA VINL=0V
Pull-down resistance RIN 50 100 200 kΩ
Charge pump
Charge pump voltage VCP 16 16.5 - V
UVLO
UVLO voltage VUVLO 1.6 - 2.5 V
Full-ON Drive block (ch1 to ch4)
Output ON-Resistance RON - 1.2 1.5 Ω
PWM Linear Constant-Current Drive block (ch5 and ch6)
Output ON-Resistance RON - 1.2 1.5 Ω
VLIM pin input current IVLIM -1 -0.2 - μA VLIMx=0V, SENSEx=0.5V
SENSE pin input current ISENSE -1 -0.2 - μA VLIMx=0.5V, SENSEx=0V
Output limit voltage VOL 485 500 515 mVVLIMx=500mV
CR clamp voltage VCR 0.8 0.9 1.0 V R=10kΩ
CR switching high voltage VCRH 0.72 0.80 0.88 V
CR switching low voltage VCRL 0.36 0.40 0.44 V
Minimum ON time TMINON 0.1 0.5 1.0 μs C=470pF, R=10kΩ
Constant voltage power supply
VREF output voltage VREF 0.81 0.90 0.99 V Iout=0~1mA
ICCST - 0 10 μA PS=0V
Min. Typ. Max.
Limit
UnitConditions
Io=±400mA, VG=16.5V
on high and low sides in total
Io=±400mA, VG=16.5V
on high and low sides in total
1 IN2A Control input pin ch2 A 25 VLIML Output current setting pin 2 ch6
2 IN2B Control input pin ch2 B 26 VLIMS Output current selection pin ch6
3 SEL1 Input mode selection pin ch1 and ch227 OUT6AH-bridge output pin ch6 A
4 IN3A Control input pin ch3 A 28 VM4 Motor power supply pin ch6
5 IN3B Control input pin ch3 B 29 RNF Resistance connection pin for output current detection ch6
6 VCC Power supply pin 30 SENSEOutput current detection pin ch6
7 GND Ground pin 31 OUT6BH-bridge output pin ch6 B
8 IN4A Control input pin ch4 A 32 OUT5AH-bridge output pin ch5 A
9 IN4B Control input pin ch4 B 33 PGND3Motor ground pin ch5
10 SEL2 Input mode selection pin ch3 and ch434 VM3 Motor power supply pin ch5
11 IN5A Control input pin ch5 A 35 OUT5BH-bridge output pin ch5 B
12 IN5B Control input pin ch5 B 36 EN1 Control input pin ch6 ENABLE
13 SEL3 Input mode selection pin ch5 37 IN6 Control input pin ch6 INPUT
14 BRK1 Control input pin ch5 BRAKE 38 PS Power-saving pin
15 OUT3A H-bridge output pin ch3 A 39 OUT1AH-bridge output pin ch1 A
16 OUT3B H-bridge output pin ch3 B 40 OUT1BH-bridge output pin ch1 B
17 VM2 Motor power supply pin ch3 and ch4 41 VM1 Motor power supply pin ch1 and ch2
18 N.C. - 42 N.C. 19 N.C. - 43 N.C. 20 PGND2 Motor ground pin ch3 and ch4 44 PGND1 Motor ground pin ch1 and ch2
21 OUT4A H-bridge output pin ch4 A 45 OUT2AH-bridge output pin ch2 A
22 OUT4B H-bridge output pin ch4 B 46 OUT2BH-bridge output pin ch2 B
23 VREF Reference voltage output pin 47 IN1A Control input pin ch1 A
24 VLIMH Output current setting pin 1 ch6 48 IN1B Control input pin ch1 B
9 VCC Power supply pin 33 DATA Serial data input pin
10 PWM3 PWM control input pin ch3 34 CR2 CR timer setting element connection pin ch6
11 PWM4 PWM control input pin ch4 35 VLIM6 Output current setting pin ch6
12 PWM5 PWM control input pin ch5 36 VM4 Motor power supply pin ch6
13 OUT3A H-bridge output pin ch3 A 37 OUT6AH-bridge output pin ch6 A
14 RNF2 Motor ground pin ch3 and ch4 38 SENSE4 Output current detection pin ch6
15 OUT3B H-bridge output pin ch3 B 39 RNF4 Resistance connection pin for output current detection ch6
16 VM2 Motor power supply pin ch3 and ch4 40 OUT6BH-bridge output pin ch6 B
17 VM2 Motor power supply pin ch3 and ch4 41 OUT1AH-bridge output pin ch1 A
18 OUT4A H-bridge output pin ch4 A 42 RNF1 Motor ground pin ch1 and ch2
19 RNF2 Motor ground pin ch3 and 4 43 OUT1BH-bridge output pin ch1 B
20 OUT4B H-bridge output pin ch4 B 44 VM1 Motor power supply pin ch1 and ch2
21 OUT5A H-bridge output pin ch5 A 45 VM1 Motor power supply pin ch1 and ch2
22 RNF3 Resistance connection pin for output current detection ch5 46 OUT2AH-bridge output pin ch2 A
23 SENSE3 Output current detection pin ch5 47 RNF1 Motor ground pin ch1 and ch2
24 OUT5B H-bridge output pin ch5 B 48 OUT2BH-bridge output pin ch2 B
●Application Circuit Diagram and Function Explanation
Bypass filter Capacitor for
power supply input. (p.14/16)
1~100uF
Motor control input
(p.8/16)
TSD & UVLO
C2
ENABLE12
INPUT1
INPUT2
D2
E3
Logic12
Level Shift
&
Pre Driver
Motor control input
(p.8/16)
D3
Motor control input
(p.8/16)
ENABLE34
INPUT3
INPUT4
B3
B4
Logic34
Level Shift
&
Pre Driver
Motor control input
brake function (p.8/16)
H : Brake
Motor control input
(p.8/16)
Motor control input
brake function (p.8/16)
H : Brake
INPUT5
BRAKE5
INPUT6
BRAKE6
C5
D4
E4
D5
Logic5
Logic6
Level Shift
&
Pre Driver
Fig.18 BD6373GW Application Circuit Diagram
1) Power-saving function
When Low-level voltage is applied to PS pin, the IC will be turned off internally and the circuit current will be 0μA (Typ.).
During operating mode, PS pin should be High-level. (See the Electrical Characteristics; p.2/16)
2) Motor Control input
(1) ENABLExx and INPUTx pins (BD6373GW), INxA, INxB, EN1 and IN6 pins (BD6873KN), and PWMx pins (BD6753KV)
These pins are used to program and control the motor drive modes. (See the Electrical Characteristics; p.2/16 and
p.3/16 and I/O Truth Table; p.12/16 and p.13/16)
(2) SELx pins (BD6873KN)
When the Low-level voltage is applied to the SELx pins, the I/O logic can be set to EN/IN mode. However, when the
High-level voltage is applied, the I/O logic can be set to IN/IN mode. The same selection made with the BD6873KN's
SELx pin can be made for the BD6753KV, using serial control. (See the Electrical Characteristics; p.2/16 and p.3/16
and I/O Truth Table)
(3) BRAKEx pins (BD6373GW) and BRK1 pin (BD6873KN)
Applying the High-level voltage pin will set the brake mode. The same selection made with the brake mode can be
made for the BD6753KV, using serial control. (See the Electrical Characteristics; p.2/16 and p.3/16 and I/O Truth
Table; p.12/16 and p.13/16)
Technical Note
VCC
F3
BandGap
H bridge
Full ON
H bridge
Full ON
H bridge
Full ON
H bridge
Full ON
H bridge
Full ON
H bridge
Full ON
F4
GND
E2
1
6
E5
F2
F1
E1
D1
C1
B1
2
B2
3
4
B5
5
F5
C6
D6
E6
F6
B6
1~100uF
VM12
OUT1A
OUT1B
OUT2A
OUT2B
PGND12
1~100uF
VM34
OUT3A
OUT3B
OUT4A
OUT4B
PGND34
1~100uF
VM56
OUT5A
OUT5B
OUT6A
OUT6B
PGND56
Bypass filter Capacitor for
power supply input. (p.14/16)
M
Bypass filter Capacitor for
power supply input. (p.14/16)
M
Bypass filter Capacitor for
power supply input. (p.14/16)
Bypass filter Capacitor for
power supply input. (p.14/16)
Power-saving (p.8/16)
H : Active
L : Standby
Motor control input
(p.8/16)
Drive mode selection
(p.8/16)
H : EN/IN
L : IN/IN
Motor control input
(p.8/16)
Drive mode selection
(p.8/16)
H : EN/IN
L : IN/IN
Motor control input
(p.8/16)
Drive mode selection
(p.8/16)
H : EN/IN
L : IN/IN
Motor control input
brake function (p.8/16)
H : Brake
IN1A
IN1B
IN2A
IN2B
SEL1
IN3A
IN3B
IN4A
IN4B
SEL2
IN5A
IN5B
SEL3
BRK1
Motor control input
(p.8/16)
When using the VREF voltage (1.2V) resistance divi sion
value as VLIMH and VLIML input value, select R
values such that,
2kΩ≦R
1+R2+R3
≦20kΩ (p.9/16)
PS
38
47
48
1
2
3
4
5
8
9
10
11
12
13
14
EN1
36
IN6
37
, R2, and R3
1
Power Save
Logic12
Logic12
Logic34
Logic5
Logic6
23 242526
VREF VLIMS VLIMH VLIML
R1
Output current selection
(p.10/16)
H : VLIML
L : VLIMH
Fig.19 BD6873KN Application Circuit Diagram
1~100uF
TSD & UVLO
Level Shift
&
Pre Driver
Level Shift
&
Pre Driver
Level Shift
&
Pre Driver
Level Shift
&
Pre Driver
SelectorVREF
R2 R3
VCC
6
3) H-bridge
The 6-channel H-bridges of can be controlled independently. For this reason, it is possible to drive the H-bridges
simultaneously, as long as the package thermal tolerances are not exceeded.
The H-bridge output transistors of the BD6373GW, BD6873KN and BD6753KV consist of Power CMOS, with the motor
power supply VM, and Power DMOS, with the charge pump step-up power supply VG, respectively. The total H-bridge
ON-Resistance on the high and low sides varies with the VM and VG voltages, respectively. The system must be
designed so that the maximum H-bridge current for each channel is 800mA or below.
4) Drive system of Linear Constant-Current H-bridge (BD6873KN: ch6)
BD6873KN (ch6) enables Linear Constant-Current Driving.
(1) Reference voltage output (with a tolerance of ±3%)
The VREF pin outputs 1.2V, based on the internal reference voltage. The output current of the Constant-Current Drive
block is controllable by connecting external resistance to the VREF pin of the IC and applying a voltage divided by the
resistor to the output current setting pins (VLIMH and VLIML pins). It is recommended to set the external resistance to
2kΩ or above in consideration of the current capacity of the VREF pin, and 20kΩ or below in order to minimize the
fluctuation of the set value caused by the base current of the internal transistor of the IC.
BandGap
H bridge
Full ON
H bridge
Full ON
H bridge
Full ON
H bridge
Full ON
H bridge
Full ON
H bridge
Const. Current
7
GND
Technical Note
Bypass filter Capacitor for
power supply input. (p.14/16)
1~100uF
41
VM1
39
40
45
46
44
17
15
16
21
22
20
34
32
35
33
28
27
31
29
30
OUT1A
OUT1B
OUT2A
OUT2B
PGND1
VM2
OUT3A
OUT3B
OUT4A
OUT4B
PGND2
VM3
OUT5A
OUT5B
PGND3
VM4
OUT6A
OUT6B
RNF
SENSE
M
Bypass filter Capacitor for
power supply input. (p.14/16)
1~100uF
M
Bypass filter Capacitor for
power supply input. (p.14/16)
1~100uF
Bypass filter Capacitor for
power supply input. (p.14/16)
1~100uF
0.1Ω~5.0Ω
The output current is converted to a voltage with
the RNF external resistor and transmitted to the
SENSE pin. (p.10/16)
Bypass filter Capacitor for
power supply input. (p.14/16)
Power-saving (p.8/16)
H : Active
L : Standby
1~100uF
9
OSC
VCC
PS
28
Motor control input
(p.8/16)
Power Save
PWM1
PWM2
2
3
Logic12
Motor control input
(p.8/16)
PWM3
PWM4
10
11
Logic34
Motor control input
(p.8/16)
Serial control input
(p.12/16)
PWM5
PWM6
STROBE
CLK
DATA
12
1
31
32
33
Logic45
Logic56
Serial
Interface
VREF
30 29 34
This CR timer determines the
off time for the PWM drive.
5kΩ≦R
10pF≦C
(p.11/16)
Fig.20 BD6753KV Application Circuit Diagram
(2) Output current settings and setting changes
When the Low-level control voltage is applied to the VLIMS pin, the value on the VLIMH pin will be used as an output current
set value to control the output current. When the High-level control voltage is applied to the VLIMS pin, the value on the VLIML
pin will be used as an output current set value to control the output current. (See the Electrical Characteristics; P.2/16)
(3) Output current detection and current settings
By connecting external resistor (0.1Ω to 5.0Ω) to the RNF pin of the IC, the motor drive current will be converted into voltage in
order to be detected. The output current is kept constant by shorting the RNF and SENSE pins and comparing the voltage with
the VLIMH or VLIML voltage. To perform output current settings more precisely, trim the external RNF resistance if needed, and
supply a precise voltage externally to the VLIMH or VLIML pin of the IC. In that case, open the VREF pin.
Output current value Iout[A] =
The output current is 400mA3% if 0.2V is applied to the VLIMH or VLIML pin and a 0.5Ω resistor is connected externally to
the RNF pin.
VLIMH[V] or VLIML[V]
If the VLIMH and VLIML pins are shorted to the VCC pin (or the same voltage level as the VCC is applied) and the SENSE and
RNF pins are shorted to the ground, this channel can be used as a Full-ON Drive H-bridge like the other five channels.
Connecting 0.01μF to 0.1μF capacitors between the CP1 and CP2, CP3
and CP4, and VG and GND pins generate a VG vo ltage of approximately
VM1 + (VCC 2). Use caution to ens ure that the voltage differential between
VG and VM is 4.5V or higher, and that the VG voltage does not exceed the
absolute maximum rating of 18 V, especially BST voltage direct input.
.12/16
0.1μF 0.1μF
CP1 4CP2
5
Charge PumpCharge Pump
TSD & UVLO
VG
VG
VG
PWM LATCH
PWM LATCH
C
≦50kΩ
CR1
≦2200pF
CR1
CR1
0.1μF
CP3 6CP4 7VG
R
C
CR2
CR2RCR1
This CR timer determines the
off time for the PWM drive.
5kΩ≦R
CR2
10pF≦C
(p.11/16)
CR2
RNF[Ω]
Technical Note
8
Bypass filter Capacitor for
power supply input. (p.14/16)
BandGap
44
H bridge
Full ON
H bridge
Full ON
42
16
H bridge
Full ON
H bridge
Full ON
14
H bridge
PWM C. Current
H bridge
PWM C. Current
263527
VLIM5 VLIM6
VREF CR2 CR1 GND VREF
R2 R3
R1
When using the VREF voltage (0.9V) resistance divi sion
≦50kΩ
≦2200pF
value as VLIM5 and VLIM6 input value, s elect R
values such that,
Select VLIMH when VLIMS is Low-level
Select VLIML when VLIMS is High-level
45
41
43
46
48
47
17
13
15
18
20
19
25
21
24
36
37
40
39
38
22
23
VM1
OUT1A
OUT1B
OUT2A
OUT2B
RNF1
VM2
OUT3A
OUT3B
OUT4A
OUT4B
RNF2
VM3
OUT5A
OUT5B
VM4
OUT6A
OUT6B
RNF4
0.1Ω~5.0Ω
SENSE4
RNF3
0.1Ω~5.0Ω
SENSE3
1~100uF
M
Bypass filter Capacitor for
power supply input. (p.14/16)
1~100uF
M
Bypass filter Capacitor for
power supply input. (p.14/16)
1~100uF
Bypass filter Capacitor for
power supply input. (p.14/16)
1~100uF
The output current is converted
to a voltage with the RNF4
external resistor and transmitted
to the SENSE4 pin. (p.11/16)
Iout[A] = VLIM6[V]÷RNF4[Ω]
The output current is converted
to a voltage with the RNF3
external resistor and transmitted
to the SENSE3 pin. (p.11/16)
5) Drive system of PWM Constant-Current H-bridge (BD6753KV: ch5 and ch6)
BD6753KV (ch5 and ch6) enable peak current control PWM Constant-Current Driving.
(1) Output current detection and current settings
By connecting external resistance (0.1Ω to 5.0Ω) to the RNF3 and RNF4 pins of the IC, the motor drive current will be
converted into voltage in order to be detected. The output current is kept constant by shorting the RNF3 and RNF4 pins with
the SENSE3 and SENSE4 pins, respectively, and comparing the voltage to the set voltage input from outside the IC to the
VLIM5 and VLIM6 pins. As with the BD6873KN, the reference voltage generated inside the IC (VREF pin: 0.9V±10%) can
be divided using external resistors (from 1kΩ to 20kΩ). The resulting value can be input as the set voltage.
It is also necessary to connect a resistor and capacitor to the CR1 and CR2 pins, to determine the PWM drive off time.
(2) PWM Constant-Current control operation
When the output current in output ON mode increases, and the RNF3 or RNF4 voltage reaches the value set with the
VLIM5 or VLIM6 voltage, the internal current limiting comparator operates to set the IC to short mode. This caused the
current to be attenuated so that the H-bridge's low-side DMOS is ON. Once the off time (Toff) ends, as measured by
the CR timer, the IC returns to output ON mode. By repeating this cycle, the IC maintains a fixed current due to the
motor's inductance characteristics.
(3) Noise cancellation function
In order to avoid false detections by the current limiting comparator (caused by spike noise generated when output is
turned on), the IC uses the noise cancellation time (Tn) to disable current detection. This begins from the time output
turns on, until the noise cancellation time elapses. The noise cancellation time represents the minimum on time, and is
determined by the CR pin's internal resistor, external resistor, and capacitor.
(4) CR timer
When output turns on, the CR pin is clamped at approximately 0.9V. When the mode changes to short mode, it
discharges to approximately 0.4V. The interval over which this 0.5V voltage differential is discharged, is determined by
the off time (Toff). Once the CR pin voltage reaches 0.4V, the pin begins to charge as the output turns on, until it
reaches 0.9V. The interval over which the pin charges from 0.4V to approximately 0.8V is given by the noise
cancellation time (Tn). Toff and Tn are determined by the external resistor and capacitor connected to the CR pin.
A low resistance value to the CR pin will prevent it from reaching the clamp voltage. Therefore a resistor from 5 kΩ to
50kΩ should be used. Capacitors should be from 10pF to 2200pF. The use of a capacitance in excess of 2200pF will
lengthen the noise cancellation time and may cause the output current to exceed the set current. Setting a longer off
time may increase the output current ripple, reducing both the average current and the motor's rotational efficiency.
Output current value Iout[A] =
VLIM5[V]
RNF3[Ω]
or
VLIM6[V]
RNF4[Ω]
Output current: Iout[A]
Spike noise
RNF voltage: VRNF[V]
CR voltage: VCR[V]
Noise cancellation time: Tn[sec]
Charge period
Discharge period
Off time: Toff[sec]
Fig.21 BD6753KV Peak Current Control PWM Constant-Current Drive Using the CR Timer
If the VLIM5 or VLIM6 is shorted to the VCC pin (or the same voltage level as the VCC is applied) and the SENSE3 or
SENSE4 and RNF3 or RNF4 pins are shorted to the ground, this channel can be used as a Full-ON Drive H-bridge
like the other four channels.
6) Charge pump (BD6753KV)
Each output H-bridge of the BD6753KV on the high and low sides consists of Nch DMOS. Therefore, the gate voltage VG
should be higher than the VM voltage to drive the Nch DMOS on the high side.The BD6753KV has a built-in charge
pump circuit that generates VG voltage by connecting an external capacitor (0.01μF to 0.1μF).
If a 0.1μF capacitor is connected between: CP1 and CP2, CP3 and CP4, VG and GND
Then, VG pin output voltage will be: VM1 + (VCC 2)
If a 0.1μF capacitor is connected between: CP1 and CP2, VG and GND
CP4 and VG pins are shorted, and CP3 pin is open
Then, VG pin output voltage will be: VM1 + VCC
The VM1 to VM4 respectively can be set to voltages different to one another. In order to ensure better performance, the
voltage differential between VG and VM must be 4.5V or higher, and the VG voltage must not exceed the absolute
maximum rating of 18V.
7) Serial interface (BD6753KV)
The BD6753KV provides an 8-bit, 3-line serial interface for setting output modes. DATA is sent to the internal shift register
during the STROBE low interval at the CLK rising edge. Shift register data is written to the IC's internal 6-bit memory at
the STROBE rising edge, according to the addresses stored in Bit[7] and Bit[6]. The serial data input order is Bit[0] to
Bit[7]. Serial settings are reset when the PS pin changes to Low-level control voltage, triggering standby mode. Serial
settings are also reset when the UVLO circuit operates.
Fig.23 BD6373GW I/O Circuit Diagram (Resistance values are typical ones)
VMx, OUTxA, OUTxB, PGNDx, RNFVLIMH, VLIML, SENSE
VREF
VCC
VCC
VMx
VCC VCC
VCC
10kΩ
100kΩ
OUTxA
OUTxB
PGNDx
RNF
10kΩ
200kΩ
PS
VCC
Fig.24 BD6873KN I/O Circuit Diagram (Resistance values are typical ones)
STROBE, CLK, DATA, PWMx CPH1, CPL1
VCC
VCC
VMx, OUTxA, OUTxB, RNFx
VMx
VLIMx, SENSEx
40kΩ
70kΩ
CP3, CP1 VG, CP4, CP2 CR1, CR2
10kΩ
100kΩ
OUTxA
OUTxB
VCC
RNFx
100kΩ
VCC
1kΩ
VCC
VCC
VG
5kΩ
CP4
CP2
Fig.25 BD6753KV I/O Circuit Diagram (Resistance values are typical ones)
VM1
●Operation Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in
IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is
suffered. The implementation of a physical safety measure such as a fuse should be considered when use of the IC in a
special mode where the absolute maximum ratings may be exceeded is anticipated.
2) Storage temperature range
As long as the IC is kept within this range, there should be no problems in the IC’s performance. Conversely, extreme
temperature changes may result in poor IC performance, even if the changes are within the above range.
3) Power supply pins and lines
None of the VM line for the H-bridges is internally connected to the VCC power supply line, which is only for the control
logic or analog circuit. Therefore, the VM and VCC lines can be driven at different voltages. Although these lines can be
connected to a common power supply, do not open the power supply pin but connect it to the power supply externally.
Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power
supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all
the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low
temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will
cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed
the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a
voltage clamp diode between the power supply and ground pins.
For this IC with several power supplies and a part consists of the CMOS block, it is possible that rush current may flow
instantaneously due to the internal powering sequence and delays, and to the unstable internal logic, respectively. Therefore,
give special consideration to power coupling capacitance, width of power and ground wirings, and routing of wiring.
4) Ground pins and lines
Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at
any time, regardless of whether it is a transient signal or not.
When using both small signal GND and large current MGND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations
caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND
wiring pattern of any external components, either.
The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6) Pin short and wrong direction assembly of the device
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins are
shorted together or are shorted to other circuit’s power lines.
7) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
8) ASO
When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO.
9) Thermal shutdown circuit
If the junction temperature (Tjmax) reaches 175°C, the TSD circuit will operate, and the coil output circuit of the motor will
open. There is a temperature hysteresis of approximately 25°C (BD6373GW and BD6873KN Typ.) and 25°C (BD6753KV
Typ.). The TSD circuit is designed only to shut off the IC in order to prevent runaway thermal operation. It is not designed to
protect the IC or guarantee its operation. The performance of the IC’s characteristics is not guaranteed and it is
recommended that the device is replaced after the TSD is activated.
10) Serial data input
In the BD6753KV, DATA input string start with LSB first.
The serial settings are reset during standby mode operation and whenever the UVLO or TSD circuits are operating.
11) Power saving terminal
Be cancelled power saving mode after turned on power supply VCC and VM, because of PS terminal combines power
saving with serial reset function. If the case of power saving terminal always shorted power supply terminal, reset function
may not be well, and it may cause the IC to malfunction.
12) Testing on application board
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or
removing it from a jig or fixture, during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting and storing the IC.
13) Application example
The application circuit is recommended for use. Make sure to confirm the adequacy of the characteristics. When using the
circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components
including static and transitional characteristics as well as dispersion of the IC.
14) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements to keep them isolated. P-N
junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example, the relation bet
ween each potential is as follows:
When GND > Pin A, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic diode and transistor.
Parasitic elements can occur inevitably in the structure of the IC. The operation of parasitic elements can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic elements
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
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