ROHM BD6735FV, BD6736FV Technical data

System Lens Driver Series for Digital Still Cameras / Single-lens Reflex Cameras

1 to 2ch Lens Drivers for Single-Lens Reflex Cameras

BD6735FV, BD6736FV

No.09014EAT03

●Description

The BD6735FV motor driver provides 2 Full-ON Drive H-bridge channels, while BD6736FV provides 1 Full-ON Drive H-bridge channel. ROHM’s lens driver series features high voltage resistance and large current output in a compact surface mount package, making it ideally suited for smaller systems such as Single-Lens Reflex with Interchangeable Lenses.

●Features

1) Low ON-Resistance Power MOS output: Full-ON Drive block with 1.0Ω Typ. (BD6735FV) Full-ON Drive block with 0.35Ω Typ. (BD6736FV)

2) DMOS output allowing a range power supply: 2.0V to 8.0V (BD6735FV), 2.0V to 9.0V (BD6736FV)

3) Built-in step-up circuit for the DMOS gate voltage drive

4) Drive mode switching function

5) H bridge maximum output current: DC maximum 1.0A (BD6735FV and BD6736FV), Peak maximum 3.2A (BD6736FV)

6) UVLO (Under Voltage Lockout Protection) function

7) Built-in TSD (Thermal Shut Down) circuit

8) Standby current consumption: 0μA Typ.

●Absolute Maximum Ratings

Parameter Symbol

BD6735FV BD6736FV

Limit

Unit

Power supply voltage VCC -0.5 to +10.0 -0.5 to +10.0 V

Motor power supply voltage VM -0.5 to +10.0 -0.5 to +10.0 V

Charge pump step-up power supply voltage VBST -0.5 to +15.0 -0.5 to +15.0 V

Control input voltage VIN -0.5 to VCC+0.5 -0.5 to VCC+0.5 V

Power dissipation Pd 810

※

810

※

Operating temperature range Topr -30 to +75 -30 to +75 ℃

Junction temperature Tjmax +150 +150 ℃

Storage temperature range Tstg -55 to +150 -55 to +150 ℃

H-bridge output current (DC) Iout -1000 to +1000

※

-1000 to +1000

H-bridge output current (Peak) Ipeak - -3200 to +3200

※1 Reduced by 6.48mW/°C over 25℃, when mounted on a glass epoxy board (70mm  70mm  1.6mm). ※2 Must not exceed Pd, ASO, or Tjmax of 150℃ ※3 Peak=100msec

※

mA/ch

※

mA/ch

●Operating Conditions (Ta=-30 to +75℃)

Parameter Symbol

BD6735FV BD6736FV

Limit

Power supply voltage VCC 2.0 to 8.0 2.0 to 9.0 V

Motor power supply voltage VM 2.0 to 8.0 2.0 to 9.0 V

Control input voltage VIN 0 to VCC 0 to VCC V

Logic input frequency FIN 0 to 100 0 to 100 kHz

Min. logic input pulse width TIN 0.5 0.5 μs

Unit

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2009.06 - Rev.A

BD6735FV, BD6736FV

Technical Note

●Electrical Characteristics

1) BD6735FV and BD6736FV Electrical Characteristics (Unless otherwise specified, Ta=25°C, VCC=5.0V, VM=5.0V)

Parameter Symbol

Min. Typ. Max.

Limit

Unit Conditions

Overall Circuit current

during standby operation

ICCST - 0 1 μA PS=0V

Circuit current (BD6735FV) ICC 0.5 2.0 4.0 mA PS=H, FIN=100kHz Circuit current (BD6736FV) ICC 0.5 1.5 4.0 mA PS=H, FIN=100kHz Power saving (PS) High-level input voltage VPSH 2.0 - VCC V Low-level input voltage VPSL -0.3 - 0.5 V High-level input current IPSH 25 50 100 μA VPSH=5V Low-level input current IPSL -1 0 1 μA VPSL=0V Control input (BD6735FV; INxA, INxB, PWMEN, and BD6736FV; INA, INB, PWM) High-level input voltage VINH 2.0 - VCC V Low-level input voltage VINL -0.3 - 0.7 V High-level input current IINH 25 50 100 μA VINH=5V Low-level input current IINL -1 0 1 μA VINL=0V UVLO UVLO voltage VUVLO 1.5 - 1.9 V BD6735FV Full-ON Drive block (ch1 and ch2) Output ON-Resistance RON - 1.0 1.35 Ω Io=700mA on high and low sides in total BD6736FV Full-ON Drive block (ch1) Output ON-Resistance RON - 0.35 0.5 Ω Io=500mA on high and low sides in total

●Electrical Characteristics

1000

800

810mW

BD6735FV, BD6736FV

600

486mW

400

200

Power dissipation : Pd [mW]

0 25 50 75 100 125 150

Ambient temperature : Ta [°C]

75°C

Fig.1 Power Dissipation Reduction

800

600

BD6735FV

Top 7 5° C Mid 25°C Low -30°C

400

: VDSL [mV]

200

Output V

0 200 400 600 800 1000

Output current : I

OUT

[mA]

Fig.4 Output ON-Voltage on Low-Side

5.0

4.0

3.0

2.0

1.0

Circuit current : ICC [mA]

0.0

0.0 2.0 4.0 6. 0 8.0 10.0

Fig.2 Circuit current

250

200

150

: VDSH [mV]

100

Output V

0 200 400 600 800 1000

Fig.5 Output ON-Voltage on High-Side

BD6735FV, BD6736FV

BD6736FV Op. range

(2.0V to 9.0V)

BD6735FV Op. range

(2.0V to 8.0V)

Top 7 5° C Mid 25°C Low -30°C

Supply voltag e : VCC [V]

Top 7 5° C Mid 25°C Low -30°C

Output current : I

OUT

BD6736FV

[mA]

800

600

400

: VDSL [mV]

200

Output V

0 200 400 600 800 1000

Output current : I

Fig.3 Output ON-Voltage on High-Side

250

200

150

: VDSH [mV]

100

Output V

0 200 400 600 800 1000

Output current : I

Fig.6 Output ON-Voltage on Low-Side

BD6735FV

Top 7 5° C Mid 25°C Low -30°C

[mA]

OUT

BD6736FV

Top 7 5° C Mid 25°C Low -30°C

[mA]

OUT

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2009.06 - Rev.A

BD6735FV, BD6736FV

●Application Circuit Diagram, Pin Function, and Pin Arrangement

Bypass filter Capacitor for power supply input. (p.7/8)

Power-saving (p.5/8)

H : Active L : Standby

Motor control input (p.5/8)

Drive mode selection (p.5/8)

H : EN/IN L : IN/IN

IN1A

IN1B

IN2A

IN2B

PWME N

Power Save

Logic

Power Save

OSC Charge Pump Charge Pump

GND

Connecting capacitors between the CPL1 and C PL2, CPH1 and CPH2, and BST and GND pins generate a BST voltage. Use caution to ensure that the vo ltage differential between BST and VM is 3.0V or higher, and that the BST voltage does not exceed the absolute maximum rating of 15V, especially set the BST voltage direct input.(p.5/8)

Fig.7 BD6735FV Application Circuit Diagram

1～100uF

Level Shift

Pre Driver

14 12 9

CPL1 CPL2

0.1μF 0.1μF 1.0μF

VCC

BST

No. Pin Name Function

1 VCC Power supply pin 2 MGND2 Motor ground pin 2 3 OUT4 H-bridge output pin 4 4 OUT3 H-bridge output pin 3 5 VM Motor power supply pin 6 OUT1 H-bridge output pin 1 7 OUT2 H-bridge output pin 2 8 MGND1 Motor ground pin 1

9 BST Charge pump step-up power supply pin 10 GND Ground pin 11 CPH2 Capacitor connection pin for second charge 2 12 CPH1 Capacitor connection pin for second charge 1 13 CPL2 Capacitor connection pin for first charge 2 14 CPL1 Capacitor connection pin for first charge 1 15 PWMEN Drive mode selection pin 16 IN2B Control input pin ch2 B 17 IN2A Control input pin ch2 A 18 IN1B Control input pin ch1 B 19 IN1A Control input pin ch1 A 20 PS Power-saving pin

Fig.8 BD6735FV Pin Arrangement (Top View)

BandGapTSD & UVLO

BST

CPH1

H bridge

Full ON

H bridge

Full ON

CPH2

BD6735FV Pin Function Table

1～100uF

OUT1

OUT2

OUT3

OUT4

MGND2

MGND1

Technical Note

Bypass filter Capacitor for power supply input. (p.7/8)

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2009.06 - Rev.A

BD6735FV, BD6736FV

Power-saving (p.5/8)

H : Active L : Standby

Motor control input (p.5/8)

Drive mode selection (p.5/8)

H : EN/IN L : IN/IN

INA

INB

PWM

Fig.10 BD6736FV Pin Arrangement (Top View)

Bypass filter Capacitor for power supply input. (p.7/8)

1～100uF

Power Save

Logic

Power Save

OSC Charge Pump Charge Pump

GND

Level Shift

Pre Driver

15 13 11

CPL1 CPL2

0.1μF 0.1μF 1.0μF

VCC

BandGapTSD & UVLO

BST

CPH1

H bridge

Full ON

CPH2

Fig.9 BD6736FV Application Circuit Diagram

BD6736FV Pin Function Table

No. Pin Name Function

1 VM Motor power supply pin 2 N.C. 3 OUTA H-bridge output pin A 4 OUTA H-bridge output pin A 5 MGND Motor ground pin 6 MGND Motor ground pin 7 OUTB H-bridge output pin B 8 OUTB H-bridge output pin B

9 VM Motor power supply pin 10 GND Ground pin 11 BST Charge pump step-up power supply pin 12 CPH2 Capacitor connection pin for second charge 2 13 CPH1 Capacitor connection pin for second charge 1 14 CPL2 Capacitor connection pin for first charge 2 15 CPL1 Capacitor connection pin for first charge 1 16 PWM Drive mode selection pin 17 INB Control input pin ch1 B 18 INA Control input pin ch1 A 19 PS Power-saving pin 20 VCC Power supply pin

BST

Technical Note

Bypass filter Capacitor for power supply input. (p.7/8)

1～100uF

OUTA

OUTB

MGND

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2009.06 - Rev.A

BD6735FV, BD6736FV

●Function Explanation

1) Power-saving function When Low-level voltage is applied to PS pin, the IC will be turned off internally and the circuit current will be 0μA (Typ.). During operating mode, PS pin should be High-level. (See the Electrical Characteristics; p.2/8)

2) Motor Control input (1) INxA and INxB pins (BD6735FV), INA and INB pins (BD6736FV)

These pins are used to program and control the motor drive modes. (See the Electrical Characteristics; p.2/8, and I/O Truth Table; p.5/8)

(2) PWMEN pin (BD6735FV), PWM pin (BD6736FV)

When the High-level voltage is applied to the PWMEN pin (PWM pin), the I/O logic can be set to EN/IN mode. However, when the Low-level voltage is applied, the I/O logic can be set to IN/IN mode. (See the Electrical Characteristics; p.2/8, and I/O Truth Table; p.5/8)

3) H-bridge The 2-channel H-bridges can be controlled independently. For this reason, it is possible to drive the H-bridges simultaneously, as long as the package thermal tolerances are not exceeded. The H-bridge output transistors consist of Power DMOS with the charge pump step-up power supply BST. The total H-bridge ON-Resistance on the high and low sides varies with the BST voltages.

4) Charge pump Each output H-bridge on the high and low sides consists of Nch DMOS. Therefore, the gate voltage BST should be

higher than the VM voltage to drive the Nch DMOS on the high side. The BD6735FV and BD6736FV have a built-in charge pump circuit that generates BST voltage by connecting an external capacitor, between CPL1 and CPL2, CPH1 and CPH2, BST and GND. In order to ensure better performance, the voltage differential between BST and VM must be 3.0V or higher, and the BST voltage must not exceed the absolute maximum rating of 15.0V.

●I/O Truth Table

BD6735FV I/O Truth Table

INPUT OUTPUT

Drive mode

PWM

IN1A/2A IN1B/2B OUT1/3 OUT2/4

L X L L Brake

EN/IN

H L H L CW H H L H CCW

IN/IN L

L L Z Z Standby H L H L CW L H L H CCW H H L L Brake

- L X X X Z Z Standby

L: Low, H: High, X: Don’t care, Z: High Impedance At CW, current flows from OUT1(3) to OUT2(4). At CCW, current flows from OUT2(4) to OUT1(3).

BD6736FV I/O Truth Table

Drive mode

PS PWM INA INB OUTA OUTB

INPUT OUTPUT

L X L L Brake

EN/IN

H L H L CW H H L H CCW

IN/IN L

L L Z Z Standby H L H L CW L H L H CCW H H L L Brake

- L X X X Z Z Standby

L: Low, H: High, X: Don’t care, Z: High Impedance At CW, current flows from OUTA to OUTB. At CCW, current flows from OUTB to OUTA.

Technical Note

Output mode

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2009.06 - Rev.A

BD6735FV, BD6736FV

Technical Note

●I/O Circuit Diagram

VCC

100kΩ

INxA, INxB, PWMEN (BD6735FV) INA, INB, PWM (BD6736FV)

VCC

10kΩ

VCC

70kΩ

VM, MGND, OUT1～4 (BD6735FV) VM, MGND, OUTA, B (BD6736FV)

OUT1, 3

CPH1, CPL1

275kΩ

100kΩ

BST, CPH2, CPL2

3.33kΩ

OUT2, 4

VCC

MGND

VM Inside REG

BST

CPH2

CPL2

Fig.11 I/O Circuit Diagram (Resistance values are typical ones)

●Notes for use

1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.

2) Storage temperature range As long as the IC is kept within this range, there should be no problems in the IC’s performance. Conversely, extreme temperature changes may result in poor IC performance, even if the changes are within the above range.

3) Power supply pins and lines None of the VM line for the H-bridges is internally connected to the VCC power supply line, which is only for the control logic or analog circuit. Therefore, the VM and VCC lines can be driven at different voltages. Although these lines can be connected to a common power supply, do not open the power supply pin but connect it to the power supply externally. Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and ground pins. For this IC with 2 power supplies and a part consists of the CMOS block, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays, and to the unstable internal logic, respectively. Therefore, give special consideration to power coupling capacitance, width of power and ground wirings, and routing of wiring.

4) Ground pins and lines Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at any time, regardless of whether it is a transient signal or not. When using both small signal GND and large current MGND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. The power supply and ground lines must be as short and thick as possible to reduce line impedance.

OUTA

OUTB

MGND

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2009.06 - Rev.A

BD6735FV, BD6736FV

Technical Note

5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

6) Pin short and wrong direction assembly of the device Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins are shorted together or are shorted to other circuit’s power lines.

7) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.

8) ASO When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO.

9) Thermal shutdown circuit If the junction temperature (Tjmax) reaches 175°C (BD6735FV Typ.) and 160°C (BD6736FV Typ.), the TSD circuit will operate, and the coil output circuit of the motor will open. There is a temperature hysteresis of approximately 20°C. The TSD circuit is designed only to shut off the IC in order to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. The performance of the IC’s characteristics is not guaranteed and it is recommended that the device is replaced after the TSD is activated.

10) Testing on application board When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or removing it from a jig or fixture, during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting and storing the IC.

11) Application example The application circuit is recommended for use. Make sure to confirm the adequacy of the characteristics. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including static and transitional characteristics as well as dispersion of the IC.

12) Regarding input pin of the IC This monolithic IC contains P

isolation and P substrate layers between adjacent elements to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows:

When GND > Pin A, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic diode and transistor. Parasitic elements can occur inevitably in the structure of the IC. The operation of parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic elements operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.

Pin A

P+ P

Parasitic element

GND

Resistor Transistor (NPN)

Pin A

N N

P substrate

Parasitic element

Fig.12 Example of Simple IC Architecture

Pin B

Parasitic element

P+

P substrate

GND

Pin B

B C

Other adjacent elements

GND

Parasitic element

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2009.06 - Rev.A

BD6735FV, BD6736FV

●Ordering part number

B D 6 7 3 5 F V - E 2

Technical Note

Part No. Part No.

6735 : 8.0V power supply voltage 6736 : 9.0V power supply voltage

3.2A peak current

SSOP-B20

6.5 ± 0.2

6.4 ± 0.3

4.4 ± 0.2

1.15 ± 0.1

0.1± 0.1

0.65

0.22 ± 0.1

Package FV : SSOP-B20

Embossed carrier tapeTape

Quantity

Direction

0.3Min.

0.15 ± 0.1

0.1

(Unit : mm)

of feed

2500pcs E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

Packaging and forming specification E2: Embossed tape and reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

Direction of feed

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2009.06 - Rev.A

Notes

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Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.

The technical information specied herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other par ties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.

Notice

The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).

The Products specied in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injur y (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.

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ROHM BD6735FV, BD6736FV Technical data

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