ROHM BD6726FU Technical data

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STRUCTURE Silicon Monolithic Integrated Circuit

PRODUCT SERIES Single-Phase Full-Wave Motor Driver for Fan Motor

TYPE

ＢＤ６７２６ＦＵ

FEATURES Pre-driver compatible for external Tr
Speed controllable by DC/PWM input
PWM soft switching drive
Built-in Speed control circuit by rotation speed feedback

〇ABSOLUTE MAXIMUM RA TINGS

Parameter

Symbol Limit Unit
Supply voltage Vcc 20 V
Power dissipation Pd 874.7＊ mW
Operating temperature Topr -40 to +100 °C
Storage temperature Tstg -55 to +150 °C
High side output voltage VOH 36 V
Low side output voltage VOL 15 V
Low side output current IOL 10 mA

FG output current
FG output voltage
REF current ability
HB current ability

IFG 10 mA

VFG 20 V

IREF 12 mA

IHB 12 mA
Input voltage (H+, H-, CS, PWMIN) VIN 7 V
ICT and SHIFT current ability IIN 100 μA
Junction temperature Tjmax 150 °C

＊Reduce by 7.0mW/°C over Ta=25°C.

(On 70.0mm×70.0mm×1.6mm glass epoxy board)

＊This product is not designed for production against radioactive rays.

REV. B

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〇OPERATING CONDITIONS

Parameter

Symbol

Limit Unit

Operating supply voltage range Vcc 5.0 to 17.0 V
Input voltage range 1 (H+, H-) VIN1

Input voltage range 2 (PWMIN) VIN2

0 to Vcc-2.0 V

0 to 7.0 V

0 to VREF V

0 to 6.5 V

less than Vcc=9.0V
more than Vcc=9.0V
less than Vcc=7.0V

more than Vcc=7.0V
Input voltage range 3 (MIN) VIN3 0 to VREF V
Input voltage range 4 (FIL) VIN4 0 to VFILH V

〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25°C, Vcc=12V)

Parameter

Symbol

Min. Typ. Max.

Limit

Unit Conditions

Circuit current Icc 3.0 5.4 8.0 mA
Hall input hysteresis VHYS ±5 ±10 ±15 mV
High side output current IH 5.0 10.5 17.0 mA VOH=12V
High side output leak current IHL - - 10 μA VOH=36V
Low side output high voltage VLH 9.3 9.5 - V IOL=-5mA
Low side output low voltage VLL - 0.5 0.7 V IOL=5mA
Lock detection ON time TON 0.18 0.3 0.42 s
Lock detection OFF time TOFF 3.6 6.0 8.4 s
FG output low voltage VFGL - - 0.3 V IFG=5mA
FG output leak current IFGL - - 10 μA VFG=17V
OSC low voltage VOSCL 0.8 1.0 1.2 V
OSC high voltage VOSCH 2.3 2.5 2.7 V
OSC charge current ICOSC -50 -32 -20 μA
OSC discharge current IDOSC 20 32 50 μA
REF voltage VREF 4.6 5.0 5.4 V IREF=-2mA
Hall bias voltage VHB 1.3 1.5 1.7 V IHB=-2mA
Current limit voltage VCL 130 160 190 mV
MIN bias current IMIN - - 1.0 μA VMIN=0V
CS bias current ICS - - 1.0 μA VCS=0V
PWMIN bias current IPWM 15 25 35 μA VPWMIN=0V
PWMIN input high voltage VPWMH 2.3 - 6.5 V
PWMIN input low voltage VPWML 0.0 - 1.0 V
FIL output high voltage VFILH 1.3 1.5 1.7 V VPWMIN=0V
FIL source current IFILH -25 -15 -10 μA VPWMIN=0V
FIL sink current IFILL 10 15 25 μA VPWMIN=VREF
VCONT charge current ICVCON -145 -100 -60 μA
VCONT discharge current IDVCON 7 11 16 μA
VCONT charge/discharge current
ratio

RVCON 9.8 10.1 10.4 -

RVCON=
(ICVCON+IDVCON)/IDVCON

Soft start time TSS 1.2 2.0 2.8 s

REV. B

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c

A

A

〇P ACKAGE OUTLINES

D6726

Lot No.

SSOP-C20 (UNIT:mm)

〇BLOCK DIAGRAM 〇TERMINAL NAME

GND

1

SHIFT

2

TSD

SPEED

CONTROL

SIGNAL

OUTPUT

ICT

3

OSC

4

MIN

5

VCONT

6

REF

7

Vc

8

A1H

9

REF

OSC

+

-

SOFT

START

SOFT

SWITCH

PWMCOMP

CONTROL

LOGIC

PRE DRIVER

QUICK
START

LOCK

PROTECTION

HALL
COMP

CURRENT
LIMIT
COMP

HB

-

+

VCL

+

-

A1L

10

FG

20

PWMIN

19

FIL

18

CP

17

H-

16

HB

15

H+

14

CS

13

2H

12

2L

11

PIN No.

1 GND
2 SHIFT
3 ICT
4 OSC
5 MIN
6 VCONT
7 REF
8 Vcc

9 A1H
10 A1L
11 A2L
12 A2H
13 CS
14 H+
15 HB
16 H­17 CP
18 FIL
19 PWMIN
20 FG

Terminal

name

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〇CAUTIONS ON USE

1) Absolute maximum ratings
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down
the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If an y over rated va lues will
expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.

2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An
external direction diode can be added.

3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor
between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem
before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low
temperatures)

4) GND potential
It is possible that the motor output terminal may deflect below GND terminal because of influence by back electromotive force of motor.
The potential of GND terminal must be minimum potential in all operating conditions, except that the levels of the motor outputs
terminals are under GND level by the back electromotive force of the motor coil. Also ensure that all terminals except GND and motor
output terminals do not fall below GND voltage including transient characteristics. Malfunction may possibly occur depending on use
condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC.

5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or
if pins are shorted together.

7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.

8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.

9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175°C (typ.) and has a hysteresis width
of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed.

10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always
discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig
or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when
transporting or storing the IC.

11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single
ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by larg
do not cause v
components, either.

12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the
current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below
100uF.

13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied
to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual
interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic
element is actuated.

ariations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external

e currents

REV. B

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