White Backlight LED Driver
for Medium to Large LCD Panels
(Switching Regulator Type)
BD6592MUV
●Description
BD6592MUV is white LED driver IC with PWM step-up DC/DC converter that can boost max 42.5V and current driver that
can drive max 40mA. The wide and precision brightness can be controlled by external PWM pulse. BD6592MUV has very
accurate current drivers, and it has few current errors between each strings. So, it will be helpful to reduce brightness spots
on the LCD. Small package type is suited for saving space.
●Features
1) High efficiency PWM step-up DC/DC converter (fsw=1MHz), max efficiency 93%
2) High accuracy & good matching (±3%) current drivers 6ch
3) Drive up to 12
4) Wide input voltage range (2.7V ~ 22V)
5) Rich safety functions
・Over-voltage protection (OVP) ・Over current limit ・External SBD open detect ・Thermal shutdown
All middle size LCD equipments backlight of Notebook PC, portable DVD player, car navigation systems, etc.
●Absolute maximum ratings (Ta=25℃)
Parameter Symbol Ratings Unit Condition
Maximum applied voltage 1 VMAX1 7 V
Maximum applied voltage 2 VMAX2 25 V
Maximum applied voltage 3 VMAX3 50.5 V VDET
Power dissipation 1 Pd1 500 mW
Power dissipation 2 Pd2 780 mW
Power dissipation 3 Pd3 1510 mW
Operating temperature range Topr -30 ~ +85 ℃
Storage temperature range Tstg -55 ~ +150 ℃
*1 Reduced 4.0mW/℃ With Ta>25℃ when not mounted on a heat radiation Board.
*2 1 layer (ROHM Standard board) has been mounted. Copper foil area 0mm
*3 4 layer (JEDEC Compliant board) has been mounted.
Copper foil area 1layer 6.28mm
●Recommended operating range (Ta=-30℃ ~ +85℃)
Parameter Symbol
*
in series, 6 strings in parallel =72 white LEDs (*white LED Vf=3.5Vmax)
* Please select the capacitor which the little bias fluctuation.
FAIL SEL
ISETH
12k
ISETL
10LED x 4aprallel
VDET
LED1
LED2
LED3
LED4
LED5
LED6
Each 40mA
VDET
LED1
LED2
LED3
LED4
LED5
LED6
Each 30mA
10LED x 6parallel
Batter
10F
RTR020N05
47m
Power
ON/OFF
200Hz
PWM
2.7V to 5.5V
4.7H
2.2F *
2.2F
2.2F *
SENSP
SENSN
PWMPOW
GND
SW
RSTB
PWMDRV
VBAT
VREG
GND
GNDGND
TEST
FAIL SEL
ISETH
12k
ISETL
Fig.28 Non-used Inside REG
or operating under 5V application
VDET
LED1
LED2
LED3
LED4
LED5
LED6
10LED x 6parallel
Each 40mA
10F
RTR020N05
47m
Power
ON/OFF
200Hz
PWM
Fig.27 10
Battery
4.7H
2.2F *
2.2F *
SW
SENSP
SENSN
RSTB
PWMPOW
PWMDRV
VBAT
VREG
2.2F
GND
GND
GND
series x 6parallel LED current 30mA setting
GND
FAIL SEL
ISETH
ISETL
TEST
16k
Power control PWM application
* Please select the capacitor which the little bias fluctuation.
●Terminal processing
TEST pin= Connect to GND
N.C. = Nothing specified in particular. Open is recommended.
VREG= When IC is driving from the outside of 2.7~5.5V, short VBAT and VREG, and put the voltage to VREG
FAILSEL, PWMDRV= Connect to GND in case of fixing at L level. Connect to VREG of IC or the power supply of more
than 1.4V in case of fixing at H level .
LED1-6= When each LED driver are not used, connect to GND of IC
GND = Each GND is connecting inside IC, but, connect to GND of all board
RSTB= RSTB is used as a power supply of internal circuit.
So, you mustn’t input RSTB voltage with pull up resistor of several k. And, please care about the relation between VBAT
and RSTB enough. (ref. P9)
1) PWM current mode DC/DC converter
While BD6592MUV is power ON, the lowest voltage of LED1, 2, 3, 4, 5, 6 is detected, PWM duty is decided to be 0.5V and
output voltage is kept invariably. As for the inputs of the PWM comparator as the feature of the PWM current mode, one is
overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that
controls the inductor current into Slope waveform to prevent sub harmonic oscillation. This output controls external Nch Tr
via the RS latch. In the period where external Nch Tr gate is ON, energy is accumulated in the external inductor, and in the
period where external Nch Tr gate is OFF, energy is transferred to the output capacitor via external SBD.
BD6592MUV has many safety functions, and their detection signals stop switching operation at once.
2) Soft start
BD6592MUV has soft start function.
The soft start function prevents large coil current.
Rush current at turning on is prevented by the soft start function.
After RSTB is changed L H, when PWMPOW is changed L H, soft start becomes effective for within 1ms and soft start
doesn't become effective even if PWMPOW is changed L H after that.
And, when the H section of PWMPOW is within 1ms, soft start becomes invalid when PWMPOW is input to H more than
three times. The invalid of the soft start can be canceled by making RSTB L.
3) FAILSEL pin
When the error condition occurs, boost operating is stopped by the protection function, and the error condition is avoided.
On that occasion, the way to stop of boost operating by the protection function can be selected with FAILSEL pin. Details
are as shown in Fig.29, 30.
After power ON, when the protection function is operating under about 1ms have passed, the stop state of the boost
operating can be held through FAILSEL is H, the stop state can reset through RSTB is L.
And, boost operating is stopped when the protection function is operating through FAILSEL is L, but when the protection
function becomes un-detect, boost operating is started again. It never keeps holding the stop state of boost operating.
In PWM control by PWMDRV can’t use this function.
When it is off over 10ms on PWM control by PWMPOW using this function, it may be stopped the boost operating as
over current protection work at off on PWMPOW=L.
Object of protect function is as shown below.
・ Over-voltage protection
・ External SBD open detect
・ Thermal shutdown
・ LED terminal over-voltage protection
・ Over current limit
<FAILSEL=H>
RSTB
“H”
FAIL SEL
Protection
function
Boost
operating
<FAILSEL =L>
RSTB
Protection
“L”
function
Boost
operating
about 1ms
un-operating range
un-detection un-detection
normal operating off boost stop
about 1ms
un-operating range FAILSEL
un-detectio
normal operating off
detection
detection
boost stop
un-detection
normal
o
eratin
off
off normal operating
normal
< When it is off on PWMPOW>
RSTB
PWMDRV
PWMPOW
Outpu
voltage
Coil current
FAI LS EL
function
< When it is off on RSTB>
RSTB
PWMDRV
PWMPOW
Outpu
voltage
Coil current
FAI LS EL
function
invalid valid
invalid
Fig.29 FAILSEL operating description Fig.30 FAILSEL=H light off control
4) External SBD open detect and over voltage protection
BD6592MUV has over boost protection by external SBD openand over voltage protection. It detects VDET voltage and is
stopped output Tr in abnormal condition. Details are as shown below.
External SBD open detect
In the case of external SBD is not connected to IC, the coil or external Tr may be destructed. Therefore, at such an error
as VOUT becoming 0.1V or below, the Under Detector shown in the figure works, and turns off the output Tr, and
prevents the coil and the IC from being destructed.
And the IC changes from activation into non-activation, and current does not flow to the coil (0mA).
Over voltage protection
At such an error of output open as the output DC/DC and the LED is not connected to IC, the DC/DC will boost too much
and the VDET terminal exceed the absolute maximum ratings, and may destruct the IC.
Therefore, when VDET becomes sensing voltage or higher, the over voltage limit works, and turns off the output Tr, and
the pressure up made stop.
At this moment, the IC changes from activation into non-activation, and the output voltage goes down slowly. And, when
the output voltage becomes the hysteresis of the over voltage limit or below, the output voltage pressure up to sensing
voltage once again and unless the application error is recovered, this operation is repeated.
5) Thermal shut down
BD6592MUV has thermal shut down function.
The thermal shut down works at 175C or higher, and the IC changes from activation into non-activation. Because
non-activation is different from RSTB=L, it doesn’t’ be reset inside IC. Moreover, even if thermal shut down function works,
soft start, FAILSEL, selection the number of LED lines of the current driver and starting current setting at PWMDRV=L
related RSTB are hold.
6) Over Current Limit
Over current flows the current detection resistor that is connected to switching transistor source and between GND,
SENSP pin voltage turns more than detection voltage, over current protection is operating and it is prevented from flowing
more than detection current by reducing ON duty of switching Tr without stopping boost.
As over current detector of BD6592MUV is detected peak current, current more than over current setting value does not flow.
And, over current value can decide freely by changing over current detection voltage.
<Derivation sequence of detection resistor>
Detection resistor =Over current detection voltage / Over current setting value
TYP value of over current detection voltage is 100mV, MIN = 70mV and MAX = 130mV and after the current value which
was necessary for the normal operation was decided, detection resistor is derived by using MIN value of over current
detection value.
For example, detection resistor when necessary current value was set at 1A is given as shown below.
Detection resistor =70mV / 1A = 70m
MAX current dispersion of this detection resistor value is
MAX current = 130mV / 70m = 1.86A
<The estimate of the current value which need for the normal operation >
As over current detector of BD6592MUV is detected the peak current, it have to estimate peak current to flow to the coil by
operating condition.
In case of, ○ Supply voltage of coil = VIN ○ Inductance value of coil = L
○ Switching frequency = fsw MIN=0.8MHz, Typ=1MHz, MAX=1.2MHz
○ Output voltage = VOUT
○ Total LED current = IOUT
○
○ Efficiency = eff (Please set up having margin, it refers to data on p.3.)
○ ON time of switching transistor = Ton
Ton=(Iave × (1-VIN/VOUT) × (1/fsw) × (L/VIN) × 2)
Each current is calculated.
As peak current varies according to whether there is the direct current superposed, the next is decided.
(1-VIN/VOUT) × (1/fsw) < Ton peak current = Ipeak /2 + Iave
(1-VIN/VOUT) × (1/fsw) > Ton peak current = Ipeak
= 0.41µs
(1-VIN/VOUT) × (1/fsw)=0.69µs > Ton
Peak current = 12V/4.7µH × 0.41µs = 1.05A
When too large current is set, output overshoot is caused, be careful enough because it is led to break down of the IC in
case of the worst.
●Operating of the application deficiency
1) When 1 LED or 1parallel OPEN during the operating
In case of FAILSEL=L, the LED parallel which became OPEN isn't lighting, but other LED parallel is lighting. At that time,
output boosts up to the over voltage protection voltage 44.7V so that LED terminal may be 0V or it boost to the output voltage
that LED terminal voltage becomes LED terminal over voltage protection 11.5V or it becomes the output voltage restricted
by the over current limit.In case of FAILSEL=H, boost stops when LED becomes OPEN and all LED turns off the lights.
2) When LED short-circuited in the plural
In case of FAILSEL=L, all LED is turned on unless LED terminal voltage is LED terminal over voltage protection of more than 11.5V.
When it was more than 11.5V only the line which short-circuited is turned on normally and LED current of other lines fall or
turn off the lights.In case of FAILSEL=H, boost stops at more than 11.5V and all LED turns off the lights.
3) When Schottky diode came off
Regardless of FAILSEL, all LED isn't turned on. Also, IC and a switching transistor aren't destroyed because boost
operating stops by the Schottky diode coming off protected function.
4) When over current detection resistor came off
Regardless of FAILSEL, all LED isn't turned on. Because the resistance of 100k is between SENSP and SENSN terminal,
over current protection works instantly and LED current can't be flow.
●Control signal input timing
VBAT
RSTB
5V 2.7V
2
1
PWM POW
PWMDRV
VR EG
DC/DC VOUT
Fig.31 Control signal timing Fig.32 Voltage with a control sign higher than VBAT
5V Min. 100 µs
220
5V
0V
VBAT
PIN
Rin
GND
Example corresponding to application of conditions
In case you input control signs, such as RSTB, PWMPOW, and PWMDRV, in the condition that the standup of supply voltage
(VBAT) is not completed, be careful of the following point.
① Input each control signal after VBAT exceeds 2.7V.
② Please do not input each control sign until VBAT exceeds HI voltage of RSTB, PWMPOW, and PWMDRV.
③ When you input RSTB during the standup of VBAT and HI voltage is inputted into PWMPOW, please give the standup
time to stable voltage as Min.100µs 2.7V of VBAT.
There is no timing limitation at each input signal of RSTB, PWMPOW and PWMDRV.
If each control sign changes into a condition lower than VBAT in (1) and (2), it goes via the ESD custody diode by the side of
VBAT of each terminal. A power supply is supplied to VBAT and there is a possibility of malfunctioning. Moreover, when the
entrance current to the terminal exceeds 50mA, it has possibility to damage the LSI. In order to avoid this condition, as
shown in the above figure, please insert about 220ohm in a signal line, and apply current qualification. Please confirm an
internal pull down resistor in the block diagram and electrical property of P.5.
●Attendance point of the restriction resistance input to RSTB
When the restriction resistance is input to RSTB, it is necessary to
250
consider the input current of RSTB.
The input current of RSTB changes that depending on the
power-supply voltage and the temperature reference to Fig.33.
A]
200
µ
Because the temperature characteristic of the input current is
shown in Fig.33, please choose resistance for which the voltage
input current[
RSTB
150
100
of the terminal can be guaranteed to 2.1V or more.
And, it has the margin in the decision of resistance, and please
confirm and make sure it is no problem in a real application.
BD6592MUV
Power supply
for RSTB
Limit resistor
terminal
RSTB inflow current
The decision example of restriction resistance
RSTB
50
2.12.42.733.33.6
RSTB[ V]
Fig.33 RSTB terminal voltage-RSTB inflow current
(At the time of the current driver six lines use)
1. When use the current driver of 6 parallel
2.9V(to RSTB power-supply) - restriction resistance value × 124A(100℃ input current) > 2.1V
restriction resistance value < (2.9-2.1)/124A=6.45k
2. 2. When use the current driver of 3 parallel
2.9V(to RSTB power-supply) - restriction resistance value × 430A(100℃ input current) > 2.1V
restriction resistance value < (2.9-2.1)/430A=1.86k
In addition, the selection number of parallel number of the current driver is changed, the power-supply current of RSTB will
be increased. Because the maximum value of the consumption current at the RSTB=2.1V is indicated in the following Table
1, be careful enough when you calculate the restriction resistance.
Table1. The use parallel number of current driver at RSTB=2.1V , 100℃ vs. RSTB input current
Parallel numbers used for current driver RSTB input current
6 0.12mA
5 0.23mA
4 0.33mA
3 0.43mA
2 0.53mA
1 0.63mA
0 0.74mA
●How to select the number of LED lines of the current driver
When the number of LED lines of the current driver is reduced, the un-select can be set the matter that the unnecessary
LED1 ~ 6 terminal is connected to GND.When it uses with 4 lines and so on, it can correspond to it by connecting 2
unnecessary lines to GND.RSTB is used as a power supply of this decision circuit. The select of the terminal is judged, It has
no relation to the logic of PWMPOW and PWMDRV and it isn't judged an unnecessary LED line even if it is connected to
GND when it is judged a necessary terminal once. This information can be reset by setting RSTB at 0V.
●Start control and select LED current driver
BD6592MUV can control the IC system by RSTB, and IC can power off compulsory by setting 0.2V or below. Also, It powers
on PWMPOW is at more than 1.4V and RSTB is at more than 2.25V.
When RSTB=PWMPOW=H, ISETH current is selected at PWMDRV=H and ISETL current is selected at PWMDRV=L.
The starting current in PWMDRV=L sets OFF second time rise of PWMDRV and it becomes 0mA setting after that.
After RSTB sets L once, the starting current can be flowed again by changing it to H.
RSTB PWMPOW PWMDRV IC LED current
H L L Off OFF
H H L On Starting current decided with ISETL
H L H Off OFF
H H H On Current decided with ISETH
●Start to use PWMPOW terminal for the PWM control, PWM operating
After RSTB and PWMDRV is changing L H, input PWM to PWMPOW terminal.
There is no constraint in turn of RSTB and PWMDRV.
And, because it corresponds to PWM drive of shorter ON time than soft start time (1ms), when PWMPOW is input H more
than three times, the soft start is invalidated and it enable to correspond the high-speed drive. Until RSTB is set L,
invalidation of the soft start isn't canceled.
In case of lighting light off lighting, when it turns off the lights with PWM=L and It starts without soft start when it sets
PWM modulated light again.
But the peak current of the coil changes owing to discharge of output capacitor, It may flow to the over current limit value, as
follows Fig.34. Because soft start can be used when it turns off the lights with RSTB=L, The peak current of the coil can be
suppressed, as follows Fig.35 and this process of light off is recommended.
Technical Note
Output
Fig.34 Light off control of PWMPOW pin at PWM control on PWM=L
PWMPOW
Output Voltage
Current coil
Fig.35 Light off control of PWMPOW pin at PWM control on RSTB=L
●Start to use PWMDRV terminal for the PWM control, PWM operating
After RSTB and PWMPOW is changing L H, input PWM to PWMDRV terminal.
There is no constraint in turn of RSTB and PWMPOW.
When resistance is set as ISET, after RSTB and PWMPOW is changing L H as follows Fig.36, when it is not input PWM to
PWMDRV pin but input L, boost of DC/DC is unstable state because current driver doesn’t pass current.
The starting current is pulled from each LED terminal and pressure up operating is stabilized to escape from this state.
Also, the starting current can be set up by the resistance value connected to the ISETL terminal.
After starting, as the starting current in PWM brightness control become useless, the starting current is set up 0mA at the
second rise time of PWMDRV automatically as follows Fig.37.
In case of lighting light off lighting, when it turns off the lights with PWM=L and It starts without soft start because of soft
start period was end when it sets PWM modulated light again.
But the peak current of the coil changes owing to discharge of output capacitor, It may flow to the over current limit value, as
follows Fig.37. Because soft start can be used when it turns off the lights with RSTB=L, The peak current of the coil can be
suppressed, as follows Fig.38 and this process of light off is recommended.
Output voltage
Current driver o
starting current
RSTB
PWMPOW
PWMDRV
LED pin
L HLHLH L
ON OFFONOFF
Fig.36 Off timing of starting current at PWMDRV=L
Output Voltage
Fig.37 Light off control of PWMDRV pin at PWM control on PWM=L
Output Voltage
Fig.38 Light off control of PWMDRV pin at PWM control on RSTB=L
There are two dimming method is available, first method is analog dimming that apply analog voltage to ISET terminal, and
second method is PWM control via digital dimming of PWMPOW or PWMDRV.Because each method has the different merit,
please choose a suitable method for the application of use.
Two techniques can be used as digital dimming by the PWM control One is PWM control of current driver, the other is PWM
control of power control.
As these two characteristics are shown in the below, selects to PWM control process comply with application.
•Efficiency emphasis in the low brightness which has an influence with the battery life 2) Power control PWM control
•LED current dispersion emphasis in the PWM brightness control 1) Current driver PWM control
(Reference)
PWM regulation process
Current driver 70% 0.2%
Power control 93% 0.5%
1) Current driver PWM control is controlled by providing PWM signal to PWMDRV, as it is shown Fig.25.
The current set up with ISETH is chosen as the Hi section of PWMDRV and the current is off as the Lo section. Therefore,
the average LED current is increasing in proportion to duty cycle of PWMDRV signal. This method that it lets internal
circuit and DC/DC to work, because it becomes to switch the driver, the current tolerance is a few when the PWM
brightness is adjusted, it makes it possible to brightness control until 20µs (MIN0.4% at 200Hz). And, don't use for the
brightness control, because effect of ON/OFF changeover is big under 20µs ON time and under 20µs OFF time. There is
no effect of ON/OFF changeover at 0% and 100%, so there is no problem on use. Typical PWM frequency is
100Hz~10kHz. When resistance is set as ISET, RSTB sets H L, so the starting current may be effective, after RSTB
sets L H, it becomes PWM of the starting current and PWM of ISETH setting current to PWM two times.
2) Power control PWM control is controlled by providing PWM signal to PWMPOW, as it is shown Fig.27. The current setting
set up with PWMDRV logic is chosen as the Hi section and the current is off as the Lo section. Therefore, the average LED
current is increasing in proportion to duty cycle of PWMPOW signal. This method is, because IC can be power-off at
off-time, the consumption current can be suppress, and the high efficiency can be available, so it makes it possible to
brightness control until 50µs (MIN1% at 200Hz). And, don't use for the brightness control, because effect of power
ON/OFF time changeover is big under 50µs ON time and under 50µs OFF time.
There is no effect of ON/OFF changeover at 0% and 100%, so there is no problem on use. Typical PWM frequency is
100Hz~1kHz. Also, PWM can't control RSTB and PWMPOW at the same time.
After RSTB sets H, control PWM only PWMPOW.
LED current can set up Normal and Starting setting current.
LED current can set up Normal current by resistance value (RISETH) connecting to ISETH voltage and LED current can set
Starting current by resistance value (RISETL) connecting to ISETL voltage.
Setting of each LED current is given as shown below.
Normal current = 20mA(24k/RISETH) Starting constant current = 0.6/RISET L
Also, Normal current setting range is 10mA~25mA, Starting current setting range is OFF setting or 1µA~100µA.
LED current can set OFF setting by open setting ISETL pin.
LED current becomes a leak current MAX 1µA at OFF setting.
ISETH Normal current setting example ISETL Starting current setting example
RISETH LED current RISETL LED current
12k (E12) 40mA
16 k (E16) 30mA
24k (E24) 20mA
25.5 k (E96) 18.8mA
27 k (E12) 17.8mA
30k (E24) 16.0mA
6.2k (E24) 97µA
10k (E6) 60µA
47k (E6) 13µA
100 k (E6) 6µA
560 k (E12) 1.1µA
Connect to VREG pin0mA
●The separations of the IC Power supply and coil Power supply
This IC can work in separating the power source in both IC power supply and coil power supply. With this application, it can
obtain that decrease of IC power consumption, and the applied voltage exceeds IC rating 22V.
That application is shown in below Fig 41. The higher voltage source is applied to the power source of coil that is connected
from an adapter etc. Next, the IC power supply is connected with a different coil power supply. Under the conditions for
inputting from 2.7V to 5.5V into IC VBAT, please follow the recommend design in Fig 38. It connects VBAT terminal and
VREG terminal together at IC outside.
When the coil power supply is applied, it is no any problem even though IC power supply is the state of 0V. Although IC
power supply is set to 0V, pull-down resistance is arranged for the power off which cuts off the leak route from coil power
supply in IC inside, the leak route is cut off. And, there is no power on-off sequence of coil power supply and IC power supply.
Coil Power supply
7V to 28V
Battery
10F
RTR020N05
47m
IC Power supply
2.7V to 5.5V
Power
ON/OFF
200Hz
PWM
1F
4.7H
2.2F
SENSP
SENSN
PWMPOW
GND
SW
RSTB
PWMDRV
VBAT
VREG
2.2F
GND
FAIL SEL
ISETH
TEST
GNDGND
12k
ISETL
VDET
LED1
LED2
LED3
LED4
LED5
LED6
10LED x 6列
40mA
各
Fig.42 Application at the time of power supply isolation
The DC/DC is designed by more than 4.7µH. When L value sets to a lower value, it is possibility that the specific
sub-harmonic oscillation of current mode DC / DC will be happened.
Please do not let L value to 3.3µH or below.
And, L value increases, the phase margin of DC / DC becomes to zero. Please enlarge the output capacitor value when you
increase L value.
This value is just examples, please made sure the final judgment is under an enough evaluation.
●PCB layout
In order to make the most of the performance of this IC, its PCB layout is very important. Characteristics such as efficiency
and ripple and the likes change greatly with layout patterns, which please note carefully.
to Power Suppl
CIN
L
PWMReset
C
BAT
C
REG
C
SBD
OUT
Tr
to Cathode
of LED
R
to GND
SENSE
VDET
N.C.
GND
SW
SENSP
TEST
VBAT
SENSN
PWMPO
GND
VREG
ISETH
RSTB
ISETL
GND
PWMDRV
FAI LSE L
LED6
LED5
LED4
GND
LED3
LED2
LED1
to Anode
of each LED
RISET
Fig.42 Layout
Connect the input bypath capacitor CIN(10µF) nearest to coil L, as shown in the upper diagram.
Wire the power supply line by the low resistance from CIN to VBAT pin. Thereby, the input voltage ripple of the IC can be
reduced. Connect smoothing capacitor CREG of the regulator nearest to between VREG and GND pin, as shown in the
upper diagram. Connect schottky barrier diode SBD of the regulator nearest to between coil L and switching transistor Tr.
And connect output capacitor COUT nearest to between CIN and GND pin. Thereby, the output voltage ripple of the IC can
be reduced.
Connect switching transistor Tr nearest to SW pin. Wire coil L and switching transistor Tr, current sensing resistor R
the low resistance. Wiring to the SENSP pin isn't Tr side, but connect it from R
low when wiring from Tr side. Connect R
wiring from R
pin to GND pin. And R
SENSE
of GND side isolated to SENS pin. Don’t wire between R
SENSE
GND line must be wired directly to GND pin of output capacitor. It has the
SENSE
side. Over current value may become
SENSE
and SNESN pin
SENSE
possibility that restricts the current drive performance by the influence of the noise when other GND is connected to this
GND.
Connect LED current setting resistor RISET nearest to ISET pin. There is possibility to oscillate when capacity is added to
ISET terminal, so pay attention that capacity isn't added. And, RISET of GND side must be wired directly to GND pin.
When those pins are not connected directly near the chip, influence is given to the performance of BD6592MUV, and may
limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to reduce
electric power consumption and increase the entire efficiency.
The layout pattern in consideration of these is shown in next page.
2.2F 50V MURATA GRM31CB31H225K3.2 1.6 1.6±0.2 B +/-10%
0.33F 50V MURATA GRM219B31H334K2.0 1.25 0.85±0.1 B +/-10%
・Resistor
Val ue Tolerance Manufacturer Product number
[ Resistor for LED current decision <ISETH pin> ]
16k ±0.5% ROHM MCR006YZPD1630.6 0.3 0.23±0.03
[ Resistor for over current decision <SENSP pin> ]
47m ±1% ROHM MCR10EZHFSR047 2.0 1.25 0.55±0.1
・SBD
Pressure Manufacturer Product number
60V ROHM RB160M-60 3.5 1.6 0.8±0.1
・MOS FET Nch
Pressure Manufacturer Product number
45V ROHM RTR020N05 2.8 2.9 1.0 2A 2.5V
60V ROHM RSS065N06 6.0 5.0 1.75 6.5A 4.0V
Vertical Horizontal Height (MAX)
Vertical HorizontalHeight
Vertical HorizontalHeight
Vertical HorizontalHeight
Vertical
Size
Size
Size
Size
Size
HorizontalHeight
Technical Note
DC current
(mA)
TC
Current
ability
DCR
()
Cap
Tolerance
Driving
voltage
The coil is the part that is most influential to efficiency. Select the coil whose direct current resistor (DCR) and current inductance characteristic is excellent. BD6592MUV is designed for the inductance value of 4.7µH.
Don’t use the inductance value less than 2.2µH. Select a capacitor of ceramic type with excellent frequency and temperature
characteristics.Further, select Capacitor to be used with small direct current resistance, and pay sufficient attention to the
PCB layout shown in P.16.
●About heat loss
In heat design, operate the DC/DC converter in the following condition.
(The following temperature is a guarantee temperature, so consider the margin.)
1. Periphery temperature Ta must be less than 85℃.
2. The loss of IC must be less than dissipation Pd.
Control LED current to charged D/A voltage.
Show application example and typ control.
Please decide final value after you evaluated application, characteristic.
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If
any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the
capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus
determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the
guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of
the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic cap
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 175℃ (typ) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not
aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or
use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(14) Selection of coil
Select the low DCR inductors to decrease power loss for DC/DC converter.
acitor as the external capacitor, determine the constant with consideration given to a
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