BD6581GU is white LED driver IC with PWM step-up
DC/DC converter that can boost max 42.5V and
current driver that can drive max 25mA. The wide and
precision brightness can be controlled by external
PWM pulse.
BD6581GU has very accurate current drivers, and it
has few current errors between each strings.
So, it will be helpful to reduce brightness spots on the
LCD.
Small package type is suited for saving space.
●Features
High efficiency PWM step-up DC/DC converter
(fsw=1MHz), max efficiency 93%
High accuracy & good matching (±1.5%) current
drivers 6ch
Drive up to 12
*
in series, 6 strings in parallel =72
white LEDs (*white LED Vf=3.5Vmax)
Rich safety functions
・Over-voltage protection (OVP)
・Over current limit
・External SBD open detect
・Thermal shutdown
●Ty pical A pplication Circuit
Battery
10F
RTR020N05
m
Powe r
ON/OFF
200Hz
PWM
1F
4.7H
2 .2F *
SW
SENSP
SENSN
RST
PWMPOW
PWMDRV
VBAT
VREG
GN
Figure 1. Typical Application Circuit
BD6581GU
TEST
GNDGND
●Key Specification
Operating power supply voltage range: 2.7V ~ 22.0V
Quiescent Current 1: 0.6A (Typ.)
Quiescent Current 2: 4.6A (Typ.)
Operating temperature range: -30℃ ~+85℃
●Package W(Typ.) x D(Typ.) x H(Max.)
VCSP85H2: 2.60mm x 2.60mm x 1.00mm
[bottom view]
ELED6 LED5 LED4 LED3 LED2
DRSTB GND FAILSEL GND LED1
CVBAT PWMPOW VREG ISETL PWMDRV
BN.C - TEST ISETH GND
AVDET N.C SW SENSP SENSN
●Application
All middle size LCD equipments backlight of Notebook
PC, portable DVD player, car navigation systems, etc.
FAILSEL
VDET
Each 20mA
ISET H
24k
ISETL
LED1
LED2
LED3
LED4
LED5
LED6
Datashee
1 2 3 4 5
10LED x 6parallel
○Product structure:Silicon monolithic integrated circuit○This product is not designed protection against radioactive rays
www.rohm.com
Terminal voltage 2 VMAX2 25 V LED1, LED2, LED3, LED4, LED5, LED6, VBAT
Terminal voltage 3 VMAX3 50.5 V VDET
Power dissipation 1 Pd1 1100 mW*1
Operating temperature range Topr -30 to +85
℃
Storage temperature range Tstg -55 to +150 ℃
*1 This value is the measurement value that was mounted on the PCB by ROHM.
Temperature deleting: 8.8mW/ ℃ from Ta>25℃
-
-
●Recommended Operating Rating (Ta=-30℃ to +85℃)
Parameter Symbol
Min. Typ. Max.
Limits
UnitCondition
Power supply voltage VBAT 2.7 12.0 22.0 V
●Electrical Characteristic
(Unless otherwise specified, VBAT=12V, RSTB=2.5V, Ta = +25
Parameter Symbol
Min. Typ. Max.
Limits
℃)
UnitCondition
[FAILSEL,PWMDRV Terminal]
EN threshold voltage (Low) VthL 0 - 0.2 V
EN threshold voltage (High) 1 VthH1 1.4 - 5.0 V VBAT>5.0V
EN threshold voltage (High) 2 VthH2 1.4 - VBATV VBAT<5.0V
EN terminal input current Iin - 8.3 14.0 µA Input=2.5V
[PWMPOW Terminal]
Low Input Voltage range PWML 0 - 0.2 V
High Input Voltage range1 PWMH1 1.4 - 5.0 V VBAT>5.0V
High Input Voltage range2 PWMH2 1.4 - VBATV VBAT<5.0V
PWM pull down resistor PWMR 300 500 700 k
[RSTB Terminal]
Low Input Voltage range RSTBL 0 - 0.2 V
High Input Voltage range1 RSTBH1 2.25 2.5 5.0 V VBAT>5.0V
High Input Voltage range2 RSTBH2 2.25 2.5 VBATV VBAT<5.0V
Current Consumption IRSTB - 89 134 µARSTB=2.5V, LED1-6=3V
[Regulator]
VREG Voltage VREG 4.0 5.0 6.0 V No load
Under Voltage Lock Out UVLO 2.05 2.25 2.65 V
(Unless otherwise specified, VBAT=12V, RSTB=2.5V, Ta = +25 ℃)
Parameter Symbol
[Switching Regulator]
Quiescent Current 1 Iq1 - 0.6 3.4 µARSTB=0V, VBAT=12V
Quiescent Current 2 Iq2 - 4.6 10 µARSTB=0V, VBAT=22V
Current Consumption Idd - 3.4 5.1 mA VDET=0V,ISETH=24k
LED Control voltage VLED 0.4 0.5 0.6 V
Over Current Limit voltage Ocp 70 100 130 mV *1
SBD Open Protect Sop - - 0.1 V Detect voltage of VDET pin
Switching frequency fSW 0.8 1.0 1.2 MHz
Duty cycle limit Duty 92.5 95.0 99.0 %LED1-6=0.3V
Over voltage limit Ovl 43.0 44.7 46.4 V LED1-6=0.3V
[Current driver]
LED maximum current ILMAX - - 25 mA
Min. Typ. Max.
Limits
UnitCondition
Datasheet
LED current accuracy ILACCU - - ±3 %ILED=16mA
LED current matching ILMAT - - ±1.5 %
ISET voltage Iset 0.5 0.6 0.7 V
LED current limiter ILOCP 35 60 90 mA
LED Terminal Over Voltage Protect LEDOVP 10.0 11.5 13.0 V RSTB=PWMDRV=2.5V
*1 This parameter is tested with dc measurement.
Each LED current/Average (LED1- 6)
ILED=16mA
Current limit value at ISET
resistance 4.7k setting
LED1, 2, 3, 4, 5, 6=0.5V
A1 VDET In Detect input for SBD open and OVP C
A2 N.C. - No connect pin F
A3 SW Out Switching Tr drive terminal G
A4 SENSP In + Side Current sense terminal G
A5 SENSN In - Side Current sense terminal A
B1 N.C. - No connect pin F
B3 TEST In TEST input (Pull down 100k to GND) G
B4 ISETH In Resistor connection for ,LED current setting at PWMDRV=H A
B5 GND - GND B
C1 VBAT In Battery input C
C2 PWMPOW In PWM input pin for power ON/OFF E
C3 VREG Out Regulator output / Internal power-supply D
C4 ISETL In Resistor connection for ,LED current setting at PWMDRV=L A
C5 PWMDRV In PWM input pin for power ON/OFF only driver E
D1 RSTB In Reset pin L :Reset H :Reset cancel E
D2 GND - GND B
D3 FAILSEL In Latch selectable pin of protect function E
D4 GND - GND B
D5 LED1 In Current sink for LED1 C
E1 LED6 In Current sink for LED6 C
E2 LED5 In Current sink for LED5 C
E3 LED4 In Current sink for LED4 C
E4 LED3 In Current sink for LED3 C
E5 LED2 In Current sink for LED2 C
1) PWM current mode DC/DC converter
While BD6581GU is power ON, the lowest voltage of LED1, 2, 3, 4, 5, 6 is detected, PWM duty is decided to be 0.5V a nd
output voltage is kept invariably. As for the inputs of the PWM comparator as the feature of the PWM current mode, one is
overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that
controls the inductor current into Slope waveform to prevent sub harmonic oscillatio n. This output controls external Nch
Tr via the RS latch. In the period where external Nch Tr gate is ON, energy is accumulated in the external inductor, and in
the period where external Nch Tr gate is OFF, energy is transferred to the output capacitor via external SBD.
BD6581GU has many safety functions, and their detection signals stop switching operation at once.
2) Soft start
BD6581GU has soft start function.
The soft start function prevents large coil current.
Rush current at turning on is prevented by the soft start function.
After RSTB is changed L H, when PWMPOW is changed L H, soft start becomes effective for within 1ms and soft
start doesn't become effective even if PWMPOW is changed L H after that.
And, when the H section of PWMPOW is within 1ms, soft start becomes invalid when PWMPOW is input to H more than
three times. The invalid of the soft start can be canceled by making RSTB L.
3) FAILSEL pin
When the error condition occurs, boost operating is stopped by t he protecti on functi on, an d the error con dition is av oid ed.
On that occasion, the way to stop of boost operating by the protection function can be s elected with FAILSEL pin. Details
are as shown in Figure 26, 27.
After power ON, when the protection function is operating under about 1ms have passed, the stop state of the boost
operating can be held through FAILSEL is H, the stop state can reset through RSTB is L.
And, boost operating is stopped when the protection function is operating t hrough FAILSEL is L, but when the protection
function becomes un-detect, boost operating is started again. It never keeps holding the stop state of boost operating.
In PWM control by PWMDRV can’t use this function.
When it is off over 10ms on PWM control by PWMPOW using this function, it may be stopped the boost operating
as over current protection work at off on PWMPOW=L.
Object of protect function is as shown below.
・Over-voltage protection
・External SBD open detect
・Thermal shutdown
・LED terminal over-voltage protection
・Over current limit
<FAILSEL=H>
RSTB
“H”
FAILSEL
Protection
function
Boost
operating
<FAILSEL=L>
RSTB
Protection
func tion
operating
“L”
Boost
about 1ms
un-operating ran ge
un-detection un-detection
normal operating off boost stop
about 1ms
un-operating range FAILSEL
un-detectio
normal operating off
detection
detection
boost stop
un-detection
normal
erating
o
off normal operating
off normal
< When it is off on PWMPOW>
RSTB
PWMDRV
PWMPOW
Output
voltage
Coil current
FAILSEL
function
< When it is off on RSTB>
RSTB
PWMDRV
PWMPOW
Output
voltage
Coil current
FAILSEL
function
invalid valid
invalid
Figure 26. FAILSEL operating description Figure 27. FAILSEL=H light off control
4) Extern al SBD open detect and over voltage protection
BD6581GU has over boost protection by external SBD open an d over voltage protection. It detects VDET voltage and is
stopped output Tr in abnormal condition. Details are as shown below.
・External SBD open detect
In the case of external SBD is not connected to IC, the coil or external Tr may be destructed. Therefore, at such an
error as VOUT becoming 0.1V or below, the Under Detector shown in the figure works, and turns off the output Tr, and
prevents the coil and the IC from being destructed.
And the IC changes from activation into non-activation, and current does not flow to the coil (0mA).
・Over voltage protection
At such an error of output open as the output DC/DC and the LED is not connected to IC, the DC/DC will boost too
much and the VDET terminal exceed the absolute maximum ratings, and may destruct the IC. Therefore, when VDET
becomes sensing voltage or higher, the over voltage limit works, and turns off the output Tr, and the pressure up made
stop.
At this moment, the IC changes from activation into non-activation, and the output voltage goes down slowly. And,
when the output voltage becomes the hysteresis of the over voltage limit or below, the output voltage pressure up to
sensing voltage once again and unless the application error is recovered, this operation is repeated.
5) Thermal shut down
BD6581GU has thermal shut down function.
The thermal shut down works at 175°C or higher, and the IC changes from activation into non-activation. Because
non-activation is different from RSTB=L, it doesn’t’ be reset inside IC. Moreover, even if thermal shut down function works,
soft start, FAILSEL, selection the number of LED lines of the current driver and starting current setting at PWMDRV=L
related RSTB are hold.
6) Over Current L imit
Over current flows the current detection resistor that is connected to switching transistor source and between GND,
SENSP pin voltage turns more than detection voltage, over current protection is operating and it is prevented from
flowing more than detection current by reducing ON duty of switching Tr without stopping boost.
As over current detector of BD6581GU is detected peak current, current more tha n over current setting value does not
flow.
And, over current value can decide freely by changing over current detection voltage.
<Derivation sequence of detection resistor>
Detection resistor =Over current detection voltage / Over current setting value
TYP value of over current detection voltage is 100mV, MIN = 70mV and MAX = 130 mV and after the current value
which was necessary for the normal operation was decided, detection resistor is derived by using MIN value of ov er
current detection value.
For example, detection resistor when necessary current value was set at 1A is given as shown below.
Detection resistor =70mV / 1A = 70m
MAX current dispersion of this detection resistor value is
MAX current = 130mV / 70m = 1.86A
<The estimate of the current value which need for the normal operation >
As over current detector of BD6581GU is detected the peak current, it have to estimate peak current to flow to the coil
by operating condition.
In case of, Supply voltage of coil = VIN Inductance value of coil = L
Switching frequency = fswMIN=0.8MHz, T yp=1MHz, MAX=1.2MHz
Output voltage = VOUT Total LED current = IOUT
Average current of coil = Iave Peak current of coil = Ipeak
Efficiency = eff (Please set up having margin, it refers to data on page 7.)
O
Ipeak = (VIN / L) x (1 / fsw) x (1-(VIN / VOUT))
Iave=(VOUT x IOUT / VIN) / eff
Ton=(Iave x (1-VIN/VOUT) x (1/fsw) x (L/VIN) x 2)
Each current is calculated.
As peak current varies according to whether there is the direct current superposed, the next is decided.
(1-VIN/VOUT) x (1/fsw) < Ton peak current = Ipeak /2 + Iave
(1-VIN/VOUT) x (1/fsw) > Ton peak current = Ipeak
(Example 1)
In case of, VIN=6.0V, L=4.7µH, fsw=1MHz, VOUT=39V, IOUT=80mA, Efficiency=85%
Ipeak = (6.0V / 4.7µH) x (1 / 1MHz) x (1-(6.0V / 39V)) =1.08A
Iave = (39V x 80mA / 6.0V) / 85% = 0.61A
Ton = (0.61A x (1-6.0V / 39V) x (1 / 1MHz) x ( 4.7µH /6.0V) x 2)
(1-VIN/VOUT) x (1/fsw)=0.85µs < Ton
Peak current = 1.08A/2+0.61A = 1.15A
In case of, VIN=12.0V, L=4.7µH, fsw=1MHz, VOUT=39V, IOUT=80mA, Efficiency=85%
Ipeak = (12.0V / 4.7µH) x (1 / 1MHz) x (1-(12V / 39V)) =1.77A
Iave = (39V x 80mA / 12.0V) / 85% = 0.31A
Ton = (0.31A x (1-12 V / 39V) x (1 / 1MHz) x ( 4.7µH /12 V) x 2)
1/2
= 0.41µs
(1-VIN/VOUT) x (1/fsw)=0.69µs > Ton
Peak current = 12V/4.7µH x 0.41µs = 1.05A
*When too large current is set, output overshoot is caused, be careful enough because it is led to break down of the IC
in case of the worst.
●Operating of the Application Deficiency
1) When 1 LED or 1parallel OPEN during the operating
In case of FAILSEL=L, the LED parallel which became OPEN isn't lighting, but other LED parallel is lighting.
At that time, output boosts up to the over voltage protection voltage 44.7V so that LED terminal may be 0V or it boost to
the output voltage that LED terminal voltage becomes LED terminal over voltage protection 11.5V or it becomes the
output voltage restricted by the over current limit.
In case of FAILSEL=H, boost stops when LED becomes OPEN and all LED turns off the lights.
2) When LED short-circuited in the plural
In case of FAILSEL=L, all LED is turned on unless LED terminal voltage is LED terminal over voltage protection of more
than 11.5V. When it was more than 11.5V only the line which short-circuited is turned on normally and LED current of
other lines fall or turn off the lights. In case of FAILSEL=H, boost stops at more than 11.5V and all LED turns off the lights.
3) When Schottky diode came off
Regardless of FAILSEL, all LED isn't turned on. Also, IC and a switching transistor aren't destroyed because boost
operating stops by the Schottky diode coming off protected function.
4)When over current detection resistor came off
Regardless of FAILSEL, all LED isn't turned on. Because the resistance of 100k is between SENSP and SENSN
terminal, over current protection works instantly and LED current can't be flow.
●Control Signal Input Timing
2.7V
①
5V
②
③
Min. 100μs
5V
5V
0V
VBAT
220
PIN
Rin
VBAT
RSTB
PWMPOW
PWMDRV
VREG
DC/DC VOUT
Figure 28. control Signal timing
Figure 29. Voltage with a control sign higher than VBAT
Example corresponding to application of conditions
GND
In case you input control signs, such as RSTB, PWMPOW, and PWMDRV, in the condition that the standup of supply
voltage (VBAT) is not completed, be careful of the following point.
①Input each control signal after VBAT exceeds 2.7V.
②Please do not input each control sign until VBAT exceeds HI voltage of RSTB, PWMPOW, and PWMDRV.
③When you input RSTB during the standup of VBAT and HI voltage is inputted into PWMPOW,
please give the standup time to stable voltage as Min.100µs 2.7V of VBAT.
There is no timing limitation at each input signal of RSTB, PWMPOW and PWMDRV.
If each control sign changes into a condition lower than VBAT in (1) and (2), it goes via the ESD custody diode by the side
of VBAT of each terminal. A power supply is supplied to VBAT and there is a possibility of malfunctioning. Moreover, when
the entrance current to the terminal exceeds 50mA, it has possibility to damage the LSI. In order to av oid this condition, as
shown in the above figure, please insert about 220ohm in a signal line, and appl y current qualification. Please confirm an
internal pull down resistor in the block diagram and electrical property of P.5.
●How to Select the Number of LED Lines of the Current Driver
When the number of LED lines of the current driver is reduced, the un-s elect can be set the matter that the unnecessary
LED1 to 6 terminal is connected to GND. When it uses with 4 lines a nd so on, it can correspond to it by connecting 2
unnecessary lines to GND.
RSTB is used as a power supply of this decision circuit. The select of the terminal is j udged, It has n o relation t o the l ogic of
PWMPOW and PWMDRV and it isn't judged an unnecessary LED line even if it is connected to GND when it is judged a
necessary terminal once. This information can be reset by setting RSTB at 0V.
●Start Control and Select LED Current Driver
BD6581GU can control the IC system by RSTB, and IC can power off compulsory by setting 0.2V or below. Also, It powers
on PWMPOW is at more than 1.4V and RSTB is at more than 2.25V.
When RSTB=PWMPOW=H, ISETH current is selected at PWMDRV=H and ISETL current is selected at PWMDRV=L.
The starting current in PWMDRV=L sets OFF second time rise of PWMDRV and it becomes 0mA setting after that.
After RSTB sets L once, the starting current can be flowed again by changing it to H.
RSTB PWMPOW PWMDRV IC LED current
1 0 0 Off OFF
1 1 0 On Starting current decided with ISETL
1 0 1 Off OFF
1 1 1 On Current decided with ISETH
0 0, 1 0, 1 Off OFF
●Attendance Point of the Restriction Resistance Input to RSTB
When the restriction resistance is input to RSTB, it is necessary to consider the input current of RST B. The input current of
RSTB changes that depending on the power-supply voltage and the tempe r ature reference to Figure 30.
Because the temperature characteristic of the input current is shown in Figure 30, please choos e resistance for which the
voltage of the terminal can be guaranteed to 2.1V or more.
And, it has the margin in the decision of resistance, and please confirm and make sure it is no problem in a real application.
Figure 31. RSTB terminal voltage-RSTB inflow current
(At the time of the current driver six lines use)
Power supply
for RSTB
RSTB inflow current
In addition, the selection number of parallel number of the current driver is changed, the power-supply current of RSTB will
be increased. Because the maximum value of the consumption current at the RST B=2.1V is indicated i n the following Table
1, be careful enough when you calculate the restriction resistance.
Table. the use parallel number of current driver at RSTB=2.1V , 100℃ vs. RSTB input current
Parallel numbers used for current driver RSTB input current
●Start to Use PWMPOW Terminal for the PWM Control, PWM Operating
After RSTB and PWMDRV is changing L → H, input PWM to PWMPOW terminal.
There is no constraint in turn of RSTB and PWMDRV.
And, because it corresponds to PWM drive of shorter ON time than soft start time (1ms), when PWMPOW is input H more
than three times, the soft start is invalidated and it enable to correspond the high-speed drive. Until RSTB is set L,
invalidation of the soft start isn't canceled.
In case of lighting → light off → lighting, when it turns off the lights with PWM=L and It starts without soft start when it sets
PWM modulated light again.
But the peak current of the coil changes owing to discharge of output capacitor, It may flow to the over current limit value,
as follows Figure 32. Because soft start can be used when it turns off the lights with RSTB=L, The peak current of the coil
can be suppressed, as follows Figure 33 and this process of light off is recommended.
RSTB
PWMDR
PWMPO
OutputVoltage
Datasheet
Current
Figure 32. Light off control of PWMPOW pin at PWM control on PWM=L
Output Voltage
Current
Figure 33. Light off control of PWMPOW pin at PWM control on RSTB=L
●Start to Use PWMDRV Terminal for the PWM Control, PWM Operating
After RSTB and PWMPOW is changing L → H, input PWM to PWMDRV terminal.
There is no constraint in turn of RSTB and PWMPOW.
After RSTB and PWMPOW is changing L → H as follows Figure 34, when it is not input PWM to PWMDRV pin but input L,
boost of DC/DC is unstable state because current driver doesn’t pass current.
The starting current is pulled from each LED terminal and pressure up operating is stabilized to escape from this state.
Also, the starting current can be set up by the resistance value connected to the ISETL terminal.
After starting, as the starting current in PWM brightness control become useless, the starting current is set up 0mA at the
second rise time of PWMDRV automatically as follows Figure 34.
In case of lighting → light off → lighting, when it turns off the lights with PWM=L and It starts without soft start because of
soft start period was end when it sets PWM modulated light again.
But the peak current of the coil changes owing to discharge of output capacitor, It may flow to the over current limit value,
as follows Figure 35. Because soft start can be used when it turns off the lights with RSTB=L, The peak current of the coil
can be suppressed, as follows Figure 36 and this process of light off is recommended.
PWMPOW
PWMDRV
Output voltage
Current driver of
starting current
RSTB
L HL HL H L
LED pin
ON OFFONOFF
Figure 34. Off timing of starting current at PWMDRV=L
Output Voltage
Figure 35. Light off control of PWMDRV pin at PWM control on PWM=L
RSTB
PWMPOW
PWMDRV
Current
RSTB
coil
PWMPO
PWMDR
Output voltage
Coil curren
Figure 36. Light off control of PWMDRV pin at PWM control on RSTB=L
There are two dimming method is available, first method is analog dimming that apply analog voltage to ISET terminal, and
second method is PWM control via digital dimming of PWMPOW or PWMDRV. Because each method has the different
merit, please choose a suitable method for the application of use.
Two techniques can be used as digital dimming by the PWM control One is PWM control of current driver, the other is PWM
control of power control.
As these two characteristics are shown in the below, selects to PWM control process comply with application.
・Efficiency emphasis in the low brightness which has an influence with the battery life → 2) Power control PWM control
・LED current dispersion emphasis in the PWM brightness control → 1) Current driver PWM control
(Reference)
PWM regulation process
Current driver 70% 0.2%
Power control 93% 0.5%
1) Current driver PWM control is controlled by providing PWM signal to PWMDRV, as it is shown Figure 41.
The current set up with ISETH is chosen as the Hi section of PWMDRV and the current is off as the Lo section. Therefore,
the average LED current is increasing in proportion to duty cycl e of PWMDRV signal. This method that it lets internal
circuit and DC/DC to work, because it becomes to switch the driver, the current tolerance is a few when the PWM
brightness is adjusted, it makes it possible to brightness control until 50µs (MIN1% at 200Hz). And, don't use for the
brightness control, because effect of ISETH, ISETL changeover is big under 50µs ON time and under 50µs OFF time.
Typical PWM frequency is 100Hz to 10kHz. When RSTB sets H → L, so the starting current may be effective, after
RSTB sets L→ H, it becomes PWM of the starting current and PWM of ISETH setting current to PW M two times.
Efficiency of LED current 0.5mA
(PWM Duty=2.5%)
PWM frequency 200Hz
Limit dispersion capability of low duty
Datasheet
PWMDRV
LED current
Coil current
IC’s active current
Figure 37. PWM modulated light by PWM DRV Pin
2) Power control PWM control is controlled by providing PWM signal to PWMPOW, as it is shown Figure 43. The current
setting set up with PWMDRV logic is chosen as the Hi section and the current is off as the Lo section. Therefore, the
average LED current is increasing in proportion to duty cycle of PWMPOW signal. This method is, because IC can be
power-off at off-time, the consumption current can be suppress, and the high efficiency can be availa ble, so it makes it
possible to brightness control until 50µs (MIN1% at 200Hz). And, don't use for the brightness control, because effect of
power ON/OFF time changeover is big under 50µs ON time and under 50µs OFF time.
Typical PWM frequency is 100Hz to 1kHz. Also, PWM can't control RSTB and PWMPOW at the same time.
After RSTB sets H, control PWM only PWMPOW.
LED current can set up Normal and Starting setting current.
LED current can set up Normal current by resistance value (RISETH) connecting to ISETH voltage and LED current can set
Starting current by resistance value (RISETL) connecting to ISETL voltage.
Setting of each LED current is given as shown below.
Normal current = 20mA (24k/RISETH) Starting constant current = 0.6/RISET L
Also, Normal current setting range is 10mA to 25mA, Starting current setting range is OFF setting or 1µA to 100µA.
LED current can set OFF setting by open setting ISETL pin.
LED current becomes a leak current MAX 1µA at OFF setting.
ISETH Normal current setting example ISETL Starting current setting example
●The Separations of the IC Power Supply and Coil Power Supply
This IC can work in separating the power source in both IC power supply and coil po wer supply. With this application, it
can obtain that decrease of IC power consumption, and the applied voltage exceeds IC rating 22V.
That applicatio n is shown in below figure 39. The higher voltage source is applied to the power source of coil that is
connected from an ada pter etc. Next, the IC power supply is connected with a different coil power supply. Under the
conditi ons for inputting from 2.7V to 5.5V into IC VBAT, please follow the recommend desig n in figure 35. It connects
VBAT terminal and VREG terminal together at IC outside.
When the coil power supply is appl ied, it is no any problem even though IC power supply is the state of 0V. Although
IC power supply is set to 0V, pull-down resistance is arranged for the power off which cuts off the leak route from coil
power supply in IC inside, the leak route is cut off. And, there is no power on-off sequence of coil power supply and IC
power supply.
IC Power supply
Coil Power supply
7V to 28V
Battery
4.7H
10F
2.2F
RTR020N05
100m
Power
ON/OFF
200Hz
PWM
2.7V to 5.5V
1F
SW
SENSP
SENSN
RSTB
PWMDRV
PWMPOW
VBAT
VREG
GND
10LED x 6
FAILSEL
ISETL
ISETH
TEST
GND
GNDGND
24k
VDET
LED1
LED2
LED3
LED4
LED5
LED6
20mA each
Figure 39. Application at the time of power supply isolation
The DC/DC is designed by more than 4.7µH. When L value sets to a lower value, it is possibility that the specific
sub-harmonic oscillation of current mode DC / DC will be happened. Please do not let L value to 3.3µH or below.
And, L value increases, the phase margin of DC / DC becomes to zero. Please enlarge the output capacitor value when you
increase L value.
This value is just examples, please made sure the final judgment is under an enough evaluation.
●Layout
In order to make the most of the performance of this IC, its layout pattern is very important. Characteristics such as
efficiency and ripple and the likes change greatly with layout patterns, which please note carefully.
to Anode of each LED
E
Rese
PWM
C
D
BA
C
B
LED5 LED4 LED3 LED2 LED6
RSTB
GND FAILSEL GND LED1
VBAT
PWMPOW VREG ISETL PWMDRV
TEST ISETH
GND
C
REG
RISET
VDET SW SENSP SENSN
12345
SBD
T
R
SENSE
C
OUT
to GND
L
C
IN
to Cathode of LED
Figure 40. Layout
Connect the input bypath capacitor CIN(10µF) nearest to coil L, as shown in the upper diagram.
Wire the power supply line by the low resistance from CIN to VBAT pin. Thereby, the input voltage ripple of the IC can be
reduced. Connect smoothing capacitor CREG of the regulator nearest to between VREG and GND pin, as shown in the
upper diagram. Connect schottky barrier diode SBD of the regulator nearest to between coil L and switching transistor Tr.
And connect output capacitor COUT nearest to between CIN and GND pin. Thereby, the output voltage ripple of the IC can
be reduced.
Connect switching transistor Tr nearest to SW pin. Wire coil L and switching transistor Tr, current sensing resistor R
the low resistance. Wiring to the SENSP pin isn't Tr side, but connect it from R
low when wiring from Tr side. Connect R
pin wiring from R
pin to GND pin. And R
SENSE
of GND side isolated to SENS pin. Don’t wire between R
SENSE
GND line must be wired directly to GND pin of output capacitor. It
SENSE
side. Over current value may become
SENSE
and SNESN
SENSE
SENSE
by
has the possibility that restricts the current drive performance by the influence of the noise when other GND is connected to this
GND.Connect LED current setting resistor RISET nearest to ISET pin. There is possibility to oscill ate when capacity is
added to ISET terminal, so pay attention that capacity isn't added. And, RISET of GND side must be wired directly to
GND pin. When those pins are not connected directly near the chip, influe nce is given to the performance of BD6581GU,
and may limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to
reduce electric power consumption and increase the entire efficiency.
1F10V MURATA GRM188B10J105K 1.6 0.8 0.8±0.1 B +/-10%
[ Output capacitor ]
1F 50V MURATA GRM31MB31H105K3.2 1.6 1.15±0.1 B +/-10%
1F 50V MURATA GRM21BB31H105K2.0 1.25 1.25±0.1 B +/-10%
2.2F 50V MURATA GRM31CB31H225K 3.2 1.6 1.6±0.2 B +/-10%
0.33F 50V MURATA GRM219B31H334K2.0 1.25 0.85±0.1 B +/-10%
・Resistor
Value Tolerance Manufacturer Product number
[ Resistor for LED current decision <ISETH pin> ]
30k ±0.5% ROHM MCR006YZPD3030.6 0.3 0.23
[ Resistor for over current decision <SENSP pin> ]
100m ±1% ROHM MCR10EZHFSR100 2.0 1.25 0.55
・SBD
Pressure Manufacturer Product number
60V ROHM RB160M-60 3.5 1.6 0.8
・MOS FET Nch
Pressure Manufacturer Product number
45V ROHM RTR020N05 2.8 2.9 1.0 2A 2.5V
Vertical Horizontal
Vertical HorizontalHeight
Vertical HorizontalHeight
Vertical HorizontalHeight
Vertical HorizontalHeight
Height
(MAX)
Size
Size
Size
Size
DC
current
(mA)
Current
Datasheet
DCR
()
TC
Ability
Cap
Tol
Driving
Voltage
60V ROHM RSS065N06 6.0 5.0 1.75 6.5A 4.0V
The coil is the part that is most influential to efficiency. Select the coil whose direct current resist or (DCR) and current inductance characteristic is excellent. BD6581GU is designed for the inductance value of 4.7µH. Doesn’t use the
inductance value less than 2.2 µH. Select a capacitor of ceramic type with excellent frequency and temperature
characteristics. Further, select Capacitor to be used with small direct current resistance, and pay sufficient attention to the
layout pattern shown in P.20.
In board pattern design, the wiring of power supply line should be low Impedance, and put the bypass capacitor if necessary.
Especially the wiring impedance must be lower around the DC/DC converter.
●About Heat Loss
In heat design, operate the DC/DC converter in the following condition.
(The following temperature is a guarantee temperature, so consider the margin.)
1. Periphery temperature Ta must be less than 85
2. The loss of IC must be less than dissipation Pd.
series x 6parallel Hi current 20mA setting Figure 42. 10 series x 4parallel Hi current 20mA setting
FAILSEL
ISETH
ISETL
TEST
24k
VDET
LED1
LED2
LED3
LED4
LED5
LED6
Each 20mA
10LED x 6parallel
10F
RTR020N05
150m
ON/OFF
200Hz
PWM
Power
Batter
1F
4.7H
2.2F *
SENSP
SENSN
GND
RSTB
PWMPOW
PWMDR V
SW
VBAT
VREG
GND
GNDGND
TEST
FAILSEL
ISETH
24k
ISETL
VDET
LED1
LED2
LED3
LED4
LED5
LED6
Current driver PWM application Current driver PWM application
*
Please select the capacitor which the little bias fluctuation.
VDET
LED1
LED2
LED3
LED4
LED5
LED6
Each 20mA
10LED x 6parallel
10F
RTR020N05
100m
Power
ON/OFF
200Hz
PWM
2.7V to 5.5V
Batter
1F
4.7H
2.2F *
SW
SENSP
SENSN
RSTB
PWMPOW
PWMDRV
VREG
GND
VBAT
GND
VDET
FAILSEL
LED1
LED2
LED3
LED4
LED5
ISETH
ISETL
TEST
GNDGND
24k
LED6
Each 20mA
RTR020N05
100m
10F
Power
ON/OFF
200Hz
PWM
Batte ry
1F
4.7H
2.2F *
SENSP
SENSN
RSTB
GND
SW
PWMPOW
PWMDRV
VBAT
VREG
GND
GND
GND
FAILSEL
ISETH
ISETL
TEST
24k
Figure 43. 10 series x 6parallel LED current
20mA setting
Figure 44. Non-used Inside REG or operating
under 5V application
Power control PWM application
* Please select the capacitor which the little bias fluctuation.
Terminal Processing
TEST pin = Connect to GND
N.C. = Nothing specified in particular. Open is recommended.
VREG = When IC is driving from the outside of 2.7 to 5.5V, short VBAT and VREG, and put the voltage to VREG
FAILSEL, PWMDRV = Connect to GND in case of fixing at L level.
Connect to VREG of IC or the power supply of more than 1.4V in case of fixing at H level.
LED1-6 = When each LED driver are not used, conne ct to GND of IC
GND = Each GND is connecting inside IC, but, connect to GND of all board
RSTB = RSTB is used as a power supply of internal circuit.
So, you mustn’t input RSTB voltage with pull up resistor of several k.
And, please care about the relation between VBAT and RSTB enough.
Please input PWM pulse from PWMPOW or PWMDRV terminal.
Please refer electrical characteristic page.6 and function (page.17).
15inch panel
Battery
4.7H
10F
2.2F *
RTR020N 05
47m
ON/OFF
100Hz~10kHz
PWM
Power
1F
GND
SW
SENSP
SENSN
RSTB
PWMPOW
PWMDRV
VBAT
VREG
GND
GND
GND
FAILSEL
ISETL
ISETH
TEST
24k
Figure 45. 10 series×6 parallel, LED current 20mA setting
Current driver PWM application
13 to 14inch panel
Battery
4.7H
10F
2.2F *
RTR020N 05
51m
ON/OFF
100Hz~1kHz
PWM
Power
1F
GND
SW
SENSP
SENSN
RSTB
PWMPOW
PWMDRV
VBAT
VREG
GND
GND
GND
FAILSEL
ISETL
ISETH
TEST
24k
Figure 46. 8 series×6 parallel, LED current 20mA setting Figure 47. 8 series×6 parallel, LED current 20mA setting
Power control PWM application Current driver PWM application
10LED x 6 parallel
VDET
LED1
LED2
LED3
LED4
LED5
LED6
Can be set up to each 10 ~25mA
Each 20mA
Batter
51m
PWM
10F
Power
ON/OFF
1F
4.7H
2.2F *
SW
SENSP
SENSN
RSTB
PWMPOW
PWMDRV
GND
VBAT
VREG
GND
8LED x 6 para lle l
VDET
RTR020N05
LED1
LED2
LED3
LED4
LED5
LED6
Each 20mA
Can be set up to each 10~25mA
Please select the capacitor which the little bias fluctuation.
Please input PWM pulse from PWMPOW or PWMDRV terminal.
Please refer electrical characteristic page.6 and function (page.17).
10 to 12inch panel
Battery
Batter
10F
RTR020N 05
56m
ON/OFF
100Hz~10kHz
PWM
Power
1F
4.7H
2.2F *
SENSP
SENSN
GND
SW
RSTB
PWMPOW
PWMDRV
VBAT
VREG
GND
GND
GND
7LED x 6 para lle l
VDET
RTR020N05
FAILSEL
LED1
LED2
LED3
LED4
LED5
ISETL
ISETH
TEST
30k
LED6
Can be set up to each 10~25mA
Each 16mA
100Hz~10kHz
56m
PWM
10F
Power
ON/OFF
1F
4.7H
2.2F *
SW
SENSP
SENSN
RSTB
PWMPOW
PWMDRV
GND
VBAT
VREG
GND
FAILSEL
ISETH
ISETL
TEST
GNDGND
24k
Figure 48. 7 series×6 parallel, LED current 16mA setting Figure 49. 10 series×4 parallel, LED current 20mA setting
Current driver PWM application Current driver PWM application
7inch panel
8LED x 3 para lle l
VDET
LED1
LED2
LED3
LED4
LED5
LED6
Can be set up to each 10~25mA
Each 20m
10F
RTR020N05
68m
ON/OFF
100Hz~10kHz
PWM
Power
Batter
1F
4.7H
2.2F *
SW
SENSP
SENSN
RSTB
PWMPOW
PWMDRV
GND
VBAT
VREG
GND
FAILSEL
ISETH
ISETL
TEST
GNDGND
24k
10F
RTR020N 05
68m
ON/OFF
100Hz~10kHz
PWM
Battery
Power
1F
4.7H
2.2F *
SENSP
SENSN
GND
SW
RSTB
PWMPOW
PWMDRV
VBAT
VREG
GND
GND
GND
FAILSEL
ISETL
ISETH
TEST
24k
Figure 50. 8 series×3 parallel, LED current 20mA setting Figure 51. 6 series×4 parallel, LED current 20mA setting
Current driver PWM application Current driver PWM application
Please select the capacitor which the little bias fluctuation.
Please input PWM pulse from PWMPOW or PWMDRV terminal.
Please refer electrical characteristic page.6 and function (page.17).
7inch panel
Battery
Batter
10F
RTR020N 05
68m
ON/OFF
100Hz~1kHz
PWM
Power
1F
4.7H
2.2F *
SENSP
SENSN
GND
SW
RSTB
PWMPOW
PWMDRV
VBAT
VREG
GND
GND
GND
4LED x 6 para lle l
VDET
RTR020N05
FAILSEL
LED1
LED2
LED3
LED4
LED5
ISETL
ISETH
TEST
24k
LED6
Each 20m
Ca n b e se t u p to e a c h 1 0 ~ 2 5 m A
100Hz~1kHz
68m
PWM
10F
Power
ON/OFF
1F
4.7H
2.2F *
SW
SENSP
SENSN
RSTB
PWMPOW
PWMDRV
GND
VBAT
VREG
GND
FAILSEL
ISETH
ISETL
TEST
GNDGND
24k
Figure 52. 4 series×6 parallel, LED current 20mA setting Figure 53. 8 series×3 parallel, LED current 40mA setting
Power control PWM application Power control PWM application
5inch panel
8LED x 2 para lle l
VDET
LED1
LED2
LED3
LED4
LED5
LED6
Each 20mA
Ca n b e se t u p to e a c h 1 0 ~ 2 5 m A
10F
RTR020N05
82m
ON/OFF
100Hz~1kHz
PWM
Power
Batter
1F
4.7H
2.2F *
SW
SENSP
SENSN
RSTB
PWMPOW
PWMDRV
GND
VBAT
VREG
GND
FAILSEL
ISETH
ISETL
TEST
GNDGND
24k
10F
RTR020N 05
82m
ON/OFF
100Hz~10kHz
PWM
Battery
Power
1F
4.7H
2.2F *
SENSP
SENSN
GND
SW
RSTB
PWMPOW
PWMDRV
VBAT
VREG
GND
GND
GND
FAILSEL
ISETL
ISETH
TEST
24k
Figure 54. 8 series×2 parallel, LED current 20mA setting Figure 55. 8 series×2 parallel, LED current 40mA setting
Current driver PWM application Power control PWM application
Please select the capacitor which the little bias fluctuation.
Please input PWM pulse from PWMPOW or PWMDRV terminal.
Please refer electrical characteristic page.6 and function (page.17).
5inch panel
Battery
Batter
10F
RTR020N 05
82m
ON/OFF
100Hz~10kHz
PWM
Power
1F
4.7H
2.2F *
SENSP
SENSN
GND
SW
RSTB
PWMPOW
PWMDRV
VBAT
VREG
GND
GND
GND
4LED x 4 para lle l
VDET
RTR020N05
FAILSEL
LED1
LED2
LED3
LED4
LED5
ISETL
ISETH
TEST
24k
LED6
Can be set up to each 10~25mA
Each 20mA
100Hz~10kHz
82m
PWM
10F
Power
ON/OFF
1F
4.7H
2.2F *
SW
SENSP
SENSN
RSTB
PWMPOW
PWMDRV
GND
VBAT
VREG
GND
FAILSEL
ISETH
ISETL
TEST
GNDGND
24k
Figure 56. 4 series×4 parallel, LED current 20mA setting Figure 57. 8 series×2 parallel, LED current 60mA setting
Current driver PWM application Current driver PWM application
3LED x 5 para lle l
VDET
LED1
LED2
LED3
LED4
LED5
LED6
Ca n b e se t u p to e a c h 1 0 ~ 2 5 m A
Each 20mA
10F
RTR020N 05
82m
ON/OFF
100Hz~1kHz
PWM
Battery
Power
1F
4.7H
2.2F *
SENSP
SENSN
GND
SW
RSTB
PWMPOW
PWMDRV
VBAT
VREG
GND
GND
GND
FAILSEL
ISETL
ISETH
TEST
24k
Figure 58. 3 series×5 parallel, LED current 20mA setting
Power control PWM application
* Please select the capacitor which the little bias fluctuation.
Control LED current to charged D/A voltage.
Show application example and typ control.
Please decide final value after you evaluated application, characteristic.
VDET
LED1
LED2
LED3
LED4
LED5
LED6
D/A
24k
Each 20mA
8LED x 6 parallel
LED current =
typ LED current =
10F
RTR020N 05
51m
ON/OFF
Battery
Power
1F
4.7H
2.2F *
SENSP
SENSN
GND
SW
RSTB
PWMPOW
PWMDRV
VBAT
VREG
GND
GND
GND
FAILSEL
ISETH
ISETL
TEST
470k
Figure 62. Analog style optical application
Please select the capacitor which the little bias fluctuation.
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, considerati on sh ould be g iven to take physical s afet y
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’ s pow er supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedanc e common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperatu re, th us determining the const ant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the mi nimum in any operating state.
Furthermore, check to be sure no terminals are at a potential low er than the GND voltage in cluding an actual electric tran sient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering bet ween terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismo unt it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunct ion and then breakdo wn of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and chan
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 175°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed
at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the
LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(14) Selection of coil
Select the low DCR inductors to decrease power loss for DC/DC converter.
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way respons ible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any propert y, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3) Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl
H
2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-solub le cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4) The Products are not subject to radiation-proof design.
5) Please verify and confirm cha racteristics of the final or mounted products in using the Products.
6) In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recomm ended. Avoid applying power
exceeding normal rated power; exceeding the power ratin g under steady-state loading condition may negatively affect
product performance and reliability.
7) De-rate Po wer Dissipation (P d) dependi ng on Ambient temperature (T a). When used i n sealed area, confirm the actual
ambient temperature.
8) Confirm that operation temperature is within the specified range described in the product specification.
9) ROHM shall not be in any way responsible or liable for failure induced under dev iant condition from what is defined in
this document.
1) When a highly active halogenous (chlor ine, bromine, etc.) flux is used, the residue of flux ma y negatively affect product
performance and reliability.
2) In principle, the reflow soldering method mu st be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of th e
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2) You agree that application notes, reference designs, and associated data and information contai ned in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsib le or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dr y condition (e.g. Gro unding of human bod y / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered conn ections may deteriorate if the Products are stored in the places where:
[a] the Products are expos ed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are expos ed to high Electrostatic
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderabilit y before using Products of which storage time is
exceeding the recommended storage time period.
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data includin g but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe an y intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
2)
third parties with respect to the information contained in this document.
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5) The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.