ROHM BD6522F Technical data

Power Management Switch ICs for PCs and Digital Consumer Products
Load Switch ICs for Potable Equipment
Description
The power switch for expansion module is a power management switch having one circuit of N-channel Power MOS FET. The switch realizes 50m(Typ.) ON resistance. The switch turns on smoothly by the built-in charge pump, therefore, it is possible to reduce inrush current at switch on. And soft start control by external capacitor is available. Further, it has a discharge circuit that discharges electric charge from capacitive load at switch off, Under voltage lockout circuit, and a thermal shutdown circuit.
Features
1) Low on resistance (50m, Typ.) N-MOS switch built in
2) Maximum output current: 2A
3) Discharge circuit built in
4) Soft start control circuit built in
5) Under voltage lockout (UVLO) circuit built in
6) Thermal shutdown (Output off latching)
7) Reverse current flow blocking at switch off (only BD6522F)
Applications
Notebook PC, PC peripheral device, etc.
Lineup
Parameter BD6520F BD6522F
Supply Voltage 3 to 5.5V 3 to 5.5V
Switch current 2A 2A
On Resistance 50m 50m
OUT Rise Time 2000µs 1000µs
OUT Fall Time 3µs 4µs
Package SOP8 SOP8
Reverse current flow blocking at switch off -
Absolute Maximum Ratings
Parameter Symbol Ratings Unit
Supply Voltage VDD -0.3 to 6.0 V
CTRL Input Voltage V
Switch Output Voltage V
Storage temperature T
Power dissipation Pd 560*1 mW
*1 This value decreases 4.48mW/ above Ta=25 * Resistance radiation design is not doing. * Operation is not guaranteed.
Operation conditions
Parameter Symbol
Supply Voltage VDD 3.0 to 5.5 V
Switch current I
Operating Temperature T
-0.3 to 6.0 V
CTRL
OUT
STG
0 to 2 A
OUT
OPR
-0.3 to 6.0 (BD6522F) V
-55 to 150
-25 to 85
-0.3 to V
+ 0.3 (BD6520F) V
DD
Ratings
Unit
No.11029EBT12
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© 2011 ROHM Co., Ltd. All rights reserved.
1/16
2011.05 - Rev.B
BD6520F,BD6522F
Electrical characteristics BD6520F(Unless otherwise specified, Ta = 25℃, VDD = 5V)
Parameter Symbol
On Resistance
Operating Current
Control Input voltage
RON1 - 50 70 mΩ VDD = 5V, V RON2 - 60 85 mΩ VDD = 3V, V
I
DD
I
DDST
V
CTRL
V
CTRL
Min. Typ. Max.
- 110 220 µA V
- - 2 µA V
L - - 0.7 V V
H 2.5 - - V V
Limits
Technical Note
Unit Condition
= 5V
CTRL
= 3V
CTRL
= 5V, OUT = OPEN
CTRL
= 0V, OUT = OPEN
CTRL
L = Low Level
CTRL
H = High Level
CTRL
Control Input current I
-1 0 1 µA V
CTRL
Turn On Delay Trd 200 1000 2000 us
Turn On Rise Time Tr 500 2000 7500 us
Turn Off Delay Tfd - 3 20 us
Turn Off Fall Time Tf - 1 20 us
Discharge Resistance R
UVLO Threshold Voltage
UVLO Hysteresis Voltage V
- 350 600 Ω VDD = 5V, V
SWDC
V
H 2.3 2.5 2.7 V VDD increasing
UVLO
V
L 2.1 2.3 2.5 V VDD decreasing
UVLO
100 200 300 mV V
HYS
Thermal Shutdown Threshold TTS - 135 - V
SSCTL Output Voltage V
- 13.5 - V V
SSCTL
BD6522F(Unless otherwise specified, Ta = 25℃, V
Parameter Symbol
On Resistance
Operating Current
Control Input Voltage
R
ON
RON2 - 60 85 mΩ VDD = 3.3V, V
I
DD
I
DDST
V
CTRL
V
CTRL
Min. Typ. Max.
1 - 50 70 mΩ VDD = 5V, V
- 110 220 µA V
- - 2 µA V
L - - 0.7 V V
H 2.5 - - V V
DD
= 5V)
Limits
= L, H
CTRL
RL = 10,SSCTL = OPEN CTRL = L→H → OUT=50%
RL = 10,SSCTL = OPEN CTRL = 10% 90%
RL = 10,SSCTL = OPEN CTRL = H→L → OUT=50%
RL = 10Ω,SSCTL = OPEN CTRL = 90% 10%
HYS
CTRL
CTRL
= V
= 5V
= 5V
UVLO
CTRL
H - V
= 0V, V
UVLO
= 5V
OUT
L
Unit Condition
= 5V
CTRL
= 3.3V
CTRL
= 5V, OUT = OPEN
CTRL
= 0V, OUT = OPEN
CTRL
L = Low Level
CTRL
H = High Level
CTRL
Control Input Current I
-1 0 1 µA V
CTRL
Turn On Time TON - 1000 3500 us
Turn Off Time T
Discharge Resistance R
UVLO Threshold Voltage
UVLO Hysteresis Voltage V
- 4 20 us
OFF
- 350 600 Ω VDD = 5V,VCTRL = 0V
SWDC
V
H 2.3 2.5 2.7 V VDD increasing
UVLO
V
L 2.1 2.3 2.5 V VDD decreasing
UVLO
100 200 300 mV V
HYS
Thermal Shutdown Threshold TTS - 135 - V
SSCTL Output Voltage V
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© 2011 ROHM Co., Ltd. All rights reserved.
- 13.5 - V V
SSCTL
2/16
= L, H
CTRL
RL = 10,SSCTL = OPEN CTRL = H OUT =90%
RL = 10,SSCTL = OPEN CTRL = L OUT = 10%
HYS
CTRL
CTRL
= V
UVLO
= 5V
= 5V
H - V
UVLO
L
2011.05 - Rev.B
BD6520F,BD6522F
Measurement circuit
BD6520F BD6522F
VDD
BD6520F
VDDA
OUTA
C
SS
VDDB
SSCTL
CTRL
VCTRL
OUTB
OUTC
VSS
RL
CL
I
OUT
Fig.1 Measurement circuit
Timing diagram
BD6520F
T
r
90%
90%
f
T
OUT
V
10%
50%
50%
10%
T
TfdTrd
OFF
VCTRL VCTRL
VCTRLH VCTRLL VCTRLHVCTRLL
Fig.2 Timing diagram
VDD
CSS
BD6522F
V
OUT
VCTRL
T
VDDA
VDDB
SSCTL
CTRL
ONTON
BD6522F
OUTA
OUTB
DISC
90%
VSS
Technical Note
RL
CL
10%
TOFF
IOUT
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© 2011 ROHM Co., Ltd. All rights reserved.
3/16
2011.05 - Rev.B
BD6520F,BD6522F
Typical characteristics BD6520F
80
Ta = 25 Ta = 25
70
60
50
40
30
20
ON RESISTANCE : Ron [mΩ]
10
0
23456
SUPPLY VOLTAGE : V
Fig.3 On resistance
120
V
DD = 5.0V Ta = 25 VDD = 5.0V
100
[uA]
DD
80
60
40
20
OPERATING CURRENT : I
0
-40-20 0 20406080100
AMBIENT TEMPERATURE : Ta [℃]
Fig.6 Operating current
(CTRL enable)
2.5
[V]
CTRL
2.0
1.5
1.0
Ta = 25
VDD = 5.0V VDD = 5.0V
Low to High
0.5
CTRL INPUT VOLTAGE : V
0.0
23456
SUPPLY VOLTAGE : V
Fig.9 CTRL input voltage
0.4
[V]
0.3
CTRLHYS
Ta = 25
VDD = 5.0V Ta = 25℃
0.2
0.1
CTRL HYSTERESIS : V
0
23456
SUPPLY VOLTAGE : V
Fig.12 CTRL hysteresis voltage
DD
High to Low
DD
DD
[V]
[V]
[V]
80
70
60
50
40
VDD=3.0V
30
20
ON RESISTANCE : Ron [mΩ]
10
0
DD=3.3V
V
DD=5.0V, 5.5V
V
-40-20 0 20406080100
AMBITENT TEMPERATURE : Ta [℃]
Fig.4 On resistance Fig.5 Operating current
0.10
[uA]
0.08
DDST
0.06
0.04
0.02
OPERATING CURRENT : I
0.00
23456
SUPPLY VOLTAGE : V
[V]
DD
Fig.7 Operating current
(CTRL disenable)
2.5
[V]
2.0
CTRL
1.5
1.0
0.5
CTRL INPUT VOLTAGE : V
0.0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
Fig.10 CTRL input voltage H→L
0.4
[V]
0.3
CTRLHYS
0.2
0.1
CTRL HYSTERESIS : V
0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
Fig.13 CTRL hysteresis voltage
Technical Note
120
100
[uA]
DD
80
60
40
20
OPERATING CURRENT : I
0
23456
Ton
[V]
DD
]
[V]
DD
SUPPLY VOLTAGE : V
(CTRL enable)
1.0
0.8
[uA]
LEAK
0.6
0.4
0.2
LEAK CURRENT : I
0.0
0 20406080100
AMBIENT TEMPERATURE : Ta [℃]
Fig.8 Leak current
2.5
[V]
2.0
CTRL
1.5
1.0
0.5
CTRL INPUT VOLTAGE : V
0.0
-40-20 0 204060 80100
]
AMBIENT TEMPERATURE : Ta [
Fig.11 CTRL input voltage L→H
5
4
3
2
TURN ON TIME :Ton [ms]
1
0
23456
]
Tr
Trd
SUPPLY VOLTAGE : V
Fig.14 Turn On Rise time
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© 2011 ROHM Co., Ltd. All rights reserved.
4/16
2011.05 - Rev.B
BD6520F,BD6522F
5
VDD = 5.0V Ta = 25 VDD = 5.0V
4
3
2
1
TURN ON TIME : Ton [ms]
0
-40-20 0 20406080100
AMBIENT TEMPERATURE : Ta [℃]
Ton
Tr
Trd
Fig.15 Turn On Rise time
7
6
5
4
3
2
TURN OFF TIME : Toff [us]
1
0
23456
Tfd
Tf
SUPPLY VOLTAGE : V
Fig.16 Turn Off Fall time
500
[Ω]
SWDC
400
300
Ta = 25
VDD = 5.0V
[Ω]
SWDC
500
400
300
200
100
DISCHARGE RESISTANCE : R
0
23456
SUPPLY VOLTAGE : V
[V]
DD
Fig.18 Switch discharge resistance Fig.19 Switch discharge resistance
200
100
DISCHARGE RESISTANCE : R
0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
0.3 V
DD = 5.0V VDD = 5.0V, Ta = 25, RL = 10Ω VDD = 5.0V, Ta = 25, RL = 10Ω
[V]
UVLOHYS
0.2
0.1
UVLO HYSTERESIS : V
0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
]
Fig.21 UVLO hysteresis voltage Fig.22 Turn On Rise time (vs. Css) Fig.23 Turn Off Fall time (vs. Css)
100
10
TURN ON TIME : Ton [ms]
1
1 10 100 1000 10000
Css [pF]
16
14
[V]
12
SSCTL
10
8
6
4
SSCTL VOLTAGE : V
2
0
Fig.24 SSCTL output voltage
VDD = 5.0V
Ta = 25
23456
SUPPLY VOLTAGE : V
[V]
DD
16
14
[V]
12
SSCTL
10
8
6
4
SSCTL VOLTAGE : V
2
0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
Fig.25 SSCTL output voltage
Tof f
Technical Note
7
6
5
4
3
2
TURN OFF TIME : Toff [us]
1
0
[V]
DD
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [℃]
Fig.17 Turn Off Fall time
3.0
V
DD = 5.0V
[V]
2.8
UVLO
2.6
2.4
2.2
UVLO THRESHOLD : V
2.0
]
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
Fig.20 UVLO threshold voltage
100
10
TURN OFF TIME : Toff [us]
1
1 10 100 1000 10000
]
Tof f
Tfd
Tf
DD increasing
V
VDD decreasing
Css [pF]
]
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© 2011 ROHM Co., Ltd. All rights reserved.
5/16
2011.05 - Rev.B
BD6520F,BD6522F
BD6522F
80
Ta = 25
70
60
50
40
30
20
ON RESISTANCE : Ron [mΩ]
10
0
23456
SUPPLY VOLTAGE : V
Fig.26 ON resistance Fig.27 ON resistance
120
DD = 5.0V
V
100
[uA]
DD
80
60
40
20
OPERATING CURRENT : I
0
-40-20 0 20406080100
AMBIENT TEMPERATURE : Ta [℃]
Fig.29 Operating current
(CTRL enable)
2.5
Ta = 25
[V]
2.0
CTRL
1.5
1.0
VDD = 5.0V Ta = 25℃
Low to High
0.5
CTRL INPUT VOLTAGE : V
0.0
23456
SUPPLY VOLTAGE : V
Fig.32 CTRL input voltage
0.4
DD = 5.0V Ta = 25 VDD = 5.0V
V
[V]
0.3
CTRLHYS
0.2
0.1
CTRL HYSTERESIS : V
0.0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
Fig.35 CTRL hysteresis voltage
DD
High to Low
[V]
DD
[V]
Technical Note
80
70
60
50
40
VDD=3.3V
30
20
ON RESISTANCE : Ron [mΩ]
10
0
-40 -20 0 20 40 60 80 100
0.10
Ta = 25
[uA]
0.08
DDST
0.06
0.04
0.02
OPERATING CURRENT : I
0.00
23456
VDD=5.0V
AMBIENT TEMPERATURE : Ta [℃]
VDD = 5.0V
SUPPLY VOLTAGE : V
[V]
DD
Fig.30 Operating current
(CTRL disenable)
2.5
[V]
2.0
CTRL
1.5
1.0
0.5
CTRL INPUT VOLTAGE : V
0.0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
High to Low
Low to High
]
Fig.33 CTRL input voltage
5
4
3
2
TURN ON TIME : Ton [ms]
1
0
23456
DD
]
SUPPLY VOLTAGE :V
[V]
Fig.36 Turn On time
120
Ta = 25
100
[uA]
DD
OPERATING CURRENT : I
80
60
40
20
0
23456
SUPPLY CURRENT : V
[V]
DD
Fig.28 Operating current
(CTRL enable)
1.0
0.8
[uA]
LEAK
0.6
0.4
0.2
LEAK CURRENT : I
0.0
0 20406080100
AMBIENT TEMPERATURE : Ta [
]
Fig.31 Leak current
0.4
[V]
0.3
CTRLHYS
0.2
0.1
CTRL HYSTERESIS : V
0
23456
SUPPLY VOLTAGE : V
[V]
DD
Fig.34 CTRL hysteresis voltage
5
4
3
2
1
TURN ON TIME : Ton [ms]
0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
]
Fig.37 Turn On time
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6/16
2011.05 - Rev.B
BD6520F,BD6522F
7
Ta = 25 VDD = 5.0V Ta = 25
6
5
4
3
2
TURN OFF TIME : Toff [us]
1
0
23456
SUPPLY VOLTAGE : V
Fig.38 Turn Off time Fig.39 Turn Off time Fig.40 Switch discharge resistance
500
DD = 5.0V Ta = 25 VDD = 5.0V
V
[]
400
SWDC
300
200
100
DISCHARGE RESISTANCE : R
0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
Fig.41 Switch discharge resistance
100
10
TURN ON TIME : Ton [ms]
1
1 10 100 1000 10000
Css [pF]
Fig.44 Turn On time (vs. Css) Fig.45 Turn Off time (vs. Css) Fig.46 SSCTL output voltage
16
V
DD = 5.0V
14
[V]
12
SSCTL
10
8
6
4
SSCTL VOLTAGE : V
2
0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
Fig.47 SSCTL output voltage
Technical Note
7
6
5
4
3
2
TURN OFF TIME : Toff [us]
1
0
-40 -20 0 20 40 60 80 100
[V]
DD
]
AMBIENT TEMPERATURE : Ta [
3.0
[V]
2.8
UVLO
2.6
2.4
2.2
UVLO THRESHOLD : V
2.0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [
DD increasing
V
VDD decreasing
]
]
Fig.42 UVLO threshold voltage
100
10
TURN OFF TIME : Toff [us]
1
1 10 100 1000 10000
Css [pF]
]
500
[Ω]
400
SWDC
300
200
100
DISCHARGE RESISTANCE : R
0
23456
SUPPLY VOLTAGE : V
0.3
[V]
UVLOHYS
0.2
0.1
UVLO HYSTERESIS : V
0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE : Ta [℃]
[V]
DD
Fig.43 UVLO hysteresis voltage
16
Ta = 25
14
[V]
12
SSCTL
10
8
6
4
SSCTL VOLTAGE : V
2
0
VDD = 5.0V, Ta = 25, RL = 10Ω VDD = 5.0V, Ta = 25, RL = 10
23456
SUPPLY VOLTAGE : V
[V]
DD
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7/16
2011.05 - Rev.B
BD6520F,BD6522F
Waveform data
VDD = 5V, CL = 47µF, RL = 47Ω, unless otherwise specified.
VCTRL
(5V/div.)
VCTRL
(5V/div.)
V
OUT
(5V/div.)
V
OUT
(5V/div.)
I
OUT
(0.5A/div.)
TIME (1ms/div.) TIME (5ms/div.) TIME (1ms/div.)
Fig.48 Turn On Rise Time
(BD6520F)
I
OUT
(0.5A/div.)
V
CTRL
(5V/div.)
CTRL
V
(5V/div.)
V
OUT
(5V/div.)
I
OUT
(0.5A/div.)
I
OUT
(0.2A/div.)
Fig.51 Turn Off Fall Time
TIME (5ms/div.)
Fig.52 Inrush current vs. Css
(BD6522F)
V
CTRL
(5V/div.)
V
OUT
(2V/div.)
DISC terminal not in use
DISC terminal in use
CTRL
V
(5V/div.)
V
OUT
(2V/div.)
Fig.54 Discharge: CL = 47uF, RL = Open
TIME (20ms/div.)
(BD6522F)
DD
DD
V
(2V/div.)
OUT
V
(2V/div.)
V
(2V/div.)
OUT
V
(2V/div.)
Fig.56 UVLO (at VDD increase) Fig.57 UVLO (at VDD decrease)
TIME (500ms/div)
Fig.49 Turn Off Fall Time
(BD6520F)
Open
470pF
TIME (2ms/div.) TIME (2ms/div.)
CL=330uF CL=330uF
2200pF
(BD6520F)
Temperature decline
Thermal shut down
Latch release
TIME (500ms/div.)
Fig.55 Thermal shutdown
TIME (500ms/div)
Return
CTRL
V
(5V/div.)
V
OUT
(5V/div.)
I
OUT
(0.5A/div.)
CTRL
V
(5V/div.)
I
OUT
(0.5A/div.)
Technical Note
Fig.50 Turn On Rise Time
(BD6522F)
Open
1000pF
4700pF
Fig.53 Inrush current vs. Css
(BD6522F)
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8/16
2011.05 - Rev.B
BD6520F,BD6522F
Block diagram, pin configuration, pin description
(BD6520F)
VDDA
1
VDDB
SSCTL
3
Oscillator
UVLO
Band
Gap
Thermal
Shutdown
CTRL
4
Fig.58 Block diagram(BD6520F)
Pin No. Symbol Pin Function
1,2 VDDA, VDDB
3 SSCTL
4 CTRL
Technical Note
OUTA
8
OUTB
7 2
Charge
Pump
S Q
FF
R
Switch input pin At use, connect each pin outside.
Soft start setting pin Add external capacitor, it is possible to delay switch On, Off time.
Control input pin Switch On at High level, switch Off at Low level.
OUTC
6
VDDA
VDDB
SSCTL
CTRL
VSS
5
1
2
3
4 5
8
7
6
OUTA
OUTB
OUTC
VSS
5 VSS Ground
6,7,8 OUTA, OUTB, OUTC
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Switch output pin At use, connect each pin outside.
9/16
2011.05 - Rev.B
BD6520F,BD6522F
(BD6522F)
VDDA
1
VDDB
SSCTL
3
UVLO
Band
Gap
Thermal
Shutdown
CTRL
4
Pin No. Symbol Pin Function
1,2 VDDA, VDDB
3 SSCTL
4 CTRL
OUTA
8
OUTB
7 2
Oscillator
Charge
Pump
DISC
S Q
6
FF
R
VDDA
VDDB
SSCTL
CTRL
VSS
5
Fig.59 Block diagram(BD6522F)
Switch input pin At use, connect each pin outside.
Soft start setting pin Add external capacitor, it is possible to delay switch On, Off time.
Control input pin Switch On at High level, switch Off at Low level.
Technical Note
1
2
3
4 5
8
7
6
OUTB
DISC
VSS
OUTA
5 VSS Ground
6 DISC Discharge pin
7,8 OUTA, OUTB
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© 2011 ROHM Co., Ltd. All rights reserved.
Switch output pin At use, connect each pin outside.
10/16
2011.05 - Rev.B
BD6520F,BD6522F
I/O circuit
Symbol Pin No.
Equivalent circuit
BD6520F
Technical Note
Equivalent circuit
BD6522F
SSCTL 3
CTRL 4
DISC
6
(BD6522F)
SSCTL
CTRL
SSCTL
CTRL
DISC
OUT
6 (BD6520F),
7, 8
OUT
OUT
Fig.60 I/O circuit
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11/16
2011.05 - Rev.B
BD6520F,BD6522F
Functional description
1. Switch operation VDD pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. And the VDD is used also as power source input to internal control circuit.
When CTRL input is set to High level and the switch is turned on, VDD and OUT is connected by a 50m switch. In a normal condition, current flows from VDD to OUT. If voltage of OUT is higher than VDD, current flows from OUT to VDD, since the switch is bidirectional.
In BD6520F, there is a parasitic diode between the drain and the source of switch MOSFET. Therefore, even when the switch is off, if the voltage of OUT is higher than that of VDD, current flows from OUT to VDD. In BD6522F, there is not this parasitic diode, it is possible to prevent current from flowing reversely from OUT to VDD.
2. Thermal shutdown Thermal shut down circuit turns off the switch when the junction temperature exceeds 135℃(Typ.).
The switch off status of the thermal shut down is latched. Therefore, even when the junction temperature goes down, switch off is maintained. To release the latch, it is necessary to input a signal to switch off to CTRL terminal or make UVLO status. When the switch on signal is input or UVLO is released, the switch output is recovered.
The thermal shut down circuit works when CTRL signal is active.
3. Low voltage malfunction prevention circuit (UVLO) The UVLO circuit monitors the voltage of the VDD pin, when the CTRL input is active. UVLO circuit prevents the switch from turning on until the V shuts off the switch.
4. Soft start control In BD6520F/BD6522F, soft start is carried out in order to reduce inrush current at switch on. Further, in order to reduce inrush current, soft start control pin (SSCTL) is prepared.
By connecting external capacitor to between SSCTL and GND, it is possible to make smoother the switch rise time. When the switch is enabled, SSCTL outputs voltage of about 13.5V.
SSCTL terminal requires high impedance, so pay attention in packaging it so that there should not be leak current. And when voltage is impressed from the outside to SSCTL terminal, switch on, off cannot be made correctly.
5. Discharge circuit When the switch between the VDD and the OUT is OFF, the 200(Typ.) discharge switch between OUT and GND turns on. By turning on this switch, electric charge at capacitive load is discharged.
In BD6522F, the input of discharge circuit is separately prepared as DISC pin. When to use the discharge circuit, connect OUT pin and DISC pin outside.
exceeds 2.5V(Typ.). If the VDD drops below 2.3V(Typ.) while the switch turns on, then UVLO
DD
Technical Note
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12/16
2011.05 - Rev.B
BD6520F,BD6522F
Timing diagram
VDD
VCTRL
VOUT
Discharge circuit
VDD
VCTRL
VOUT
Discharge circuit
Discharge circuit
ON OFF ON
ON OFF
Over temperature occurs
VDD
CTRL
V
OUT
V
Latch
Release
Fig.61 Normal operation
VUVLOL VUVLOH
Fig.62 UVLO operation
Over temperature corrected
Set
OFF OFF OFF ON
Fig.63 Thermal shutdown operation
Release
Over temperature occurs
Release
Over temperature corrected
Set
Release
Technical Note
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13/16
2011.05 - Rev.B
BD6520F,BD6522F
Typical application circuits
Power Supply
On/Off
Fig.64 Power supply switch circuit (BD6520F) Fig.65 Power supply switch circuit (BD6522F)
Power Supply A
On/Off
Thermal derating characteristic
(SOP8)
1µF
Css
Css
POWER DISSIPATION: Pd[mW]
600
500
400
300
200
100
BD6520F
VDDA
VDDB
SSCTL
CTRL
BD6522F
VDDA
VDDB
SSCTL
CTRL
Fig.66 2 power supply changeover switch circuit (BD6522F)
OUTA
OUTB
OUTC
VSS
OUTA
OUTB
DISC
VSS
Load
Power Supply B
Power Supply
1µF
Css
On/Off
Css
On/Off
BD6522F
VDDA
VDDB
SSCTL
CTRL
BD6522F
VDDA
VDDB
SSCTL
CTRL
OUTA
OUTB
DISC
VSS
Technical Note
OUTA
OUTB
DISC
VSS
Load
Load
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0
0 255075100125150
AMBIENT TEMPERATURE: Ta [℃]
Fig. 67 Power dissipation curve
14/16
2011.05 - Rev.B
BD6520F,BD6522F
Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 135°C (typ.) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.
will cause no fluctuations in voltages of the
Technical Note
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15/16
2011.05 - Rev.B
BD6520F,BD6522F
Ordering part number
B D 6 5 2 0 F - E 2
Part No. Part No.
6520 6522
SOP8
5.0±0.2
(MAX 5.35 include BURR)
7
6
+
6
°
4
°
−4°
0.17
+0.1
-
0.05
(Unit : mm)
0.3MIN
0.9±0.15
4.4±0.2
6.2±0.3
1.27
438251
S
0.1 S
0.42±0.1
0.595
1.5±0.1
0.11
Package
F: SOP8
Packaging and forming specification E2: Embossed tape and reel (SOP8)
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction of feed
2500pcs E2
The direction is the 1pin of product is at the upper left when you hold
()
reel on the left hand and you pull out the tape on the right hand
Reel
1pin
Order quantity needs to be multiple of the minimum quantity.
Technical Note
Direction of feed
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16/16
2011.05 - Rev.B
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specications, which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.
The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu­nication devices, electronic appliances and amusement devices).
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While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
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