Power Management Switch ICs for PCs and Digital Consumer Products
Load Switch ICs
for Potable Equipment
BD6520F,BD6522F
●Description
The power switch for expansion module is a power management switch having one circuit of N-channel Power MOS FET.
The switch realizes 50mΩ(Typ.) ON resistance. The switch turns on smoothly by the built-in charge pump, therefore, it is
possible to reduce inrush current at switch on. And soft start control by external capacitor is available.
Further, it has a discharge circuit that discharges electric charge from capacitive load at switch off, Under voltage lockout
circuit, and a thermal shutdown circuit.
●Features
1) Low on resistance (50mΩ, Typ.) N-MOS switch built in
2) Maximum output current: 2A
3) Discharge circuit built in
4) Soft start control circuit built in
5) Under voltage lockout (UVLO) circuit built in
6) Thermal shutdown (Output off latching)
7) Reverse current flow blocking at switch off (only BD6522F)
●Applications
Notebook PC, PC peripheral device, etc.
●Lineup
Parameter BD6520F BD6522F
Supply Voltage 3 to 5.5V 3 to 5.5V
Switch current 2A 2A
On Resistance 50mΩ 50mΩ
OUT Rise Time 2000µs 1000µs
OUT Fall Time 3µs 4µs
Package SOP8 SOP8
Reverse current flow blocking at switch off - ○
●Absolute Maximum Ratings
Parameter Symbol Ratings Unit
Supply Voltage VDD -0.3 to 6.0 V
CTRL Input Voltage V
Switch Output Voltage V
Storage temperature T
Power dissipation Pd 560*1 mW
*1 This value decreases 4.48mW/℃ above Ta=25℃
* Resistance radiation design is not doing.
* Operation is not guaranteed.
1. Switch operation
VDD pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. And the VDD is used
also as power source input to internal control circuit.
When CTRL input is set to High level and the switch is turned on, VDD and OUT is connected by a 50mΩ switch. In a
normal condition, current flows from VDD to OUT. If voltage of OUT is higher than VDD, current flows from OUT to VDD,
since the switch is bidirectional.
In BD6520F, there is a parasitic diode between the drain and the source of switch MOSFET. Therefore, even when the
switch is off, if the voltage of OUT is higher than that of VDD, current flows from OUT to VDD. In BD6522F, there is not this
parasitic diode, it is possible to prevent current from flowing reversely from OUT to VDD.
2. Thermal shutdown
Thermal shut down circuit turns off the switch when the junction temperature exceeds 135℃(Typ.).
The switch off status of the thermal shut down is latched. Therefore, even when the junction temperature goes down,
switch off is maintained. To release the latch, it is necessary to input a signal to switch off to CTRL terminal or make UVLO
status. When the switch on signal is input or UVLO is released, the switch output is recovered.
The thermal shut down circuit works when CTRL signal is active.
3. Low voltage malfunction prevention circuit (UVLO)
The UVLO circuit monitors the voltage of the VDD pin, when the CTRL input is active. UVLO circuit prevents the switch
from turning on until the V
shuts off the switch.
4. Soft start control
In BD6520F/BD6522F, soft start is carried out in order to reduce inrush current at switch on. Further, in order to reduce
inrush current, soft start control pin (SSCTL) is prepared.
By connecting external capacitor to between SSCTL and GND, it is possible to make smoother the switch rise time. When
the switch is enabled, SSCTL outputs voltage of about 13.5V.
SSCTL terminal requires high impedance, so pay attention in packaging it so that there should not be leak current. And
when voltage is impressed from the outside to SSCTL terminal, switch on, off cannot be made correctly.
5. Discharge circuit
When the switch between the VDD and the OUT is OFF, the 200Ω(Typ.) discharge switch between OUT and GND turns on.
By turning on this switch, electric charge at capacitive load is discharged.
In BD6522F, the input of discharge circuit is separately prepared as DISC pin. When to use the discharge circuit, connect
OUT pin and DISC pin outside.
exceeds 2.5V(Typ.). If the VDD drops below 2.3V(Typ.) while the switch turns on, then UVLO
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the
same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic
element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal.
Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than
the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when
no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals
a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 135°C (typ.) or higher, the thermal shutdown circuit operates and turns a switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed
at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the
LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.
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