ROHM BD6383EFV Technical data

A

Stepping Motor Driver series

High Performance, High Reliability
36V Stepping Motor Driver Series

BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM

●Description
BD6387EFV, BD6385EFV, BD6383EFV, BD6389FM are the high-grade type that provides the highest function and highest
reliance in the ROHM stepping motor driver series. This series has the perfect various protection circuits and reduces IC’s
generation of heat by adopting low-ON resistance DMOS and high heat-radiation power package.
As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power supply’s rated
voltage of 36V and rated output current of 1.0A～2.2A. For the input interface, the CLK-IN drive mode and the parallel IN
drive mode are compatible with each other, so please choose an input mode according to needs of application. There are
excitation modes of FULL STEP & HALF STEP (2 kinds), QUARTER STEP mode, and for current decay mode, the ratio of
FAST DECAY & SLOW DECAY can be freely set, so the optimum control conditions for every motor can be realized. In
addition, being able to drive with one system of power supply makes contribution to the set design’s getting easy.

●Feature

1) Power supply: one system drive (rated voltage of 36V)

2) Rated output current: 1.0A, 1.5A, 2.0A, 2.2A

3) Low ON resistance DMOS output

4) CLK-IN drive mode (built-in translator circuit)

5) Parallel IN drive mode

6) Stepping motor／DC motor(×2) drives are selectable

7) PWM constant current control (self oscillation)

8) Built-in spike noise cancel function (external noise filter is unnecessary)

9) FULL STEP & HALF STEP (two kinds), applicable to QUARTER STEP

10) Applicable to the μSTEP drive

11) Current decay mode switching function (linearly variable FAST/SLOW DECAY ratio)

12) Normal rotation & reverse rotation switching function

13) Power save function

14) Built-in logic input pull-down resistor

15) Power-on reset function

16) Thermal shutdown circuit (TSD)

17) Over current protection circuit (OCP)

18) Under voltage lock out circuit (UVLO)

19) Over voltage lock out circuit (OVLO)

20) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention)

21) Electrostatic discharge: 6kV (HBM specification)

22) Adjacent pins short protection

23) Inverted mounting protection

24) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package
(BD6387EFV/BD6385EFV/BD6383EFV)

25) FIN heat-radiating type HSOP package (BD6389FM)

26) Pin-compatible line-up (BD6387EFV/BD6385EFV/BD6383EFV or BD6389FM)

●Application
PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, se wing machine, photo
printer, FAX, scann er, mini printer, toy, and robot etc.

No.12009EAT04

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© 2012 ROHM Co., Ltd. All rights reserved.

1/8

2012.02 - Rev.

BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM

A

Technical Note

●Absolute maximum ratings(Ta=25℃)

Item Symbol BD6387EFV BD6385EFV BD6383EFV BD6389FM Unit

Supply voltage V
Power dissipation Pd

-0.2～+36.0 V

CC0,1,2

1

※

2.8

1.6

2

※

4.7

5.2

3

※

4

※

W

W
Input voltage for control pin VIN -0.2～+5.5 V
RNF maximum voltage V

Maximum output current
Operating temperature range T

Storage temperature range T
Junction temperature T

1

※

70mm×70mm×1.6mm glass epoxy board. Derating in done at 12.8mW/℃ for operating above Ta=25℃.

2

※

4-layer recommended board. Derating in done at 37.6mW/℃ for operating above Ta=25℃.

3

※

70mm×70mm×1.6mm glass epoxy board. Derating in done at 22.4mW/℃ for operating above Ta=25℃.。

4

※

4-layer recommended board. Derating in done at 41.6mW/℃ for operating above Ta=25℃.

5

※

Do not, however exceed Pd, ASO and T

0.5 V

RNF

I

OUT

-25～+75 ℃

opr

-55～+150 ℃

stg

150 ℃

jmax

=150℃.

jmax

5

※

1.5

2.0

5

※

1.0

5

※

2.2

5

※

A/phas

e

●Operating conditions(Ta= -25～+75℃)
Item Symbol BD6387EFV BD6385EFV BD6383EFV BD6389FM Unit

Supply voltage V
Output current(DC)

※6 Do not however exceed Pd, ASO.

10～28 V

CC0,1,2

I

OUT

6

※

1.7

1.2

6

※

0.7

6

※

1.9

6

※

A/phas

e

●Electrical characteristics

Applicable to all the series (Unless otherwise specified Ta=25℃, Vcc0,1,2=24V)

Item Symbol

Min. Typ. Max.

Limit

Unit Condition

Whole

Circuit current at standby I

- 1.0 3.0 mA PS=L

CCST

Circuit current ICC - 4.5 10 mA PS=H, VREFX=2V

Control input (SELECT, CW_CCW, CLK, PS, MODE0, MODE1, ENABLE)

H level input voltage V
L level input voltage V
H level input current I
L level input current I

2.0 - - V

INH

- - 0.8 V

INL

35 50 85 μA VIN=5V

INH

-10 0 - μA VIN=0V

INL

Output (OUT1A, OUT1B, OUT2A, OUT2B)

I

=±1.5A,

Output ON resistance (BD6387EFV) RON - 0.8 1.04 Ω

Output ON resistance (BD6385EFV) RON - 1.0 1.3 Ω

Output ON resistance (BD6383EFV) RON - 1.5 1.95 Ω

Output ON resistance (BD6389FM) RON - 0.7 0.91 Ω
Output leak current I

- - 10 μA

LEAK

OUT

Sum of upper and lower

=±1.0A,

I

OUT

Sum of upper and lower
I

=±0.5A,

OUT

Sum of upper and lower
I

=±1.7A,

OUT

Sum of upper and lower

Current control

RNFXS input current I
RNFX input current I
VREFX input current I
VREFX input voltage range V
MTHX input current I
MTHX input voltage range V
Comparator threshold V
Minimum on time t

-2.0 -0.2 - μA RNFXS =0V

RNFS

-40 -20 - μA RNFX=0V

RNF

-2.0 -0.1 - μA VREFX=0V

VREF

0 - 2.0 V

REF

-2.0 -0.1 - μA MTHX=0V

MTH

0 - 3.5 V

MTH

0.36 0.4 0.44 V VREFX=2V

CTH

0.3 0.7 1.2 μs R=39kΩ,C=1000pF

ONMIN

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© 2012 ROHM Co., Ltd. All rights reserved.

2/8

2012.02 - Rev.

BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM

A

Technical Note

●Terminal function

1) BD6387EFV / BD6385EFV / BD6383EFV

Pin
No.

Pin name Function Pin

No.

Pin name Function

1 NC Non connection 21 VCC0 Power supply terminal
2 RNF1

Connection terminal of resistor for output
current detection

22 NC

Non connection

3 RNF1S Input terminal of current limit comparator 23 GND Ground terminal
4 NC Non connection 24 MODE0 Motor excitation mode setting terminal
5 OUT1B H bridge output terminal 25 MODE1 Motor excitation mode setting terminal

6 NC Non connection 26 ENABLE Output enable terminal
7 OUT1A H bridge output terminal 27 VREF2 Output current value setting terminal
8 NC Non connection 28 MTH2 Current decay mode setting terminal
9 VCC1 Power supply terminal 29 NC Non connection

10 NC
11 CR1

Non connection
Connection terminal of CR for setting PWM

frequency

30 CR2
31 NC

Connection terminal of CR for setting PWM
frequency

Non connection

12 NC Non connection 32 VCC2 Power supply terminal
13 MTH1 Current decay mode setting terminal 33 NC Non connection
14 VREF1 Output current value setting terminal 34 OUT2A H bridge output terminal
15 SELECT Input mode select terminal 35 NC Non connection
16 CW_CCW Motor rotating direction setting terminal 36 OUT2B H bridge output terminal
17 NC Non connection 37 NC Non connection

18 CLK
19 PS
20 TEST

Clock input terminal
for advancing the electrical angle.

Power save terminal
Terminal for testing

(used by connecting with GND)

38 RNF2S Input terminal of current limit comparator
39 RNF2
40 GND

Connection terminal of resistor for output
current detection

Ground terminal

2) BD6389FM

Pin
No.

Pin name Function Pin

No.

Pin name Function

1 NC Non connection 19 VCC2 Power supply terminal
2 CR1

Connection terminal of CR for setting PWM
frequency

20 NC Non connection

3 MTH1 Current decay mode setting terminal 21 NC Non connection
4 VREF1 Output current value setting terminal 22 OUT2A H bridge output terminal
5 SELECT Input mode select terminal 23 NC Non connection
6 CW_CCW Motor rotating direction setting terminal 24 OUT2B H bridge output terminal

7 CLK

Clock input terminal
for advancing the electrical angle.

25 NC Non connection
8 PS Power save terminal 26 RNF2S Input terminal of current limit comparator
9 TEST

FIN FIN

Terminal for testing
(used by connecting with GND)

Fin terminal
(used by connecting with GND)

27 RNF2

FIN FIN

10 GND Ground terminal 28 RNF1

Connection terminal of resistor for output
current detection

Fin terminal
(used by connecting with GND)

Connection terminal of resistor for output
current detection

11 MODE0 Motor excitation mode setting terminal 29 RNF1S Input terminal of current limit comparator
12 MODE1 Motor excitation mode setting terminal 30 NC Non connection
13 ENABLE Output enable terminal 31 OUT1B H bridge output terminal
14 VREF2 Output current value setting terminal 32 NC Non connection
15 MTH2 Current decay mode setting terminal 33 OUT1A H bridge output terminal

16 CR2
17 NC

18 NC

Connection terminal of CR for setting PWM
frequency

Non connection
Non connection

34 NC Non connection

35 VCC1

36 VCC0

Power supply terminal
Power supply terminal

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© 2012 ROHM Co., Ltd. All rights reserved.

3/8

2012.02 - Rev.

BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM

A

K

●Block diagram･Application circuit diagram･Input output equivalent circuit diagram

Set the PWM frequency .
Setting range is
C:470pF～4700pF
R:10kΩ～100kΩ.

Set the PWM frequency .
Setting range is
C:470pF～4700pF
R:10kΩ～100kΩ.

39kΩ

39kΩ

VREF1

1000pF

MODE0
MODE1

CW_CCW

ENABLE
SELECT

VREF2

1000pF

CR1

MTH1

CL

CR2

MTH2

TEST

Buffer

Timer

Buffer

Timer

DAC

CR

DAC

CR

Current Limit Comp.

Logic

Translator

Current Limit Comp.

Logic

Predriver

TSD

RESET

Predriver

OCP

Reg
OVLO
UVLO

OCP

VCC1
OUT1A

OUT1B
RNF1

RNF1S

VCC0

GND

PS

VCC2
OUT2A

OUT2B
RNF2
RNF2S

Terminal for testing.
Pleaseconnect to GND.

Fig.1 Block diagram & Application circuit diagram of BD6387EFV/BD6385EFV/BD6383EFV/BD6389FM

●Points to notice for terminal description
○CLK／Clock input terminal for advancing the electrical angle

CLK is reflected at rising edge. The Electrical angle advances by one for each CLK input.
Motor’s misstep will occur if noise is picked up at the CLK terminal, so please design the pattern in such a way that
there is no noise plunging.

○MODE0,MODE1／Motor excitation mode setting terminal
Set the motor excitation mode.

MODE0 MODE1 Excitation mode

L L FULL STEP

H L HALF STEP A

L H HALF STEP B

H H QUARTER STEP

○CW_CCW Terminal／Motor rotating direction setting terminal

Set the motor’s rotating direction. Change in setting is reflected at the CLK’s rising edge immediately after the chang e
in setting

CW_CCW Rotating direction

L

Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current)

H Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s current)

○ENABLE Terminal／Out put enable terminal

Turn off forcibly all the output transistors (motor output is open).
At the time of ENABLE=L, electrical angle or operating mode is maintained even if CLK is inputted.
Please be careful because the electrical angle at the time of ENABLE b eing release d (ENABLE=L →H) is different from

the released occasion at the section of CLK=H and from the released occasion at the section of CLK＝L.

ENABLE Motor output

L OPEN (electrical angle maintained)

H ACTIVE

0.2Ω

100uF

0.2Ω

Technical Note

Resistor for current. detecting
Setting range is

0.1Ω～0.3Ω.

Be sure to short VCC0, VCC1 &

0.1uF

Bypass capacitor.
Setting range is
100uF～470uF(electrolytic)

0.01uF～0.1uF(multilayer ceramic etc.)

Resistor for current. detecting.
Setting range is

0.1Ω～0.3Ω.

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© 2012 ROHM Co., Ltd. All rights reserved.

4/8

2012.02 - Rev.

BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM

A

Technical Note

○PS／Power save terminal

PS can make circuit standby state and make motor output OPEN. In standby state, translator circuit is reset (initialized)
and electrical angle is initialized.
Please be careful because there is a delay of 40μs(ma x.) before it is returned from standby state to normal state and
the motor output becomes ACTIVE.

PS State

L Standby state (RESET)

H ACTIVE

The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows.
Please be careful because the initial state at the time of FULL STEP is different from those of other excitation modes.

Excitation mode Initial electrical angle

FULL STEP 45°

HALFSTEP A

0°

HALFSTEP B 0°

QUARTER

STEP

0°

○SELECT Terminal／Input mode switching terminal

This is the terminal to set the input mode.

SELECT Input mode

L CLK-IN drive
H Parallel IN drive

●Power dissipation
○HTSSOP-B40 Package (BD6387EFV/BD6385EFV/BD6383EFV)

HTSSOP-B40 has exposed metal on the back, and it is possible to dissipate heat from a t hrough h ole in the back. A lso, the
back of board as well as the surfaces has large areas of copper foil he at dissipation patterns, greatly increasing power
dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a
possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation
efficiency.

5.0

4.0

3.0

2.0

1.0

Power Dissipation：Pd[W]

4.7W

3.6W

1.95W

1.6W

4

3

2

Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
Board size：70*70*1.6mm
(With through holes on the board)

The exposed metal of the backside is connected to the board with
solder.
Board①：1-layer board(Copper foil on the back 0mm

Board②：2-layer board(Copper foil on the back 15*15mm
Board③：2-layer board(Copper foil on the back 70*70mm
Board④：4-layer board(Copper foil on the back 70*70mm

Board①：θ
Board②：θja=64.1℃/W
Board③：θja=34.7℃/W

=78.1℃/W

ja

Board④：θja=26.6℃/W

3

1

0

100 125

Ambient Temperature:Ta[℃]

Fig.2 HTSSOP-B40 Derating Curve

2

)

2

)

2

)

2

)

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© 2012 ROHM Co., Ltd. All rights reserved.

5/8

2012.02 - Rev.

BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM

A

Technical Note

○HSOP-M36 Package (BD6389FM/BD6388FM)

HSOP-M36 has a heat-dissipating FIN terminal on the IC side, but it is possible to greatly increase power dissipation by
taking a large heat dissipation pattern, such as with copper foil, on the back as well as the surface of the board. Also, this
terminal is a GND potential, therefore there is a possibility for malfunction or destruction if it is shorted with any potential
other than GND.

5.2W

5.0

4.1W

4.0

3.0W

3.0

2.8W

2.0

4

3

2

1

Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
Board size：70*70*1.6mm
(With through holes on the board)

Board①：1-layer board(Copper foil on the back 0mm

Board②：2-layer board(Copper foil on the back 15*15mm
Board③：2-layer board(Copper foil on the back 70*70mm
Board④：4-layer board(Copper foil on the back 70*70mm

Board①：θja=44.6℃/W

Board②：θja=41.6℃/W

Board③：θja=30.5℃/W

Board④：θja=24.0℃/W

3

2

)

1.0

Power Dissipation：Pd[W]

0

Fig.3 HSOP-M36 Derating Curve

100 125

Ambient Temperature:Ta[℃]

●Usage Notes
(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaki ng mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.

(2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can da mage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.

(3) Power supply Lines

Design PCB layout pattern to provide low impedance GND and supply lin es . To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.

(4) GND Potential

The potential of GND pin must be minimum potential in all operating conditions.

(5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Users should be aware that BD6387EFV, BD6385EFV and BD6383EFV have been designed to expose their frames at
the back of the package, and should be used with suitable heat dissipation treatment in t his area to improve dissipation.
As large a dissipation pattern should be taken as possible, not only on the front of the baseboard but also on th e back
surface. BD6389FM and BD6388FM are both equipped with FIN heat diss ipation terminals, but dissipation efficiency can
be improved by applying heat dissipation treatment in this area. It is important to consider actual usage conditions and to
take as large a dissipation pattern as possible.

(6) Inter-pin shorts and mounting errors

When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.

2

)

2

)

2

)

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© 2012 ROHM Co., Ltd. All rights reserved.

6/8

2012.02 - Rev.

BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM

A

P

iti

P

iti

Technical Note

(7) Operation in a strong electric field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.

(8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(9) Thermal shutdown circuit

The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher,
coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal
operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect
peripheral equipment.

TSD on temperature [℃] (Typ.) Hysteresis Temperature [℃] (Typ.)

175 25

(10) Inspection of the application board

During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be perform ed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.

(11) Input terminal of IC

This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.
This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.
For example, when the resistance and transistor are connected to the terminal as shown in figure 4,

○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),

the P-N junction operates as a parasitic diode.

○Also, when GND＞(Terminal B) at the transistor (NPN)

The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned

parasitic diode.
Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. T he
operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.
Therefore, be careful not to use it in a way which causes the parasitic elements to opera te, such as by applying voltage
that is lower than the GND (P substrate) to the input terminal.

Pin A

Resistor Transistor (NPN)

Pin B

C

Pin A

B

E

Pin B

C

Parasitic element

+

N

P

P

P

P substrate

GND

+

N N

aras

element

N

c

Parasitic element

P+ P

N

P

P substrate

GND

+

N

GND

B

E

GND

Other adjacent elements

Fig. 4 Pattern Diagram of Parasitic Element

(12) Ground Wiring Patterns

When using both small signal and large current GND patterns, it is recommended to isolate the t wo ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to chang e
the GND wiring pattern potential of any external components, either.

(13) TEST Terminal

Be sure to connect TEST pin to GND.

aras

element

c

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© 2012 ROHM Co., Ltd. All rights reserved.

7/8

2012.02 - Rev.

BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM

A

●Ordering part number

Technical Note

B D 6 3 8 3

形名

HTSSOP-B40

HSOP-M36

7.8±0.2

0.625

1.0Max.

0.85±0.05

9.9± 0.2

5.4±0.1

0.08±0.05

7.5± 0.1

0.85

13.6±0.1

(MAX 13.95 include BURR)

(8.4)

1

1PIN MARK

0.65

18.5± 0.1

(MAX 18.75 include BURR)

2.77±0.1

28

1

9

1PIN MARK

0.08 S

27

10

0.24

2140

(3.2)

20

+0.05

−0.04

1936

18

+0.055

0.27

−0.045

EF V

パッケージ

EFV : HTSSOP-B40
FM : HSOP-M36

<Tape and Reel information>

+6

4

0.17

S

0.08

4

−4

1.2 ± 0.2

0.5 ± 0.15

+0.05

−0.03

M

(Unit : mm)

+6

−4

0.5± 0.15

1.2± 0.2

Quantity

Direction
of feed

<Tape and Reel information>

Quantity

Direction
of feed

-E 2

包装、フォーミング仕様
E2: リール状エンボステーピング

Embossed carrier tape (with dry pack)Tape
2000pcs

E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

Embossed carrier tape (with dry pack)Tape
1500pcs

E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

Direction of feed

2.4MAX

2.2± 0.05

0.1± 0.05

0.8

−0.04

0.08

+0.05

0.37

0.08 S

M

(Unit : mm)

Reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

Direction of feed

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© 2012 ROHM Co., Ltd. All rights reserved.

8/8

2012.02 - Rev.

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.

The content specied herein is subject to change for improvement without notice.

The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.

The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.

The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, commu­nication devices, electronic appliances and amusement devices).

The Products specied in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transpor tation equipment, aerospace machinery, nuclear-reactor controller, fuel­controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.

Notice

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