ROHM BD6380EFV Technical data

A

Stepping Motor Drivers

Low Voltage
Stepping Motor Drivers

BD6380EFV, BD6381EFV

No.12009EAT01

●Description
This series can drive the bipolar stepping motor used for paper feed carriages. It is a low power consumption bipolar P WM
constant current-drive driver. It is suitable for the mobile devices of a battery drive by po wer save function. It contributes
also to reduction of mounting area by ultra-thin and high heat-radiation (exposed metal type) HTSSOP package.

●Feature

1) Low ON resistance DMOS output

2) PWM constant current control (self oscillation)

3) Built-in spike noise cancel function (external noise filter is unnecessary)

4) Power save function

5) Built-in logic input pull-down resistor

6) Power-on reset function

7) Thermal shutdown circuit (TSD)

8) Over current protection circuit (OCP)

9) Under voltage lock out circuit (UVLO)

10) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention)

11) Electrostatic discharge: 4kV (HBM specification)

12) Adjacent pins short protection

13) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package

●Application
Mini printer, Handy printer, Monitoring camera, WEB camera, Scanner, Toy, and Robot etc.

●Absolute maximum ratings(Ta=25℃)

Item Symbol BD6380EFV BD6381EFV Unit
Supply voltage VCC VCC -0.2～+7.0 -0.2～+7.0 V
Supply voltage VM VM -0.2～+15.0 -0.2～+15.0 V

Power dissipation Pd

1

※

1.1

1.1

2

※

4.0

4.0

1

※

2

※

W

W

Input voltage for control pin VIN -0.2～(VCC +0.3) -0.2～(VCC +0.3) V
RNF maximum voltage V
Maximum output current I
Operating temperature range T
Storage temperature range T
Junction temperature T

※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃.
※2 4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃.
※3 Do not exceed Pd, ASO and Tjmax=150℃.

0.5 0.5 V

RNF

0.8

OUT

-25～+75 -25～+75 ℃

opr

-55～+150 -55～+150 ℃

stg

150 150 ℃

jmax

3

※

1.2

3

※

A/ch

www.rohm.com

© 2012 ROHM Co., Ltd. All rights reserved.

1/8

2012.02 - Rev.

BD6380EFV/BD6381EFV

A

●Operating conditions (Ta=-25～+75℃)
Item Symbol BD6380EFV BD6381EFV Unit

Supply voltage VCC VCC 2.5～5.5 2.5～5.5 V
Supply voltage VM VM 4.0～13.5 6.0～13.5 V
Input voltage for control pin VIN 0～VCC 0～VCC V
Output current (DC) I

※4 Do not exceed Pd, ASO

0.5

OUT

4

※

0.8

4

※

A/ch

●Electrical characteristics

Applicable to BD6380EFV,BD6381EFV(Unless otherwise specified Ta=25℃, VCC=3.3V, VM=6.0V)

Item Symbol

Min. Typ. Max.

Limit

Unit Conditions

Whole

VCC current at standby I

- 0 10 μA PS=L

CCST

VCC current ICC - 1.6 3.0 mA PS=H, VLIMX=0.5V
VM current at standby I

- 0 10 μA PS=L

VMST

VM current IVM - 0.08 0.50 mA PS=H, VLIMX=0.5V

Control input (PS, IN1A, IN1B, IN2A, IN2B)

H level input voltage V
L level input voltage V
H level input current I
L level input current I

2.0 - 3.3 V

INH

0 - 0.8 V

INL

15 30 60 μAVIN =3V

INH

-10 0 - μAVIN =0V

INL

Output (OUT1A, OUT1B, OUT2A, OUT2B)

Output ON resistance
(BD6380EFV)
Output ON resistance
(BD6381EFV)
Output leak current I

RON - 1.2 1.5 Ω

RON - 1.0 1.25 Ω

- - 10 μA

LEAK

I

OUT

Sum of upper and lower
I

OUT

Sum of upper and lower

Current control

RNFX input current I
SENSEX input current I
VLIMX input current I
VLIMX input voltage range V
Comparator offset voltage V

-40 -20 - μA RNFX=0V

RNF

-2.0 -0.1 - μA SENSEX=0V

SENSE

-2.0 -0.1 - μAVLIMX=0V

VLIM

0 - 0.5 V

VLIM

-10 - 10 mV

OFS

Noise cancel time tn 0.3 0.7 1.2 μs R=39kΩ, C=1000pF
VREF voltage V

0.97 1.00 1.03 V I

VREF

VREF

Technical Note

=±0.3A, VM=6V

=±0.6A, VM=7.2V

=0~1mA

www.rohm.com

© 2012 ROHM Co., Ltd. All rights reserved.

2/8

2012.02 - Rev.

BD6380EFV/BD6381EFV

A

A

A

●Terminal function･Block diagram･Application circuit diagram

1) BD6380EFV / BD6381EFV

Pin
No.

Pin name Function

1 GND Ground terminal
2 PS Power save terminal

Pin

No.

Pin name Function

13 RNF2

Connection terminal of resistor for
output current detection

3 VLIM1 Output current limit setting terminal 14 OUT2B H bridge output terminal
4 SENSE1 Input terminal of current limit comp. 15 OUT2A H bridge output terminal

5 CR1

Connection terminal of CR for setting
PWM frequency

16 VM2 Power supply terminal for motor

17 NC Non connection
6 IN1A Logic input terminal 18 IN2B Logic input terminal
7 IN1B Logic input terminal 19 IN2A Logic input terminal

Technical Note

8 NC Non connection

20 CR2
9 VM1 Power supply terminal for motor

Connection terminal of CR for setting
PWM frequency

10 OUT1A H bridge output terminal 21 SENSE2 Input terminal of current limit comp.
11 OUT1B H bridge outpu t terminal 22 VLIM2 Output current limit setting terminal

12 RNF1

You can devide the
reference voltage by
external resistor, and use
it for output current limit
setting.

Connection terminal of resistor for
output current detection

Bypass capacitor.
Setting range is

4.7uF～47uF(electrolytic)

0.01uF～0.1uF(multilayer ceramic etc.)

23 VREF Reference voltage output terminal

4.7uF

0.1uF

Set the PWM
frequency.
Setting range is
C:470pF～4700pF
R:10kΩ～100kΩ

Set the PWM frequency .
Setting range is
C:470pF～4700pF
R:10kΩ～100kΩ

39kΩ

39kΩ

VREF

VLIM1

CR1

1000pF

PS 2

IN1
IN1B

IN2
IN2B

CR2

1000pF

VLIM2

23

19
18

20

22

3

CR

5

Timer

6
7

CR

Timer

VCC

Current Limit Comp.

Logic

Current Limit Comp.

GND

24

VREF

Predriver

UVLO

TSD
OCP

Predriver

1

VM1

9

OUT1A

10
11

OUT1B

12

RNF1

4

SENSE1

VM2

16

OUT2A

15
14

OUT2B

13

RNF2

21

SENSE2

0.3Ω

47uF

0.3Ω

Resistor for current. detecting.
Setting range is

0.1Ω～1.0Ω

0.1uF

Bypass capacitor.
Setting range is
10uF～470uF(electrolytic)

0.01uF～0.1uF
(multilayer ceramic etc.)

Resistor for current. detecting.
Setting range is

0.1Ω～1.0Ω

Fig.1 Block diagram & Application circuit diagram of BD6380EFV / BD6381EFV

www.rohm.com

© 2012 ROHM Co., Ltd. All rights reserved.

3/8

2012.02 - Rev.

BD6380EFV/BD6381EFV

A

●Points to notice for terminal description
○PS／Power save terminal

PS can make circuit standby state and make motor output OPEN. Please be careful because there is a delay of 40μ
s(max.) before it is returned from standby state to normal state and the motor output becomes ACTIVE at PS=L→H.
If you don't use power save mode, you may short PS terminal to VCC.

PS State

L Standby state (RESET)

H ACTIVE

○IN1A,IN1B,IN2A,IN2B／Logic input terminal

These pins decide output state.

Input Output

PS

L X X OPEN OPEN Standby state (RESET)
H L L OPEN OPEN Standby
H H L H L Forward
H L H L H Reverse
H H H L L Brake

●Protection Circuits
○Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above
175℃ (typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150℃ (typ.), it
automatically returns to normal operation. However, even when TSD is in operation, if heat is conti nued to be added
externally, heat overdrive can lead to destruction.

○Over current Protection (OCP)

This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are
shorted each other or VCC-output or motor output-GND is shorted. This circuit latches the motor output to OPEN
condition when the regulated threshold current flows for 4μs (typ.). It returns with VCC power reactivation or a reset of
the PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular
situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets
should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues
and the return by power reactivation or a reset of the PS terminal is carried out repeatly, then OCP operates repeatly
and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being
long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values
may be exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output
current rating and under the OCP detection current flows, the IC can heat up to over Tjmax=150℃ and can deteriorate,
so current which exceeds the output rating should not be applied.

○Under voltage lock out (UVLO)

This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply
under voltage. When the applied voltage to the VCC terminal goes under 1.95V (typ.), the motor output is set to OPEN.
This switching voltage has a 0.25V (typ.) hysteresis to prevent false operation by noise etc. Please be a ware that this
circuit does not operate during power save mode.

○False operation prevention function in no power supply (Ghost Supply Preventi on)

If a logic control signal is input when there is no power supplied to this IC, there is a function which prevents the false
operation by voltage supplied via the electrostatic destruction prevention diode from the logic co ntrol input terminal to
the VCC, to this IC or to another IC’s power supply. Therefore, there is no chance of malfunction of the circuit even
when voltage is supplied to the logic control input terminal while there is no power supply.

IN1A
IN2A

IN1B
IN2B

OUT1A
OUT2A

OUT1B
OUT2B

Technical Note

X: H or L

www.rohm.com

© 2012 ROHM Co., Ltd. All rights reserved.

4/8

2012.02 - Rev.

BD6380EFV/BD6381EFV

A

●Power dissipation
○HTSSOP-B24 Package

HTSSOP-B24 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also,
the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing
power dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is
a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat
dissipation efficiency.

4.0

4.0W

3.0

2.8W

2.0

1.7W

1.0

Power Dissipation : Pd[W]

1.1W

0

Technical Note

Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
Board size：70*70*1.6mm

4

3

(With through holes on the board)
The exposed metal of the backside is connected to the board with
solder.
Board①：1-layer board(Copper foil on the back 0mm

Board②：2-layer board(Copper foil on the back 15*15mm
Board③：2-layer board(Copper foil on the back 70*70mm
Board④：4-layer board(Copper foil on the back 70*70mm

Board①：θja=113.6 ℃/W
Board②：θja =73.5℃/W

2

Board③：θja =44.6℃/W

Board④：θja =31.3℃/W

1

100 125

Ambient Temperature : Ta[℃]

Fig.2 HTSSOP-B24 Derating curve

3

2

)

2

)

2

)

2

)

www.rohm.com

© 2012 ROHM Co., Ltd. All rights reserved.

5/8

2012.02 - Rev.

BD6380EFV/BD6381EFV

A

●Usage Notes

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaki ng mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.

(2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can da mage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.

(3) Power supply Lines

Design PCB layout pattern to provide low impedance GND and supply lin es . To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.

(4) GND Potential

The potential of GND pin must be minimum potential in all operating conditions.

(5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Users should be aware that BD6380EFV and BD6381EFV have been designed to expos e their frames at the back of the
package, and should be used with suitable heat dissipation treatment in this area to improve dissipation. As large a
dissipation pattern should be taken as possible, not only on the front of the baseboard but also on the back surface.

(6) Inter-pin shorts and mounting errors

When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.

(7) Operation in a strong electric field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.

(8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(9) Thermal shutdown circuit

The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher,
coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal
operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect
peripheral equipment.

TSD ON Temperature [℃] (typ.) Hysteresis Temperature [℃] (typ.)

175 25

(10) Inspection of the application board

During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be perform ed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.

Technical Note

www.rohm.com

© 2012 ROHM Co., Ltd. All rights reserved.

6/8

2012.02 - Rev.

BD6380EFV/BD6381EFV

A

P

iti

P

iti

Technical Note

(11) Input terminal of IC

This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.
This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.
For example, when the resistance and transistor are connected to the terminal as shown in figure 3,

○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),

the P-N junction operates as a parasitic diode.

○Also, when GND＞(Terminal B) at the transistor (NPN)

The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned parasitic

diode.
Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationsh ip. The
operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.
Therefore, be careful not to use it in a way which causes the parasitic elements to opera te, such as by applying voltage
that is lower than the GND (P substrate) to the input terminal.

Pin A

Resistor Transistor (NPN)

Pin B

C

Pin A

B

E

Pin B

C

N

P+ P

Parasitic element

P

P substrate

GND

+

N N

aras

element

N

c

Parasitic element

P+ P

N

GND

+

P

P substrate

N

GND

B

E

Other adjacent elements

Fig.3 Pattern Diagram of Parasitic Element

(12) Ground Wiring Patterns

When using both small signal and large current GND patterns, it is recommended to isolate the t wo ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to chang e
the GND wiring pattern potential of any external components, either.

GND

aras

element

c

www.rohm.com

© 2012 ROHM Co., Ltd. All rights reserved.

7/8

2012.02 - Rev.

BD6380EFV/BD6381EFV

A

●Ordering part number

Technical Note

B D 6 3 8 0

形名

HTSSOP-B24

7.6±0.2

5.6±0.1

0.325

1.0MAX

0.85±0.05

0.08±0.05

7.8±0.1

(MAX 8.15 include BURR)

(5.0)

24 13

112

1PIN MARK

0.65

+0.05

0.24

-

0.04

0.08

(3.4)

S

S

0.08

EF V

パッケージ
EFV=HTSSOP-B24

<Tape and Reel information>

+

6°

4°

−

4°

1.0±0.2

0.53±0.15

+0.05

0.17

-

0.03

M

(Unit : mm)

Quantity

Direction
of feed

-E 2

包装、フォーミング仕様
E2: リール状エンボステーピング

Embossed carrier tape (with dry pack)Tape
2000pcs

E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Direction of feed

Reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.com

© 2012 ROHM Co., Ltd. All rights reserved.

8/8

2012.02 - Rev.

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.

The content specied herein is subject to change for improvement without notice.

The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.

The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.

The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, commu­nication devices, electronic appliances and amusement devices).

The Products specied in this document are not designed to be radiation tolerant.

While ROHM always makes ef forts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machiner y, nuclear-reactor controller, fuel­controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.

Notice

www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.

Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

R1120

A