System Lens Driver Series for Mobile Phone Cameras
TECHNICAL NOTE
Parallel Interface Type
Lens Drivers for Stepping Motor
BD6360GUL
●Description
The BD6360GUL motor driver provides 2 Full-ON Drive H-bridge channel.
It is offered in an ultra small functional lens system for use in an auto focus or zoom system using a stepping motor.
And It integrates a power supply and wave-shaping circuit for the photo-interrupter necessary in order to determine the
location of the motor.
Circuit current ICC - 1.1 1.8 mA PS=3V with no signal, and no load
Control input (VIN=IN1A, IN1B, IN2A, IN2B, SEL, PS)
High level input voltage VINH 1.5 - VCC V
Low level input voltage VINL 0 - 0.5 V
High level input current IINH 15 30 60 μA VINH=3V, pull down resistance typ.100kΩ
Low level input current IINL -1 0 - μA VINL=0V
UVLO
UVLO voltage VUVLO 1.6 - 2.2 V
Photo-interrupter (PI) comparator
Input bias current
Output low level voltage
Output igh level voltage
IBIPI -3 0 3 μA
VLOPI 0 - 0.5 V
VHIPI VCC-0.5- VCC V
Threshold voltage VTHPI 1.2 1.3 1.4 V Lo→Hi threshold voltage
Hysteresis voltage VHYSPI 200 300 400 mV Hi→Lo threshold voltage VTHPI-VHYSPI
Photo-interrupter (PI) regulator
ON-Resistance RONSW - - 10 Ω Io=-30mA
OFF current ILSW -1.0 0 - μA BIAS=0V
Full-ON Drive block (ch1 and ch2)
Output ON-Resistance RON - 1.00 1.25 Ω Io=+400mA on high and low sides in total
Output AC characteristic
Turn-on time - - - 2.0 μs Io=±400mA
Turn-off time toff - 0.08 0.5 μs Io=±400mA
Rise time tr 0.1 0.15 1.0 μs Io=±400mA
Fall time tf - 0.03 0.2 μs Io=±400mA
Limit
Max.
Unit Conditions
PS=0V
Io=+1mA
Io=-1mA
100%
50% 50%
VIN
Mottor current
ton
toff
90%
50% 50%
10%
-10%
-50% -50%
tf tr tf tr
-90% -90%
toff
-10%
ton
90%
10%
0%
100%
0%
-100%
Fig.1 BD6360GUL I/O Switching Waveform
2/8
●Power Dissipation Reduction
730
380
Power Dissipation:Pd[mW]
0 25 85 150
Ambient Temperature:Ta [° C ]
Fig.2 BD6360GUL Power Dissipation Reduction
●Electrical Characteristic Diagrams
10.0
Top 85 ℃
Middle 25℃
8.0
Lower -25℃
6.0
4.0
2.0
Stand-by current, Icc [ μA]
0.0
Op. range (2.3V~5.5V)
-2.0
0.01.02.0 3.0 4. 0 5.0 6.07.0
Supply voltage, Vcc [V]
Fig.3 Standby Current
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
Output voltage, VOUTH [V]
-0.8
-0.9
-1.0
Op. range (0~400mA)
Top -2 5℃
Middle 25℃
Lower 85℃
VM=VCC=3V
0.00.10.20.30.40.5
Output current, Io [A]
Fig.6 PMOS Output Voltage
3.5
3.0
2.5
2.0
1.5
1.0
Circuit current, Icc [mA]
0.5
0.0
0.01.02.03.04.05.06.07.0
Op. range (2.3V~5.5V)
Middle 25℃
Lower -25℃
Supply voltage, Vcc [V]
Top 85 ℃
Fig.4 Circuit Current
0.0
-0.1
-0.2
Op. range (0~30mA)
-0.3
Output voltage, VBIAS [V]
-0.4
-0.5
0 1020 3040 5060 7080 90100
Output current, Io [mA]
Top -2 5℃
Middle 25℃
Lower 85℃
0.5
Top 85 ℃
Middle 25℃
0.4
0.3
0.2
Output voltage, VOUTL [V]
0.1
0.0
Lower -25℃
VM=VCC=3V
Op. range (0~400mA)
0.00.10.20.30.40.5
Output current, Io [A]
Fig.5 NMOS Output Voltage
Fig.7 BIAS Output Voltage
3/8
●Block Diagram, Application Circuit Diagram, Pin Arrangement and Pin Function Table
_
p
1)BD6360GUL Block Diagram, Application Circuit Diagram, Pin Arrangement and Pin Function Table
Bypass filter Capacitor for power
supply input. See. P.6/8
Motor control input pin 1ch
Motor control input
in 2ch
Power -Saving
H: Active
L: Stand by
Input mode
selection
PS
IN1A
IN1B
IN2A
IN2B
SEL
4D
3D
2C
3B
3C
4C
Power Save
PS
Photo-interrupter regulator
Logic
VCC
0.1
BandGap
BIAS
~10uF
TSD & UVLO
Pre Driver
4B
VREF
VCC
BandGap
H bridge
H bridge
2A
3A 4A
CIN COUT
Input Comparator waveform
VCC
1ch FULL ON output pin
1D
OUT1A
OUT1B
1C
1B
OUT2A
OUT2B
1A
GND
2D
Output Comparator waveform
Fig.8 BD6360GUL Application Circuit Diagram
BD6360GUL Pin Function Table
1 2 3 4
A OUT2B CIN COUT BIAS
B OUT2A
INDEX
POST
IN2A VCC
C OUT1B IN1B IN2B SEL
D OUT1A GND IN1A PS
Fig.9 BD6360GUL Pin Arrangement (Top View)
No.Pin nameFunction
1AOUT2B H-bridge output pin ch2 B
2ACIN Comparator circuits with output waveform input pin
3ACOUT Comparator circuits with output waveform output pin
4ABIAS Voltage-regulator for photo-interrupter
1BOUT2A H-bridge output pin ch2 A
2B
3BIN2A Control input pin ch2 A
4BVCC Power supply pin
1COUT1B H-bridge output pin ch1 B
2CIN1B Control input pin ch1 B
3CIN2B Control input pin ch2 B
4CSEL Input mode selection pin ch1
1DOUT1A H-bridge output pin ch1 A
2DGND Ground pin
3DIN1A Control input pin ch1 A
4DPS Power-saving pin
4/8
M
2ch FULL ON output pin
●I/O Truth Table
BD6360GUL I/O Truth Table (x=1or2)
mode
PS SEL INxA INxB OUTxAOUTxB
INPUT OUTPUT
Output mode
L X Z Z Standby
EN/IN
L
H L H L Forward rotation
H H L H Reverse rotation
H
IN/IN H
L L Z Z Standby
L H L H Reverse rotation
H L H L Forward rotation
H H L L Brake
- L X X X Z Z Standby
At forward rotation, current flows from OUTxA to OUTxB. At reverse rotation, current flows form OUTxB to OUTxA.
L: Low, H: High, X: Don’t care, Z: Hi impedance
●Function Explanation
1) Power save function
When the L voltage is applied the PS pin, the IC’s inside circuit stop, and when 0V applied, the circuit current became
0μA(Typ.), especially.
When the IC drive, Serial input while the PS pin applied H voltage. (See the electrical characteristics; P.2/8)
2) Control Input Pin
IN1A, IN1B, IN2A, IN2B, SEL pins
The IN1A, IN1B, IN2A, IN2B are used to program and control the motor drive modes.
And, when the L voltage is applied to the SEL pin, the I/O logic can be set to EN(Enable)/IN mode, when the H voltage is
applied to the one, the I/O logic can be set to IN/IN mode. (See the electrical characteristics; P2/8, and the I/O Truth
Table; P5/8)
3) H-bridge on the output stage
Specify maximum current applied to the H-bridge within the operating range, in consideration of power dissipation.
(See the Operating Conditions; P.1/8)
4) Photo-interrupter regulator
Pay attention to the ON resistance with regard to the power source of the Photo interrupter.
(See the electrical characteristics; P.2/8)
5) The wave-shaping circuit convert
The wave-shaping circuit convert the distorted output signals from the photo-interrupter into clean rectangular waves,
then outputs them to the DSP.
A hysteresis function is included that blocks output signal chatter caused by input signal noise.
Fig.11 BD6360GUL I/O Circuit Diagram(Resistance values are typical ones)
●Operation Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings, such as the applied voltage (VCC) or operating temperature range
(Topr), may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open
mode) when such damage is suffered. A physical safety measure, such as a fuse, should be implemented when using
the IC at times where the absolute maximum ratings may be exceeded.
2) Storage temperature range (Tstg)
As long as the IC is kept within this range, there should be no problems in the IC’s performance. Conversely, extreme
temperature changes may result in poor IC performance, even if the changes are within the above range.
3) Power supply and wiring
Be sure to connect the power terminals outside the IC. Do not leave them open. Because a return current is generated
by a counter electromotive force of the motor, take necessary measures such as putting a Capacitor between the power
source and the ground as a passageway for the regenerative current. Be sure to connect a Capacitor of proper
capacitance (0.1μF to 10μF) between the power source and the ground at the foot of the IC, and ensure that there is no
problem in properties of electrolytic Capacitors such as decrease in capacitance at low temperatures. When the
connected power source does not have enough current absorbing capability, there is a possibility that the voltage of the
power source line increases by the regenerative current an exceeds the absolute maximum rating of this product and
the peripheral circuits.
Therefore, be sure to take physical safety measures suc h as putting a zener diode for a voltage clamp between
the power source an the ground.
For this IC with a part consists of the CMOS block, it is possible that rush current may flow instantaneously due to the
unstable internal logic. Therefore, give special consideration to power coupling capacitance, width of power and ground
wirings, and routing of wiring.
4) Ground terminal and wiring
The potential at GND terminals should be made the lowest under any operating conditions. Ensure that there are no
terminals where the potentials are below the potential at GND terminals, including the transient phenomena. Use short
and thick power source and ground wirings to ensure low impedance.
5) Thermal design
Use a proper thermal design that allows for a sufficient margin of the power dissipation (Pd) at actual operating
conditions.
BIAS
VCC
BIAS
OUTxB
COUT
6/8
6) Pin short and wrong direction assembly of the device.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins are
shorted together or are shorted to other circuit’s power lines.
7) Avoiding strong magnetic field
Malfunction may occur if the IC is used around a strong magnetic field.
8) ASO
Ensure that the output transistors of the motor driver are not driven under excess conditions of the absolute maximum
ratings and ASO.
9) TSD (Thermal Shut Down) circuit
If the junction temperature (Tjmax) reaches 175°C , the TSD circuit will operate, and the coil output circuit of the motor
will open. There is a temperature hysterics of approximately 25°C. The TSD circuit is designed only to shut off the IC in
order to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. The
performance of the IC’s characteristics is not guaranteed and it is recommended that the device is replaced after the
TSD is activated.
10) Testing an application board
When testing the IC on an application board, connecting a Capacitor to a pin with low impedance subjects the IC to
stress. Always discharge Capacitors after each process or step. Always turn the IC's power supply off before connecting
it to, or removing it from a jig or fixture, during the inspection process. Ground the IC during assembly steps as an
antistatic measure. Use similar precaution when transporting and storing the IC.
11) Regarding the input pin of the IC
+
This monolithic IC contains P
isolation and P substrate layers between adjacent elements to keep them isolated. P-N
junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example, the relation between each potential is as follows:
When GND > Pin A, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic diode and transistor.
Parasitic elements can occur inevitably in the structure of the IC. The operation of parasitic elements can result in
mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic
elements operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not
be used.
Pin A
N
P+ P
P
Parasitic element
GND
ResistorTransistor (NPN)
Pin A
+
N N
P substrate
Parasitic
element
Fig.12 Example of Simple IC Architecture
Pin B
N
Parasitic elements
C
P+
B
N
E
P
P substrate
GND
P+
N
GND
Pin B
B C
E
Parasitic
elements
GND
Other adjacent elements
7/8
●Selecting a Model Name when Ordering
(
B D
6 3 6 0 G
U
L
-
ROHM model namePart numberPackage typeTaping type
VCSP50L2
< Dimension >
6360 : FULL ON 2ch
GUL : VCSP50L2
< Tape and Reel information >
Tape
Quantity
Direction
of feed
Embossed carrier tape (with dry pack)
3000pcs
E2
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand.)
E2 : Reel-wound embossed taping
12341234123412341234 1234
Unit:mm)
Reel
※When you order , please order in times the amount of package quantity.