ROHM BD62321HFP Technical data

H-bridge Drivers for Brush Motors

H-bridge Drivers High current series

BD62231HFP

●Description

BD62321HFP is full bridge driver for brush motor applications. This IC can operate at a wide range of power-supply voltages (from 6V to 32V), supporting output currents of up to 3A. MOS transistors in the output stage allow for PWM signal control. The replacement is also easy because of the pin compatible with BD623XHFP series.

●Features

1) Built-in one channel driver

2) Low standby current

3) Supports PWM control signal input (20kHz to 100kHz)

4) Cross-conduction prevention circuit

5) Four protection circuits provided: OCP, OVP, TSD, UVLO and SAP

●Applications

VCR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals;OA equipments

●Absolute maximum ratings (Ta=25℃, All voltages are with respect to ground)

Parameter Symbol Ratings Unit

Supply voltage VCC 36 V

Output current I

3.0 *1 A

OMAX

No.11007EBT05

All other input pins VIN -0.3 ~ VCC V

Operating temperature T

Storage temperature T

Power dissipation Pd 1.4 *2 W

Junction temperature T

*1 Do not, exceed Pd or ASO. *2 HRP7 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.2mW/℃ above 25℃.

●Operating conditions (Ta=25℃)

Parameter Symbol Ratings Unit

Supply voltage VCC 6 ~ 32 V

-40 ~ +85 ℃

OPR

-55 ~ +150 ℃

STG

150 ℃

jmax

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BD62321HFP

●Electrical characteristics (Unless otherwise specified, Ta=25℃ and VCC=24V)

Limits

Parameter Symbol

Unit Conditions

Min. Min. Min.

Supply current ICC 0.7 1.4 2.2 mA Forward / Reverse / Brake

Technical Note

Stand-by current I

- 0 10 µA Stand-by

STBY

Input high voltage VIH 2.0 - - V

Input low voltage VIL - - 0.8 V

Input bias current IIH 30 50 100 µA VIN=5.0V

Output ON resistance RON 0.5 1.0 1.5 Ω IO=1.0A, vertically total

Input frequency range F

20 - 100 kHz FIN / RIN

MAX

●Block diagram and pin configuration

BD62321HFP

1 VCC

FIN

RIN

Fig.1 BD62321HFP

CTRL

FIN

GND

PROTECT

OUT1 OUT2

6 2

Table 1 BD62321HFP

VCC

Pin Name Function

1 VCC Power supply

2 OUT1 Driver output

GND

3 FIN Control input (forward)

4 GND Ground

5 RIN Control input (reverse)

6 OUT2 Driver output

7 VCC Power supply

FIN GND Ground

Note: Use all VCC pin by the same voltage.

VCC

OUT1

FIN

GND

RIN

OUT2

VCC

Fig.2 HRP7 package

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BD62321HFP

]

Technical Note

●Electrical characteristic curves (Reference data)

2.0

1.5

1.0

Circuit Current: Icc [mA

0.5 6 1218243036

Supply Voltag e: Vcc [V]

Fig.3 Supply current Fig.4 Stand-by current Fig.5 Input threshold voltage

1.0

0.8

85°C 25°C

-40° C

85°C 25°C

-40° C

0.6

0.4

Input Bias Current: I IH [mA]

0.2

0.0 0 6 12 18 24 30 36

Input Voltag e: VIN [V]

Fig.6 Input bias current Fig.7 Under voltage lock out Fig.8 Over voltage protection

2.5

1.5

85°C 25°C

-40° C



Stand-by Current: ISTBY [

6 1218243036

Supply Vol tage: Vc c [V]

Internal signal: Release [V] _

4.5 5 5.5 6

Supply Vol tage: VC C [V]

1.5

-40° C 25°C 85°C

85°C 25°C

-40° C

25°C 85°C

1.5

1.0

-40°C 25°C 85°C

0.5

0.0

Internal Logic: H/L [-] _

-0.5

0.8 1.2 1.6 2

Input Vol tage: V IN [ V]

85°C 25°C

-40° C

Internal signal: Release [V] _

36 40 44 48

Supply Vol tage: VC C [V]

1.5

1.0

0.5

-40° C 25°C 85°C

85°C 25°C

-40°C

0.5

Output Voltage: V CC-VOUT [V]

0.5

Output Voltage:V CC- VOUT [V]

0.0

Internal Logic: H/L [-] _

00.511.522.53

Output Current: IOUT [A]

Fig.9 Output high voltage Fig.10 High side body diode Fig.11 Over current protection (H side)

2.5

1.5

Output Voltage: V OUT [V]

0.5

00.511.522.53

Output Current: IOUT [A]

85°C 25°C

-40° C

Fig.12 Output low voltage Fig.13 Low side body diode Fig.14 Over current protection (L side)

00.511.522.53

Output Current: IOUT [A]

1.5

0.5

Output Voltage: V OUT [V]

00.511.522.53

Output Current: IOUT [A]

-40°C 25°C 85°C

-0.5 4 4.2 4.4 4.6 4.8 5

Load Cur rent [A ]

1.5

1.0

0.5

0.0

Internal Logic: H/L [-] _

-0.5 4 4.2 4.4 4.6 4.8 5

Load Cur rent [A ]

85°C 25°C

-40° C

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BD62321HFP

Technical Note

●Functional descriptions

1) Operation modes

Table 2 Logic table

FIN RIN OUT1 OUT2 Operation

a L L Hi-Z* Hi-Z* Stand-by (idling)

b H L H L Forward (OUT1 > OUT2)

c L H L H Reverse (OUT1 < OUT2)

d H H L L Brake (stop)

e PWM L H

f L PWM

* Hi-Z is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay.

__________

PWM

__________

PWM

Forward (PWM control)

H Reverse (PWM control)

a) Stand-by mode

In stand-by mode, all internal circuits are turned off, including the output power transistors. Motor output goes to high impedance. If the motor is running at the switch to stand-by mode, the system enters an idling state because of the body diodes. However, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50µs before shutting down all circuits.

b) Forward mode

This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2.

c) Reverse mode

This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1.

d) Brake mode

This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because the internal control circuit is operating in the brake mode. Please switch to the stand-by mode (rather than the brake mode) to save power and reduce consumption.

OFF

a) Stand-by mode b) Forward mode c) Reverse mode d) Brake mode

Fig.15 Four basic operations (output stage)

OFF

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BD62321HFP

e) f) PWM control mode

The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN pin or the RIN pin. In this mode, the high side output is fixed and the low side output does the switching, corresponding to the input signal. The switching operates by the output state toggling between "L" and "Hi-Z". The PWM frequency can be input in the range between 20kHz and 100kHz. Note that control may not be attained by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. Also, circuit operation may not respond correctly when the input signal is higher than 100kHz. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.

OFF

Control input : H Control input : L

Fig.16 PWM control operation (output stage)

FIN

RIN

OUT1

OUT2

Fig.17 PWM control operation (timing chart)

2) Cross-conduction protection circuit In the full bridge output stage, when the upper and lower transistors are turned on at the same time, and this condition exists during the period of transition from high to low, or low to high, a rush current flows from the power supply to ground, resulting in a loss. This circuit protects against the rush current by providing a dead time (about 800ns, nominal) at the transition.

3) Output protection circuits

a) Under voltage lock out (UVLO) circuit

To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 5.3V (nominal) or below, the controller forces all driver outputs to high impedance. When the voltage rises to 5.5V (nominal) or above, the UVLO circuit ends the lockout operation and returns the chip to normal operation.

b) Over voltage protection (OVP) circuit

When the power supply voltage exceeds 45V (nominal), the controller forces all driver outputs to high impedance. The OVP circuit is released and its operation ends when the voltage drops back to 40V (nominal) or below. This protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.

c) Thermal shutdown (TSD) circuit

The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175℃ nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (150℃ nominal). Thus, it is a self-returning type circuit. The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate

the IC in an environment where activation of the circuit is assumed.

Technical Note

OFF

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BD62321HFP

d) Over current protection (OCP) circuit

To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this circuit works independently for each channel.

Threshold

Iout

CTRL Input

Inte rnal status

Monitor / Timer

OFF ON

mon.

off timer

Fig.18 Over current protection (timing chart)

e) Safe area protection (SAP) circuit

To protect the output MOS transistors from ASO, ground faults, power supply line faults and load short circuits, the SAP circuit monitors the conditions for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects to exceed ASO, the controller forces all driver outputs to high impedance and latch in the state. It is released that via standby mode during 150µs or more by the control inputs FIN and RIN.

●ASO (Area of Safety Operation)

~Reference data~



1msT

=10msTON=100ms

TON=1msTON=10ms

=100ms



100µs

[A] I

[A]

0.1 1 10 100

[V]

0.1 1 10 100

[V]

Fig.19 ASO curve (Ta=25℃) Fig.20 ASO curve (Tj=150℃)

When using this IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. The output protection circuits are effective only in the area of safety operation.

Technical Note

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BD62321HFP

●Thermal design

10.0

8.0

6.0

Pd [W]

4.0

2.0

0.0

0 25 50 75 100 125 150

iv) 4 layers PCB(copper foil: 70mm x 70mm) iii) 2 layers PCB (copper foil: 70mm x 70mm) ii) 2 layers PCB (copper foil: 15mm x 15mm) i) 1 layer PCB (copper foil: 10.5mm x 10.5mm)

iv) 7.3W

iii) 5.5W

ii) 2.3W

i) 1.4W

Mounted on ROHM standard PCB

(70mm x 70mm x 1.6mm FR4 glass-epoxy board)

AMBIENT TEMPERATURE [°C]

Table 3 Thermal resistance

Board

j-a

[℃/W]

Board (4) 17.1

Board (3) 22.7

Board (2) 54.4

Board (1) 89.3

* Transient thermal resistance is measured data only; values are not guaranteed.

Fig.21 Thermal derating curve (HRP7 package)

Thermal design needs to meet the following operating conditions. In creating the thermal design, sufficient margin must be provided to guarantee the temperature conditions below.

1. The ambient temperature Ta must be 85℃ or below

2. The junction temperature Tj must be 150℃ or below

The junction temperature Tj can be determined using the following equation.

Tj ≈ Ta +

x Pc [℃]

j-a

The power consumption Pc can be determined using the following equation. Refer to page 3 about V

Pc ≈ (I

x RON) x D + I

OUT

x (V

ON(H)

+ V

) x (1 - D) + VCC x ICC [W]

F(H)

ON(H)

Example)

Conditions: Ta=50℃, VCC=24V, Iout=0.5A, D (on duty)=100%.

The power consumption of the IC and the junction temperature are as follows:

Pc ≈ 0.5

x 1.0 + 24 x 1.7m = 290.8mW

Tj ≈ 50 + 89.3 x 290.8m = 76 [℃]

Where the Tjmax parameter is 150℃ and the derating is set to 80 percents, the maximum ambient temperature Tamax is determined as follows.

Ta ≤ Tjmax x 0.8 -

x Pc ≈ 94 [℃]

j-a

In this example, thermal design can be considered satisfactory (meaning that there are no problems in thermal design), since the system meets the operating temperature conditions.

●Interfaces

VCC

FIN

RIN

100k

OUT1 OUT2

GND

Fig.22 FIN / RIN Fig.23 OUT1 / OUT2

Technical Note

and V

F(H)

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BD62321HFP

●Notes for use

1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is to be implemented.

2) Connecting the power supply connector backward Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as adding an external direction diode.

3) Power supply lines Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors – including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND.

4) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the same way, care must be taken to avoid changes in the GND wire pattern in any external connected component.

5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating conditions.

6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error, or if pins are shorted together.

7) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields.

8) ASO - Area of Safety Operation When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

9) Built-in thermal shutdown (TSD) circuit The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.

10) Capacitor between output and GND In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1μF between output and GND.

11) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC.

12) Switching noise When the operation mode is in PWM control, PWM switching noise may effects to the control input pins and cause IC malfunctions. In this case, insert a pulled down resistor (10kΩ is recommended) between each control input pin and

nd.

grou

Technical Note

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BD62321HFP

13) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. Do not force the voltage of the input pins in excess of 5.5V when the power does not supply to the IC.

Pin A

Parasitic element

P substrate

GND

Technical Note

Resistor Transistor (NPN)

Pin B

Pin A

N N

Parasitic element

Appendix: Example of monolithic IC structure

P substrate

GND

Pin B

B C

Parasitic element

GND

Other adjacent elements

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BD62321HFP

●Ordering part number

B D 6 2 3 2 1 H F P - T R

Technical Note

ROHM part number

HRP7

1.017±0.2

8.0±0.13

0.8875

Type Package

9.395±0.125

(MAX 9.745 include BURR)

8.82±0.1 (5.59)

7654321

1.27

0.08±0.05

0.73±0.1

0.08

(7.49)

1.905±0.1

0.835±0.2

4.5°

0.27

10.54±0.13

1.523±0.15

5.5°

−

4.5°

+0.1

0.05

(Unit : mm)

HFP: HRP7

Embossed carrier tapeTape

Quantity

Direction of feed

2000pcs TR

The direction is the 1pin of product is at the upper right when you hold

( )

reel on the left hand and you pull out the tape on the right hand

Reel

Packaging spec.

TR: Embossed taping

1pin

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

∗

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Notes

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Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.

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ROHM BD62321HFP Technical data

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