ROHM BD6231HFP Technical data

DC Brush Motor Drivers (36V max.)

BD623xxx Series

●General Description

These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power supply voltages (from 6V to 32V), with output currents of up to 2A. MOS transistors in the output stage allow PWM speed control. The integrated VREF voltage control function allows direct replacement of deprecated motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design.

●Features  Built-in, selectable one channel or two channels

configuration

 VREF voltage setting pin enables PWM duty control  Cross-conduction prevention circuit  Four protection circuits provided: OCP, OVP, TSD

and UVLO

●Applications

VTR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals; OA equipments

●Ordering Information

●Key Specifications

■ Supply Voltage Range: 36V(Max.)

■ Maximum Output Current: 0.5A / 1.0A / 2.0A

■ Output ON resistance: 1.5 / 1.5 / 1.0

■ PWM Input frequency range: 20 to 100kHz

■ Standby current: 0A (Typ.)

■ Operating temperature range: -40 to 85℃

●Packages (Typ.) (Typ.) (Max.) SOP8 5.00mm x 6.20mm x 1.71mm HSOP25 13.60mm x 7.80mm x 2.11mm HSOP-M28 18.50mm x 9.90mm x 2.41mm HRP7 9.395mm x 10.540mm x 2.005mm

HRP7 (Pd=1.60W)

HSOP25( (Pd=1.45W)

*Pd : Mounted on a 70mm x 70mm x 1.6mm

Datashee

SOP8 (Pd=0.69W)

HSOP-M28 (Pd=2.20W)

lass-epoxy

B D 6 2 3 x x x x - x x

Part Number

●Lineup Rating voltage

(Max.)

36V

Channels

1ch

2ch

Package F : SOP8 FP : HSOP25 FM : HSOP-M28 HFP : HRP7

Output current

(Max.)

0.5A SOP8 Reel of 2500 BD6230F-E2

1.0A

2.0A

1.0A

2.0A HSOP-M28 Reel of 1500 BD6237FM-E2

HRP7 Reel of 2000 BD6231HFP-TR SOP8 Reel of 2500 BD6231F-E2 HRP7 Reel of 2000 BD6232HFP-TR HSOP25 Reel of 2000 BD6232FP-E2 HSOP25 Reel of 2000 BD6236FP-E2 HSOP-M28 Reel of 1500 BD6236FM-E2

Packaging and forming specification E2: Embossed taping (SOP8/HSOP25/HSOP-M28) TR: Embossed taping (HRP7)

Package

Ordeble

Part Number

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays .

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Datasheet

BD623xxx Series

●Block Diagrams / Pin Configurations / Pin Descriptions

BD6230F / BD6231F

6 VREF DUTY

FIN

RIN

CTRL

PROTECT

OUT1 OUT2

7 1

VCC

8 GND

Fig.1 BD6230F / BD6231F

OUT1

VCC VCC

FIN

GND OUT2 VREF RIN

Fig.2 SOP8 (TOP VIEW)

BD6231HFP / BD6232HFP

VREF DUTY

PROTECT

VCC

FIN

RIN

CTRL

FIN

GND

OUT1 OUT2

GND

6 2

Fig.3 BD6231HFP / BD6232HFP

VREF

OUT1

FIN

GND

RIN

OUT2

VCC

Fig.4 HRP7 (TOP VIEW)

BD6232FP

VREF DUTY

FIN

RIN

CTRL

GND

PROTECT

FIN

GND

12 1

2 13

OUT1 OUT2

VCC

RNF

Fig.5 BD6232FP

OUT1 OUT1

NC NC NC

GND GND RNF

RNF

NC NC

NC OUT2 OUT2

NC NC VCC VCC VCC FIN

GND RIN

NC VREF NC NC NC

Fig.6 HSOP25 (TOP VIEW)

Table 1 BD6230F/BD6231F

Pin Name Function

1 OUT1 Driver output 2 VCC Power supply 3 VCC Power supply 4 FIN Control input (forward) 5 RIN Control input (reverse) 6 VREF Duty setting pin 7 OUT2 Driver output 8 GND Ground

Note: Use all VCC pin by the same voltage.

Table 2 BD6231HFP/BD6232HFP

Pin Name Function

1 VREF Duty setting pin 2 OUT1 Driver output 3 FIN Control input (forward) 4 GND Ground 5 RIN Control input (reverse) 6 OUT2 Driver output 7 VCC Power supply

FIN GND Ground

Table 3 BD6232FP Pin Name Function 1,2 OUT1 Driver output

6 GND Small signal ground

7,8 RNF Power stage ground

12,13 OUT2 Driver output

17 VREF Duty setting pin 19 RIN Control input (reverse) 20 FIN Control input (forward) 21 VCC Power supply

22,23 VCC Power supply

FIN GND Ground

Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage.

Datasheet

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BD623xxx Series

●Block Diagrams / Pin Configurations / Pin Descriptions - Continued BD6236FP

VREFA DUTY

PROTECT

FINA

RINA

CTRL

GND

VREFB DUTY

PROTECT

FINB

RINB

GND

CTRL

FIN

GND

Fig.7 BD6236FP

OUT1

RNFA

OUT2

GND

VREF

RIN

FIN

VCC VCC

NC NC

VCC VCC FINB RINB VREFB GND

GND OUT2B

NC NC RNFB NC OUT1B

VCC

OUT1A

OUT2A

RNFA

VCC

OUT1B

OUT2B

RNFB

Pin Name Function

1 OUT1A Driver output 3 RNFA Power stage ground 6 OUT2A Driver output 8 GND Small signal ground

9 VREFA Duty setting pin 10 RINA Control input (reverse) 11 FINA Control input (forward) 12 VCC Power supply 13 VCC Power supply 14 OUT1B Driver output 16 RNFB Power stage ground 19 OUT2B Driver output 20 GND Small signal ground 21 VREFB Duty setting pin 22 RINB Control input (reverse) 23 FINB Control input (forward) 24 VCC Power supply 25 VCC Power supply

FIN GND Ground

Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage.

Fig.8 HSOP25 (TOP VIEW)

Datasheet

Table 4 BD6236FP

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Datasheet

BD623xxx Series

●Block Diagrams / Pin Configurations / Pin Descriptions - Continued BD6236FM

VREFA DUTY

PROTECT

FINA

RINA

CTRL

GND

VREFB DUTY

PROTECT

FINB

RINB

CTRL

GND

FIN

GND

Fig.9 BD6236FM

OUT1

RNFA

OUT2

NC NC

GND

VREF

RIN FIN

VCC VCC

VCC NC VCC FINB RINB VREFB GND

GND

NC OUT2B NC NC RNFB NC OUT1B

VCC

OUT1A

OUT2A

RNFA

VCC

OUT1B

OUT2B

RNFB

Pin Name Function

1 OUT1A Driver output 3 RNFA Power stage ground 6 OUT2A Driver output 8 GND Small signal ground

9 VREFA Duty setting pin 10 RINA Control input (reverse) 11 FINA Control input (forward) 12 VCC Power supply 14 VCC Power supply 15 OUT1B Driver output 17 RNFB Power stage ground 20 OUT2B Driver output 22 GND Small signal ground 23 VREFB Duty setting pin 24 RINB Control input (reverse) 25 FINB Control input (forward) 26 VCC Power supply 28 VCC Power supply

FIN GND Ground

Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage.

Fig.10 HSOP-M28 (TOP VIEW)

Datasheet

Table 5 BD6236FM

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Datasheet

BD623xxx Series

●Block Diagrams / Pin Configurations / Pin Descriptions - Continued BD6237FM

VREFA DUTY

PROTECT

FINA

RINA

GND

VREFB DUTY

CTRL

PROTECT

FINB

RINB

GND

CTRL

FIN GND

Fig.11 BD6237FM

OUT1 OUT1

RNFA RNFA

OUT2 OUT2

GND

VCC VCC VCC FINB RINB VREFB GND

GND

VCC

OUT1A

OUT2A

RNFA

VCC

OUT1B

OUT2B

RNFB

Pin Name Function 1,2 OUT1A Driver output 3,4 RNF A Power stage ground 6,7 OUT2A Driver output

8 GND Small signal ground

9 VREFA Duty setting pin 10 RINA Control input (reverse) 11 FINA Control input (forward) 12 VCC Power supply

13,14 VCC Power supply 15,16 OUT1B Driver output 17,18 RNFB Power stage ground 20,21 OUT2B Driver output

22 GND Small signal ground 23 VREFB Duty setting pin 24 RINB Control input (reverse) 25 FINB Control input (forward) 26 VCC Power supply

27,28 VCC Power supply

FIN GND Ground

Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage.

GND

VREF

RIN FIN

VCC VCC VCC

OUT2B OUT2B NC RNFB RNFB OUT1B OUT1B

Fig.12 HSOP-M28 (TOP VIEW)

Datasheet

Table 6 BD6237FM

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Datasheet

BD623xxx Series

●Absolute Maximum Ratings (Ta=25℃, All voltages are with respect to ground) Parameter Symbol Ratings Unit

Supply voltage VCC 36 V

Datasheet

Output current I

0.5 *1 / 1.0 *2 / 2.0 *3 A

OMAX

All other input pins VIN -0.3 to VCC V

Operating temperature T

Storage temperature T

Power dissipation Pd 0.687 *4 / 1.6 *5 / 1.45 *6 / 2.2 *

Junction temperature T

*1 BD6230. Do not exceed Pd or ASO. *2 BD6231 / BD6236. Do not exceed Pd or ASO. *3 BD6232 / BD6237. Do not exceed Pd or ASO. *4 SOP8 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 5.5mW/℃ above 25℃. *5 HRP7 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 12.8mW/℃ above 25℃. *6 HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 11.6mW/℃ above 25℃. *7 HSOP-M28 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 17.6mW/℃ above 25℃.

-40 to +85 ℃

OPR

-55 to +150

STG

150 ℃

jmax

℃

●Recommended Operating Ratings (Ta=25℃)

Parameter Symbol Ratings Unit

Supply voltage VCC 6 to 32 V

VREF voltage VREF 3 to 32 V

●Electrical Characteristics (Unless otherwise specified, Ta=25℃ and VCC=VREF=24V) Parameter Symbol

Min. Min. Min.

Limits

Unit Conditions

Supply current (1ch)

Supply current (2ch)

Stand-by current

Input high voltage

Input low voltage

Input bias current

Output ON resistance *1

Output ON resistance *2

Output ON resistance *3

VREF bias current

Carrier frequency

Input frequency range

*1 BD6230 *2 BD6231 / BD6236 *3 BD6232 / BD6237

ICC

STBY

VIH

RON

VREF

PWM

MAX

0.8 1.3 2.5

1.3 2.0 3.5

- 0 10

2.0 - -

- - 0.8 V

30 50 100

1.0 1.5 2.5

0.5 1.0 1.5

-10 0 10

20 25 35

20 - 100

kHz

Forward / Reverse / Brake

Stand-by

µA



µA

IN=5.0V

O=0.25A, vertically total

IO=0.5A, vertically total

IO=1.0A, vertically total

VREF=VCC

VREF=18V

FIN / RIN

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Datasheet

BD623xxx Series

●Typical Performance Curves (Reference data)

2.5

2.0

1.5

Circuit Current: I cc [ mA]

1.0

0.5 6 1218243036

Supply Voltage: Vcc [ V]

Fig.13 Supply current (1ch) Fig.14 Supply current (2ch)

1.5

1.0

0.5

Internal Logic : H/ L [ - ] _

0.0

-0.5

-40°C 25°C 85°C

0.8 1.2 1.6 2 Input Volt ag e: VI N [V]

Fig.15 Input threshold voltage Fig.16 Input bias current

85°C 25°C

-40°C

Datasheet

3.0

2.5

2.0

Circuit Current: I cc [ mA]

1.5

-40°C

1.0 6 1218243036

Supply Voltage: Vcc [ V]

1.0

85°C

0.8

0.6

0.4

0.2

Input Bias Current: IIH [mA] _

0.0 0 6 12 18 24 30 36

Input V oltage: VIN [V]

25°C

-40°C

85°C 25°C

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BD623xxx Series

●Typical Performance Curves (Reference data) - Continued

Fig.17 VREF input bias current Fig.18 VREF - DUTY (VCC=24V)

-5

Input Bias Current: IVREF [µA]

-10 0 6 12 18 24 30 36

Input Voltage: VREF [V]

Oscillation Frequency: FPWM [kHz]

6 1218243036

Supply Voltage: VCC [V ]

-40°C 25°C 85°C

85°C 25°C

-40°C

1.0

0.8

0.6

0.4

Switching Duty: D [Ton/T] _

0.2

0.0 0 0.2 0.4 0.6 0.8 1

Input Voltage: VREF / V CC [V]

Int er nal signal: Release [V] _

4.555.56 Supply Voltage: VCC [V ]

Datasheet

-40°C 25°C 85°C

85°C 25°C

-40°C

Fig.19 VCC - Carrier frequency Fig.20 Under voltage lock out

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Datasheet

BD623xxx Series

●Typical Performance Curves (Reference data) - Continued

Int er nal signal: Release [V]

-40°C 25°C 85°C

36 40 44 48

Supply Voltage: VCC [V ]

Fig.21 Over voltage protection Fig.22 Thermal shutdown

1.5 85°C

25°C

-40°C

1.0

1.5

1.0

0.5

Internal Logic : H/ L [ - ]

0.0

-0.5 125 150 175 200

Junction T emperature: Tj [°C]

1.5

1.0

Datasheet

85°C 25°C

-40°C

0.5

Internal Logic : H/ L [ - ]

0.0

-0.5

22.533.54 Load Current / Iomax : Normalized

Fig.23 Over current protection (H side) Fig.24 Over current protection (L side)

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0.5

Internal Logic : H/ L [ - ]

0.0

-0.5 1 1.25 1.5 1.75 2

Load Current / Iomax : Normalized

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Datasheet

BD623xxx Series

●Typical Performance Curves (Reference data) – Continued

0.8

0.6

0.4

0.2

Output Voltage: VCC-V OUT [V]

0 0.10.20.30.40.5

Output Current: IOUT [A]

Fig.25 Output high voltage (BD6230) Fig.26 Output high voltage (BD6231/36)

1.5

85°C 25°C

-40°C

85°C 25°C

-40°C

Datasheet

1.6 85°C

25°C

-40°C

1.2

0.8

0.4

Output Voltage: VCC-V OUT [V]

00.20.40.60.81 Output Current: IOUT [A]

-40°C 25°C 85°C

1.5

0.5

Output Voltage: VCC-V OUT [V]

00.40.81.21.62 Output Current: IOUT [A]

Fig.27 Output high voltage (BD6232/37) Fig.28 High side body diode (BD6230)

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0.5

Output V oltage: VCC-VOUT [ V ]

0 0.10.20.30.40.5

Output Current: IOUT [A]

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Datasheet

BD623xxx Series

●Typical Performance Curves (Reference data) – Continued

-40°C 25°C 85°C

1.5

0.5

Output V oltage: VCC-VOUT [ V ]

00.20.40.60.81 Output Current: IOUT [A]

Fig.29 High side body diode (BD6231/36) Fig.30 High side body diode (BD6232/37)

Datasheet

-40°C 25°C 85°C

1.5

0.5

Output V oltage: VCC-VOUT [ V ]

00.40.81.21.62 Output Current: IOUT [A]

0.8

0.6

0.4

0.2

Output Voltage: VOUT [V]

0 0.10.20.30.40.5

Output Current: IOUT [A]

Fig.31 Output low voltage (BD6230) Fig.32 Output low voltage (BD6231/36)

85°C 25°C

-40°C

1.6

1.2

0.8

0.4

Output Voltage: VOUT [V]

00.20.40.60.81 Output Current: IOUT [A]

85°C 25°C

-40°C

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Datasheet

BD623xxx Series

●Typical Performance Curves (Reference data) - Continued

1.5

0.5

Output Voltage: VOUT [V]

00.40.81.21.62 Output Current: IOUT [A]

Fig.33 Output low voltage (BD6232/37) Fig.34 Low side body diode (BD6230)

1.5

0.5

Output Voltage: VOUT [V]

00.20.40.60.81 Output Current: IOUT [A]

85°C 25°C

-40°C

-40°C 25°C 85°C

Datasheet

1.5

0.5

Output Voltage: VOUT [V]

0 0.10.20.30.40.5

Output Current: IOUT [A]

1.5

0.5

Output Voltage: VOUT [V]

00.40.81.21.62 Output Current: IOUT [A]

-40°C 25°C 85°C

Fig.35 Low side body diode (BD6231/36) Fig.36 Low side body diode (BD6232/37)

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BD623xxx Series

●Functional Descriptions

1) Operation modes Table 7 Logic table

FIN RIN VREF OUT1 OUT2 Operation a L L X Hi-Z* Hi-Z* Stand-by (idling) b H L VCC H L Forward (OUT1 > OUT2) c L H VCC L H Reverse (OUT1 < OUT2) d H H X L L Brake (stop) e PWM L VCC H

f L PWM VCC

g H PWM VCC

__________

PWM

__________

PWM

h PWM H VCC L

i H L Option H j L H Option

* Hi-Z : all output transistors are off. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay. X : Don’t care

__________

PWM

__________

PWM

Forward (PWM control mode A)

H Reverse (PWM control mode A)

L Forward (PWM control mode B)

__________

PWM

__________

PWM

Reverse (PWM control mode B) Forward (VREF control)

H Reverse (VREF control)

a) Stand-by mode

Stand-by operates independently with the VREF pin voltage. In stand-by mode, all internal circuits are turned off, including the output power transistors. Motor output goes to high impedance. When the system is switched to stand-by mode while the motor is running, the system enters an idling state because of the body diodes. However, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50µs before shutting down all circuits.

b) Forward mode

This operating mode is defined as the forward rotation of the motor when the OUT 1 pin is high and OUT2 pin is low. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. To operate in this mode, connect the VREF pin to the VCC pin.

c) Reverse mode

This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. To operate in this mode, connect the VREF pin to the VCC pin.

d) Brake mode

This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because the internal control circuit is operating in the brake mode. Please switch to stand-by mode (rather than the brak e mode) to save power and reduce consumption.

OFF

a) Stand-by mode b) Forward mode c) Reverse mode d) Brake mode

Fig.37 Four basic op erations (output stage)

Datasheet

OFF

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BD623xxx Series

e) f) PWM control mode A

The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the RIN pin. In this mode, the high side output is fixed and the low side output is switching, corresponding to the input signal. The state of the output toggles between "L" and "Hi-Z". The frequency of the input PWM signal can be between 20kHz and 100kHz. T he circuit may not operate prop erly for PWM frequencies below 20kHz and above 100kHz. Note that control may n ot be attained by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. To operate in this mode, connect the VREF pin to the VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or higher is recommended) between VCC and ground.

OFF

Control input : H Control input : L

Fig.38 PWM control mode A operation (output stage)

FIN

RIN

OUT1

OUT2

Fig.39 PWM control mode A operation (timing chart)

g) h) PWM control mode B

The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the RIN pin. In this mode, the low side output is fixed and the high side output is switching, corresponding to the input

signal. The state of the output toggles between "L" and "H". The frequency of the input PWM signal can be between 20kHz and 100kHz. T he circuit may not operate properl y for PWM frequencies below 20kHz and above 100kHz. To operate in this mode, connect the VREF pin to the VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or higher is recommended) between VCC and ground.

OFF

Control input : H Control input : L

Fig.40 PWM control mode B operation (output stage)

FIN

RIN

OUT1

OUT2

Fig.41 PWM control mode B operation (timing chart)

Datasheet

OFF

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BD623xxx Series

i) j) VREF control mode

The built-in VREF duty cycle conversion circuit provides a duty cycle corr esponding to the voltage of the VREF pin

and the VCC voltage. The function offers the same level of control as the high voltage output setting function in

previous models. The duty cycle is calculated by the following equation. DUTY  VREF [V] / VCC [V] For example, if VCC voltage is 24V and VREF pin voltage is 18V, the duty cycle is about 75 percent. However,

please note that the duty cycle might be limited by the range of the VREF pin voltage (Refer to the operating conditions, shown on page 2). The PWM carrier frequency in this mode is 25kHz (nominal), and the switching operation is the same as the PWM control modes. When operating in this mode, do not input a PWM signa l to the FIN and RIN pins. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.

VCC

VREF

FIN

RIN

OUT1

OUT2

2) Cross-conduction protection circuit In the full bridge output stage, when the upper and lower transistors are turned on at the same time during high to low or low to high transition, an inrush current flows from the power supply to ground, resulting to a loss. This circuit eliminates the inrush current by providing a dead time (about 400ns, nominal) during the transition.

3) Output protection circuits a) Under voltage lock out (UVLO) circuit

To ensure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 5.0V (nominal) or below, the controller forces all driver outputs to high impedance. When the voltage rises to 5.5V (nominal) or above, the UVLO circuit ends the lockout operation and returns the chip to normal operation.

b) Over voltage protection (OVP) circuit

When the power supply voltage exceeds 45V (nominal), the controller forces all driver outputs to high impedance. The OVP circuit is released and its operation ends when the voltage drops back to 40V (nominal) or below. This protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.

Datasheet

Fig.42 VREF control operation (timing chart)

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BD623xxx Series

Datasheet

c) Thermal shutdown (TSD) circuit

The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175℃ nominal). At this time, the controller forces all driver outputs to high impedance. Since ther mal h ysteresis is provi ded in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset

temperature (150℃ nominal). Thus, it is a self-resetting circuit. The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.

d) Over current protection (OCP) circuit

To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC returns to normal operation after the off time period has elapsed (self-returning type). At the two channels t ype, this circuit works independently for each channel.

Threshold

Iout

CTRL Input

Internal status

Monitor / Timer

mon.

OFF ON

off timer

Fig.43 Over current protection (timing chart)

●I/O equivalent circuit

VCC

FIN

RIN

VCC

100k

VREF

VCC

10k

OUT1 OUT2

GND

Fig.44 FIN / RIN Fig.45 VREF Fig.46 OUT1 / OUT2 Fig.47 OUT1 / OUT2

(SOP8/HRP7) (HSOP25/HSOPM28)

VCC

OUT1 OUT2

RNF GND

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●Operational Notes

1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins . Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2) Reverse connection of power supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals.

3) Power supply lines

Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground an d supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors.

4) Ground Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operati ng conditi ons. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition.

5) Thermal consideration

Use a thermal design that allows for a sufficient margin by taking into account the permissible power diss ipation (Pd) in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (PcPd).

Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja Power dissipation : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib

Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] , θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W], Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current

Datasheet

6) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

7) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8) Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO).

9) Capacitor between output and GND If a large capacitor is connected between the output pin and GND pin, current from the charged capacitor can flow into the output pin and may destroy the IC wh capacitor smaller than 10uF between output and GND.

10) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

11) Switching noise When the operation mode is in PWM control or VREF control, PWM switching no ise may affect the control input pins and cause IC malfunctions. In this case, insert a pull down resistor (10k is recommende d) between each control input pin and ground.

en the VCC or VIN pin is shorted to ground or pulled down to 0V. Use a

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12) Regarding the input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.

Pin A

Parasitic element

P+ P

P substrate

GND

Datasheet

Resistor Transistor (NPN)

Pin B

Pin A

N N

Fig. 48 Example of monolithic IC structure

Parasitic element

P+

Parasitic element

P substrate

GND

P+

GND

Pin B

B C

Parasitic element

GND

Other adjacent elements

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●Physical Dimensions Tape and Reel Information

SOP8

5.0±0.2

(MAX 5.35 include BURR)

4.4±0.2

6.2±0.3

438251

0.595

1.5±0.1

0.11

1.27

0.42±0.1

0.1 S

−4°

0.3MIN

0.9±0.15

+0.1

0.17

0.05

(Unit : mm)

HSOP25

13.6 ± 0.2

(MAX 13.95 include BURR)

2.75 ± 0.1

25 14

7.8 ± 0.3

1.9 ± 0.1

0.11

5.4 ± 0.2

0.8

12.0 ± 0.2

1.95 ± 0.1

0.36 ± 0.1

0.3Min.

0.25 ± 0.1

0.1 S

(Unit : mm)

Embossed carrier tapeTape

Quantity

Direction of feed

2500pcs E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

Embossed carrier tapeTape

Quantity

Direction of feed

2000pcs E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

Datasheet

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

Direction of feed

HSOP-M28

9.9± 0.3

7.5± 0.2

1.25

2.2± 0.1

0.11

18.5± 0.2

(MAX 18.85 include BURR)

5.15± 0.1

0.37± 0.1

0.8

Embossed carrier tapeTape

+6°

4°

−4°

Quantity

Direction of feed

1.2± 0.15

0.1 S

0.5± 0.2

+0.1

0.27

−0.05

(Unit : mm)

1500pcs E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Direction of feed

Reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

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●Physical Dimensions Tape and Reel Information- Continued

HRP7

9.395±0.125

(MAX 9.745 include BURR)

8.82±0.1

1.017±0.2

(6.5)

1.905±0.1

8.0±0.13

0.8875

1.27

0.08±0.05

0.08

7654321

0.73±0.1

(7.49)

0.835±0.2

1.523±0.15

5.5°

4.5°

−

4.5°

+0.1

0.27

0.05

(Unit : mm)

10.54±0.13

Quantity

Direction of feed

Datasheet

Embossed carrier tapeTape 2000pcs

The direction is the 1pin of product is at the upper right when you hold

( )

reel on the left hand and you pull out the tape on the right hand

1pin

Direction of feed

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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BD623xxx Series

●Marking Diagrams

SOP8(TOP VIEW)

HSOP-M28 (TOP VIEW)

Part Number Package Part Number Marking BD6230F SOP8 6230 BD6231HFP HRP7 BD6231HFP BD6231F SOP8 6231 BD6232HFP HRP7 BD6232HFP BD6232FP HSOP25 BD6232FP BD6236FP HSOP25 BD6236FP

Datasheet

HSOP25 (TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

Part Number Marking

LOT Number

1PIN MARK

HRP7 (TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

Part Number Marking

LOT Number

1PIN MARK

BD6236FM HSOP-M28 BD6236FM BD6237FM HSOP/M28 BD6237FM

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BD623xxx Series

●Revision History

Date Revision Changes

10.Apr.2012 001 New Release

25.Dec.2012 002

Improved the statement in all pages. Deleted “Status of this document” in page 18.

Datasheet

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Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way respons ible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any propert y, which a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl

2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-solub le cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-pro of design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power ratin g under steady-state loading condition may negatively affect product performance and reliability.

7) De-rate Po wer Dissipation (P d) dependi ng on Ambient temp erature (T a). When used i n sealed area, co nfirm the actual ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant co ndition from what is defined in this document.

Notice - Rev.004

Datasheet

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlori ne, bromin e, etc.) flux is used, the residue of flux may negativel y affect product performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an e xternal circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics.

2) You agree that application notes, reference designs, and associated data and inform ation contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgmen t in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dr y condition (e.g. Gro unding of human bod y / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connecti ons may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humi dity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time peri od may be degraded. It is strongly recommended to confirm solderabilit y before using Products of which storage time is exceeding the recommended storage time period.

3) Store / transport cartons in the correct direct ion, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contain ed in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe an y intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.:

No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

2) third parties with respect to the information contained in this document.

Datasheet

Notice - Rev.004

Datasheet

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Datasheet

Notice - Rev.004

ROHM BD6231HFP Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual