ROHM BD622 Datasheet

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Page 1

Part Number

Package

(HRP7)

: SOP8

0.5A

HRP7 (Pd=1.60W)

SOP8 (Pd=0.69W)

HSOP25 (Pd=1.45W)

(Note) Pd : Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board.

Datashee

DC Brush Motor Drivers (18V Max)

BD622xxx Series

General Description

These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a power supply voltage range of 6V to 15V, with output currents of up to 2A. MOS transistors in the output stage allow PWM speed control. The integrated VREF voltage control function allows direct replacem ent of discontinued motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design.

Features

 Built-in Selectable One Channel or Two Channels

Configuration

 VREF Voltage Setting Pin Enables PWM Duty Control  Cross-Conduction Prevention Circuit  Four Protection Circuits Provided: OCP, OVP, TSD

and UVLO

Key Specifications

■ Supply Voltage Range: 18V(Max)

■ Maximum Output Current: 0.5A / 1.0A / 2.0A

■ Output ON-Resistance: 1.5Ω / 1.5Ω / 1.0Ω

■ PWM Input Frequency Range: 20kHz to 100kHz

■ Standby Current: 0μA (Typ)

■ Operating T emperature Range: -40°C to +85°C

Packages W(Typ) x D(Typ) x H(Max)

SOP8 5.00mm x 6.20mm x 1.71mm HSOP25 13.60mm x 7.80mm x 2.11mm HRP7 9.395mm x 10.540mm x 2.005mm

Applications

VTR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals; OA equipments

Ordering Information

B D 6 2 2 x x x x - x x

Lineup

Voltage Rating

(Max)

18V

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays. www.rohm.com

Channels

1ch

2ch

Packaging and forming specification

E2: Embossed tape and reel FP HFP

Output Current

: HSOP25 : HRP7

(Max)

SOP8 Reel of 2500 BD6220F-E2

1.0A SOP8 Reel of 2500 BD6221F-E2

2.0A

1.0A HSOP25 Reel of 2000 BD6226FP-E2

HSOP25 Reel of 2000 BD6222FP- E2 HRP7 Reel of 2000 BD6222HFP-TR HSOP25 Reel of 2000 BD6225FP-E2

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(SOP8/HSOP25)

TR: Embossed tape and reel

Package

TSZ02201-0P2P0B300080-1-2

09.Sep.2014 Rev.003

Orderable

Part Number

Page 2

BD622xxx Series

Table 2 BD6222HFP

OUT1

VCC

FIN

GND

OUT2

VREF

RIN

VREF OUT1 FIN GND RIN OUT2 VCC

7 1

CTRL

PROTECT

FIN

RIN

VCC

OUT1 OUT2

8 GND

VREF

DUTY

CTRL

PROTECT

FIN

RIN

VCC

OUT1 OUT2

GND

VREF DUTY

FIN

GND

Block Diagrams / Pin Configurations / Pin Descriptions

BD6220F/BD6221F

Figure 1. BD6220F / BD6221F

Figure 2. SOP8 (TOP VIEW)

BD6222HFP

Figure 3. BD6222HFP

Figure 4. HRP7 (TOP VIEW)

Table 1 BD6220F/BD6221F

Pin No. Pin Name Function

1 OUT1 Driver output

2 VCC Power supply

3 VCC Power supply

4 FIN Control input (forward)

5 RIN Control input (reverse)

6 VREF Duty setting pin

7 OUT2 Driver output

8 GND Ground

(Note) Use all VCC pin by the same voltage.

Pin No. Pin Name Function

1 VREF Duty setting pin 2 OUT1 Driver output 3 FIN Control input (forward) 4 GND Ground 5 RIN Control input (reverse) 6 OUT2 Driver output 7 VCC Power supply

FIN GND Ground

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BD622xxx Series

OUT1

GND

RNF

OUT2

GND

VCC

FIN

RIN

VREF

CTRL

PROTECT

FINA

RINA

VCC

RNFA

VREFA DUTY

OUT1A

OUT2A

GND

CTRL

PROTECT

FINB

RINB

VCC

RNFB

VREFB DUTY

OUT1B

OUT2B

GND

FIN

GND

OUT1A

GND

RNFA

OUT2A

GND

VREFA

RINA

FINA

VCC

GND

FINB

RINB

VREFB

GND

OUT2B

RNFB

OUT1B

CTRL

PROTECT

FIN

RIN

VCC

OUT1 OUT2

RNF

VREF

DUTY

GND

FIN

GND

Block Diagrams / Pin Configurations / Pin Descriptions - Continued

BD6222FP

Figure 5. BD6222FP

Figure 6. HSOP25 (TOP VIEW)

BD6225FP / BD6226FP

Figure 7. BD6225FP / BD6226FP

Figure 8. HSOP25 (TOP VIEW)

Table 3 BD6222FP

Pin No. Pin Name Function

1,2 OUT1 Driver output

6 GND Small signal ground

7,8 RNF Power stage ground

12,13 OUT2 Driver output

17 VREF Duty setting pin 19 RIN Control input (reverse) 20 FIN Control input (forward) 21 VCC Power supply

22,23 VCC Power supply

FIN GND Ground

(Note) All pins not described above are NC pins. Note: Use all VCC pin by the same voltage.

Table 4 BD6225FP/BD6226FP

Pin No. Pin Name Function

1 OUT1A Driver output 3 RNFA Power stage ground 6 OUT2A Driver output 8 GND Small signal ground 9 VREFA Duty setting pin

10 RINA Control input (reverse)

11 FINA Control input (forward) 12 VCC Power supply 13 VCC Power supply 14 OUT1B Driver output 16 RNFB Power stage ground 19 OUT2B Driver output 20 GND Small signal ground 21 VREFB Duty setting pin 22 RINB Control input (reverse) 23 FINB Control input (forward) 24 VCC Power supply 25 VCC Power supply

FIN GND Ground

(Note) All pins not described above are NC pins. Note: Use all VCC pin by the same voltage.

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BD622xxx Series

Absolute Maximum Ratings (Ta=25°C, All voltages are with respect to ground)

Parameter Symbol Rating Unit

Supply Voltage VCC 18 V Output Current I

OMAX

0.5

(Note 1)

/ 1.0

(Note 2)

/ 2.0

(Note 3)

A All Other Input Pins VIN -0.3 to VCC V Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -55 to +150 °C Power Dissipation Pd 0.68

(Note 4)

/ 1.6

(Note 5)

/ 1.4

(Note 6)

Junction Temperature Tjmax 150 °C

(Note 1) BD6220 / BD6225. Do not exceed Pd or ASO. (Note 2) BD6221 / BD6226. Do not exceed Pd or ASO. (Note 3) BD6222. Do not exceed Pd or ASO. (Note 4) SOP8 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 5.5mW/°C for Ta above 25°C. (Note 5) HRP7 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 12.8mW/°C for Ta above 25°C. (Note 6) HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 11.6mW/°C for Ta above 25°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.

Recommended Operating Conditions (Ta=25°C)

Parameter Symbol Rating Unit

Supply voltage VCC 6 to 15 V VREF voltage V

Electrical Characteristics (Unless otherwise specified, Ta=25°C and VCC=V

Parameter Symbol

Supply Current (1ch) ICC 0.8 1.3 2.5 mA Forward / Reverse / Brake Supply Current (2ch) ICC 1.3 2.0 3.5 mA Forward / Reverse / Brake Stand-by Current I Input High Voltage VIH 2.0 - - V Input Low Voltage VIL - - 0.8 V Input Bias Current IIH 30 50 100 µA VIN=5.0V Output ON-Resistance Output ON-Resistance Output ON-Resistance VREF Bias Current I Carrier Frequency f Input Frequency Range f

(Note 7) BD6220 / BD6225 (Note 8) BD6221 / BD6226 (Note 9) BD6222

(Note 7)

RON 1.0 1.5 2.5 Ω I

(Note 8)

RON 1.0 1.5 2.5 Ω I

(Note 9)

RON 0.5 1.0 1.5 Ω I

3 to 15 V

REF

=12V)

REF

Limit

Min Typ Max

- 0 10 µA Stand-by

STBY

-10 0 +10 µA V

VREF

20 25 35 kHz V

PWM

20 - 100 kHz FIN / RIN

MAX

Limit Conditions

OUT OUT OUT

=0.25A, vertically total =0.5A, vertically total =1.0A, vertically total

= VCC

REF

=9V

REF

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100

200

300

400

0 6 12 18

Input Voltage: VIN [V]

Input Bias Current: IIH [µA] _

85°C 25°C

40°C

(2ch)

1.0

1.5

2.5

6 9 12 15 18

Supply Voltage: Vcc [ V]

Circuit Current: Icc [mA]

85°C 25°C

40°C

0.5

1.0

1.5

2.0

6 9 12 15 18

Supply Voltage: Vcc [ V]

Circuit Current: Icc [mA]

85°C 25°C

-40°C

Supply Current : I

[mA]

-0.5

0.0

1.0

1.5

1 1.2 1.4 1.6 1.8 2

Input Voltage: VIN [V]

Internal Logic : H/ L [-] _

-40°C 25°C 85°

T ypical Performance Curves (Reference Data)

Figure 9. Supply Current vs Supply Voltage

Figure 11. Internal Logic vs Input Voltage

Supply Voltage : VCC [V]

(1ch)

Input Voltage : VIN [V]

(Input Threshold Voltage)

[mA]

Supply Current : I

Supply Voltage : VCC [V]

Figure 10. Supply Current vs Supply Voltage

[µA]

Input Bias Current : I

Input Voltage : VIN [V]

Figure 12. Input Bias Current vs Input Voltage

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0.0

0.2

0.4

0.8

1.0

0 0.2 0.4 0

.6 0.8 1

Input Voltage: VREF / VCC [V]

Switching Duty: D [Ton/T] _

-40°C 25°C 85°C

Oscillation Frequency: f

PWM

[kHz]

4 4.5 5 5.5 6

Supply Voltage: VCC [V]

Internal s ignal: Release [V] _

85°C 25°C

40°C

Figure 15. Oscillation Frequency vs Supply Voltage

6 9 12 15 18

Supply Volt age: VCC [V]

Os c illation F r equenc y : F PWM [kHz]

85°C 25°C

-40°C

-10

-5 0 5

0 6 12

-40°C

25°C

85°C

Typical Performance Curves (Reference dat a) – continued

[µA]

VREF

Input Bias Current : I

Input Voltage : V

REF

[V]

Figure 13. VREF Input Bias Current vs Input Voltage

Input Voltage : V

REF

/ VCC [V]

Figure 14. Switching Duty vs Input Voltage

(VCC=12V)

[kHz]

PWM

Internal Signal: Release [V]

Oscillation Frequency : f

Supply Voltage : VCC [V]

(VCC- Carrier Frequency)

Figure 16. Internal Signal vs Supply Voltage

(Under Voltage Lock Out)

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BD622xxx Series

(Thermal Shutdown)

-0.5

0.0

0.5

1.0

1.5

125 150 175 200

Junction T emperat ur e: T j [°C]

Internal Logic : H/ L [-]

Load Current / Iomax : Normalized

Internal Logic : H/ L [-]

85°C 25°C

-40°C

-0.5

0.0

0.5

1.0

1.5

1 1.25 1.5 1.75 2

Load Current / Iomax : Normalized

Internal Logic : H/ L [-]

85°C 25°C

-40°C

20 24 28 32

Supply Voltage: VCC [V]

Internal s ignal: Release [V]

-40°C 25°C 85°C

Typical Performance Curves (Reference Data) – continued

Internal Signal : Release [V]

Supply Voltage : VCC [V]

Figure 17. Internal Signal vs Supply Voltage

(Over Voltage Protection)

1.5

1.0

0.5

0.0

-0.5 2 2.5 3 3.5 4

Load Current / I

Figure 19. Internal Logic vs Load Current

(Over-Current Protection, H side)

: Normalized

OMAX

Junction T emperature : Tj [°C]

Figure 18. Internal Logic vs Junction Temperature

Load Current / I

Figure 20. Internal Logic vs Load Current

(Over-Current Protection, L side)

: Normalized

OMAX

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0.2

0.6

0.8

0 0.2 0.4 0.6 0.8 1

Output Cur r ent: IOUT [A]

Output V oltage: VCC-VOUT [V]

85°C 25°C

40°C

0.1

0.3

0.4

0 0.1 0.2 0.3 0.4 0.5

Output Cur r ent: IOUT [A]

Output V oltage: VCC-VOUT [V]

85°C 25°C

40°C

0.5

0 0.1 0.2 0.3 0.4 0.5

Output Cur r ent: IOUT [A]

Output V oltage: VCC-VOUT [V]

-40°C 25°C 85°

Output Voltage : V

-V

[V]

85°C 25°C

-40°C

T ypical Performance Curves (Reference Data) – continued

[V]

OUT

-V

[V]

OUT

-V

Output Voltage : V

Output Voltage: V

Output Current : I

OUT

[A]

Figure 21. Output High Voltage vs Output Current

(BD6220/25)

0.4

[V]

OUT

-V

[V]

OUT

-V

Output Voltage : V

Output Voltage: V

Output Current : I

OUT

[A]

Figure 22. Output High Voltage vs Output Current

(BD6221/26)

[V]

0.3

OUT

-V

OUT

0.2

0.1

Output Voltage : V

Output V oltage: VCC-VOUT [V]

0 0.1 0.2 0.3 0.4 0.5

Output Cur r ent: IOUT [A]

Output Current : I

Figure 23. Output High Voltage vs Output Current

OUT

[A]

Figure 24. Output Voltage vs Output Current

(BD6222)

Output Current : I

OUT

[A]

(High Side Body Diode, BD6220/25)

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0.3

0.9

1.2

0 0.2 0.4 0.6 0.8 1

Output Cur r ent: IOUT [A]

Output V oltage: VOUT [V]

85°C 25°C

40°C

85°C 25°C

-40°C

0.5

0 0.4 0.8 1.2 1.6 2

Output Cur r ent: IOUT [A]

Output V oltage: VCC-VOUT [V]

-40°C

25°C 85°

Output Voltage : V

-V

[V]

-40°C 25°C 85°C

Typical Performance Curves (Reference Data) – continued

1.5

[V]

OUT

-V

0.5

Output V oltage: VCC-VOUT [V]

Output Voltage : V

0 0.2 0.4 0.6 0.8 1

Output Current : I

Output Cur r ent: IOUT [A]

OUT

[A]

OUT

Output Current : I

OUT

[A]

Figure 25. Output Voltage vs Output Current

(High Side Body Diode, BD6221/26)

Figure 26. Output Voltage vs Output Current

(High Side Body Diode, BD6222)

0.4

0.3

[V]

OUT

[V]

OUT

0.2

Output Voltage : V

0.1

Output V oltage: VOUT [V]

Output Voltage : V

0 0.1 0.2 0.3 0.4 0.5

Output Current : I

Output Cur r ent: IOUT [A]

OUT

[A]

Output Current : I

OUT

[A]

Figure 27. Output Low Voltage vs Output Current

(BD6220/25)

Figure 28. Output Low Voltage vs Output Current

(BD6221/26)

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0.5

0 0.2 0.4 0.6 0.8 1

Output Cur r ent: IOUT [A]

Output Voltage: VOUT [V]

-40°C 25°C 85°

-40°C 25°C 85°C

0.5

0 0.1 0

.2 0.3 0.4 0.5

Output Cur r ent: IOUT [A]

Output Voltage: VOUT [V]

-40°C 25°C 85°

85°C 25°C

-40°C

T ypical Performance Curves (Reference Data) – continued

1.2

0.9

[V]

OUT

0.6

0.3

Output V oltage: VOUT [V]

Output Voltage : V

0 0.4 0.8 1.2 1.6 2

Output Cur r ent: IOUT [A]

Output Current : I

OUT

[A]

Figure 29. Output Low Voltage vs Output Current

(BD6222)

[V]

OUT

Output Voltage : V

Output Current : I

OUT

[A]

Figure 31. Output Voltage vs Output Current

(Low Side Body Diode, BD6221/26)

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[V]

OUT

Output Voltage : V

Output Current : I

Figure 30. Output Voltage vs Output Current

(Low Side Body Diode, BD6220/25)

1.5

[V]

OUT

0.5

Output Voltage: VOUT [V]

Output Voltage : V

0 0.4 0.8 1.2 1.6 2

Output Cur r ent: IOUT [A]

Output Current : I

Figure 32. Output Voltage vs Output Current

(Low Side Body Diode, BD6222)

TSZ02201-0P2P0B300080-1-2

[A]

OUT

[A]

OUT

09.Sep.2014 Rev.003

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BD622xxx Series

PWM

__________

PWM

__________

PWM

__________

PWM

__________

OFF

Application Information

Description of Functions

(1) Operation Modes

Table 5 Logic table

Mode FIN RIN VREF OUT1 OUT2 Operation

a L L X Hi-Z

(Note)

Hi-Z b H L VCC H L Forward (OUT1 > OUT2) c L H VCC L H Reverse (OUT1 < OUT2) d H H X L L Brake (stop) e PWM L VCC H

f L PWM VCC

g H PWM VCC

PWM

h PWM H VCC L

i H L Option H j L H Option

(Note) Hi-Z : all output transistors are OFF. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay. X : Don’t care

Mode (a) Stand-by Mode

Stand-by operates independently with the VREF pin voltage. In stand-by mode, all internal cir cuits are turned OFF, including the output power transistor s. Motor output goes to high impedan ce state. When the system is switched to stand-by mode while the motor is running, the system enters an idling state because of the body diodes. However, when the system switches to stand-by from any other mode (except the brake mode), the control logic remain in the HIGH state for at least 50µs before shutting down all circuits.

Mode (b) Forward Mode

This operating mode is defined as th e forward rotation of the motor when OUT1 pin is HIG H and OUT2 pin is LOW. When the motor is connected between OUT1 and OUT2 pins, the current flows from OUT1 t o OUT2. To operate in this mode, connect the VREF pin to the VCC pin.

Mode (c) Reverse Mode

This operating mode is defined as the rever se rotation of the motor when OUT1 pin is low a nd OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. To operate in this mode, connect the VREF pin to the VCC pin.

Mode (d) Brake Mode

This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because the internal control circuit is operating in the brake mode. Please switch to stand-by mode (rather than the brake mode) to save power and reduce consumption.

( a) Stand-by Mode (b) For ward Mode (c) Reverse Mode (d) Brake Mode

Figure 33. Four Basic Operations (Out put Stage)

(Note)

Stand-by (idling)

Forward (PWM control mode A)

H Reverse (PWM control mode A)

L Forward (PWM control mode B)

Reverse (PWM control mode B)

PWM

Forward (VREF control)

H Reverse (VREF control)

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BD622xxx Series

FIN

OUT1

OUT2

FIN

RIN

OUT1

OUT2

OFF

Mode (e),(f) PWM Control Mode A

Control Input : H Control Input : L

Mode (g),(h) PWM Control Mode B

Control Input : H Control Input : L

The rotational speed of the motor can be cont rolled by the duty cyc le of the PWM signal fed to the FIN pin or the RIN pin. In this mode, the high side output is fixed and the lo w side output is switching, corresponding t o the input signal. The state of the output toggles between "L" and "Hi-Z". The frequency of the input PWM signal can be between 20kHz and 1 00kHz. The cir cuit may not operate proper ly for PWM frequencies below 20kHz and abov e 100k Hz. Note t hat contr ol ma y not be attained b y switc hing on d ut y at frequencies lower than 20kHz, since the operat ion functions via the stand-by mode. To operate in this mode, connect the VREF pin to the VCC pin. In addition, establis h a current path for the recovery current from the m otor, by connecting a bypass capacitor (10µF or higher is recommended) between VCC and ground.

Figure 34. PWM Control Mode A Operation (Output Stage)

Figure 35. PWM Control Mode A Operation (Timing Chart)

The rotational speed of the motor can be cont rolled by the duty cyc le of the PWM signal fed to the FIN pin or the RIN pin. In this mode, the low side output is fixed and the high side out put is switching, corresponding to the input signal. The state of the output toggles between "L" and "H". The frequency of the input PWM signal can be between 20kHz and 1 00kHz. The cir cuit may not operate proper ly for PWM frequencies below 20kHz and above 100kHz . To operate in this mode, connect the VREF pin to the VCC pin. In addition, establish a current path for the recover y current f rom the mot or, by connecting a bypass capacitor (10µF or higher is recommended) between VCC and ground.

Figure 36. PWM Control Mode B Operation (Output Stage)

Figure 37. PWM Control Mode B Operation (Timing Chart)

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BD622xxx Series

[ ] [ ]

VVVVDUTY

CCREF

/≈

VCC

VREF

FIN

RIN

OUT1

OUT2

Mode (i),(j) VREF Control Mode

The built-in VRE F duty cycle conversion circuit provides a duty c ycle corresponding to the voltage of the VREF pin and the VCC v oltage. The function offers the same level of control as the high voltage output set ting function in previous modes. The duty cycle is calculated by the following equation.

For example, if VCC voltage is 12V and VREF pin voltage is 9V, the duty cycle is about 75 percent. However, please note that the duty cycle might be limited b y the range of the VR EF pin voltage (Refer to the recommended operating conditions, shown on page 4). The PWM carrier frequency in this mode is 25kHz (nominal), and the switching operation is the same as the PWM control modes. When operating in this mode, do not input a PWM signal to the FIN and RIN pins. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.

(2) Cross-Conduction Protection Circuit

In the full bridge output stage, when the up per and lower transist ors are t urned ON at t he same time d uring hig h to lo w

or low to high transition, an inrush current flo ws from the power supply to ground, resulting to a loss . This circuit eliminates the inrush current by providing a dead time (about 400ns, nominal ) during the transition.

(3) Output Protection Circuits

(a) Under Voltage Lock Out (UVLO) Circuit

To ensure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 5.0V (nominal) or below, the controller forces all driver outputs to hig h imp edance state. When the voltage rises to 5.5 V (nomi nal) or above, the UVLO circuit ends the loc kout operation and returns the chip to its normal operation.

(b) Over Voltage Protection (OVP) Circuit

When the power supply voltage exceeds 30V (nomina l), the controller forces all driver outputs to high impedance state. The OVP circuit is released and its operation ends when the voltage drops back to 25V (nominal) or below. This protection circuit does no t work in t he stand-by mode. Also, note that this circui t is s uppleme ntary, and thus if it is asserted, the absolute max imum rating will have been excee ded. Therefore, do not continue to use the I C after this circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.

The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175°C nominal). At this time, the con troller forces all dr iver outputs to high imped ance state. Since therma l hysteresis is provided by the TSD circuit, the chi p returns to its normal operation when the juncti on temperatur e falls belo w the preset temperature (150°C nominal). Thus, it is a self-resetting circuit. The TSD circuit is designed only to shut the IC off to prevent thermal runa way. It is not designed to protect the IC or guarantee its operation in the presence of extrem e heat. Do not continue to use the IC after t he TSD circuit is activated, and do not operate the IC i n an environment where activation of the circuit is assumed.

Figure 38. VREF Control Operation (Timing Chart)

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BD622xxx Series

FIN

VCC

RIN

100k

VREF

VCC

10k

OUT1

OUT2

Threshold

Iout

CTRL Input

Internal status

Monitor / Timer

OFF ON

mon.

off timer

(d) Over Current Protection (OCP) Circuit

To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors the output current fo r the circuit’s monitoring time ( 10µs, nom inal) . When the protection circuit detects an over current, the controller forces al l driver outputs to high impedance state during the off time (290µs, nominal). The IC returns to its normal operation after the off time period has elapsed (self-returning type). At the two channels type, this circuit works i ndependently for each channel.

OUT

Figure 39. Over-Current Protection (Timing Chart)

I/O Equivalent Circuits

Figure 40. FIN / RIN Figure 41. VREF Figure 42. OUT1 / OUT2 Figur e 43. OUT1 / OUT2 (SOP8/HRP7) (HSOP25)

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in rev erse polarity can d amage the IC. Take precautions against reverse p olarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide lo w impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent nois e in the ground an d supply lines of the digital bloc k from affecting the anal og block. Furthermore, connect a capacitor to ground at all power supply pins. Consid er the effect of temperature and aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-curr ent ground t races , the t wo ground traces should be rout ed separately but connected to a single ground at the referenc e point of the application board to avoid f luctuations in the small-signal ground caused by large currents. Also ensur e that the ground tr aces of external com ponents do not cause variat ions on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissip ation rating be exceeded the rise in temperature of the chip may result i n deterioration of the properties of the c hip. In case of exceeding this absolute m aximum rat ing, inc re ase t he boar d siz e and copper area to prevent exceeding t he Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are g uaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may caus e the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharg e capacitors completely after each process or step. The IC’s power suppl y should always be turned off completely before connec ting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assem bly and use s imil ar prec autions durin g transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are cor rect when mountin g the IC on t he PCB. Incorr ect mount ing ma y result in damaging the IC. Avoid nearby pins being shorted t o each other especially to ground, p ower supply and output pin. Inter-pin shorts could be due to many reaso ns such as metal particles, water droplets (in very humid enviro nment) and unintentional solder bridge depos i ted in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to t he gate of a M OS transi stor. The gate has extremely high i mpedance an d extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a s ignificant effect on the conduction through the transistor and cause unexpected operation of the I C. So unless otherwise spec ified, unused input pins should be connected to t he power supply or ground line.

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BD622xxx Series

N N

P Substrate

GND

N N

P Substrate

GND GND

Parasitic

Elements

Pin A

Pin B Pin B

B C

Parasitic

Elements

GND

Parasitic

Elements

B E

Transistor (NPN)

Resistor

N Region

close-by

Parasitic

Elements

Operational Notes – continued

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolatio n and P substrate layers between adjacent elements in order to keep the m isolated. P-N junctions are formed at the intersection of the P layers with the N layers o f other elements, creating a parasitic diode or transistor. For example (refer to figure bel ow):

When GND > P in A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > P in B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operat ional faults, or physic al damage. Therefore, conditions that c ause these diodes to operate, such as applying a voltage lo wer than the GND vo ltage to an input pin (and thu s to the P substrate) shou ld be avoided.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within t he Area of Safe Operation (ASO).

14. Power supply lines2

Return current generated by the motor ’s Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors – including a capacitance drop at lo w temperatur es - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will incr ease voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety meas ures should be taken, such as providing a voltage clamping diode across the power supply and GND.

15. Capacitor Between Output and Ground

If a large capacitor is connected betwee n the output pin and ground p in, current from the c harged capacitor can flo w

into the output pin and may destro y the IC when the VCC o r VIN pin is short ed to groun d or pul led do wn to 0V. Use a capacitor smaller than 10µF between out put and ground.

16. Switching Noise

When the operation mode is in PWM control or VREF contr ol, PWM switching nois e may affect the control input pins

and cause IC malfunctions. In this case, insert a pull down resistor (10kΩ is recommended) between each control

input pin and ground.

Figure 44. Example of monolithic IC st ructure

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BD622xxx Series

HRP7 (TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

SOP8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

HSOP25 (TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

Marking Diagrams

Part Number Package Part Number Marking BD6220F SOP8 6220 BD6221F SOP8 6221 BD6222HFP HRP7 BD6222HFP BD6222FP HSOP25 BD6222FP BD6225FP HSOP25 BD6225FP BD6226FP HSOP25 BD6226FP

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Datasheet

Package Name

SOP8

(UNIT : mm)

(Max 5.35 (include.BURR))

Physical Dimension, Tape and Reel Information

PKG : SOP8 Drawing No. : EX112-5001-1

TSZ22111･15･001

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Datasheet

Package Name

HSOP25

Max 13.95 (include. BURR)

UNIT：mm）

Physical Dimension, Tape and Reel Information - continued

（

PKG：HSOP25 Drawing: EX139-5001

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Datasheet

Package Name

HRP7

Physical Dimension, Tape and Reel Information - continued

TSZ22111･15･001

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Datasheet

14.Mar.2012

001

New Release

Improved the statement in all pages. Deleted “Status of this document” in page 16.

Applied the ROHM Standard Style. Improved Operational Notes.

Revision History

Date Revision Changes

25.Dec.2012 002

06.Aug.2014 003

TSZ22111･15･001

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Page 22

Datasheet

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment , OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medica l equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way respons ible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA CLASSⅢ CLASSⅣ CLASSⅢ

CLASSⅢ

CLASSⅡb

CLASSⅢ

(Note 1)

, transport

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any propert y, which a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl

2S, NH3, SO2, and NO2

H [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-solub le cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is appli ed, confirmation of performance characteristics after on-board mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power ratin g under steady-state loading condition may negatively affect product performance and reliability.

7. De-rate Power Dissipation (P d) dependi ng on Ambient temp erature (T a). When used i n sealed area, confirm the actual ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure in duced under deviant condition from what is defined i n this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux ma y negatively affect product performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, ple ase consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice – GE Rev.002

Page 23

Datasheet

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgme nt in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dr y condition (e.g. Gro unding of human bod y / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderabilit y before using Products of which storage time is exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to applic ation example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe an y intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduce d or otherwise changed without prior written consent of ROHM.

3. In no eve nt shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons.

4. The proper na mes of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – GE Rev.002

Page 24

DatasheetDatasheet

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

Notice – WE Rev.001

ROHM BD622 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

General Description

Features

Key Specifications

Packages W(Typ) x D(Typ) x H(Max)

Applications

Ordering Information

Lineup

Block Diagrams / Pin Configurations / Pin Descriptions

BD6220F/BD6221F

BD6222HFP

BD6222FP

BD6225FP / BD6226FP

Application Information

(1) Operation Modes

(2) Cross-Conduction Protection Circuit

(3) Output Protection Circuits

I/O Equivalent Circuits

Operational Notes

1. Reverse Connection of Power Supply

2. Power Supply Lines

3. Ground Voltage

4. Ground Wiring Pattern

5. Thermal Consideration

6. Recommended Operating Conditions

7. Inrush Current

8. Operation Under Strong Electromagnetic Field

9. Testing on Application Boards

10. Inter-pin Short and Mounting Errors

11. Unused Input Pins

12. Regarding the Input Pin of the IC

13. Area of Safe Operation (ASO)

14. Power supply lines2

15. Capacitor Between Output and Ground

16. Switching Noise

Marking Diagrams

SOP8

Physical Dimension, Tape and Reel Information

HSOP25

HRP7

Revision History