ROHM BD6210F Technical data

H-bridge Drivers for Brush Motors

7V Max. H-bridge Drivers

BD621X Series

No.11007EDT01

●Description

These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a range of power supply voltages (from 3.0V to 5.5V), supporting output currents of up to 2A. MOS transistors in the output stage allow for PWM signal control, while the integrated VREF voltage control function of previous models offers direct replacement of deprecated motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design.

●Features

1) Built-in one channel configuration

2) Low standby current

3) Supports PWM control signal input (20kHz to 100kHz)

4) VREF voltage setting pin enables PWM duty control

5) Cross-conduction prevention circuit

6) Four protection circuits provided: OCP, OVP, TSD and UVLO

●Applications

VCR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals; OA equipments

●Line up matrix

Maximum output current

Rating voltage Channels

0.5A 1.0A 2.0A

1ch

2ch

1ch

18V

2ch

1ch

36V

2ch

*Packages; F:SOP8, HFP:HRP7, FP:HSOP25, FM:HSOP-M28

BD6210

HFP / F

BD6220

BD6225

BD6230

BD6211 HFP / F

BD6221

BD6226

BD6231 HFP / F

BD6236 FP / FM

BD6212

HFP / FP

BD6222

HFP / FP

BD6232

HFP / FP

BD6237

www.rohm.com

1/13

2011.12 - Rev.D

BD621X Series

●Absolute maximum ratings (Ta=25℃, All voltages are with respect to ground)

Parameter Symbol Ratings Unit

Supply voltage VCC 7 V

Technical Note

Output current I

0.5 *1 / 1.0 *2 / 2.0 *3 A

OMAX

All other input pins VIN -0.3 ~ VCC V

Operating temperature T

Storage temperature T

-40 ~ +85 ℃

OPR

-55 ~ +150 ℃

STG

Power dissipation Pd 0.687 *4 / 1.4 *5 / 1.45 *6 W

Junction temperature T

*1 BD6210. Do not, exceed Pd or ASO. *2 BD6211. Do not, exceed Pd or ASO. *3 BD6212. Do not, exceed Pd or ASO. *4 SOP8 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 5.5mW/℃ above 25℃. *5 HRP7 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.2mW/℃ above 25℃. *6 HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.6mW/℃ above 25℃.

150 ℃

jmax

●Operating conditions (Ta=25℃)

Parameter Symbol Ratings Unit

Supply voltage VCC 3.0 ~ 5.5 V

VREF voltage VREF 1.5 ~ 5.5 V

●Electrical characteristics (Unless otherwise specified, Ta=25℃ and VCC=VREF=5V)

Parameter Symbol

Min. Min. Min.

Limits

Limits Conditions

Supply current (1ch) ICC 0.4 0.7 1.5 mA Forward / Reverse / Brake

Stand-by current I

- 0 10 µA Stand-by

STBY

Input high voltage VIH 2.0 - - V

Input low voltage VIL - - 0.8 V

Input bias current IIH 30 50 100 µA VIN=5.0V

Output ON resistance *1 R

Output ON resistance *2 R

Output ON resistance *3 R

VREF bias current I

Carrier frequency F

Input frequency range F

*1 BD6210 *2 BD6211 *3 BD6212

0.5 1.0 1.5 Ω IO=0.25A, vertically total

0.5 1.0 1.5 Ω IO=0.5A, vertically total

0.2 0.5 1.0 Ω IO=1.0A, vertically total

-10 0 10 µA VREF=VCC

VREF

20 25 35 kHz VREF=3.75V

PWM

20 - 100 kHz FIN / RIN

MAX

www.rohm.com

2/13

2011.12 - Rev.D

BD621X Series

Technical Note

●Electrical characteristic curves (Reference data)

1.0

0.8

0.6

85°C 25°C

-40°C

0.4

Circuit Current: Icc [mA]

0.2

0.0

Fig.1 Supply current (1ch) Fig.2 Input threshold voltage

3456

Supply Voltage: Vcc [V]

1.5

1.0

-40°C 25°C 85°C

0.5

0.0

Internal Logic: H/L [-] _

-0.5

1 1.2 1.4 1.6 1.8 2

Input Voltage: VIN [V]

-40°C 25°C 85°C

100

Input Bias Current: IIH [µA] _

85°C 25°C

-40° C

01 234 56

Input Voltag e: VIN [V]

Fig.3 Input bias current Fig.4 VREF input bias current Fig.5 VREF - DUTY (VCC=5V)

85°C 25°C

-40° C



-5

Input Bias Current: IVREF [

-10 012345

Input Vol tage: V REF [V]

6.0

85°C 25°C

4.0

-40°C

-40° C 25°C 85°C

1.0

0.8

0.6

0.4

Switching Duty: D [Ton/T] _

0.2

0.0 0 0.2 0.4 0.6 0.8 1

Input Vol tage: V REF / VCC [V]

9.0

6.0

-40° C 25°C 85°C

Oscillation Frequency: FPWM [kHz]

3456

Supply Vol tag e: VCC [V]

Fig.6 VCC - Carrier frequency Fig.7 Under voltage lock out Fig.8 Over voltage protection

1.5

1.0

2.0

Internal signal: Release [V] _

0.0

1.52 2.533.5

Supply Vol tage: VC C [V]

1.5

1.0

85°C 25°C

-40°C

3.0

Internal signal: Release [V] _

0.0

66.5 77.58

Supply Vol tage: VC C [V]

1.5

1.0

85°C 25°C

-40°C

0.5

Internal Logic: H/L [-] _

0.0

Internal Logic: H/L [-] _

0.0

Internal Logic: H/L [-] _

0.0

-0.5 125 150 175 200

Junc tion Temper ature: T j [ °C ]

Fig.9 Thermal shutdown Fig.10 Over current protection (H side) Fig.11 Over current protection (L side)

-0.5

1.5 2 2.5 3

Load Cur rent / I omax: Nor mali zed

-0.5

11.5 22.5

Load Cur rent / I omax: Nor mali zed

www.rohm.com

3/13

2011.12 - Rev.D

BD621X Series

Technical Note

●Electrical characteristic curves (Reference data) - Continued

0.4

0.3

85°C 25°C

-40° C

0.8

0.6

85°C 25°C

-40° C

0.8

0.6

85°C 25°C

-40° C

0.2

0.4

0.1

Output Voltage: V CC-VOUT [V]

0 0.1 0.2 0.3 0.4 0.5

Output Current: IOUT [A]

Fig.12 Output high voltage (0.5A class) Fig.13 Output high voltage (1A class) Fig.14 Output high voltage (2A class)

1.5

-40° C 25°C 85°C

0.2

Output Voltage: V CC-VOUT [V]

0 0.2 0.4 0.6 0.8 1

Output Current: IOUT [A]

1.5

-40° C 25°C 85°C

0.2

Output Voltage: V CC-VOUT [V]

0 0.4 0.8 1.2 1.6 2

Output Current: IOUT [A]

1.5

-40° C 25°C 85°C

0.5

Output Voltage:V CC-VOUT [V]

0.5

Output Voltage:V CC-VOUT [V]

0.5

Output Voltage:V CC-VOUT [V]

0 0.1 0.2 0.3 0.4 0.5

Output Current: IOUT [A]

Fig.15 High side body diode (0.5A class) Fig.16 High side body diode (1A class) Fig.17 High side body diode (2A class)

0 0.2 0.4 0.6 0.8 1

Output Current: IOUT [A]

0 0.4 0.8 1.2 1.6 2

Output C urrent: IOUT [A]

0.4

0.3

85°C 25°C

-40° C

0.8

0.6

85°C 25°C

-40° C

0.8

0.6

85°C 25°C

-40° C

0.2

0.4

0.1

Output Voltage: V OUT [V]

0.2 Output Voltage: V OUT [V]

0.2

0 0.1 0.2 0.3 0.4 0.5

Output Current: IOUT [A]

Fig.18 Output low voltage (0.5A class) Fig.19 Output low voltage (1A class) Fig.20 Output low voltage (2A class)

0 0.2 0.4 0.6 0.8 1

Output Current: IOUT [A]

0 0.4 0.8 1.2 1.6 2

Output C urrent: IOUT [A]

1.5

0.5

Output Voltage: VOUT [V] _

0 0.1 0.2 0.3 0.4 0.5

Output Current: IOUT [A]

-40° C 25°C 85°C

1.5

0.5

Output Voltage: VOUT [V] _

0 0.2 0.4 0.6 0.8 1

Output Current: IOUT [A]

-40° C 25°C 85°C

1.5

0.5

Output Voltage: VOUT [V] _

0 0.4 0.8 1.2 1.6 2

Output Current: IOUT [A]

-40° C 25°C 85°C

Fig.21 Low side body diode (0.5A class) Fig.22 Low side body diode (1A class) Fig.23 Low side body diode (2A class)

www.rohm.com

4/13

2011.12 - Rev.D

BD621X Series

●Block diagram and pin configuration

BD6210F / BD6211F

CTRL

PROTECT

OUT1 OUT2

7 1

VCC

8 GND

6 VREF DUTY

FIN

RIN

Fig.24 BD6210F / BD6211F

OUT1

VCC

FIN

GND

OUT2

VREF

RIN

Fig.25 SOP8

BD6210HFP / BD6211HFP / BD6212HFP

CTRL

FIN

GND

PROTECT

OUT1 OUT2

6 2

VCC

GND

VREF DUTY

FIN

RIN

Fig.26 BD6210HFP / BD6211HFP / BD6212HFP

VREF

OUT1

FIN

GND

RIN

OUT2

VCC

Fig.27 HRP7

Technical Note

Table 1 BD6210F/BD6211F

Pin Name Function

1 OUT1 Driver output

2 VCC Power supply

3 VCC Power supply

4 FIN Control input (forward)

5 RIN Control input (reverse)

6 VREF Duty setting pin

7 OUT2 Driver output

8 GND Ground

Note: Use all VCC pin by the same voltage.

Table 2 BD6210HFP/BD6211HFP/BD6212HFP

Pin Name Function

1 VREF Duty setting pin

2 OUT1 Driver output

3 FIN Control input (forward)

4 GND Ground

5 RIN Control input (reverse)

6 OUT2 Driver output

7 VCC Power supply

FIN GND Ground

www.rohm.com

5/13

2011.12 - Rev.D

BD621X Series

●Block diagram and pin configuration - Continued

BD6212FP

VREF DUTY

FIN

RIN

CTRL

GND

PROTECT

FIN

GND

12 1

2 13

OUT1 OUT2

Fig.28 BD6212FP

Fig.29 HSOP25

OUT1 OUT1

NC NC NC

GND

RNF RNF

NC NC

NC OUT2 OUT2

NC NC VCC VCC VCC FIN

GND

RIN NC VREF NC NC NC

VCC

RNF

Technical Note

Table 3 BD6212FP

Pin Name

1,2 OUT1 Driver output

6 GND Small signal ground

7,8 RNF Power stage ground

12,13 OUT2 Driver output

17 VREF Duty setting pin

19 RIN Control input (reverse)

20 FIN Control input (forward)

21 VCC Power supply

22,23 VCC Power supply

FIN GND Ground

Note: All pins not described above are NC pins.

Note: Use all VCC pin by the same voltage.

Function

www.rohm.com

6/13

2011.12 - Rev.D

BD621X Series

Technical Note

●Functional descriptions

1) Operation modes

FIN RIN VREF OUT1 OUT2 Operation

a L L X Hi-Z* Hi-Z* Stand-by (idling)

b H L VCC H L Forward (OUT1 > OUT2)

c L H VCC L H Reverse (OUT1 < OUT2)

d H H X L L Brake (stop)

e PWM L VCC H

f L PWM VCC

g H PWM VCC

h PWM H VCC L

i H L Option H

j L H Option

* Hi-Z is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay. X : Don’t care

Table 4 Logic table

__________

PWM

__________

PWM

__________

PWM

H Reverse (PWM control mode A)

L Forward (PWM control mode B)

__________

PWM

__________

PWM

H Reverse (VREF control)

Forward (PWM control mode A)

Reverse (PWM control mode B)

Forward (VREF control)

a) Stand-by mode

Stand-by operates independently of the VREF pin voltage. In stand-by mode, all internal circuits are turned off, including the output power transistors. Motor output goes to high impedance. If the motor is running at the switch to stand-by mode, the system enters an idling state because of the body diodes. However, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50µs before shutting down all circuits.

b) Forward mode

This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. For operation in this mode, connect the VREF pin with VCC pin.

c) Reverse mode

This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. For operation in this mode, connect the VREF pin with VCC pin.

d) Brake mode

This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because the internal control circuit is operating in the brake mode. Please switch to the stand-by mode (rather than the brake mode) to save power and reduce consumption.

OFF

a) Stand-by mode b) Forward mode c) Reverse mode d) Brake mode

Fig.30 Four basic operations (output stage)

OFF

www.rohm.com

7/13

2011.12 - Rev.D

BD621X Series

e) f) PWM control mode A

The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN pin or the RIN pin. In this mode, the high side output is fixed and the low side output does the switching, corresponding to the input signal. The switching operates by the output state toggling between "L" and "Hi-Z". The PWM frequency can be input in the range between 20kHz and 100kHz. Note that control may not be attained by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. Also, circuit operation may not respond correctly when the input signal is higher than 100kHz. To operate in this mode, connect the VREF pin with VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.

Control input : H Control input : L

OFF

Fig.31 PWM control mode A operation (output stage)

FIN

RIN

OUT1

OUT2

Fig.32 PWM control mode A operation (timing chart)

g) h) PWM control mode B

The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN pin or the RIN pin. In this mode, the low side output is fixed and the high side output does the switching, corresponding to the input signal. The switching operates by the output state toggling between "L" and "H". The PWM frequency can be input in the range between 20kHz and 100kHz. Also, circuit operation may not respond correctly when the input signal is higher than 100kHz. To operate in this mode, connect the VREF pin with VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.

OFF

Control input : H Control input : L

Fig.33 PWM control mode B operation (output stage)

FIN

RIN

OUT1

OUT2

Fig.34 PWM control mode B operation (timing chart)

Technical Note

OFF

www.rohm.com

8/13

2011.12 - Rev.D

BD621X Series

i) j) VREF control mode

The built-in VREF-switching on duty conversion circuit provides switching duty corresponding to the voltage of the VREF pin and the VCC voltage. The function offers the same level of control as the high voltage output setting function in previous models. The on duty is shown by the following equation.

DUTY ≈ VREF [V] / VCC [V]

For example, if VCC voltage is 5V and VREF pin voltage is 3.75V, the switching on duty is about 75 percent. However, please note that the switching on duty might be limited by the range of VREF pin voltage (Refer to the operating conditions, shown on page 2). The PWM carrier frequency in this mode is 25kHz (nominal), and the switching operation is the same as it is the PWM control modes. When operating in this mode, do not input the PWM signal to the FIN and RIN pins. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.

VCC

VREF

FIN

RIN

OUT1

OUT2

2) Cross-conduction protection circuit In the full bridge output stage, when the upper and lower transistors are turned on at the same time, and this condition exists during the period of transition from high to low, or low to high, a rush current flows from the power supply to ground, resulting in a loss. This circuit protects against the rush current by providing a dead time (about 400ns, nominal) at the transition.

3) Output protection circuits

a) Under voltage lock out (UVLO) circuit

To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 2.3V (nominal) or below, the controller forces all driver outputs to high impedance. When the voltage rises to 2.5V (nominal) or above, the UVLO circuit ends the lockout operation and returns the chip to normal operation.

b) Over voltage protection (OVP) circuit

When the power supply voltage exceeds 7.3V (nominal), the controller forces all driver outputs to high impedance. The OVP circuit is released and its operation ends when the voltage drops back to 6.8V (nominal) or below. This protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.

c) Thermal shutdown (TSD) circuit

The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175℃ nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (150℃ nominal). Thus, it is a self-returning type circuit. The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.

Technical Note

Fig.35 VREF control operation (timing chart)

www.rohm.com

9/13

2011.12 - Rev.D

BD621X Series

Technical Note

d) Over current protection (OCP) circuit

To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this circuit works independently for each channel.

Threshold

Iout

CTRL Input

Inte rnal s tatus

Monitor / Timer

mon.

OFF ON

off timer

Fig.36 Over current protection (timing chart)

●Interfaces

VCC

FIN

RIN

VCC

100k

VREF

VCC

10k

OUT1 OUT2

GND

Fig.37 FIN / RIN Fig.38 VREF Fig.39 OUT1 / OUT2 Fig.40 OUT1 / OUT2

(SOP8/HRP7) (HSOP25)

VCC

OUT1 OUT2

RNF

GND

www.rohm.com

10/13

2011.12 - Rev.D

BD621X Series

●Notes for use

1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is to be implemented.

2) Connecting the power supply connector backward Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as adding an external direction diode.

3) Power supply lines Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors – including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND.

4) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the same way, care must be taken to avoid changes in the GND wire pattern in any external connected component.

5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating conditions.

6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error, or if pins are shorted together.

7) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields.

8) ASO - Area of Safety Operation When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

9) Built-in thermal shutdown (TSD) circuit The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.

10) Capacitor between output and GND In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1μF between output and GND.

11) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC.

12) Switching noise When the operation mode is in PWM control or VREF control, PWM switching noise may effects to the control input pins and cause IC malfunctions. In this case, insert a pulled down resistor (10kΩ is recommended) between each control input pin and ground.

Technical Note

www.rohm.com

11/13

2011.12 - Rev.D

BD621X Series

13) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.

Pin A

Parasitic element

GND

Technical Note

Resistor Transistor (NPN)

N N

P substrate

Pin B

Pin A

Parasitic element

Appendix: Example of monolithic IC structure

P substrate

GND

Pin B

B C

Parasitic element

GND

Other adjacent elements

www.rohm.com

12/13

2011.12 - Rev.D

BD621X Series

●Ordering part number

Technical Note

B D 6 2 1 0

ROHM part number BD

SOP8

6.2±0.3

HSOP25

1.9 ± 0.1

(MAX 5.35 include BURR)

4.4±0.2

0.595

1.5±0.1

0.11

(MAX 13.95 include BURR)

25 14

7.8 ± 0.3

5.4 ± 0.2

0.11

Type 62XX 1X: 7V max. X0: 1ch/0.5A X1: 1ch/1A X2: 1ch/2A

5.0±0.2

0.1 S

−4°

0.17

0.1 S

+0.1

0.05

0.25 ± 0.1

0.8

12.0 ± 0.2

1.27

13.6 ± 0.2

2.75 ± 0.1

1.95 ± 0.1

0.36 ± 0.1

438251

0.42±0.1

0.3MIN

0.9±0.15

(Unit : mm)

0.3Min.

(Unit : mm)

H F P - T R

Package

F : SOP8 FP : HSOP25 HFP : HRP7

Embossed carrier tapeTape

Quantity

Direction of feed

Quantity

Direction of feed

2500pcs E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

Embossed carrier tapeTape 2000pcs

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

Packaging and forming specification E2: Embossed taping (SOP8/HSOP25) TR: Embossed taping (HRP7)

Direction of feed

HRP7

9.395±0.125

(MAX 9.745 include BURR)

(7.49)

0.73±0.1 S

1.905±0.1

8.82±0.1

0.08±0.05

1.27

(6.5)

7654321

0.08

1.017±0.2

8.0±0.13

0.8875

www.rohm.com

0.835±0.2

1.523±0.15

5.5°

4.5°

−

4.5°

+0.1

0.27

0.05

(Unit : mm)

10.54±0.13

Embossed carrier tapeTape

Quantity

Direction of feed

2000pcs TR

The direction is the 1pin of product is at the upper right when you hold

( )

reel on the left hand and you pull out the tape on the right hand

Reel

13/13

1pin

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

∗

2011.12 - Rev.D

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd.

The content specied herein is subject to change for improvement without notice.

The content specied herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specications, which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.

The technical information specied herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.

The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).

The Products specied in this document are not designed to be radiation tolerant.

While ROHM always makes effor ts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injur y, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specied herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.

Notice

Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

R1120

ROHM BD6210F Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual