Multifunction Backlight LED Drivers
for Small LCD Panels (Charge Pump Type)
BD6085GUL
●Description
BD6085GUL is Multi-Function LED Driver that is the most suitable for the cellular phone.
It has many functions that are needed to "the upper side" of the cellular phone.
●Features
1) Total 7LEDs driver for LCD Backlight (Main/Sub) and LED Flash
It can set maximum 30mA by 32 steps (Current DAC) for Main/Sub Display
It can set maximum 360mA for Flash LED driver
(It has 3 channels LED driver at maximum 120mA/ch for Flash.)
The number of lighting for Main/Sub/Flash LED can be set up grouping by register.
Ex. ) 4LEDs / 0LED / 3LEDs
4LEDs / 1LED / 2LEDs
4LEDs / 2LEDs / 1LED
4LEDs / 1LED / 1LED
5LEDs / 1LED / 1LED
5LEDs / 0LED / 2LEDs
6LEDs / 0LED / 1LED
It can use the 1LED Flash module to 3LED Flash module.
Normal mode = maximum 30mA/ch, Flash mode = x4 normal mode (for 3ch LED).
The grouping of LED is independently controlled by register.
2) 4ch Series Regulator (LDO)
It has selectable output voltage by the register.
LDO1,LDO2 : Iomax=200mA
LDO3,LDO4 : Iomax=150mA
3) Charge Pump DC/DC for LED driver
It has x1/x1.33/x1.5/x2 mode that will be selected automatically.
Soft start
Over voltage protection (Auto-return type)
Over current protection (Auto-return type)
4) Thermal shutdown (Auto-return type)
2
5) I
6) VCSP50L3(3.30mm×3.30mm, 0.55mm) Small and thin CSP package
*This chip is not designed to protect itself against radioactive rays.
*This material may be changed on its way to designing.
*This material is not the official specification.
●Absolute Maximum Ratings (Ta=25 ℃)
functions
C BUS FS mode(max 400kHz)Write/Read
No.11040EAT28
Parameter Symbol Ratings Unit
Maximum voltage VMAX 7 V
Power Dissipation Pd 1325 mW
Operating Temperature Range Topr -35 ~ +85 ℃
Storage Temperature Range Tstg -55 ~ +150 ℃
note)Power dissipation deleting is 10.6mW/ ℃, when it’s used in over 25 ℃.
(It’s deleting is on the board that is ROHM’s standard)
LDO1=LDO2=ON, I
Other blocks=OFF
LDO3=LDO4=ON, I
Other blocks=OFF
LDO1=LDO2=ON, I
DC/DC x1mode,
I
=2.8125(30x3/32)mA x 4ch
LED
DC/DC x1mode, I
VBAT=3.7V, LED Vf=3.0V
DC/DC x1.33mode, I
VBAT=3.1V, LED Vf=3.0V
DC/DC x1.5 mode, I
VBAT=2.9V, LED Vf=3.5V
DC/DC x2 mode, I
VBAT=2.9V, LED Vf=4.0V
LDO
LDO
LDO
LED
LED
=60mA
LED
LED
【LED Driver】
LED current Step ILEDSTP 32 Step LED1~7
White LED Maximum setup
current
Flash LED Maximum setup
current
White LED current accuracy IWLED -7% 15 +7%mA
Flash LED current accuracy IFLED - 60 - mA
IMAXWLED- 30 - mA LED1~7 (Normal mode)
IMAXFLED - 120 - mA LED5~7 (Flash mode)
=15mA setting (Normal mode)
I
LED
At VLED=1.0V
I
=60mA setting (Flash mode)
LED
At VLED=1.0V
LED current Matching ILEDMT - - 4 % Between LED1~7 at VLED=1.0V
Flash / Normal current ratio RATFL 3.2 4 4.8 A/A
LED5~7, Flash mode/Normal mode
At VLED=1.0V
LED OFF Leak current ILKLED - - 1.0 μA VLED=4.5V
【DC/DC(Charge Pump)】
Maximum Output voltage V℃P 4.65 5.1 5.55 V
Current Load IOUT - - 480 mA VBAT≥3.2V, VOUT=4V
Oscillator frequency fosc 0.72 0.9 1.08 MHz
Over Voltage Protection detect
voltage
OVP 5.0 5.5 6.0 V
Short Circuit current limit Ilim - 250 500 mA VOUT=0V
【I2C Input (SDA, SCL)】
LOW level input voltage VIL -0.3 -
HIGH level input voltage VIH
Hysteresis of Schmitt trigger
input
LOW level output voltage
(SDA) at 3mA sink current
Vhys
VOL 0 - 0.3 V
0.75 ×
VIO
0.05 ×
VIO
0.25 ×
VIO
VBAT
+0.3
V
V
- - V
Input current each I/O pin lin -3 - 3 μA Input voltage = 0.1×VIO~0.9×VIO
【RESETB】
LOW level input voltage VIL -0.3 -
HIGH level input voltage VIH
0.75 ×
VIO
0.25 ×
VIO
VBAT
+0.3
V
V
Input current each I/O pin Iin -3 - 3 μA Input voltage = 0.1×VIO~0.9×VIO
1 B6 VBATCP - - GND Power supply for charge pump A
2 F3 VBAT1 - - GND Power supply A
3 E3 VBAT2 - - GND Power supply A
4 F5 VBATLDO1 - - GND Power supply for LDO A
5 F2 VBATLDO2 - - GND Power supply for LDO A
6 A1 T1 I VBAT GND Test Input Pin (short to Ground) S
7 A6 T2 I VBAT GND Test Input Pin (short to Ground) S
8 F6 T3 O VBAT GND Test Output Pin (Open) M
9 F1 T4 O VBAT GND Test Output Pin (Open) N
10 E6 VIO - VBAT GND Power supply for I/O and Digital C
11 D3 RESETB I VBAT GND Reset input (L: reset, H: reset cancel) H
12 D5 SDA I/O VBAT GND I2C data input / output I
13 D4 SCL I VBAT GND I2C clock input H
14 C4 CPGND - VBAT - Ground B
15 F4 AGND - VBAT - Ground B
16 B2 WGND - VBAT - Ground B
17 C2 FLGND - VBAT - Ground B
18 D6 C1N I/O VBAT GND Charge Pump capacitor is connected F
19 C6 C1P I/O - GND Charge Pump capacitor is connected G
20 C5 C2N I/O VBAT GND Charge Pump capacitor is connected F
21 B5 C2P I/O - GND Charge Pump capacitor is connected G
22 A4 C3N I/O VBAT GND Charge Pump capacitor is connected F
23 A5 C3P I/O - GND Charge Pump capacitor is connected G
24 B4 VOUT O - GND Charge Pump output pin A
25 E5 LDO1O O VBAT GND LDO1 output pin Q
26 E1 LDO2O O VBAT GND LDO2 output pin Q
27 E4 LDO3O O VBAT GND LDO3 output pin Q
28 E2 LDO4O O VBAT GND LDO4 output pin Q
29 A3 LED1 I - GND LED cathode connection 1 (for Back Light) E
30 B3 LED2 I - GND LED cathode connection 2 (for Back Light) E
31 A2 LED3 I - GND LED cathode connection 3 (for Back Light) E
32 B1 LED4 I - GND LED cathode connection 4 (for Back Light) E
33 C1 LED5 I - GND LED cathode connection 5 (for Back Light or Flash)E
34 D1 LED6 I - GND LED cathode connection 6 (for Back Light or Flash)E
35 D2 LED7 I - GND LED cathode connection 7 (for Back Light or Flash)E
※The LED terminal that isn't used is to short-circuit to the ground. But, the setup of a register concerned with LED that isn't used is prohibited.
The writing/reading operation is based on the I2C slave standard.
・Slave address
A7 A6 A5 A4 A3 A2 A1 R/W
1 1 1 0 1 1 0 1/0
・Bit Transfer
SCL transfers 1-bit data during H. SCL cannot change signal of SDA during H at the time of bit transfer. If SDA changes
while SCL is H, START conditions or STOP conditions will occur and it will be interpreted as a control signal.
SDA
SCL
SDA a state of stability
Data are effective
SDA
:
It can change
・START and STOP condition
When SDA and SCL are H, data is not transferred on the I
2
C- bus. This condition indicates, if SDA changes from H to L
while SCL has been H, it will become START (S) conditions, and an access start, if SDA changes from L to H while SCL
has been H, it will become STOP (P) conditions and an access end.
SDA
SCL
S P
START condition
STOP condition
・Acknowledge
It transfers data 8 bits each after the occurrence of START condition. A transmitter opens SDA after transfer 8bits data, and
a receiver returns the acknowledge signal by setting SDA to L.
A register address is transferred by the next 1 byte that transferred the slave address and the write-in command. The 3rd
byte writes data in the internal register written in by the 2nd byte, and after 4th byte or, the increment of register address is
carried out automatically. However, when a register address turns into the last address, it is set to 00h by the next
transmission. After the transmission end, the increment of the address is carried out.
It reads from the next byte after writing a slave address and R/W bit. The register to read considers as the following address
accessed at the end, and the data of the address that carried out the increment is read after it. If an address turns into the
last address, the next byte will read out 00h. After the transmission end, the increment of the address is carried out.
After specifying an internal address, it reads by repeated START condition and changing the data transfer direction. The
data of the address that carried out the increment is read after it. If an address turns into the last address, the next byte will
read out 00h. After the transmission end, the increment of the address is carried out.
As for reading protocol and multiple reading protocols, please do A(not acknowledge) after doing the final reading
operation. It stops with read when ending by A(acknowledge), and SDA stops in the state of Low when the reading
data of that time is 0. However, this state returns usually when SCL is moved, data is read, and A(not acknowledge)
is done.
SCL clock frequency fSCL 0 - 100 0 - 400 kHz
LOW period of the SCL clock tLOW 4.7 - - 1.3 - - μs
HIGH period of the SCL clock tHIGH 4.0 - - 0.6 - - μs
Hold time (repeated) START condition
After this period, the first clock is generated
Set-up time for a repeated START
condition
tHD;STA4.0 - - 0.6 - - μs
SU;STA4.7 - - 0.6 - - μs
t
Data hold time tHD;DAT0 - 3.45 0 - 0.9 μs
Data set-up time tSU;DAT250 - - 100 - - ns
Set-up time for STOP condition tSU;STO4.0 - - 0.6 - - μs
Bus free time between a STOP
“00000” : 0.9375 mA (Initial value)
“00001” : 1.875 mA
“00010” : 2.8125 mA
“00011” : 3.75 mA
“00100” : 4.6875 mA
“00101” : 5.625 mA
“00110” : 6.5625 mA
“00111” : 7.5 mA
“01000” : 8.4375 mA
“01001” : 9.375 mA
“01010” : 10.3125 mA
“01011” : 11.25 mA
“01100” : 12.1875 mA
“01101” : 13.125 mA
“01110” : 14.0625 mA
“01111” : 15 mA
“10000” : 15.9375 mA
“10001” : 16.875 mA
“10010” : 17.8125 mA
“10011” : 18.75 mA
“10100” : 19.6875 mA
“10101” : 20.625 mA
“10110” : 21.5625 mA
“10111” : 22.5 mA
“11000” : 23.4375 mA
“11001” : 24.375 mA
“11010” : 25.3125 mA
“11011” : 26.25 mA
“11100” : 27.1875 mA
“11101” : 28.125 mA
“11110 ” : 29.0 625 mA
“11111” : 30 m A
“00000” : 0.9375 mA (Initial value)
“00001” : 1.875 mA
“00010” : 2.8125 mA
“00011” : 3.75 mA
“00100” : 4.6875 mA
“00101” : 5.625 mA
“00110” : 6.5625 mA
“00111” : 7.5 mA
“01000” : 8.4375 mA
“01001” : 9.375 mA
“01010” : 10.3125 mA
“01011” : 11.25 mA
“01100” : 12.1875 mA
“01101” : 13.125 mA
“01110” : 14.0625 mA
“01111” : 15 mA
“10000” : 15.9375 mA
“10001” : 16.875 mA
“10010” : 17.8125 mA
“10011” : 18.75 mA
“10100” : 19.6875 mA
“10101” : 20.625 mA
“10110” : 21.5625 mA
“10111” : 22.5 mA
“11000” : 23.4375 mA
“11001” : 24.375 mA
“11010” : 25.3125 mA
“11011” : 26.25 mA
“11100” : 27.1875 mA
“11101” : 28.125 mA
“11110 ” : 29.0 625 mA
“11111” : 30 m A
“0000” : 1.20 V
“0001” : 1.30 V
“0010” : 1.50 V
“0011” : 1.60 V
“0100” : 1.80 V
“0101” : 2.20 V
“0110” : 2.40 V
“0111” : 2.50 V (Initial value)
“1000” : 2.60 V
“1001” : 2.70 V
“1010” : 2.80 V
“1011” : 2.90 V
“1100” : 3.00 V
“1101” : 3.10 V
“1110” : 3.20 V
“1111” : 3. 30 V
“0000” : 1.20 V
“0001” : 1.30 V
“0010” : 1.50 V
“0011” : 1.60 V
“0100” : 1.80 V (Initial value)
“0101” : 2.20 V
“0110” : 2.40 V
“0111” : 2.50 V
“1000” : 2.60 V
“1001” : 2.70 V
“1010” : 2.80 V
“1011” : 2.90 V
“1100” : 3.00 V
“1101” : 3.10 V
“1110” : 3.20 V
“1111” : 3. 30 V
“0000” : 1.20 V
“0001” : 1.30 V
“0010” : 1.50 V
“0011” : 1.60 V
“0100” : 1.80 V
“0101” : 2.20 V
“0110” : 2.40 V
“0111” : 2.50 V
“1000” : 2.60 V
“1001” : 2.70 V
“1010” : 2.80 V (Initial value)
“1011” : 2.90 V
“1100” : 3.00 V
“1101” : 3.10 V
“1110” : 3.20 V
“1111” : 3. 30 V
“0000” : 1.20 V
“0001” : 1.30 V
“0010” : 1.50 V
“0011” : 1.60 V
“0100” : 1.80 V (Initial value)
“0101” : 2.20 V
“0110” : 2.40 V
“0111” : 2.50 V
“1000” : 2.60 V
“1001” : 2.70 V
“1010” : 2.80 V
“1011” : 2.90 V
“1100” : 3.00 V
“1101” : 3.10 V
“1110” : 3.20 V
“1111” : 3. 30 V
There are two kinds of reset, software reset and hardware reset.
(1) Software reset
・All the registers are initialized more than making a register (SFTRST) setup "1".
・The register of software resetting is an automatic return (Auto Return 0).
(2) Hardware reset
・It shifts to hardware reset by changing RESETB pin “H” → “L”.
・The condition of all the registers under hardware reset pin is returned to the initial value,
and it stops accepting all address.
・It’s possible to release from a state of hardware reset by changing RESETB pin “L” → “H”.
・RESETB pin has delay circuit. It doesn’t recognize as hardware reset in “L” period under 5μs.
(3) Reset Sequence
・When hardware reset was done during software reset, software reset is canceled when
hardware reset is canceled. (Because the initial value of software reset is “0”)
2. Thermal shutdown
The blocks which thermal shutdown function is effective in the following.
Charge pump
LED Driver
LDO1, LDO2, LDO3, LDO4
A thermal shutdown function works in about 190
Detection temperature has a hysteresis, and detection release temperature is about 170
℃.
℃.
(Design reference value)
3. Charge Pump for LED driver
Charge Pump block is designed for the power supply for LED driver.
It has the x1.0/x1.33/x1.5/x2.0 mode. it changes to the most suitable mode automatically by Vf of LED and the battery
voltage. It has the mode of x1.33 and it can be higher efficiency than traditional.
Start
Charge Pump circuit operates when any LED turns ON.
Soft start When the start of the Charge Pump circuit is done, it has the soft start function to prevent a rush current.
LED current value setting (for Main/Sub) Internal circuit fixes maximum current value of LED.
LED current is maximum 30mA/ch.
LED current value setting (for Flash) Internal circuit fixes maximum current value of LED.
When FLASHEN (Address 04h)=0, LED current is maximum 30mA/ch. (Normal mode)
When FLASHEN (Address 04h)=1, LED current change to x4 of Normal mode. (Flash mode)
At Normal mode, it can use for LCD Backlight or Torch mode of Flash.
At Flash mode, it can use for LED Flash.
The number of LED Lighting The number of lighting for Main/Sub/Flash LED can be set up grouping by the register GRPSET*
(Address 00h).
The setting of the number of lighting is as the following.
The grouping of LED (Main/Sub/Flash) is independently controlled by register MLEDEN, SLEDEN, FLLEDEN
(Address 01h).
Grouping
setting
(0,0,0) Main Main Main Main Flash Flash Flash 4 / 0 / 3
(0,0,1) Main Main Main Main Sub Flash Flash 4 / 1 / 2
(0,1,0) Main Main Main Main Sub Sub Flash 4 / 2 / 1
(0,1,1) Main Main Main Main Sub - Flash 4 / 1 / 1
(1,0,0) Main Main Main Main Main Sub Flash 5 / 1 / 1
(1,0,1) Main Main Main Main Main Flash Flash 5 / 0 / 2
(1,1,0) Main Main Main Main Main Main Flash 6 / 0 / 1
(1,1,1) Main Main Main Main Main Main Flash 6 / 0 / 1
The change of the Grouping setting with turning it on is prohibited.
The LED terminal that isn’t used must be connected to the ground.
Normal mode/Flash mode Normal mode and Flash mode change as the figure of the follow. ILED is set by the register.
LED1 LED2 LED3 LED4 LED5 LED6 LED7 Main/Sub/Flash
Grouping setting (*,*,*) means (“GRPSET2”,”GRPSET1”,”GRPSET0”).
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If
any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Power supply and ground line
Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay
attention to the interference by common impedance of layout pattern when there are plural power supplies and ground
lines. Especially, when there are ground pattern for small signal and ground pattern for large current included the
external circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor
between the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure
the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low
temperature, thus determining the constant.
(3) Ground voltage
Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric
transient.
(4) Short circuit between pins and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between
the pin and the power supply or the ground pin, the ICs can break down.
Technical Note
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input pins
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage
lower than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the
input pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied,
apply to the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical
characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
This LSI builds in a thermal shutdown (TSD)circuit. When junction temperatures become detection temperature or
higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at
isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI.
Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd)in
actual states of use.
(10) LDO
Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because
it has the possibility that an operation becomes unstable.
(11) About the pin for the test, the un-use pin
Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a
function manual and an application notebook. And, as for the pin that doesn't specially have an explanation, ask our
company person in charge.
(12) About the rush current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring,
width of ground wiring, and routing of wiring.
(13) About the function description or application note or more.
The function description and the application notebook are the design materials to design a set. So, the contents of the
materials aren't always guaranteed. Please design application by having fully examination and evaluation include the
external elements.
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.