Multifunction Backlight LED Drivers
for Small LCD Panels (Charge Pump Type)
BD6081GU, BD6081GVW
●Description
BD6081GU / BD6081GVW is compound LED Driver which is the most suitable for the cellular phone.
Main LCD Back Light LED Driver (Max 4 Light), Sub LCD Back Light LED Driver (Max 2 Light), 2 system RGB LED Drivers,
2Ch LDO (2.8V/1.8V) included. This is PMIC (Power Management IC) that is the most suitable for "the indication part" of the
cellular phone.A charge pump form is adopted, and a coil is never used for the part DC/DC. This IC achieves compact size
with the chip size package (VCSP85H3). [BD6081GU] This IC solves a mounting problem by BGA package
(SBGA063W060). [BD6081GVW]
●Features
1) Main LCD Back Light LED Driver (Max 4 Light)
4 Lighting / 3 Lighting can be chosen (register setting)
2) Sub LCD Back Light LED Driver (Max 2 Light)
2 Lighting / 1 Lighting can be chosen (register setting)
3) RGB LED Driver (2 System)
Slope control is built in.(2 system independence can be controlled.)
LED connection (for G1LED,G2LED,B1LED,B2LED) can be set up in the battery or the DC/DC output.(register setting)
LED connection (for R1LED,R2LED) can be set up in the battery only.
4) 2ch Series Regulator
2.8V output Iomax=150mA
1.8V output Iomax=150mA(normal mode)
1.8V output low current consumption mode / normal mode Switching is possible. (The outside pin control / regi ster setting)
5) Charge Pump DC/DC
Soft start Functions
Over voltage protection (Auto-return type)
Over current protection (Auto-return type)
6) Thermal shutdown (Auto-return type)
2
7) I
●Absolute Maximum Ratings (Ta=25
C BUS Fast-mode (max 400kHz)Writing
*This chip is not designed to protect itself against radioactive rays.
*This material may be changed on its way to designing.
*This material is not the specification.
℃)
Parameter
SymbolRatings Unit
No.11040EAT27
Maximum Applied voltage VMAX 7 V
Power Dissipation
Operating Temperature Range Topr -25 ~ +85 ℃
Storage Temperature Range Tstg -55 ~ +150 ℃
cote1)Power dissipation deleting is 13.8mW/ ℃, when it’s used in over 25 ℃.
(It’s deleting is on the board that is ROHM’s standard))
Note2)Power dissipation deleting is 8.48mW/
(It’s deleting is on the board that is ROHM’s standard))
●Operating conditions (VBATVIO, Ta=-25~85
Parameter Symbol
VBAT input voltage VBAT 2.7 ~ 5.5 V
VIO pin voltage VIO 1.65 ~ 3.3 V
VBAT Circuit current 1 IBAT1 - 0.1 3.0 A
VBAT Circuit current 2 IBAT2 - 0.5 3.0 A
VBAT Circuit current 3 IBAT3 - 6.2 9.5 A
VBAT Circuit current 4 IBAT4 - 100 150 A
VBAT Circuit current 5 IBAT5 - 140 210 A
VBAT Circuit current 6 IBAT6 - 63 95 mA
VBAT Circuit current 7 IBAT7 - 95 143 mA
VBAT Circuit current 8 IBAT8 - 125 188 mA
【LED Driver】
LED current Step1 ILEDSTP1 32 Step
LED current Step2 ILEDSTP2 64 Step
LED Maximum setup current 1
LED Maximum setup current 2
LED current accurate ILED 18 20 22 mA
LED current Matching ILEDMT - 5 10 %
LED OFF Leak current ILKLED - - 1.0 A
【DC/DC(Charge Pump)】
Output voltage V℃P Vf+0.15 Vf+0.2- V
Current Load IOUT - - 255 mA
Oscillator frequency fosc 0.8 1.0 1.2 MHz
Over voltage protection
detect voltage
Over current protection
detect current
【REG1】
Output voltage Vo1 2.7162.80 2.884V
I/O voltage difference Vsat1 - 0.2 0.3 V
Load stability Vo11 - 10 60 mV
Input stability Vo12 - 10 60 mV
Ripple Rejection Ratio RR1 30 40 - dB
Short circuit current limit Ilim01 - 225 450 mA
Discharge resister at OFF ROFF1 - 1.0 1.5 k
【REG2】
Output voltage 1 Vo21 1.74 1.8 1.86 V
Output voltage 2 Vo22 1.71 1.8 1.89 V
Load stability Vo21 - 10 60 mV
Input stability Vo22 - 10 60 mV
Ripple Rejection Ratio RR2 30 40 - dB
Short circuit current limit Ilim02 - 225 450 mA
Discharge resister at OFF ROFF2 - 1.0 1.5 k
IMAX1 - - 32 mA
IMAX2 - - 31.5 mA
OVP - 6.0 6.5 V
OCP - 250 375 mA
Min. Typ. Max.
Limits
Unit Condition
RESET=0V, VIO=0V
RESET=0V, VIO=1.8V
REG2 low current consumption mode,
Io=0mA
REG2 normal mode, Io=0mA
REG1, REG2 normal mode, Io=0mA
DC/DC x1mode, Io=60mA,VBAT=4.0V
DC/DC x1.5mode,
●Package
BD6081GU
VCSP85H3 CSP small Package
SIZE : 3.90mm×3.90mm(A difference in public: X and Y, together, ± 0.1mm) height 1.0mm max
A ball pitch : 0.5mm
1 B7 E4 VBATCP - - - GND Battery is connectedA
2 G2 B8 VBAT1 - - - GND Battery is connectedA
3 A5 E3 VBAT2 - - - GND Battery is connectedA
4 G4 D7 VBATREG - - - GND Battery is connectedA
5 A1 A1 T1 - - - GND Test Pin (short to GND) A
6 A7 H1 T2 - - - GND Test Pin (short to GND) A
7 G7 H8 T3 - - VBATGND Test Pin (short to GND) J
8 G1 A8 T4 - - VBATGND Test Pin (short to GND) J
9 F3 C7 CREF O - VBATGND Reference voltage output P
10 G6 G8 VIO - - VBATGND I/O voltage source is connected C
11 F7 H7 RESET I VIO VBATGND Reset input (L: RESET, H: RESET cancel) H
12 E6 H6 SDA I VIO VBATGND I2C data input I
13 D5 G6 SCL I VIO VBATGND I2C clock input H
14 B5 F1 CPGND - - VBAT- GroundB
15 F1 B6 REFGND - - VBAT- GroundB
16 G5 E7 REGGND - - VBAT- GroundB
17 B2 C2 BLGND - - VBAT- GroundB
18 D1 A3 RGBGND - - VBAT- GroundB
19 E7 F5 DGND - - VBAT- GroundB
20 B6 G1 C1N I/O - VBATGND Charge Pump capacitor is connected F
21 C6 H2 C1P I/O - - GND Charge Pump capacitor is connected G
22 A6 F2 C2N I/O - VBATGND Charge Pump capacitor is connected F
23
24 D7 F4 VOUT O 25 D6 G4 VOUTM O - - GND Charge Pump output pin output pin A
26 E3 A7 ISET I - VBATGND LED standard current O
27 F4 D6 REG1O O - VBATGND REG1 output pin Q
28 G3 C8 REG2O O - VBATGND REG2 output pin Q
29 A3 D3 MLED1 I - VBATGND Main LCD Back Light LED is connected 1 D
30 B3 D1 MLED2 I - VBATGND Main LCD Back Light LED is connected 2D
31 A4 E1 MLED3 I - VBATGND Main LCD Back Light LED is connected 3D
32 B4 E2 MLED4 I - VBATGND Main LCD Back Light LED is connected 4D
33 B1 B2 SLED1 I - VBATGND Sub LCD Back Light LED is connected 1 D
34 A2 B1 SLED2 I - VBATGND Sub LCD Back Light LED is connected 2 D
35 F2 A6 R1LED I
36 E1 A5 G1LED I - VBATGND Green LED1 is connected D
37 E2 A4 B1LED I - VBATGND Blue LED1 is connected D
38 D2 B3 R2LED I
39 C1 A2 G2LED I - VBATGND Green LED2 is connected D
40 C2 C3 B2LED I - VBATGND Blue LED2 is connected D
41 F6 F6 RGB1CNT I VIO VIO GND RGB1 LED external ON/OFF Synchronism Pin K
42 E5 G7 RGB2CNT I VIO VIO GND RGB2 LED external ON/OFF Synchronism Pin K
43 E4 E6 REG2EN I (VBAT)VBATGND REG2 ON/OFF control Pin (L: OFF, H: ON) L
44 F5 F8 REG2MD I (VBAT)VBATGND
45 D3 F3 TESTI1 I - VBATGND Test input pin 1 (short to GND) H
46 D4 C6 TESTI2 I - VBATGND Test input pin 2 (short to GND)H
47 C5 G5 TESTO1 O - VBATGND Test output pin 1 (OPEN)M
48 C4 F7 TESTO2 O - VBATGND Test output pin 2 (OPEN) N
49
-
63
※ The LED pin which isn't used is to short-circuit to the ground. But, the setup of a register concerned with LED that isn’t used is prohibited.
Total: Functional 48Pin
48 balls (BD6081GU)
63 balls (BD6081GVW)
Pin No.
C7
- (Other) NC - - - - Non connect pin -
H3 C2P I/O - - GND Charge Pump capacitor is connected G
Pin Name I/O
Input
Level
-
-
ESD Diode
For
Power
VBATGND Red LED1 is connected D
VBATGND Red LED2 is connected D
For
Ground
-
GND Charge Pump output pin A
REG2 Mode control Pin
(L: low current consumption, H: normal)
●I2C BUS format
The writing/reading operation is based on the I2C slave standard.
・Slave address
A7 A6 A5 A4 A3 A2 A1 W
1 1 1 0 1 1 0 0
・Bit Transfer
SCL transfers 1-bit data during H. SCL cannot change signal of SDA during H at the time of bit transfer. If SDA changes
while SCL is H, START conditions or STOP conditions will occur and it will be interpreted as a control signal.
SDA
SCL
Data lin e stable;
Data valid
Change of data
allowed
・START and STOP condition
When SDA and SCL are H, data is not transferred on the I
2
C- bus. This condition indicates, if SDA changes from H to L
while SCL has been H, it will become START (S) conditions, and an access start, if SDA changes from L to H while SCL
has been H, it will become STOP (P) conditions and an access end.
SDA
SCL
S P
START Condition
STOP Condition
・Acknowledge
It transfers data 8 bits each after the occurrence of START condition. A transmitter opens SDA after transfer 8bits data, and
a receiver returns the acknowledge signal by setting SDA to L.
A register address is transferred by the next 1 byte that transferred the slave address and the write-in command. The 3rd
byte writes data in the internal register written in by the 2nd byte, and after 4th byte or, the increment of register address is
carried out automatically. However, when a register address turns into the last address (1Ah), it is set to 00h by the next
transmission. After the transmission end, the increment of the address is carried out.
SCL clock frequency fSCL 0 - 100 0 - 400 kHz
LOW period of the SCL clock tLOW 4.7 - - 1.3 - - s
HIGH period of the SCL clock tHIGH 4.0 - - 0.6 - - s
Hold time (repeated) START condition
After this period, the first clock is generated
tHD;STA4.0 - - 0.6 - - s
Set-up time for a repeated START condition tSU;STA4.7 - - 0.6 - - s
Data hold time tHD;DAT0 - 3.45 0 - 0.9 s
Data set-up time tSU;DAT250 - - 100 - - ns
Set-up time for STOP condition tSU;STO4.0 - - 0.6 - - s
Bus free time between a STOP
D7 - - - D6 - - - D5 REG2NML 0 REG2 low current consumption modeREG2 normal mode
D4 REG2PD 0 REG2 power OFF REG2 power ON
D3 - - - D2 - - - D1 - - - D0 REG1PD 0 REG1 power OFF REG1 power ON
Address 02h <Control Back Light>
BIT Name Initial
D7 - - - D6 - - - D5 SLEDSEL 0 2 lights ON (SLED1~2) 1 lights ON (SLED1)
D4 SLEDEN 0 Sub Back Light OFF Sub Back Light ON
D3 - - - D2 - - - D1 MLEDSEL 0 4 lights ON (MLED1~4) 3 lights ON (MLED1~3)
D0 MLEDEN 0 Main Back Light OFF Main Back Light ON
D7 RGB1MD1 0 Refer to the following Refer to the following
D6 RGB1MD0 0 Refer to the following Refer to the following
D5 B1LEDPL 0 Refer to the following Refer to the following
D4 G1LEDPL 0 Refer to the following Refer to the following
D3 R1LEDPL 0 Refer to the following Refer to the following
D2 B1LEDEN 0 B1 LED OFF B1 LED ON
D1 G1LEDEN 0 G1 LED OFF G1 LED ON
D0 R1LE DEN 0 R1 LED OFF R1 LED ON
D7 RGB2MD1 0 Refer to following Refer to following
D6 RGB2MD0 0 Refer to following Refer to following
D5 B2LEDPL 0 Refer to following Refer to following
D4 G2LEDPL 0 Refer to following Refer to following
D3 R2LEDPL 0 Refer to following Refer to following
D2 B2LEDEN 0 B2 LED OF F B2 LED ON
D1 G2LEDEN 0 G2 LED OFF G2 LED ON
D0 R2LEDEN 0
But, a state of lighting depends on the setup of other registers.
24/35
2011.04 - Rev.
A
BD6081GU,BD6081GVW
●RGB LED operating
1. Operating mode
RGB LED can set up the following operating mode by the setup of the register.
<Setup register>
I1**LED : (register) Initial electric current value [mA]
IDLT**LED : (register) The electric current value of around 1Step [mA]
RGB*SLNUM : (register) slope step number (1,2,4,8,16,32,64 Step)
RGB*SL1STEP : (register) The first half slope 1Step time [ms]
RGB*SL2STEP : (register) The latter half slope 1Step time [ms]
RGB*WT1TM : (register) The first half lighting time [ms]
RGB*WT2TM : (register) The latter half lighting time [ms]
As for the following setup, calculate it from the ab ove setup.
I2**LED : At the time of middle lighting current value [mA] = I1**LED + IDLT**LED x RGB*SLNUM
(In case of the value that a calculation exceeds maximum value, the current value is at the limit with maximum.)
RGB*SL1TM : The first half slope time [ms] = RGB*SL1STEP x RGB*SLNUM
RGB*SL2TM : The latter half slope time [ms] = RGB*SL2STEP x RGB*SLNUM
Each setup is necessary for DC current (at Normal mode or Blink mode).
(* : 1/ 2 channels is shown. ** : R1/G1/B1/R2 /G2/B2 is shown.)
Note) The current value in the table, it is value when 120k is connected to ISET pin.
2. Slope control
The slope control that this LSI is equipped processes step ti me inside as follows.
It is made to have electric current by the log curve that is a simple target as to the slope.
RGB*STA
IDLT**LED
I1**LED
LED
current
T1
T2
T3
T4
T5
T7
T6
T8
(A)Section : It transits at the step time of two times when it was set up with RGB*SL1STEP
(B)Section : It transits at the step time when it was set up with RGB*SL1STEP.
(C)Section : It transits at the step time of a half times when it was set up with RGB*SL1STEP.
The time of the total (RGB*SL1TM) is calculated with RGB*SL1STEP x RGB*SLNUM.
A similar movement is done on the descent (RGB*SL2TM) side as well.
The acceptance of the setup of a register concerned with LED working during the slope movement stops.
But, a RGB*STA signal interrupts even during the slope movement, and it is possible that LED is turned off.
1. Reset
There are two kinds of reset, software reset and hardware reset.
(1) Software reset
・All the registers are initialized more than making a register (SFTRST) setup "1".
・The register of software resetting is an automatic return (Auto Return 0).
(2) Hardware reset
・It shifts to hardware reset by changing RESET pin “H” “L”.
・The condition of all the registers under hardware reset pi n is returned to the initial value,
and it stops accepting all address.
・It’s possible to release from a state of hardware reset by setting register “L” “H”.
・RESET pin has delay circuit. It doesn’t recognize as hardware reset in “L” period under 5s.
(3) Reset Sequence
・When hardware reset was done during software reset, software reset is canceled when
hardware reset is canceled. (Because the initial value of software reset is “0”)
2. Thermal shutdown
The blocks which thermal shutdown function is effective in the following.
Charge pump
LED Driver
REG1
REG2 is not shut down by thermal shutdown function, because REG2 can be used for I/O voltage.
A thermal shutdown function works in about 195
Detection temperature has a hysteresis, and detection rel ease temperature is about 175
(Design reference value)
DC/DC circuit operates when either LED turns ON.
(But, when LED connection is set to DC/DC output (VOUT) only.)
DC/DC circuit has soft start function to prevent a rush current.
VBAT and VIO sequence is as follow.
BAT
VIO
RESET
EN (*)
VOUT
LED Current
(*) An EN signal means the following in the upper figure.
EN = “MLEDEN” or “SLEDEN” or “RGB1STA” or “RGB2STA”
(= LED The LED lighting control of a setup of connection VOUT)
But, as for VBAT < 2.2V (typ) or Ta > T
Mode transition
The transition of boosts multiple transits automatically by the VBAT voltage and the voltage of the LED electric current
inflow pin.
Condition:○
1
mode down=”H”
mode down=”H”
Over voltage protection / Over current protection
DC/DC circuit output (VOUT) is equipped with the over-voltage protection and the over current protection function.
A VOUT over-voltage detection voltage is about 6.0V.
A detection voltage has a hysteresis, and a detection release voltage is about 5.75V. (Design reference value)
And, when VOUT output short-circuits in GND, drain electric current is controlled by an over current protection function.
T
VBATON
T
VIOON=min 0.1ms
T
RSTB=min 0.1ms
T
(typ : 195° C), a protection function functions, and an EN signal doesn't become effective.
TSD
STANDBY
MLEDEN=”1” or SLEDEN =”1” or RGB *STA=”1”
(But, LED connection= It is limited to the LED lighting co ntrol of a setup of VOUT.)
1
○
VBAT>2.2V(typ) and Ta<T
SOFT
VOUT>1.5V(typ) After it is detected, 128us(typ) wait
LED maximum current value (White LED driver and RGB LED Driver common) can be established in the resistance
value RISET that it is connected to the ISET Pin.
A setting is shown in the following.
ILEDmax = 6.4 x 0.6 [V] / RISET [k] [A] (Typ) MLED1to4, SLED1to2
ILEDmax = 6.3 x 0.6 [V] / RISET [k] [A] (Typ) All RGB LED
The maximum setting of LED current is 32mA (MLED and SLED), 31.5mA (RGB) on the D range of the internal circuit.
LED current overload protection
ISET Pin is mount with the GND short detection function. LED current value prevents excessive LE D current from
flowing when ISET Pin becomes low impedance because it is shown with a formula of the former extension.
White LED Driver
The number of lighting of white LED can be set up by the register MLEDSEL and SLEDSEL (address02h).
The settlement of the number of lighting can be setup with follow.
Main LCD Back light
Sub LCD Back light
・・・3 Light (MLED1 ~ 3) or 4 Light (MLED1 ~ 4)
・・・1 Light (SLED1) or 2 Light (SLED1 ~ 2)
Connect the LED pin that isn't used to the ground.
RGB LED Driver
By register B*LEDMD and G*LEDMD (address05h), a place of connection of Green LED and Blue LED It can be set up
in VBAT or VOUT. When Vf is low, it is connected to VBAT, and it is possible that efficiency is raised.
When a VBAT connection is chosen, a feedback route to the DC/DC circuit is interrupted, and it works as a simple
constant current driver.
A write protect is given in the following address when "1" is written in the RGB*STA register.
When the connection of LED is VBAT, only a LED driver turns it on, and a DC/DC circuit is turned off.
The LED pin which isn't used is to short to the ground.
But, the setup of a register concerned with LED that isn’t used is prohibited.
5. I/O
CPU interface control input is possible low voltage interface. Interface peripheral block diagram is as follows.
VIO voltage or interface voltage is possible the setting range of 1.65~3.3V. (But, VBAT voltage VIO voltage)
Also, I/O of with enable is being used for SCL, SDA input as a prevention of clock propagation to the inside when other LSI
shared the SCL, SDA line.
RESET=L, Output "H"
SCL
(SDA)
RESET
EN
Level shift
Logic
An equivalent circuit around the part I/O becomes p.8. By rising turn of the I/O power supply and the input level be careful
enough because an electric current route may occur through the protection Diode of the pin.
It must start as follows when REG2 output is used as VIO voltage.
VBAT (force)
RESET
(external pin control)
REG2EN
(external pin control)
REG2MD
(external pin control)
REG2O(output)
(=VIO voltage)
Min:7.5ms (*2)
Min:0ms (*4)
Technical Note
Low current
Stand By
(*1) This sequence is when REG2O is used as an I/O voltage.
(*2) When the low consumption mode is unnecessary, REG2EN=REG2MD (simultaneous control) is possible.
(*3) REG2 should go for a release of RESET at the time of the normal mode.
(*4) REG2EN= Though "L" and RESET= "L" don't care even about the simultaneous timing,
It is prohibition to take REG2EN= "L" in front of RESET= "L".
consumption mode
Min:2ms(*2)
Take the specifications of the outside power supply into consideration when the I/O voltage is applied from outside.
But, at that case as well, REG2 rising time in the normal mode Take a (Min : 2ms) into consideration.
Normal mode
Register access is possible (*3)
Stand By
It must start as follows when external power supply is used as VIO voltage.
VBAT(force)
VIO(force)
RESET(external pin control)
Register control
Impossible
VIO should go for a release of RESET after the time of the rising mode.
nd it is forbid to fall VIO before RESET=”L”.
Possible
Impossible
7. About the pin management of the function that isn't used and test pins
Please connect the pin that isn ’t used and test pin referred to equivalent circuit (P.8).
TESTI1, TESTI2 Short to GND (Must) because input pin for test
TESTO1, TESTO2 Be OPEN because out put for test
T1~T4 Short to GND (Must) because input pin for test
Non-used LED Pin Short to GND
But, the setup of a register concerned with LED that isn’t used is prohibited.
REG2EN, REG2MD, RGB1CNT, RGB2CNT Pull-Down resistance is built in.
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identif y breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is a ssumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Power supply and ground line
Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention
to the interference by common impedance of layout pattern when there are plural power supplies and ground lines.
Especially, when there are ground pattern for small signal and ground pattern for large current included the external
circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between
the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the
characteristics of the capacitor to be used present no problem includin g the occurrence of capacity dropout at a low
temperature, thus determining the constant.
(3) Ground voltage
Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no pins are at a potential lo wer than the ground voltage including an actual electric
transient.
(4) Short circuit between pins and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin
and the power supply or the ground pin, the ICs can break down.
Technical Note
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input pins
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower
than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input
pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to
the input pins a voltage lower than the power supply voltage or within the guarante ed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher,
the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating
the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do
not continuously use the LSI with this circuit operat ing or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(10) LDO
Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because it
has the possibility that an operation becomes unstable.
(11) About the pin for the test, the un-use pin
Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a
function manual and an application noteboo k . And, as for the pin that doesn't specially have an explanation, ask our
company person in charge.
(12) About the function description or application note or more.
The function manual and the application notebook are the design materials to design a set. So, the cont ents of t he
materials aren't always guaranteed. Please design application by having fully examinati on and evaluation include the
external elements.
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The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injur y (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.