The BD6062GU is 1A Flash LED Driver ICs that can drive 1LED. It is possible to select how to control, 2wired control mode
(Direct Control Mode) or 3wired mode (Register Control Mode). The BD6062GU has original Timer function in 3wired mode
and easily set pre-flash timer and flash timer.
●Features
1) 400mA ~ 800mA selectable in Flash mode (Register Control Mode)
2) 50 ~ 200mA Torch mode (Register Control Mode)
3) 800mA in Flash mode (Direct control Mode)
4) 200mA in Torch mode (Direct control Mode)
5) Maximum current of LED is 1A in both Flash and Torch mode
6) 3Wired Mode and Direct control Mode selectable
7) In 3Wired Mode, Pre-Flash Timer and Flash Timer controllable
8) In 3Wired Mode, Flash current and Torch current is controllable
9) Over voltage protection
10) CSP 23pin Small and Thin package
●Applications
Flash and torch of camera for mobile phone
●Line up matrix
Parameter BD6062GU
Input voltage 2.7 ~ 5.5V
No.11041EBT13
Switching Frequency 480 ~ 720kHz
Maximum LED Current 1A
Package VCSP85H2
●Absolute maximum ratings (Ta=25℃)
Parameter Symbol Ratings Unit Condition
Maximum applied voltage VMAX 7 V VBAT, VIO
Power dissipation Pd 1100 *1 mW
Operating temperature range Topr -30~+85 ℃
Storage temperature range Tstg -55~+150 ℃
*1 50mm × 58mm × 1.75mm At glass epoxy board mounting. When it’s used by more than Ta=25℃, it’s reduced by 11mW/℃
It depends on battery or external components condition, internal power consumption will be large at flash action and there is
a possibility that it will over Power dissipation of IC.
BD6062GU can limit drive current on over power condition, and protect to over Power dissipation.
When this mode is enable, BD6062GU limit maximum current automatically as below.
Torch Max200mA Max200mA
Flash Max800mA 400mA
3) Power Control
BD6062GU can be controlled the status of activation using Enable control resistor.
4) LED drive current (Torch Mode)
The LED current is decided by the voltage of RTORCH terminal. (Rtorch=1.0)
ILED is given as follows,
BD6062GU has soft start function.
Soft start function will prevent the big peak current from IC and coil.
The detail of soft start is as follows.
ERRAMP
B
RQ
Q
Q
S
C
OSC
EN
VOUT
B
C
dashed
duty width increase little by little
Fig.32 Soft start Diagram and Timing
8) Soft Current Limiter
BD6062GU has Soft Current Limiter function.
Soft current limiter function will change the value of current gradually.
It has four steps. And the steps are as follows;
4Step of soft current limiter
Action Start 2nd step 3rd step 4th step Normal
Time 0~500us 500~700us700~800us800~900us900us~
Current Limit (DC) 0A* always 0.5A 1A 1.5A 2A
Current Limit “H (peak) 1.125A 1.75A 2.375A 3.0A 3.625A
Current Limit “L (peak) 0.675A 1.05A 1.425A 1.8A 2.175A
Peak current of BD6062GU depends on only soft current limiter.
Switching frequency or VBAT voltage does not affect Peak current of BD6062GU.
9) Thermal shut down
BD6062GU has a thermal shut down function.
It works above 175℃, and while, IC will change the status from active to inactive.
When the temperature will be under 175℃, IC will return to normal operation.
10-1) Over voltage detect function (OVP)
When OVP become more than 5.5V, IC stop the switching.
When OVP become less than detect voltage, the status of switching will restart.
10-2) Open detect function (ODF)
When OVP pin is not connected any components, IC will stop the switching.
●Selection of external parts
Recommended external parts are as shown below.
When to use other parts than these, select the following equivalent parts.
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If
any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
( 2 ) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
( 3 ) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
( 4 ) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this
regard, for the digital block power supply and the analog block power supply, even though these power supplies has
the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus
suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the
wiring patterns. For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the
capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus
determining the constant.
( 5 ) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
( 6 ) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
( 7 ) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
( 8 ) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to
the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
( 9 ) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the
guaranteed value of electrical characteristics.
( 10 ) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of
the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
( 11 ) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
( 12 ) Thermal shutdown circuit (TSD)
When junction temperatures become 175℃ (typ) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is
not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
( 13 ) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
( 14 ) Selection of coil
Select the low DCR inductors to decrease power loss for DC/DC converter.
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