BD5471MUV is a low voltage drive class-D stereo speaker amplifier that was developed for note-book PC, cellular phone,
mobile audio products and the others. LC filters of speaker outputs are unnecessary, and only 7 external components are
needed for speaker system. Also, 3.3V regulator in BD5471MUV can use power supply for audio-codec. BD5471MUV, that
is high-efficiency, low consumption, is suitable for application by using battery. Shutdown current is 0µA typically. Also,
start-up time is fast from shutdown to active mode. BD5471MUV can use for some applications that change mode between
“shutdown state” and “active state”.
●Features
1) High power 2.3W typ. (VDD=5V, RL=4Ω, THD+N=10%, stereo input)
High power 1.5W typ. (VDD=5V, RL=8Ω, THD+N=10%, stereo input)
2) Gain selectable by the external control (6, 12, 18, 24dB)
3) Pop noise suppression circuitry
4) Standby function (Mute function) [I
5) Protection circuitry (Short protection [Audio, REG], Thermal shutdown, Under voltage lockout)
6) Built-in 3.3V regulator
7) Built-in BEEP detect circuitry
8) Very small package VQFN024V4040
●Applications
Notebook computers,Mobile electronic applications,Mobile phones,PDA etc.
●Absolute Maximum Ratings(Ta=+25℃)
Parameter Symbol Ratings Unit
=0uA]
SD
No.10101EAT03
Power Supply Voltage VDD 7.0 V
0.7 *1 W
Power Dissipation Pd
2.2 *2 W
Storage Temperature Range Tstg -55 ~ +150 ℃
Input Voltage Range *3 Vin -0.3 ~ VDD+0.3 V
Control Terminal
Input Voltage Range *4
*1 74.2mm×74.2mm×1.6mm, FR4 1-layer glass epoxy board(Copper on top layer 0%)
Derating in done at 5.6mW/℃ for operating above Ta=25℃. There are thermal via on the board
*2 4.2mm×74.2mm×1.6mm, FR4 4-layer glass epoxy board (Copper on bottom 2 and 3 layer 100%)
*3 input Terminal (INL+, INL-, INR+, INR-)
*4 Control Terminal (MUTE, G0, G1, EAPD, BEEP, REG_SD)
●Operating Conditions
Parameter Symbol Ratings Unit
Power Supply Voltage
Temperature Range
* These products aren’t designed for protection against radioactive rays.
Qty. Item Description SMD Size Manufacturer/Part Number
Technical Note
1 C1 Capacitor, 0.01μF 1608
1 C2 Capacitor, 2.2μF 1608
2 C3, C4,C6,C7 Capacitor, 0.1μF 1608
1 C5, C8 Capacitor, 10μF A (3216)
1 U1
1 PCB1
●The relation in the gain setting and input impedance Ri
The gain setting terminal (G0,G1)
G0 G1 Gain[dB] Ri [Ohm]
L L 6 90k
L H 12 60k
H L 18 36k
H H 24 20k
●Description of External parts
①Power down timing capacitor (C1)
It’s the capacitor which adjusts time from BEEP signal stop to amplifier stop.
Turn off time Toff is set the following formula.
Toff
②Regulator output capacitor(C2)
Output capacitor of 3.3V regulator.
Use capacitance equal to or more than 1uF.
③Input coupling capacitor Ci (C3,C4, C6,C7)
It makes an Input coupling capacitor 0.1uF.
Input impedance Ri in each gain setting becomes the above table.
In 18dB gain setting, it is Ri=36kΩ(Typ.).
It sets cutoff frequency fc by the following formula by input coupling capacitor Ci (C3,C4, C6,C7) and input impedance Ri
fc
In case of Ri=36kΩ, Ci=0.1uF, it becomes fc=about 44Hz.
④The power decoupling capacitor (C5,C8)
It makes a power decoupling capacitor 10uF.
When making capacitance of the power decoupling capacitor small, there is an influence in the Audio characteristic.
When making small, careful for the Audio characteristic at the actual application.
When measuring Audio characteristics, insert LC filter during the output terminal of IC and the speaker load and measure it.
it. Arrange LC filter as close as possible to the output terminal of IC.
In case of L=22μH, C=1μF, the cutoff frequency becomes the following.
This IC has BEEP detection.
When inputting beep signal to 1pin BEEP terminal at standby mode, amplifier becomes standby to active.
When beep signal stops, amplifier becomes active to standby.
It is adjustable the time(Toff) from beep signal stop to amplifier standby by a capacitance connect to 2pin DET_C terminal.
If no need to use BEEP detection, make 1pin BEEP terminal open or connect to GND.
MUTE
BEEP
DET_C
Amplifier
state
Toff calculation fomula
To ff =
C×0.8VDD
5u
Example C=0.01u, VDD=5V → Toff= 8 mse c
C: Condenser to connect to a 2pin
MUTE=H, BEEP signal input MUTE=H, BEEP signal stop
This IC has the cuircuit of pop noise reduction at starting and stop.
Pop noise reduction is realized in controlling to adjust the timing of output at starting and stop.
Turn on time is 1msec.
●About the short protection
Output starting (MUTE=H, EAPD=L→H)
Ton=1msec
H-
Bridge
Short
Protection
Short
Protection
H-
Bridge
OUTL+
OUTL-
OUTR+
OUTR-
Output stop (MUTE=H, EAPD=H→L)
EAPD
5V/div
OUTL+
5V/div
OUTL5V/div
When detecting a short of Lch output,
Lch output stops, and Rch output stops.
Also when detecting a short of Rch output,
Rch output stops, and Lch output stops.
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation. Pay attention to points such as the following.
Since an maximum junction temperature (Tj
.)or operating temperature range (Topr) is shown in the absolute maximum
MAX
ratings of the IC, to reference the value, find it using the Pd-Ta characteristic (temperature derating curve).
If an input signal is too great when there is insufficient radiation, TSD (thermal shutdown) may operate. TSD, which
operates at a chip temperature of approximately +180℃, is canceled when this goes below approximately +100℃.
Since TSD operates persistently with the purpose of preventing chip damage, be aware that long-term use in the vicinity
that TSD affects decrease IC reliability.
Temperature Derating Curve
Reference Data
3.5
③3.1W
3.1
VQFN024V4040
measurement conditions
: IC unit Rohm standard board mounted
board size : 74.2mm×74.2mm×1.6mmt
board① FR4 1-layer glass epoxy board(Copper on top layer 0%)
board② FR4 4-layer glass epoxy board(Copper on 2,3 layer 100%)
board size : 35mm×25mm×1.6mmt
board③ FR4 4-layer glass epoxy board(Copper on 2,3 layer 100%)
connecting with thermal via
2.5
②2.2W
2.2
2.0
1.5
Power dissipation Pd(W)
1.0
①0.7W
0.7
0.5
0.0
0 25 50 75 100 125
85
Ambient temperature Ta(℃)
150
Note) Values are actual measurements and are not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted. The Power dissipation of this IC when
mounted on a multilayer board designed to radiate is greater than the values in the graph above.
This IC may be damaged if the absolute maximum ratings for the applied voltage, temperature range, or other
parameters are exceeded. Therefore, avoid using a voltage or temperature that exceeds the absolute maximum ratings.
If it is possible that absolute maximum ratings will be exceeded, use fuses or other physical safety measures and
determine ways to avoid exceeding the IC's absolute maximum ratings.
(2) GND terminal’s potential
Try to set the minimum voltage for GND terminal’s potential, regardless of the operation mode.
(3) Shorting between pins and mounting errors
When mounting the IC chip on a board, be very careful to set the chip's orientation and position precisely. When the
power is turned on, the IC may be damaged if it is not mounted correctly. The IC may also be damaged if a short occurs
(due to a foreign object, etc.) between two pins, between a pin and the power supply, or between a pin and the GND.
(4) Operation in strong magnetic fields
Note with caution that operation faults may occur when this IC operates in a strong magnetic field.
(5) Thermal design
Ensure sufficient margins to the thermal design by taking in to account the allowable power dissipation during actual use
modes, because this IC is power amp. When excessive signal inputs which the heat dissipation is insufficient condition, it
is possible that thermal shutdown circuit is active.
(6) Thermal shutdown circuit
This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output
transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the IC avoiding
thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = +150℃, and is not intended to
protect and secure an electrical appliance.
(7) Load of the output terminal
This IC corresponds to dynamic speaker load, and doesn't correspond to the load except for dynamic speakers.
(8) The short protection of the output terminal
This IC is built in the short protection for a protection of output transistors. When the short protection is operated, output
terminal become Hi-Z condition and is stopped with latch. Once output is stopped with latch, output does not recover
automatically by canceling the short-circuiting condition. The condition of stopping with latch is cancelled, when power
supply or mute signal is turned off and turned on again.
(9) Operating ranges
The rated operating power supply voltage range (VDD=+4.5V ~ +5.5V) and the rated operating temperature range
(Ta=-40℃ ~ +85℃) are the range by which basic circuit functions is operated. Characteristics and rated output power are
not guaranteed in all power supply voltage ranges or temperature ranges.
(10) Electrical characteristics
Electrical characteristics show the typical performance of device and depend on board layout, parts, power supply.
The standard value is in mounting device and parts on surface of ROHM’s board directly.
(11) Maximum output power
When stereo inputs at RL=4Ω, maximum output power may not achieve up to typical value because the device heats.
Ensure sufficient margins to the thermal design to get larger output power.
(12) Power decoupling capacitor
Because the big peak current flows through the power line, the class-D amplifier has an influence on the Audio
characteristic by the capacitance value or the arrangement part of the power decoupling capacitor.
(13) Power supply
Use single power supply, because power supplies (4,10,15,21pin) of audio amplifier and regulator are shorted inside.
Audio
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