BD5446EFV is a Class D Speaker Amplifier designed for Flat-panel TVs in particular for space-saving and low-power
consumption, delivers an output power of 20W+20W. This IC employs state-of-the-art Bipolar, CMOS, and DMOS (BCD)
process technology that eliminates turn-on resistance in the output power stage and internal loss due to line resistances up
to an ultimate level. With this technology, the IC can achieve high efficiency of 87% (10W+10W output with 8Ω load). In
addition, the IC is packaged in a compact reverse heat radiation type power package to achieve low power consumption
and low heat generation and eliminates necessity of external heat-sink up to a total output power of 40W. This product
satisfies both needs for drastic downsizing, low-profile structures and many function, high quality playback of sound system.
●Features
1) BD5446EFV has two system of digital audio interface.
(I
2) Within the wide range of the power supply voltage, it is possible to operate in a single power supply. (10~26V)
3) It contributes to miniaturizing, making to the thin type, and the power saving of the system by high efficiency and low heat.
4) S/N of the system can be optimized by adjusting the gain setting among 8 steps. (20~34dB / 2dB step)
5) It has the output power limitation function that can be adjusted to an arbitrary output power.
6) The decrease in sound quality because of the change of the power supply voltage is prevented with the feedback
7) It provides with the best stereo DAC output for the headphone usage. As a result, the output of the selection of the
8) Eliminates pop noise generated when the power supply goes on/off, or when the power supply is suddenly shut off.
9) BD5446EFV is a highly reliable design to which it has various protection functions.
(High temperature protection, Under voltage protection, Output short protection, Output DC voltage protection and
●Applications
Flat Panel TVs (LCD, Plasma), Home Audio, Desktop PC, Amusement equipments, Electronic Music equipments, etc.,
Supply voltage VCC 30 V Pin 25, 28, 29, 53, 54 *1 *2
2.0 W *3
Power dissipation Pd
4.5 W *4
6.2 W *5
Input voltage VIN -0.3 ~ 4.5 V Pin 7 ~ 18, 21 *1
Open-drain terminal voltage V
Operating temperature range T
Storage temperature range T
Maximum junction temperature T
*1 The voltage that can be applied reference to GND (Pin 6, 36, 37, 45, 46).
*2 Do not, however exceed Pd and Tjmax=150℃.
*3 70mm×70mm×1.6mm, FR4, 1-layer glass epoxy board (Copper on bottom layer 0%)
Derating in done at 16mW/℃ for operating above Ta=25℃.
*4 70mm×70mm×1.6mm, FR4, 2-layer glass epoxy board (Copper on bottom layer 100%)
Derating in done at 36mW/℃ for operating above Ta=25℃. There are thermal via on the board.
*5 70mm×70mm×1.6mm, FR4, 4-layer glass epoxy board (Copper on bottom layer 100%)
Derating in done at 49.6mW/℃ for operating above Ta=25℃. There are thermal via on the board.
-0.3 ~ 30 V Pin24 *1
ERR
-25 ~ +85 ℃
opr
-55 ~ +150 ℃
stg
+150 ℃
jmax
●Operating conditions (Ta=25℃)
Parameter
Symbol Ratings Unit Conditions
Supply voltage VCC 10 ~ 26 V Pin 25, 28, 29, 53, 54*1 *2
Minimum load impedance
(Speaker Output)
Minimum load impedance
(DAC Output)
*6 Do not, however exceed Pd.
* No radiation-proof design.
High level input voltage VIH 2.5 - 3.3 V Pin 7 ~ 18, 21
Low level input voltage VIL 0 - 0.8 V Pin 7 ~ 18, 21
Input current
(Input pull-down terminal)
33 66 132µA Pin 7 ~ 18, 21,VIN = 3.3V
I
IH
Speaker Output
Maximum momentary
output power 1
Maximum momentary
output power 2
P
- 10 - W
O1
- 20 - W
P
O2
THD+n=10%
GAIN=26dB
VCC=18V, THD+n=10%
GAIN =26dB
*7
*7
Total harmonic distortion THDSP - 0.07- % PO=1W, BW=20~20kHz *7
Crosstalk CTSP 65 80 - dB PO=1W, BW=IHF-A *7
Output noise voltage
(Sampling mode)
Residual noise voltage
(Mute mode)
PWM sampling frequency
V
- 140280µVrms -∞dBFS, BW=IHF-A *7
NO_SP
V
- 5 10 µVrms MUTEX=0V,-∞dBFS, BW=IHF-A *7
NOR_SP
f
- 512- KHz fs=32kHz *7
PWM1
f
- 705.6- KHz fs=44.1kHz *7
PWM2
f
- 768- KHz fs=48kHz *7
PWM3
DAC Output
Maximum output voltage V
0.85 1.0 - Vrms0dBFS,THD+n=1%
OMAX
Channel Balance CB -1 0 1 dB 0dBFS
Total harmonic distortion THDDA - 0.050.5 % -20dBFS,BW=20~20kHz
Crosstalk CTDA 65 80 - dB 0dBFS,BW=IHF-A
Output noise voltage V
Residual noise voltage V
*7 These items show the typical performance of device and depend on board layout, parts, and power supply.
The standard value is in mounting device and parts on surface of ROHM’s board directly.
●Input digital audio signal sampling frequency (fs) explanation
PWM sampling frequency, Soft-start, Soft-mute time, and the detection time of the DC voltage protection in the speaker
depends on sampling frequency (fs) of the digital audio input.
Sampling frequency of the
digital audio input
(fs)
PWM sampling frequency
(fpwm)
Soft-start / Soft-mute time
DC voltage protection in
the speaker detection time
32kHz 512kHz 64msec. 64msec.
44.1kHz 705.6kHz 46msec. 46msec.
48kHz 768kHz 43msec. 43msec.
●For voltage gain (Gain setting)
BD5446EFV prescribe voltage gain at speaker output (BTL output) under the definition 0dBV (1Vrms) as full scale input of
the digital audio input signal. For example, digital audio input signal = Full scale input, Gain setting = 20dB, Load resistance
= 8Ω will give speaker output (BTL output) amplitude as Vo=10Vrms. (Output power Po = Vo2/R
R
L_SP
= 12.5W )
L_SP
●Speaker output and DAC output
Digital audio input signal SDATA1 will be output to the speaker. (SDATA2 will not be output to the speaker. DAC output can
be selected either from digital audio input signal SDATA1 or SDATA2.)
●Format of digital audio input
・SYS_CLK: It is System Clock input signal.
It will input LRCLK, BCLK, SDATA1 (SDATA2) that synchronizes with this clock that are 256 times of sampling frequency
(256fs).
・LRCLK: It is L/R clock input signal.
It corresponds to 32kHz/44.1kHz/48kHz with those clock (fs) that are same to the sampling frequency (fs) .
The data of a left channel and a right channel for one sample is input to this section.
・BCLK: It is Bit Clock input signal.
It is used for the latch of data in every one bit by sampling frequency’s 64 times sampling frequency (64fs).
・SDATA1 & SDATA2: It is Data input signal.
It is amplitude data. The data length is different according to the resolution of the input digital audio data.
It corresponds to 16/ 20/ 24 bit.
Protection function Detecting & Releasing condition
Output short
protection
DC voltage protection
in the speaker
High temperature
protection
Under voltage
protection
Detecting
condition
Detecting
condition
Detecting
condition
Releasing
condition
Detecting
condition
Releasing
condition
Detecting
condition
Detecting current = 10A (TYP.)
PWM output Duty=0% or 100%
43msec(fs=48kHz) above fixed
Chip temperature to be above 150℃ (TYP.)
Chip temperature to be below 120℃ (TYP.)
Power supply voltage to be below 8V (TYP.)
Power supply voltage to be above 9V (TYP.)
No change to SYS_CLK more than 1usec (TYP.)
Clock stop protection
Releasing
condition
* The ERROR pin is Nch open-drain output.
* Once an IC is latched, the circuit is not released automatically even after an abnormal status is removed.
The following procedures ① or ② is available for recovery.
①After the MUTEX pin is made Low once, the MUTEX pin is returned to High again.
②Turning on the power supply again.
1) High temperature protection
This IC has the high temperature protection circuit that prevents thermal reckless driving under an abnormal state for the
temperature of the chip to exceed Tjmax=150℃.
Detecting condition - It will detect when MUTE pin is set High and the temperature of the chip becomes 150℃(TYP.) or
more. The speaker output is muted through a soft-mute when detected.
Releasing condition - It will release when MUTE pin is set High and the temperature of the chip becomes 120℃(TYP.)
or less. The speaker output is outputted through a soft-start when released.
2) Under voltage protection
This IC has the under voltage protection circuit that make speaker output mute once detecting extreme drop of the power
supply voltage.
Detecting condition – It will detect when MUTE pin is set High and the power supply voltage becomes lower than 8V.
The speaker output is muted through a soft-mute when detected.
Releasing condition – It will release when MUTE pin is set High and the power supply voltage becomes more than 9V.
The speaker output is outputted through a soft-start when released.
3) Clock stop protection
This IC has the clock stop protection circuit that make the speaker output mute when the SYS_CLK signal of the digital
audio input stops.
Detecting condition - It will detect when MUTE pin is set High and the SYS_CLK signal stops for about 1usec or more.
The speaker output is muted through a soft-mute when detected.
Releasing condition - It will release when MUTE pin is set High and the SYS_CLK signal returns to the normal clock
operation. The speaker output is outputted through a soft-start when released.
4)Output short protection(Short to the power supply)
This IC has the PWM output short protection circuit that stops the PWM output when the PWM output is short-circuited to
the power supply due to abnormality.
Detecting condition - It will detect when MUTE pin is set High and the current that flows in the PWM output pin
becomes 10A(TYP.) or more. The PWM output instantaneously enters the state of HiZ-Low if
detected, and IC does the latch.
Releasing method - ①After the MUTEX pin is set Low once, the MUTEX pin is set High again.
5) Output short protection(Short to GND)
This IC has the PWM output short protection circuit that stops the PWM output when the PWM output is short-circuited to
GND due to abnormality.
Detecting condition - It will detect when MUTE pin is set High and the current that flows in the PWM output terminal
becomes 10A(TYP.) or more. The PWM output instantaneously enters the state of HiZ-Low if
detected, and IC does the latch.
Releasing method – ①After the MUTEX pin is set Low once, the MUTEX pin is set High again.
6) DC voltage protection in the speaker
When the DC voltage in the speaker is impressed due to abnormality, this IC has the protection circuit where the speaker
is defended from destruction.
Detecting condition - It will detect when MUTE pin is set High or Low and PWM output Duty=0% or 100% ,
43msec(fs=48kHz) or above. Once detected, The PWM output instantaneously enters the state
of HiZ-Low, and IC does the latch.
Releasing method – ①After the MUTEX pin is set Low once, the MUTEX pin is set High again.
②Turning on the power supply again
PWM out locked duty=100% abnormal state.
Abnormal state release.
OUT1P (50, 51pin)
OUT1N (43, 44pin)
OUT2P (31, 32pin)
OUT2N (38, 39pin)
Speaker output
PWM output : IC latche with HiZ-Low.
Latch release state.
ERROR (24pin)
Protection start surge current
into speaker output for 43msec
(fs=48kHz) and over.
This IC is provided with an output power limiter function to protect speakers from destruction by an excessive output.
Limiter values are freely specified by changing external resistors R1/R2 as shown in Fig-26. Fig-27 shows a speaker output
waveform that is generated with use of the output limiter function. Because the waveform is soft-clipped, unusual noises on
audible signals are significantly reduced under operation of limiter.
Use resistors with a high degree of accuracy for R1 and R2 (±1% or higher accuracy is recommended). The capacitor C is
for the noise removal of output power limitation terminal (3pin). Provide grounding with a 1µF capacitor. Specify a resistor of
10kΩ or higher resistor R1 and R2. If the output power limiter function is not used, R1, R2 and C is unnecessary. However,
connect 3pin with GNDA.
An output filter is required to eliminate radio-frequency components exceeding the audio-frequency region supplied to a
load (speaker). Because this IC uses sampling clock frequencies from 200kHz to 400kHz in the output PWM signals, the
high-frequency components must be appropriately removed.
This section takes an example of an LC type LPF shown in Fig.29, in which coil L and capacitor C compose a differential
filter with an attenuation property of -12dB/oct. A large part of switching currents flow to capacitor C, and only a small part
of the currents flow to speaker R
. This filter reduces unwanted emission this way. In addition, coil L and capacitor Cg
L
compose a filter against in-phase components, reducing unwanted emission further.
Filter constants depend on load impedances. The following are formulas to calculate values of L, C, and Cg when Q=0.707
is specified.
4 8 , 4 9
o
3 8 , 3 9
4 5 , 4 6
3 3 , 3 4
L
g
C
C
Cg
L
R
L
Cg = 0 . 2 CF
L =
C =
RL2
H
4 π
C
1
2 π f C R L2
F
Fig. 29
R
: Load impedance (Ω)
L
: LPF cut off frequency (Hz)
f
C
Following presents output LC filter constants with typical load impedances.
Use coils with a low direct-current resistance and with a sufficient margin of allowable currents. A high direct-current
resistance causes power losses. In addition, select a closed magnetic circuit type product in normal cases to prevent
unwanted emission.
Use capacitors with a low equivalent series resistance, and good impedance characteristics at high frequency ranges
(100kHz or higher). Also, select an item with sufficient withstand voltage because flowing massive amount of
high-frequency currents is expected.
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a
special mode where the absolute maximum ratings may be exceeded is anticipated.
2 ) Power supply lines
As return of current regenerated by back EMF of output coil happens, take steps such as putting capacitor between
power supply and GND as a electric pathway for the regenerated current. Be sure that there is no problem with each
property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the
connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage
on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute
maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp
diode between the power supply and GND pins.
3 ) GND potential(Pin 6, 36, 37, 45, 46).
Any state must become the lowest voltage about GND terminal and VSS terminal.
4 ) Input terminal
The parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes the
wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by impressing
to input terminals lower voltage than GND and VSS. Please do not apply the voltage to the input terminal when the
power-supply voltage is not impressed.
5 ) Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat
dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation
pattern not only on the board surface but also the backside.
Class D speaker amplifier is high efficiency and low heat generation by comparison with conventional Analog power
amplifier. However, In case it is operated continuously by maximum output power, Power dissipation (Pdiss) may exceed
package dissipation. Please consider about heat design that Power dissipation (Pdiss) does not exceed Package
dissipation (Pd) in average power (Poav). (Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃], θja : Thermal resistance of package[℃/W], Poav : Average power[W], η : Efficiency)
Package dissipation : Pd(W)=(Tjmax - Ta)/θja
Power dissipation : Pdiss(W)= Poav ×(1/η- 1)
6 ) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
Technical Note
7 ) Thermal shutdown circuit
This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output
transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the IC avoiding
thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = 150℃.
8 ) Shorts between pins and misinstallation
When mounting the IC on a board, pay adequate attention to orientation and placement discrepancies of the IC. If it is
misinstalled and the power is turned on, the IC may be damaged. It also may be damaged if it is shorted by a foreign
substance coming between pins of the IC or between a pin and a power supply or a pin and a GND.
9 ) Power supply on/off (Pin 25, 28, 29, 53, 54)
In case power supply is started up, RESETX(Pin 12), MUTEX(Pin 13) and PDX (Pin 14) always should be set Low. And
in case power supply is shut down, it should be set Low likewise. Then it is possible to eliminate pop noise when power
supply is turned on/off. And also, all power supply terminals should start up and shut down together.
10 ) ERROR terminal(Pin 24)
error flag is outputted when Output short protection and DC voltage protection in the speaker are operated. These flags
A
are the function which the condition of this product is shown in.
N.C. terminal (Non Connection Pin) does not connect to the inside circuit. Therefore, possible to use open.
12 ) TEST terminal(Pin 19, 20)
TEST terminal connects with ground to prevent the malfunction by external noise.
13 ) Precautions for Spealer-setting
If the impedance characteristics of the speakers at high-frequency range while increase rapidly, the IC might not have
stable-operation in the resonance frequency range of the LC-filter. Therefore, consider adding damping-circuit, etc.,
depending on the impedance of the speaker.
Measuring instrument : TH-156(Shibukawa Kuwano Electrical Instruments Co., Ltd.)
Measuring conditions : Installation on ROHM’s board
Board size : 70mm×70mm×1.6mm(with thermal via on board)
Material : FR4
・The board on exposed heat sink on the back of package are connected by soldering.
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consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
Notice
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
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