ROHM BD5240FVE Technical data

Voltage Detector IC Series

Free Delay Time Setting CMOS Voltage Detector IC Series

Datasheet

BD52xx series BD53xx series

●General Description

ROHM’s BD52xx and BD53xx series are highly accurate, low current consumption reset IC series with a built-in delay circuit. The lineup was established with tow output types (Nch open drain and CMOS output) and detection voltages range from 2.3V to 6.0V in increments of 0.1V, so that the series may be selected according the application at hand.

●Features

 Free delay time setting by external capacitor  Two output types (Nch open drain and CMOS output)  Ultra-low current consumption  Very small and low height package

●Ty pical A pplication Circuit

VDD1

●Connection Diagram SSOP5 VSOF5

TOP VIEW

●Pin Descriptions

PIN No. Symbol Function PIN No. Symbol Function

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

TSZ22111･14･001

Marking

1 VOUT Reset Output 1 VOUT Reset Output 2 VDD Power Supply Voltage 2 SUB Substrate*

3 GND GND 3 CT

4 N.C. Unconnected Terminal 4 GND GND

5 CT

1/10

BD52xx

Open Drain Output type

BD52xx Series

VOUT VDD GND

Micro

RST

controller

(Capacitor for noise filtering)

N.C. C

Lot. No

SSOP5 VSOF5

Capacitor connection terminal for

output delay time

VDD2

GND

●Key Specifications

 Detection voltage: 2.3V to 6.0V (Typ.)

0.1V steps

 High accuracy detection voltage: ±1.0%  Ultra-low current consumption: 0.95µA (Typ.)

●Package

SSOP5: 2.90mm x 2.80mm x 1.15mm VSOF5: 1.60mm x 1.60mm x 0.60mm

●Applications

All electronic devices that use micro controllers and logic circuits

VDD1

GND

CMOS Output type

TOP VIEW

Marking

VOUT SUB CT

Capacitor connection terminal for

5 V

*Connect the substrate to GND.

DD Power Supply Voltage

BD53xx

BD53xx Series

GND

VDD

output delay time

(Capacitor for noise filtering)

Lot. No

TSZ02201-0R7R0G300040-1-2

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RST

Micro controller

BD52xx series BD53xx series

Datasheet

●Ordering Information

B D 5 2 2 3 G － T R

BD52: Adjustable Delay Time Reset Voltage Value Package Packaging and forming specification

CMOS Reset IC 23: 2.3V to (0.1V step) G: SSOP5 TR: Embossed tape and reel Open Drain Type 60: 6.0V FVE: VSOF5

BD53: Adjustable Delay Time

CMOS Reset IC CMOS Output Type

●Lineup

Marking

PW 6.0V BD5260 PB 4.1V BD5241 RW 6.0V BD5360 RB 4.1V BD5341

PV 5.9V BD5259 PA 4.0V BD5240 RV 5.9V BD5359 RA 4.0V BD5340 PU 5.8V BD5258 MV 3.9V BD5239 RU 5.8V BD5358 QV 3.9V BD5339 PT 5.7V BD5257 MU 3.8V BD5238 RT 5.7V BD5357 QU 3.8V BD5338 PS 5.6V BD5256 MT 3.7V BD5237 RS 5.6V BD5356 QT 3.7V BD5337 PR 5.5V BD5255 MS 3.6V BD5236 RR 5.5V BD5355 QS 3.6V BD5336 PQ 5.4V BD5254 MR 3.5V BD5235 RQ 5.4V BD5354 QR 3.5V BD5335

PP 5.3V BD5253 MQ 3.4V BD5234 RP 5.3V BD5353 QQ 3.4V BD5334 PN 5.2V BD5252 MP 3.3V BD5233 RN 5.2V BD5352 QP 3.3V BD5333 PM 5.1V BD5251 MN 3.2V BD5232 RM 5.1V BD5351 QN 3.2V BD5332

PL 5.0V BD5250 MM 3.1V BD5231 RL 5.0V BD5350 QM 3.1V BD5331

PK 4.9V BD5249 ML 3.0V BD5230 RK 4.9V BD5349 QL 3.0V BD5330

PJ 4.8V BD5248 MK 2.9V BD5229 RJ 4.8V BD5348 QK 2.9V BD5329 PH 4.7V BD5247 MJ 2.8V BD5228 RH 4.7V BD5347 QJ 2.8V BD5328 PG 4.6V BD5246 MH 2.7V BD5227 RG 4.6V BD5346 QH 2.7V BD5327

PF 4.5V BD5245 MG 2.6V BD5226 RF 4.5V BD5345 QG 2.6V BD5326

PE 4.4V BD5244 MF 2.5V BD5225 RE 4.4V BD5344 QF 2.5V BD5325 PD 4.3V BD5243 ME 2.4V BD5224 RD 4.3V BD5343 QE 2.4V BD5324 PC 4.2V BD5242 MD 2.3V BD5223 RC 4.2V BD5342 QD 2.3V BD5323

SSOP5

1.25Max.

VSOF5

1.6± 0.05

0.6MAX

Detection

Voltage

+0.2

−0.1

2.8±0.2

1.6

1.1±0.05

0.05±0.05

1.6± 0.05

1.0± 0.05

1.2± 0.05

(MAX 1.28 include BURR)

0.5

Part

Number

2.9±0.2

0.95

Marking

0.22± 0.05

0.42

0.1

−4

0.13

+0.05

−0.04

(Unit : mm)

0.13± 0.05

(Unit : mm)

Detection

Voltage

° °

+0.05

−0.03

0.2MAX

0.2Min.

Embossed carrier tapeTape

Quantity

Direction of feed

Part

Number

3000pcs TR

The direction is the 1pin of product is at the upper right when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

Marking

Detection

Voltage

1pin

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

∗

Part

Number

Marking

Detection

Voltage

Number

Part

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z Absolute maximum ratings (Ta=25°C)

Parameter Symbol Limits Unit

Power Supply Voltage VDD-GND -0.3 ~ +10 V

Output Voltage

Dissipation

Nch Open Drain Output GND-0.3 ~ +10

CMOS Output

SSOP5

VSOF5

*1*3

*2*3

OUT

540 Power

GND-0.3 ~ V

210

+0.3

Operating Temperature Topr -40 ~ +105 °C

Ambient Storage Temperature Tstg -55 ~ +125 °C

*1 Use above Ta=25°C results in a 5.4mW loss per degree. *2 Use above Ta=25°C results in a 2.1mW loss per degree. *3 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted.

●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)

Parameter Symbol Condition

Detection Voltage V

VDD=HÆL, RL=470k

DET

Circuit Current when ON IDD1 VDD=VDET-0.2V

Circuit Current when OFF IDD2 VDD=VDET+2.0V

Operating Voltage Range VOPL

‘Low’ Output Current (Nch) IOL

VOL0.4V, Ta=25~105°C, RL=470k 0.95 - -

OL0.4V, Ta=-40~25°C, RL=470k 1.20 - -

VDS=0.5V VDD=1.2V 0.4 1.2 -

DS=0.5V VDD=2.4V 2.0 5.0 -

Min. Typ. Max.

DET(T)

×0.99

=2.3-3.1V - 0.80 2.40

DET

=3.2-4.2V - 0.85 2.55

DET

=4.3-5.2V - 0.90 2.70

DET

=5.3-6.0V - 0.95 2.85

DET

=2.3-3.1V - 0.75 2.25

DET

=3.2-4.2V - 0.80 2.40

DET

=4.3-5.2V - 0.85 2.55

DET

=5.3-6.0V - 0.90 2.70

DET

Limit

DET(T)

VDS=0.5V VDD=4.8V VDET=2.3-4.2V 0.7 1.4 -

‘High’ Output Current (Pch) IOH

VDS=0.5V VDD=6.0V VDET=4.3-5.2V 0.9 1.8 -

VDS=0.5V VDD=8.0V VDET=5.3-6.0V 1.1 2.2 -

Leak Current when OFF I

VDD=VDS=10V

leak

VDD=VDET×1.1, VDET=2.3-2.6V, RL=470k

VDD=VDET×1.1, VDET=2.7-4.2V, RL=470k

CT pin Threshold Voltage VCTH

VDD=VDET×1.1, VDET=4.3-5.2V, RL=470k

DD=VDET×1.1, VDET=5.3-6.0V, RL=470k

Output Delay Resistance RCT VDD=VDET×1.1 VCT=0.5V

CT pin Output Current ICT

Detection Voltage Temperature coefficient

VDET/T Ta=-40°C to 105°C - ±100 ±360 ppm/°C

VCT=0.1V VDD=0.95V

CT=0.5V VDD=1.5V 150 240 -

Hysteresis Voltage  VDET VDD=LÆHÆL, RL=470k

- - 0.1 µA

×0.30

VDD

×0.30

VDD

×0.35

VDD

×0.40

5.5 9 12.5 M

15 40 -

VDET

×0.03

VDD

×0.40

VDD

×0.45

VDD

×0.50

VDD

×0.50

VDET

×0.05

VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. Designed Guarantee. (Outgoing inspection is not done on all products.) *1 Guarantee is Ta=25°C.

Datasheet

DET(T)

×1.01

VDD

×0.60

VDD

×0.60

VDD

×0.60

VDD

×0.60

VDET

×0.08

Unit

µA

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BD52xx series BD53xx series

●Block Diagrams

Vref

VDD

Vref

VDD

GND

Fig.1 BD52xx Series

GND

Fig.2 BD53xx Series

Datasheet

OUT

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●Typical Performance Curves

Datasheet

2.0

[A]

1.5

：

1.0

0.5

CIRCUIT CURRENT

0.0 0123 456 78 910

SUPPLY VOLTAGE ：VDD[V]

Fig.3 Circuit Current

BD5242G/FVE

【

【BD5242】

【BD5342】

】

BD5242G/F VE

【

[mA]

：

【BD5242】

【BD5342】

VDD=2.4V

"LOW" OUTPUT CURRENT

VDD=1.2V

0.0 0.5 1.0 1.5 2.0 2.5

DRAIN-SOURCE VOLTAGE ： V

Fig.4 “Low” Output Current

】

[V]

BD5342G/F VE

【

[mA]

：

【BD5342】

VDD=8.0V

"HIGH" OUTPUT CURRENT

VDD=6.0V

VDD=4.8V

0123456

DR AIN- SOUR C E VOLTAGE ： V

Fig.5 “High” Output Current

】

[V]

OUT

：

OUTPUT VOLTAGE

Ta=25

00.5 11.522.533.544.555.5

VDD SUPPLY VOLTAGE ：VDD[V]

Fig.6 I/O Characteristics

℃

BD5242G/FVE

【

【BD5242】

【BD5342】

Ta=25

℃

】

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Datasheet

1.0

BD5242G/FVE

【

[V]

OUT

：

0.8

【BD5242】

【BD5342】

0.6

0.4

0.2

OUTPUT VOLTAGE

0.0

0.0 0.5 1.0 1.5 2.0 2.5

SUPPLY VOLTAGE ： VDD[V]

Fig.7 Operating Limit Voltage

】

[A]

：

CT OUTPUT CURRENT

450

400

350

【

【BD5242】

【BD5342】

】

BD5242G/F VE

300

250

200

150

100

012345

SUPPLY VOLTAGE ： VDD[V]

Fig.8 CT Terminal Current

5.6

BD5242G/F VE

【BD5242】

[V]

5.2

DET

：

4.8

Low to hig h(V

【

【BD5342】

DET

4.4

4.0

High to low(V

3.6

～～

DETECTION VOLTAGE

3.2

-40 0 40 80

TEMPERATURE ： Ta[℃]

Fig.9 Detection Voltage

Release Voltage

+ΔV

DET

1.5

】

)

[A]

DD1

：

1.0

【BD5242】

BD5242G/FVE

【

【BD5342】

】

0.5

)

0.0

CIRCUIT CURRENT WHEN ON

-40 - 20 0 20 40 60 80 100

TEM PERATURE ： Ta[℃]

Fig.10 Circuit Current when ON

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BD52xx series BD53xx series

Datasheet

1.5

【BD5242】

BD5242G/FVE

[A]

DD2

：

【

【BD5342】

1.0

0.5

CIRCUIT CURRENT WHEN OFF

0.0

-40 - 20 0 20 40 60 80 100

TEM PERATURE ： Ta[℃]

Fig.11 Circuit Current when OFF

】

1.5

BD5242G/FVE

【BD5242】

[V]

OPL

：

【

【BD5342】

1.0

0.5

MINIMUM OPERATING VOLTAGE

0.0

-40-20020406080100

TEM PERATU RE ： Ta[℃]

Fig.12 Operating Limit Voltage

】

【BD5242】

BD5242G/FVE

【

【BD5342】

：

[M]

RESISTAN C E OF C

-40 - 20 0 20 40 60 80 100

TEMPERATURE ： Ta[℃]

Fig.13 CT Terminal Circuit Resistance

】

10000

BD5242G/F VE

【

【BD5242】

1000

[ms]

PLH

100

：

DELAY T IM E

0.1

0.0001 0.001 0.01 0.1

CAPAC IT ANCE OF C

Fig.14 Delay Time (t

Terminal External Capacitance

【BD5342】

： CCT[F]

PLH

】

) and

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Datasheet

●Application Information Explanation of Operation

For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the V

pins reaches the applicable threshold voltage, the V

OUT

voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD52xx series uses an open drain output type, it is possible to connect a pull-up resistor to V becomes V

or the voltage of the other power supply].

Vref

GND

or another power supply [The output “High” voltage (V

VDD

Vref

GND

RESET

OUT

) in this case

OUT

Fig.15 (BD52xxType Internal Block Diagram) Fig.16 (BD53xxType Internal Block Diagram)

Setting of Detector Delay Time

This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal. Delay time at the rise of V

+V

voltage(V

DET

)

= -CCT×RCT×ln

PLH

: CT pin Externally Attached Capacitance R

: CT pin Threshold Voltage（P.2 V CTH refer.） ln : Natural Logarithm

CTH

：Time until when Vout rise to 1/2 of V

DD tPLH

VDD-V

CTH

after VDD rise up and beyond the release

: CT pin Internal Impedance （P.2 RCT refer.）

Reference Data of Falling Time (t

Examples of Falling Time (t

Part Number t

) Output

PHL

) Output

PHL

[µs] -40°C t

PHL

[µs] ,+25°C t

PHL

[µs],+105°C

PHL

BD5227 30.8 30 28.8

BD5327 26.8 26 24.8

*This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

Timing Waveforms

Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output

VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in

voltage Fig.15 and 16).

VDD

VDET+ΔVDET

VDET

VOPL

1/2 VDD

⑤

When the power supply is turned on, the output is unsettled from

after over the operating limit voltage (V

OPL) until tPHL. There fore it is

possible that the reset signal is not outputted when the rise time of V

is faster than tPHL.

When VDD is greater than VOPL but less than the reset release

voltage (V

DET+VDET), the C

terminal (VCT) and output (VOUT)

voltages will switch to L.

If VDD exceeds the reset release voltage (VDET+VDET), then

OUT switches from L to H (with a delay to the C

If VDD drops below the detection voltage (VDET) when the power

terminal).

supply is powered down or when there is a power supply fluctuation, V

VOUT

tPHL

tPLH

tPHL

OUT switches to L (with a delay of tPHL).

The potential difference between the detection voltage and the

release voltage is known as the hysteresis width (V

DET). The

system is designed such that the output does not flip-flop with power

①

② ③ ④

Fig.17 Timing Waveform

supply fluctuations within this hysteresis width, preventing malfunctions due to noise

terminal

RESET

OUT

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Circuit Applications

●Examples of a common power supply detection reset circuit

VDD1

Micro

BD52xx

RST

（Noise-filtering

Capacitor）

controller

Fig.18 Open Drain Output Type

VDD1

BD53xx

RST

（Noise-filtering

Capacitor）

GND

Fig.19 CMOS Output Type

VDD2

GND

Micro controller

Datasheet

Application examples of BD52xx series (Open Drain output type) and BD53xx series (CMOS output type) are shown below.

CASE1: the power supply of the microcontroller (V differs from the power supply of the reset detection (V Use the open drain output type (BD52xx) attached a load resistance (R

) between the output and V

. (As shown

DD2

Fig.15)

CASE2: the power supply of the microcontroller (V same as the power supply of the reset detection (V Use CMOS output type (BD53xx) or open drain output type (BD52xx) attached a load resistance (R the output and V

. (As shown Fig.16)

DD1

) between

When a capacitance C the V

pin (the reset signal input terminal of the

OUT

for noise filtering is connected to

microcontroller), please take into account the waveform of the rise and fall of the output voltage (V

OUT

DD1

DD2

) is

)

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Datasheet

●Operational Notes

1 . Absolute maximum range

Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered.

2 . GND potential

GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if, include transient feature.

3 . Electrical Characteristics

Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature, supply voltage, and external circuit.

4 . Bypass Capacitor for Noise Rejection

Please put into the capacitor of 1µF or more between V

pin and GND, and the capacitor of about 1000pF between V

OUT

and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point.

5 . Short Circuit between Terminal and Soldering

Don’t short-circuit between Output pin and V

pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the

IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed.

6 . Electromagnetic Field

Mal-function may happen when the device is used in the strong electromagnetic field.

7 . The V

8. A V

9 . Lower than the mininum input voltage makes the V

line inpedance might cause oscillation because of the detection current.

-GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

OUT high impedance, and it must be VDD in pull up (VDD) condition.

10. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the V resistance. If 10M leakage is assumed between the C terminal and the V connected to C

terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak

OUT

terminal and the GND terminal, 1M connection between the CT

DD terminal would be recommended. The value of RCT depends on the external resistor that is

terminal, so please consider the delay time that is decided by ×RCT×C

changes.

11. External parameters The recommended parameter range for C

T is 100pF~0.1µF and RL is 50k~1M. There are many factors (board layout,

etc) that can affect characteristics. Please verify and confirm using practical applications.

12. Power on reset operation Please note that the power on reset output varies with the V

rise up time. Please verify the actual operation.

13. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.

14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered.

Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority.

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Datasheet

Notice

●Precaution for circuit design

1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA

equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following:

[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure

2) The products are designed for use in a standard environment and not in any special environments. Application of the

products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions:

[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl

and NO [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in proximity to heat-producing components, plastic cords, or other flammable items [f] Use involving sealing or coating the products with resin or other coating materials [g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] Use of the products in places subject to dew condensation

2, H2S, NH3, SO2,

3) The products are not radiation resistant.

4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised.

5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability.

6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature.

7) Confirm that operation temperature is within the specified range described in product specification.

8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed.

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the Company in advance.

Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics.

2) The application examples, their constants, and other types of information contained herein are applicable only when the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made.

Notice - Rev.001

Datasheet

●Precaution for Electrostatic

This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the products are stored in the following places:

[a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] Where the temperature or humidity exceeds those recommended by the Company [c] Storage in direct sunshine or condensation [d] Storage in high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is exceeding recommended storage time period .

3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton.

4) Use products within the specified time after opening a dry bag.

●Precaution for product label

QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a internal part number that is inconsistent with an product part number.

●Precaution for disposition

When disposing products please dispose them properly with a industry waste company.

●Precaution for Foreign exchange and Foreign trade act

Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export.

●Prohibitions Regarding Industrial Property

1) Information and data on products, including application examples, contained in these specifications are simply for reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for:

[a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein.

2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use, sell, or dispose of the products.

Datasheet

Notice - Rev.001

ROHM BD5240FVE Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual