ROHM BD4823FVE, BD4823G, BD4824FVE, BD4824G, BD4825FVE Schematic [ru]

2

22.May.2013.Rev.008

www.rohm.com

Datasheet

DD1

ST

Capacitor for

Capacitor for

noise filtering

V

DD1

controller

Voltage Detector IC Series

Standard CMOS
Voltage Detector IC

BD48xxx series BD49xxx series

●General Description

ROHM’s BD48xxx and BD49xxx series are highly
accurate, low-current Voltage Detector IC series. The
family includes BD48xxx devices with N-channel open
drain output and BD49xxx devices with CMOS output.
The devices are available for specific detection voltages
ranging from 2.3V to 6.0V in increments of 0.1V.

●Features

 High accuracy detection
 Ultra-low current consumption
 Two output types (Nch open drain and CMOS output)
 Wide Operating temperature range
 Very small and low height package
 Package SSOP5 is similar to SOT-23-5 (JEDEC)
 Package SSOP3 is similar to SOT-23-3 (JEDEC)

●Key Specifications

 Detection voltage: 2.3V to 6.0V (Typ.),

0.1V steps

 High accuracy detection voltage: ±1.0%
 Ultra-low current consumption: 0.9µA (Typ.)

 Operating temperature range: -40°C to +105°C

●Package
SSOP5: 2.90mm x 2.80mm x 1.25mm

SSOP3: 2.92mm x 2.80mm x 1.25mm

VSOF5: 1.60 mm x 1.60mm x 0.60mm

●Applications

Circuits using microcontrollers or logic circuits that
require a reset.

●Typical Application Circuit

V

BD48xxx

(Open Drain Output type）

BD48xxx series

RL

R

L

C

(

noise filtering

Micro
controller

）

DD2

V

GND

GND

Micro

BD49xxx

(CMOS Output type）

BD49xxx series

CL

(

RST

）

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
.

© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001

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TSZ02201-0R7R0G300030-1-

Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

TOP VIEW

V

OUT

SUB

N.C

VDD

GND

TOP VIEW

V

OUT

VDD

GND N.C. N.C.

1 2

3

1 2

3

Blank

G

SSOP5

●Connection Diagram
SSOP5

VSOF5

4

5

Marking

●Pin Descriptions

SSOP5 VSOF5

PIN No. Symbol Function PIN No. Symbol Function

SSOP3(1pin GND) SSOP3(3pin GND)

●Pin Descriptions

SSOP3-1 SSOP3-2

 Ordering Information

Part Output Type Package1 Reset Voltage Value Package2 Packaging and
Number 48 : Open Drain 23 : 2.3V forming specification

1 VOUT Reset Output 1 VOUT Reset Output
2 VDD Power Supply Voltage 2 SUB Substrate*
3 GND GND
4 N.C. Unconnected Terminal 4 GND GND
5 N.C.

*Connect the substrate to GND.

Marking

GND

PIN No. Symbol Function PIN No. Symbol Function

1 GND GND 1 VOUT Reset Output
2 VOUT Reset Output 2 VDD Power Supply Voltage
3

Note: When ordering new SSOP5, select “E” for Package 1 and “G” for Package 2.

VDD Power Supply Voltage 3 GND GND

49 : CMOS 0.1V step Embossed tape and reel

Unconnected Terminal 5 VDD Power Supply Voltage

VDD

VOUT

TOP VIEW

Lot. No

Lot. No

60 : 6.0V TR :The pin number 1is

Package1 Package2 Package name the upper left
E G SSOP5 :SSOP3-1
K G SSOP3(1pin GND) :SSOP3-2
L G SSOP3(3pin GND)
Blank FVE VSOF5

Marking

3 N.C.

Marking

1

GND

VOUT

TOP VIEW

3

2

Unconnected Terminal

VDD

:SSOP5
:VSOF5
TL :The pin number 1is

Lot. No

Lot. No

the upper right

Rx x x xB D x x - T

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TSZ02201-0R7R0G300030-1-

Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

(Unit : mm)

SSOP5

2.9±0.2

0.13

4

°

+

6

°

−4

°

1.6

2.8±0.2

1.1±0.05

0.05±0.05

+0.2

−0.1

+0.05

−0.03

0.42

+0.05

−0.04

0.95

5

4

1 2

3

1.25Max.

0.2Min.

0.1

Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

<Tape and Reel information>

Embossed carrier tapeTape

Quantity

Direction
of feed

The direction is the 1

pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs
TR

( )

1pin

(Unit : mm)

VSOF5

1.2±0.05

4

3

1.0±0.05

1

0.6MAX

0.22±0.05

0.5

5

1.6±0.05

0.13±0.05

0.2MAX

2

1.6±0.05

(MAX 1.28 include BURR)

SSOP3

3

±

0.15

12

1.9±0.1 0.4±0.1

© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001

2.92±0.1

±0.1

±0.15

±0.05

4°±4°

3/15

L

TSZ02201-0R7R0G300030-1-

Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

Detection

●Lineup
Table 1. Lineup for VSOF5 and SSOP5 Package

Package Type

Output Type Open Drain CMOS Open Drain CMOS

VSOF5 or SSOP5 SSOP5

Voltage

6.0V

5.9V

5.8V

5.7V

5.6V

5.5V

5.4V

5.3V

5.2V

5.1V

5.0V

4.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

Marking

EW BD4860 GW BD4960 Cm BD48E60 Ff BD49E60

EV BD4859 GV BD4959 Ck BD48E59 Fe BD49E59
EU BD4858 GU BD4958 Ch BD48E58 Fd BD49E58
ET BD4857 GT BD4957 Cg BD48E57 Fc BD49E57
ES BD4856 GS BD4956 Cf BD48E56 Fb BD49E56
ER BD4855 GR BD4955 Ce BD48E55 Fa BD49E55
EQ BD4854 GQ BD4954 Cd BD48E54 Ey BD49E54
EP BD4853 GP BD4953 Cc BD48E53 Er BD49E53
EN BD4852 GN BD4952 Cb BD48E52 Ep BD49E52

EM BD4851 GM BD4951 Ca BD48E51 En BD49E51

EL BD4850 GL BD4950 By BD48E50 Em BD49E50
EK BD4849 GK BD4949 Br BD48E49 Ek BD49E49

EJ BD4848 GJ BD4948 Bp BD48E48 Eh BD49E48
EH BD4847 GH BD4947 Bn BD48E47 Eg BD49E47
EG BD4846 GG BD4946 Bm BD48E46 Ef BD49E46
EF BD4845 GF BD4945 Bk BD48E45 Ee BD49E45
EE BD4844 GE BD4944 Bh BD48E44 Ed BD49E44
ED BD4843 GD BD4943 Bg BD48E43 Ec BD49E43
EC BD4842 GC BD4942 Bf BD48E42 Eb BD49E42
EB BD4841 GB BD4941 Be BD48E41 Ea BD49E41
EA BD4840 GA BD4940 Bd BD48E40 Dy BD49E40
DV BD4839 FV BD4939 Bc BD48E39 Dr BD49E39
DU BD4838 FU BD4938 Bb BD48E38 Dp BD49E38
DT BD4837 FT BD4937 Ba BD48E37 Dn BD49E37
DS BD4836 FS BD4936 Ay BD48E36 Dm BD49E36
DR BD4835 FR BD4935 Ar BD48E35 Dk BD49E35

DQ BD4834 FQ BD4934 Ap BD48E34 Dh BD49E34

DP BD4833 FP BD4933 An BD48E33 Dg BD49E33
DN BD4832 FN BD4932 Am BD48E32 Df BD49E32

DM BD4831 FM BD4931 Ak BD48E31 De BD49E31

DL BD4830 FL BD4930 Ah BD48E30 Dd BD49E30
DK BD4829 FK BD4929 Ag BD48E29 Dc BD49E29
DJ BD4828 FJ BD4928 Af BD48E28 Db BD49E28
DH BD4827 FH BD4927 Ae BD48E27 Da BD49E27

DG BD4826 FG BD4926 Ad BD48E26 Cy BD49E26

DF BD4825 FF BD4925 Ac BD48E25 Cr BD49E25
DE BD4824 FE BD4924 Ab BD48E24 Cp BD49E24
DD BD4823 FD BD4923 Aa BD48E23 Cn BD49E23

Part Number

Marking

Part Number

Marking

Part Number

Marking

Part Number

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TSZ02201-0R7R0G300030-1-

Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

Detection

●

●Lineup - continued

●●

Table 2. Lineup for SSOF3(1pin GND) and SSOP3(3pin GND) Package
Package Type

Output Type Open Drain CMOS Open Drain CMOS

SSOP3(1pin GND) SSOP3(3pin GND)

Voltage

6.0V

5.9V

5.8V

5.7V

5.6V

5.5V

5.4V

5.3V

5.2V

5.1V

5.0V

4.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

Marking

Cm

Ck
Ch
Cg

Cf
Ce
Cd
Cc
Cb
Ca

By

Br
Bp
Bn

Bm

Bk
Bh
Bg

Bf
Be
Bd

Bc
Bb
Ba

Ay

Ar
Ap
An

Am

Ak
Ah
Ag

Af
Ae
Ad

Ac
Ab
Aa

Part Number

BD48K60
BD48K59
BD48K58
BD48K57
BD48K56
BD48K55
BD48K54
BD48K53
BD48K52
BD48K51
BD48K50
BD48K49
BD48K48
BD48K47
BD48K46
BD48K45
BD48K44
BD48K43
BD48K42
BD48K41
BD48K40
BD48K39
BD48K38
BD48K37
BD48K36
BD48K35
BD48K34
BD48K33
BD48K32
BD48K31
BD48K30
BD48K29
BD48K28
BD48K27
BD48K26
BD48K25
BD48K24
BD48K23

Marking

Ff
Fe
Fd
Fc
Fb
Fa
Ey

Er
Ep
En

Em

Ek
Eh
Eg

Ef
Ee
Ed
Ec
Eb
Ea
Dy
Dr
Dp
Dn

Dm

Dk
Dh
Dg

Df
De
Dd
Dc
Db
Da
Cy
Cr
Cp
Cn

Part Number

BD49K60
BD49K59
BD49K58
BD49K57
BD49K56
BD49K55
BD49K54
BD49K53
BD49K52
BD49K51
BD49K50
BD49K49
BD49K48
BD49K47
BD49K46
BD49K45
BD49K44
BD49K43
BD49K42
BD49K41
BD49K40
BD49K39
BD49K38
BD49K37
BD49K36
BD49K35
BD49K34
BD49K33
BD49K32
BD49K31
BD49K30
BD49K29
BD49K28
BD49K27
BD49K26
BD49K25
BD49K24
BD49K23

Marking

Kb
Ka
Hy

Hr
Hp
Hn

Hm

Hk
Hh
Hg

Hf
He
Hd
Hc
Hb
Ha
Gy
Gr
Gp
Gn

Gm

Gk
Gh
Gg

Gf
Ge
Gd
Gc
Gb
Ga
Fy

Fr
Fp
Fn

Fm

Fk
Fh
Fg

Part Number

BD48L60
BD48L59
BD48L58
BD48L57
BD48L56
BD48L55
BD48L54
BD48L53
BD48L52
BD48L51
BD48L50
BD48L49
BD48L48
BD48L47
BD48L46
BD48L45
BD48L44
BD48L43
BD48L42
BD48L41
BD48L40
BD48L39
BD48L38
BD48L37
BD48L36
BD48L35
BD48L34
BD48L33
BD48L32
BD48L31
BD48L30
BD48L29
BD48L28
BD48L27
BD48L26
BD48L25
BD48L24
BD48L23

Marking

Np
Nn

Nm

Nk
Nh
Ng

Nf
Ne
Nd
Nc
Nb
Na

My

Mr

Mp
Mn

Mm

Mk
Mh
Mg

Mf

Me
Md
Mc
Mb
Ma

Ky

Kr
Kp
Kn

Km

Kk
Kh
Kg

Kf
Ke
Kd
Kc

Part Number

BD49L60
BD49L59
BD49L58
BD49L57
BD49L56
BD49L55
BD49L54
BD49L53
BD49L52
BD49L51
BD49L50
BD49L49
BD49L48
BD49L47
BD49L46
BD49L45
BD49L44
BD49L43
BD49L42
BD49L41
BD49L40
BD49L39
BD49L38
BD49L37
BD49L36
BD49L35
BD49L34
BD49L33
BD49L32
BD49L31
BD49L30
BD49L29
BD49L28
BD49L27
BD49L26
BD49L25
BD49L24
BD49L23

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TSZ22111・15・001

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TSZ02201-0R7R0G300030-1-

Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

●Absolute Maximum Ratings

Parameter Symbol Limits Unit

Power Supply Voltage VDD-GND -0.3 to +10 V
Output Voltage

Nch Open Drain Output
CMOS Output GND-0.3 to VDD+0.3

V

OUT

Output Current Io 70 mA

*1*4
*2*4
*3*4

Pd

Power
Dissipation

SSOP5

VSOF5
Operating Temperature Topr -40 to +105 °C
Ambient Storage Temperature Tstg -55 to +125 °C

*1 Reduced by 5.4mW/°C when used over 25°C.
*2 Reduced by 7.0mW/°C when used over 25°C.
*3 Reduced by 2.1mW/°C when used over 25°C.
*4 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).

●Electrical Characteristics (Unless Otherwise Specified, Ta=-40 to 105°C)

Parameter Symbol Condition

RL=470kΩ, VDD=HL

*1

Ta=+25°C 2.475 2.5 2.525

VDET=2.5V

Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C 2.970 3.0 3.030

VDET=3.0V

Ta=-40°C to 85°C
Ta=85°C to 105°C

Detection Voltage V

DET

VDET=3.3V

Ta=+25°C 3.267 3.3 3.333
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C 4.158 4.2 4.242

VDET=4.2V

Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C 4.752 4.8 4.848

VDET=4.8V

Ta=-40°C to 85°C
Ta=85°C to 105°C

Output Delay Time “LH” tPLH

Circuit Current when ON ICC1 VDD=V

Circuit Current when OFF ICC2 VDD=V

Operating Voltage Range VOPL

V

(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)

DET

CL=100pF RＬ=100kΩ
Vout=GND50%

DET

DET

VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ 0.95 - ­VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ 1.20 - -

-0.2V *1

*1

+2.0V

V

=2.3-3.1V - 0.51 1.53

DET

V

=3.2-4.2V - 0.56 1.68

DET

V

=4.3-5.2V - 0.60 1.80

DET

V

=5.3-6.0V - 0.66 1.98

DET

V

=2.3-3.1V - 0.75 2.25

DET

V

=3.2-4.2V - 0.80 2.40

DET

V

=4.3-5.2V - 0.85 2.55

DET

V

=5.3-6.0V - 0.90 2.70

DET

*2

RL: Pull-up resistor to be connected between VOUT and power supply.
CL: Capacitor to be connected between VOUT and GND.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guaranteed at Ta=25°C.

*2 t

PLH:VDD=(V

typ.-0.5V)(V

DET

typ.+0.5V)

DET

GND-0.3 to +10

540
700
210

Limit

Min. Typ. Max.

V

(T)

DET

×0.99

V

DET

2.418 - 2.584

2.404 - 2.597

2.901 - 3.100

2.885 - 3.117

3.191 - 3.410

3.173 - 3.428

4.061 - 4.341

4.039 - 4.364

4.641 - 4.961

4.616 - 4.987

- - 100 µs

(T)

V

V

mW SSOP3

(T)

DET

×1.01

Unit

V

µA

µA

V

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TSZ22111・15・001

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TSZ02201-0R7R0G300030-1-

Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

●Electrical Characteristics (Unless Otherwise Specified, Ta=-40 to 105°C) - continued

Parameter Symbol Condition

‘Low’Output Voltage (Nch) VOL

‘High’Output Voltage (Pch)
(BD49Exxx Series)

Leak Current when OFF
(BD48xxx Series)
Detection Voltage
Temperature coefficient

V

VOH

I

DET

Hysteresis Voltage ∆V

V

(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)

DET

VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V - - 0.5
VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V - - 0.5
VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V)

VDD=8.0V, ISOURCE=1.1 mA,VDET(5.3V to 6.0V)

VDD=VDS=10V

leak

Ta=-40°C to 105°C

/∆T

(Designed Guarantee)

VDD=LHL, RL=470kΩ V

DET

Min. Typ. Max.

VDD-0.5 - -

VDD-0.5 - -

*1

- - 0.1 µA

- ±100 ±360 ppm/°C

×0.03 V

DET

RL: Pull-up resistor to be connected between VOUT and power supply.
CL: Capacitor to be connected between VOUT and GND.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guaranteed at Ta=25°C.

Limit

×0.05 V

DET

×0.08 V

DET

Unit

V

V VDD=6.0V, ISOURCE=0.9 mA,VDET(4.3V to 5.2V) VDD-0.5 - -

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TSZ02201-0R7R0G300030-1-

Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

V

V

GND

V

●Block Diagrams

Vref

DD

Vref

Fig.1 BD48xxx series

VDD

Fig.2 BD49xxx series

OUT

OUT

GND

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Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

】

℃

●Typical Performance Curves

2.0

【BD48x42】

BD4842G/FVE

【

[µA]

DD

1.5

I

：

1.0

0.5
CIRCUIT CURRENT

0.0

0 1 2 3 4 5 6 7 8 9 10

VDD SUPPLY VOLTAGE ：VDD[V]

Fig.3 Circuit Current

【BD49x42】

45
40

[mA]

OH

I

35

：

BD4942G/FVE

【

【BD49x42】

30
25
20

VDD=8.0V

15
10

5
0

"HIGH" OUTPUT CURRENT

VDD=6.0V

VDD=4.8V

0 1 2 3 4 5 6

DRAIN-SOURCE VOLTAGE ： VDS[V]

20

BD4842G/FVE

【BD48x42】

[mA]

OL

I

：

15

【

【BD49x42】

】

10

VDD=2.4V

5

VDD=1.2V

0

"LOW" OUTPUT CURRENT

0.0 0.5 1.0 1.5 2.0 2.5
DRAIN-SOURCE VOLTAGE ： VDS[V]

Fig.4 “Low” Output Current

9

】

8

[V]

7

OUT

V

：

6

BD4842G/FVE

【BD48x42】

【

【BD49x42】

】

5
4
3

Ta=25

2

OUTPUT VOLTAGE

1

Ta=25

0

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5

℃

VDD SUPPLY VOLTAGE ：VDD[V]

© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001

Fig.5 “High” Output Current

9/15

Fig.6 I/O Characteristics

TSZ02201-0R7R0G300030-1-

Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

V

【

】

】

】

【

】

【

】 【

】

TEMPERATURE

:

～

【

】

●Typical Performance Curves – continued

A]

μ

[

DD1

I

：

1.0

0.8

0.6

0.4

0.2

0.0

1.5

1.0

【BD48x42】

BD4842G/FVE

【BD49x42】

0.5

0

1.5

1

SUPPLY VOLTAGE :

Fig.7 Operating Limit Voltage

BD4842G/FVE

【

【BD48x42】
【BD49x42】

BD48x42x

2

[V]

BD48x42x

2.5

5.4

[V]

DET

5.0

:

4.6

4.2

3.8

3.4

～

3.0

-40 0 40 80

Low to High(V

High to Low(V

Fig.8 Detection Voltage

Release Voltage

1.5

A]

μ

[

DD2

I

：

1.0

BD4842G/FVE

【BD48x42】

BD48x42x

【

【BD49x42】

+∆V

Ta[℃]

BD48x42x

BD4842G/FVE

【

【BD48x42】
【BD49x42】

】

）

）

0.5

0.0

CIRCUIT CURRENT WHEN ON

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TSZ22111・15・001

-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]

Fig.9 Circuit Current when ON

10/15

0.5

0.0

CIRCUIT CURRENT WHEN OFF

-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]

Fig.10 Circuit Current when OFF

TSZ02201-0R7R0G300030-1-

Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

【

】

●Typical Performance Curves – continued

1.5
BD48x42x

BD4842G/FVE

[V]

OPL

V

：

【

【BD48x42】
【BD49x42】

1.0

0.5

MINIMUM OPERATION VOLTAGE

0.0

-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]

】

Fig.11 Operating Limit Voltage

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Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

1

2

3

4

5

②

④

Vref

Vref

●Application Information

Explanation of Operation

For both the open drain type (Fig.12) and the CMOS output type (Fig.13), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the appropriate threshold voltage, the V

OUT

voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical
Characteristics for information on hysteresis.
Because the BD48xxx series uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another
power supply if needed [The output “High” voltage (V

) in this case becomes VDD or the voltage of the other power

OUT

supply].

V

DD

R1

R2

R3

Q1

R

L

V

OUT

GND

R1

R2

R3

Q2

Q1

Fig.12 (BD48xxx series Internal Block Diagram) Fig.13 (BD49xxx series Internal Block Diagram)

Reference Data

Examples of Leading (t

Part Number t

) and Falling (t

PLH

) Output

PHL

(µs) t

PLH

PHL

(µs)
BD48x45 39.5 87.8
BD49x45 32.4 52.4

VDD=4.3V5.1V VDD=5.1V4.3V

*These data are for reference only.

The figures will vary with the application, so please check actual operating conditions before use.

Timing Waveform

Example: the following shows the relationship between the input voltages VDD and the output voltage V

when the

OUT

input power supply voltage VDD swept up and down (the circuits are those in Fig.12 and 13).

When the power supply is turned on, the output is unstable

V

DD

VDET+ΔVDET

V

OUT

0V

VOH

VOL

VDET

VOPL

tPHL

tPLH

tPHL

①

③

Fig.14 Timing Waveform

⑤

tPLH

from after over the operating limit voltage (VOPL) until tPHL.
Therefore it is possible that the reset signal is not outputted when
the rise time of VDD is faster than tPHL.

When VDD is greater than V

voltage (V

If VDD exceeds the reset release voltage (V

V

switches from L to H.

OUT

If VDD drops below the detection voltage (V

DET

+ ∆V

), the output voltages will switch to Low.

DET

but less than the reset release

OPL

+ ∆V

DET

) when the power

DET

supply is powered down or when there is a power supply
fluctuation, V

The potential difference between the detection voltage and the

switches to L (with a delay of t

OUT

PHL

).

release voltage is known as the hysteresis width (∆V
system is designed such that the output does not toggle with
power supply fluctuations within this hysteresis width, preventing
malfunctions due to noise.

terminal

V

DD

V

OUT

GND

), then

DET

). The

DET

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Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

V

V

controller

capacitor is for

noise filtering

capacitor is for

controller

RL

●

●Circuit Applications

●●

1) Examples of a common power supply detection reset circuit.

DD1

L

R

BD48xxx

C

L

(

Micro

ST

R

）

DD2

GND

Application examples of BD48xxx series (Open Drain
output type) and BD49xxx series (CMOS output type)
are shown on the left.

CASE1: Power supply of the microcontroller (V
differs from the power supply of the reset detection IC
(V

).

DD1

Use an open drain output type (BD48xxx) device with a
load resistance RL attached as shown in figure 15.

CASE2: Power supply of the microcontroller (V

Fig.15 Open Drain Output Type

same as the power supply of the reset detection IC
(V

).

DD1

Use a CMOS output type (BD49xxx) device or an open

DD1

V

drain device with a pull up resistor between output and
VDD1.

When a capacitance CL for noise filtering is connected to
the V

pin (the reset signal input terminal of the

OUT

BD49xxx

Micro

ST

R

microcontroller), please take into account the rise and

GND

C

L

(

filtering

fall waveform of the output voltage (V

）

The Electrical characteristics were measured using

OUT

).

RL= 470kΩ and CL = 100pF.

Fig.16 CMOS Output Type

2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.

VDD2VDD1 VDD3

BD48xxx

BD48xxx

Microcontroller

RST

Fig.17

GND

To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BD48xxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller

) as shown in Fig. 17. By pulling-up to V

(V

DD3

, output “High” voltage of micro-controller power supply is possible.

DD3

DD1

DD2

) is

)

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Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

R2

R1

V1

3) Examples of the power supply with resistor dividers

In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow

into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of
current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow
may cause malfunction in the systems operation such as output oscillations, etc.

I1

CIN

VDD

BD48xxx
BD49xxx

VOUT

CL

GND

Fig.18

When an in-rush current (I1) flows into the circuit (Refer to Fig. 18) at the time when output switches from “Low” to “High”,

a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the
VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at
“Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will
switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will
result to oscillation.

IDD

Through Current

DD

0

VDET

V

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Fig.19 Current Consumption vs. Power Supply Voltage

14/15

TSZ02201-0R7R0G300030-1-

Datasheet

BD48xxx series BD49xxx series

2

22.May.2013.Rev.008

www.rohm.com

●Operational Notes

1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.

3) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.

4) Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between V
Be careful when using extremely big capacitor as transient response will be affected.

5) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7) The VDD line impedance might cause oscillation because of the detection current.

8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.

10) External parameters
The recommended parameter range for R
characteristics. Please verify and confirm using practical applications.

11) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.

12) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.

13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.

14) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If 10M
assumed between the CT terminal and the GND terminal, 1M connection between the CT terminal and the VDD
terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the
pull up resistor should be less than 1/10 of the assumed leak resistance.

is 10k to 1M. There are many factors (board layout, etc) that can affect

L

DD pin and GND and 1000pF capacitor between VOUT pin and GND.

 leakage is

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Datasheet

Datasheet

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
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serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA
CLASSⅢ
CLASSⅣ CLASSⅢ

CLASSⅢ

CLASSⅡb

CLASSⅢ

(Note 1)

, transport

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[a] Installation of protection circuits or other protective devices to improve system safety
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H
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
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[h] Use of the Products in places subject to dew condensation

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5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
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8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
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Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.

For details, please refer to ROHM Mounting specification

2,

Notice - GE Rev.002

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Datasheet

Datasheet

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
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This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
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1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or accident arising from the use of a ny
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