A
Power Management Switch ICs for PCs and Digital Consumer Products
1ch Small Package
High Side Switch ICs
for USB Devices and Memory Cards
BD2246G, BD2247G
●Description
BD2246G and BD2247G are low on-resistance N-channel MOSFET high-side power switches, optimized for Universal
Serial Bus (USB) applications. BD2246G and BD2247G are equipped with the function of over-current detection, thermal
shutdown, under-voltage lockout and soft-start.
●Features
1) Low On-Resistance (Typ. 110mΩ) N-channel MOSFET Built-in
2) Reverse Current Protection when Power Switch Off
3) Output Discharge Function
4) Over-Current Detection
5) Thermal Shutdown
6) Open-Drain Fault Flag Output
7) Under-Voltage Lockout
8) Soft-Start Circuit
9) Input Voltage Range: 2.7V ~ 5.5V
10) Control Input Logic Active-High (BD2246G), Active-Low (BD2247G)
11) SSOP5 Package
●Absolute Maximum Ratings (Ta=25℃)
Parameter Symbol Ratings Unit
VIN supply voltage VIN -0.3 ~ 6.0 V
No.11029EAT25
EN(/EN) input voltage VEN(/EN) -0.3 ~ 6.0 V
/OC voltage V/OC -0.3 ~ 6.0 V
/OC sink current I/OC 5 mA
VOUT voltage VOUT -0.3 ~ 6.0 V
Storage temperature TSTG -55 ~ 150 ℃
Power dissipation Pd 675 *1 mW
*1 Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1℃ above 25℃
* This IC is not designed to be radiation-proof.
●Operating Conditions
Parameter Symbol
VIN operating voltage VIN 2.7 5.0 5.5 V
Operating temperature TOPR -40 - 85 ℃
Min. Typ. Max.
Ratings
Unit
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1/13
2011.05 - Rev.
BD2246G, BD2247G
A
●Electrical Characteristics (VIN= 5V, Ta= 25℃, unless otherwise specified.)
BD2246G
DC Characteristics
Limits
Parameter Symbol
Unit Conditions
Min. Typ. Max.
Technical Note
Operating current IDD
- 110 160
μA
EN = 5V, VOUT = open, VIN = 5V
V
- 75 110 VEN = 3.3V, VOUT = open, VIN = 3.3V
Standby current ISTB - 0.01 5 μA VEN = 0V, VOUT = open, VIN = 5V
VENH 2.0 - - V High input, VIN = 3.3~5V
EN input voltage
VENL
- - 0.8 V Low input, V
IN = 5V
- - 0.6 Low input, VIN = 3.3V
EN input leakage IEN -1 0.01 1 μA VEN = 0V or 5V
On-resistance RON
- 110 155
mΩ
OUT = 500mA, VIN = 5V
I
- 130 180 IOUT = 500mA, VIN = 3.3V
Reverse leak current IREV - - 1 μA VOUT = 5V, VIN = 0V
Over-current threshold ITH
630 765 900
mA
IN = 5V
V
600 740 890 VIN = 3.3V
Short circuit output current ISC 350 500 650 mA VOUT = 0V,RMS, VIN = 3.3~5V
Output discharge resistance RDISC
30 60 120
DISC = 1mA, VIN = 5V
I
Ω
50 100 200 IDISC = 1mA, VIN = 3.3V
/OC output low voltage V/OC - - 0.4 V I/OC = 0.5mA, VIN = 3.3~5V
UVLO threshold
V
VTUVL
2.1 2.3 2.5 V V
2.0 2.2 2.4 V VIN decreasing
IN increasing
TUVH
AC Characteristics
Limits
Parameter Symbol
Unit Conditions
Min. Typ. Max.
Output rise time TON1 - 1 6 ms RL = 20Ω, VIN = 3.3~5V
Output turn-on time TON2 - 1.5 10 ms RL = 20Ω, VIN = 3.3~5V
Output fall time TOFF1 - 1 20 μs RL = 20Ω, VIN = 3.3~5V
Output turn-off time TOFF2 - 3 40 μs RL = 20Ω, VIN = 3.3~5V
/OC delay time T/OC
10 15 20
ms
IN = 5V
V
11 16 21 VIN = 3.3V
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2/13
2011.05 - Rev.
BD2246G, BD2247G
A
BD2247G
DC Characteristics
Parameter Symbol
Technical Note
Limits
Unit Conditions
Min. Typ. Max.
Operating current IDD
- 110 160
μA
/EN = 0V, VOUT = open, VIN = 5V
V
- 75 110 V/EN = 0V, VOUT = open, VIN = 3.3V
Standby current ISTB - 0.01 5 μA V/EN = 5V, VOUT = open, VIN = 5V
V/ENH 2.0 - - V High input, VIN = 3.3~5V
/EN input voltage
V/ENL
- - 0.8 V Low input, V
- - 0.6 Low input, VIN = 3.3V
IN = 5V
/EN input leakage I/EN -1 0.01 1 μA V/EN = 0V or 5V
On-resistance RON
- 110 155
mΩ
I
OUT = 500mA, VIN = 5V
- 130 180 IOUT = 500mA, VIN = 3.3V
Reverse leak current IREV - - 1 μA VOUT = 5V, VIN = 0V
Over-current threshold ITH
630 765 900
mA
IN = 5V
V
600 740 890 VIN = 3.3V
Short circuit output current ISC 350 500 650 mA VOUT = 0V,RMS, VIN = 3.3~5V
Output discharge resistance RDISC
30 60 120
DISC = 1mA, VIN = 5V
I
Ω
50 100 200 IDISC = 1mA, VIN = 3.3V
/OC output low voltage V/OC - - 0.4 V I/OC = 0.5mA, VIN = 3.3~5V
UVLO threshold
TUVH
VTUVL
2.1 2.3 2.5 V V
IN increasing
2.0 2.2 2.4 V VIN decreasing
V
AC Characteristics
Limits
Parameter Symbol
Unit Conditions
Min. Typ. Max.
Output rise time TON1 - 1 6 ms RL = 20Ω, VIN = 3.3~5V
Output turn-on time TON2 - 1.5 10 ms RL = 20Ω, VIN = 3.3~5V
Output fall time TOFF1 - 1 20 μs RL = 20Ω, VIN = 3.3~5V
Output turn-off time TOFF2 - 3 40 μs RL = 20Ω, VIN = 3.3~5V
/OC delay time T/OC
10 15 20
ms
V
IN = 5V
11 16 21 VIN = 3.3V
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3/13
2011.05 - Rev.
BD2246G, BD2247G
A
●Measurement Circuit
VIN
A
Technical Note
IN
V
A
EN(/EN)
V
VIN
1µF
GND
EN(/EN)
VOUT
/OC
VIN
1µF RL
GND
EN(/EN)
V
EN(/EN)
VOUT
/OC
Operating current EN,/EN Input voltage, Output rise/fall time
EN(/EN)
V
1µF
A
VIN
VIN
GND
EN(/EN)
VOUT
/OC
I
OUT
10kΩ
EN(/EN)
V
1µF
A
IN
V
VIN
GND
EN(/EN)
VOUT
/OC
OC
I
On-resistance, Over-current detection /OC Output low voltage
Fig.1 Measurement circuit
●Timing Diagram
VEN
50%
TON2
50%
OFF2
T
V/EN
50%
TON2
50%
OFF2
T
90%
V
OUT
TON1 TOFF1
Fig.2 Output rise/fall time
(BD2246G)
90%
10%10%
V
OUT
90%
TON1 TOFF1
Fig.3 Output rise/fall time
(BD2247G)
90%
10% 10%
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4/13
2011.05 - Rev.
BD2246G, BD2247G
A
●Reference Data
140
Ta= 2 5° C
120
[μA]
DD
100
80
60
40
20
OPERATING CURRENT : I
0
2 3456
SUPPLY VOLTAGE : V
Fig.4 Operating current
EN,/EN enable
1.0
VIN=5.0V
0.8
[μA]
STB
0.6
0.4
0.2
STANDBY CURRENT : I
0.0
-50 0 50 100
AMBIENT TEMPERATURE : T a[℃]
Fig.7 Standby current
EN,/EN disable
200
Ta= 2 5° C
]
Ω
150
[m
ON
100
50
ON RESISTANCE : R
0
2 3456
SUPPLY VOLTAGE : V
Fig.10 On-resistance Fig.11 On-resistance
1.0
VIN=5.0V
[A]
TH
0.9
0.8
0.7
0.6
0.5
OVERCURRENT THRESHOLD : I
0.4
-5 0 0 50 1 00
AMB IENT TEMP ERA TURE : Ta [℃]
Fig.13 Over-current threshold Fig.14 /OC output low voltage
Technical Note
140
VIN=5.0V Ta=25°C
120
[μA]
DD
100
80
60
40
20
OPERATING CURRENT : I
0
-50 0 50 100
[V]
IN
AMBI ENT TEM PE R ATU R E : Ta[℃]
Fig.5 Operating current
EN,/EN enable
2.0
Ta= 2 5° C
[V]
EN
1.5
Low to High
1.0
0.5
ENABLE INPUT VOLTAGE : V
0.0
23456
High to Low
SU PPLY VOLT AGE : V
[V]
IN
Fig.8 EN,/EN input voltage
200
VIN=5.0V
]
Ω
150
[m
ON
100
50
ON RESISTANCE : R
0
-50 0 50 100
[V]
IN
[mV]
/OC OUTPUT LOW VOLTAGE:V
AMBI EN T T EMPE R ATU RE : Ta[℃]
100
Ta= 2 5° C
/O C
80
60
40
20
0
23456
SUPPLY VOLTAGE : V
[V]
IN
1.0
0.8
[μA]
STB
0.6
0.4
0.2
STANDBY CURRENT : I
0.0
23 456
SUPPLY VOLTAGE : V
[V ]
IN
Fig.6 Standby current
EN,/EN disable
2.0
VIN=5.0V
[V]
EN
1.5
1.0
0.5
ENABLE INPUT VOLTAGE : V
0.0
-50 0 50 100
AMBIENT TEMPERATURE : T a[℃]
Low to High
High to Low
Fig.9 EN,/EN input voltage
1.0
Ta= 2 5° C
[A]
TH
0.9
0.8
0.7
0.6
0.5
OVERCURRENT THRESHOLD : I
0.4
2 3456
SUPPLY VOLTAGE : V
[V]
IN
Fig.12 Over-current threshold
10 0
VIN=5.0V
[mV]
/O C
80
60
40
20
/OC OUTPUT LOW VOLTAGE:V
0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
Fig.15 /OC output low voltage
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5/13
2011.05 - Rev.
BD2246G, BD2247G
A
2.5
VIN=5.0V
[V]
2.4
TUV L
, V
TUV H
2.3
VTUVH
2.2
2.1
UVLO THRESHOLD : V
2.0
-50 0 50 100
AMBI ENT TEM PE R ATU R E : Ta[
VTUVL
Fig.16 UVLO threshold Fig.17 UVLO hysteresis voltage
5.0
VIN=5.0V
4.0
[ms ]
3.0
ON1
2.0
RISE TIME : T
1.0
0.0
-50 0 50 100
A MBI ENT T EMPE RATUR E : Ta[℃]
Fig.19 Output rise time Fig.20 Output turn-on time
5.0
Ta= 2 5° C
4.0
[μs]
3.0
OFF 1
2.0
FALL TI ME : T
1.0
0.0
23456
S UPP LY VO LT AGE : V
Fig.22 Output fall time Fig.23 Output fall time
6.0
VIN=5.0V
5.0
[μs]
4.0
OFF 2
3.0
2.0
1.0
TURN OFF TIME : T
0.0
-50 0 50 10 0
AMB IENT TEMP ERA TURE : Ta[℃]
Fig.25 Output turn-off time Fig.26 /OC delay time
Technical Note
1.0
VIN=5.0V Ta=25°C
[V]
HSY
0.8
0.6
0.4
0.2
UVLO HYSTERESIS VOLTAGE:V
0.0
℃]
[V]
IN
-50 0 50 100
A MBI ENT T EMPE RATU RE : Ta[℃]
5.0
Ta= 2 5° C
4.0
[ms ]
ON2
3.0
2.0
1.0
TURN ON TIME : T
0.0
23456
SU PPLY VOLT AGE : V
5.0
VIN=5.0V
4.0
[μs]
3.0
OFF 1
2.0
FALL TI ME : T
1.0
0.0
-50 0 50 100
A MBI ENT T EMPE RATU RE : Ta[℃]
20
Ta= 2 5° C
18
[ms ]
/O C
16
14
12
/OC DDLAY TIME : T
10
23456
SUPPLY VOLTAGE : V
[V]
IN
[V]
IN
5.0
4.0
[ms ]
3.0
ON1
2.0
RI SE T IME : T
1.0
0.0
23456
S UPP LY VO LTAGE : V
[V]
IN
Fig.18 Output rise time
5.0
VIN=5.0V
4.0
[ms]
ON2
3.0
2.0
1.0
TURN ON TIME : T
0.0
-50 0 50 100
A MBI ENT T EMPE RATU RE : Ta[℃]
Fig.21 Output turn-on time
6.0
Ta= 2 5° C
5.0
[μs]
4.0
OFF 2
3.0
2.0
1.0
TURN OFF TIME : T
0.0
2 3456
SUPPLY VOLTAGE : V
[V]
IN
Fig.24 Output turn-off time
20
VIN=5.0V
18
[ms ]
/O C
16
14
12
/OC DDLAY TIME : T
10
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
Fig.27 /OC delay time
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6/13
2011.05 - Rev.
BD2246G, BD2247G
A
200
Ta= 2 5° C
]
Ω
[
150
DISC
200
VIN=5.0V
[Ω]
DISC
150
100
100
50
DISC ON RESISTANCE : R
0
2 3456
SUPPLY VOLTAGE : V
Fig.28 Discharge on resistance Fig.29 Discharge on resistance
[V]
IN
50
DISC ON RESISTANCE : R
0
-50 0 50 100
AMBI EN T T EMPE R ATU RE : Ta[℃]
●Waveform Data (BD2246G)
(0.5A/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
VIN=5V
RL=20Ω
VEN
(5V/div.)
/OC
V
(5V/div.)
V
OUT
(5V/div.)
IOUT
(0.5A/div.)
Fig.30 Output rise characteristic
TIME(1ms/div.)
Fig.31 Output fall characteristic
TIME(1us/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
OUT
V
(5V/div.)
IOUT
(0.5A/div.)
VIN=5V
TIME (5ms/div.)
Fig.33 Over-current response
ramped load
I
OUT
(0.5A/div.)
TIME (5ms/div.)
Fig.34 Over-current response
enable to shortcircuit
VOUT
(5V/div.)
V/OC
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
IOUT
(1A/div.)
VIN=5V
IOUT
(0.2A/div.)
Fig.36 Over-current response
1 load to enabled device
TIME (5ms/div.)
TIME (10ms/div.)
Fig.37 UVLO response
increasing V
VIN=5V
RL=20Ω
R
IN
VIN=5V
L=20Ω
Technical Note
V
EN
(5V/div.)
/OC
V
(5V/div.)
IOUT
(0.2A/div.)
Fig.32 Inrush current response
VEN
(5V/div.)
V/OC
(5V/div.)
OUT
V
(5V/div.)
I
OUT
(0.5A/div.)
Fig.35 Over-current response
enable to shortcircuit
VIN
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
RL=20Ω
Fig.38 UVLO response
CL=220uF
CL=47uF
TIME (1ms/div.)
TIME (100ms/div.)
TIME (10ms/div.)
decreasing V
CL=100uF
VIN=5V
RL=20Ω
VIN=5V
IN
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7/13
2011.05 - Rev.
BD2246G, BD2247G
A
y
r
Technical Note
●Block Diagram
VIN
GND
EN(/EN)
Under-voltage
Lockout
Over-current
Protection
Charge
Pump
Dela
Counte
Reverse current
Protection
/EN
Thermal
Shutdown
VOUT
/OC
GND
EN(/EN)
VIN
1
2
Top View
3 45/OC
Fig.39 Block diagram Fig.40 Pin configuration
●Pin Description
Pin No. Symbol I/O Function
1 VIN - Switch input and the supply voltage for the IC.
VOUT
2 GND - Ground.
3 EN, /EN I
4 /OC O
5 VOUT O Switch output.
●I/O Circuit
Symbol Pin No. Equivalent Circuit
EN
(/EN)
Enable input.
EN: High level input turns on the switch. (BD2246G)
/EN: Low level input turns on the switch. (BD2247G)
Over-current notification terminal.
Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
3
EN
(/EN)
VOUT 5
/OC 4
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VOUT
8/13
/OC
2011.05 - Rev.
BD2246G, BD2247G
A
●Functional Description
1. Switch Operation
VIN terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VIN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN,/EN control input, VIN terminal and VOUT terminal are connected by a
110mΩ(Typ.) switch. In on status, the switch is bidirectional. Therefore, when the potential of VOUT terminal is higher
than that of VIN terminal, current flows from VOUT terminal to VIN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to
prevent current from flowing reversely from VOUT to VIN.
2. Thermal Shutdown Circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 135℃(Typ.) in the condition of over-current detection, thermal shutdown circuit operates and makes power switch
turn off and outputs fault flag (/OC). Then, when the junction temperature decreases lower than 115℃(Typ.), power
switch is turned on and fault flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is removed or the
output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active).
3. Over-Current Detection (OCD)
The over-current detection circuit limits current (I
MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status
soon.
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.)
while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ).
Under-voltage lockout circuit works when the switch is on (EN,/EN signal is active).
5. Fault Flag (/OC) Output
Fault flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output.
Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
) and outputs fault flag (/OC) when current flowing in each switch
SC
Technical Note
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2011.05 - Rev.
BD2246G, BD2247G
A
Technical Note
VOUT
IOUT
V/OC
Over Current
Detection
I
TH
T/OC
SC
I
Over Current
Load Removed
Fig.41 Over-current detection
VEN
V
OUT
Output Shortcircuit
Thermal Shutdown
I
OUT
/OC
V
Delay
Fig.42 Over-current detection, Thermal shutdown timing (BD2246G)
V
/EN
OUT
V
I
OUT
/OC
V
Fig.43 Over-current detection, Thermal shutdown timing (BD2247G)
Output Shortcircuit
Thermal Shutdown
Delay
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BD2246G, BD2247G
A
T
/OC
+
-
●Typical Application Circuit
10kΩ~
100kΩ
Technical Note
5V (Typ.)
C
IN
VIN
VOU
Ferrite
Beads
Controller
GND
EN(/EN)
C
L
Fig.44 Typical application circuit
●Application Information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC,
and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor C
IN by VIN terminal
and GND terminal of IC. 1μF or higher is recommended. In order to decrease voltage fluctuations of power source line to IC,
connect a low ESR capacitor in parallel with CIN. 10μF ~ 100μF or higher is effective.
Pull up /OC output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including static and transitional characteristics as well as dispersion of the IC.
●Power Dissipation Characteristic
(SSOP5 package)
700
600
500
400
300
200
POWER DISSIPATION : Pd [mW]
100
0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE : Ta [℃]
* 70mm x 70mm x 1.6mm Glass Epoxy Board
85
Fig.45 Power Dissipation Curve (Pd-Ta Curve)
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11/13
2011.05 - Rev.
BD2246G, BD2247G
A
●Notes for use
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not
continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
Technical Note
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© 2011 ROHM Co., Ltd. All rights reserved.
12/13
2011.05 - Rev.
BD2246G, BD2247G
A
●Ordering part number
B D 2 2 4 6 G - T R
Part No.
Part No.
2246
2247
SSOP5
2.8±0.2
1.25Max.
1.1±0.05
2.9±0.2
5
4
+0.2
−0.1
1.6
12
3
0.95
0.05±0.05
0.42
0.1 S
+0.05
−0.04
S
°
+
6
°
4
°
−4
+0.05
0.13
−0.03
(Unit : mm)
0.2Min.
Package
G: SSOP5
Packaging and forming specification
TR: Embossed tape and reel
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
3000pcs
TR
The direction is the 1pin of product is at the upper right when you hold
()
reel on the left hand and you pull out the tape on the right hand
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
Technical Note
1pin
Direction of feed
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13/13
2011.05 - Rev.
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes effor ts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
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The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
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Notice
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Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
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R1120
A
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