ROHM BD1601MUV Technical data

Datasheet

4-Channel Charge Pump White LED Driver with 64 Dimming Steps and 1-wire Serial Interface

BD1601MUV

●General Description The multi-level brightness control white LED driver not only ensures efficient boost by automatically changing the boost rate but also works as a constant current driver in 64 steps, so that the driving current can be adjusted finely. This IC is best suited to turn on white LEDs that require high-accuracy LED brightness control.

●Features

 Built-in parallel LED driver for 4 lamps.  64-step LED current adjusts function.  Inter-LED relative current accuracy: 3% or less  Lighting/dimming control via a single-line digital

control interface.

 Automatic transition charge pump type DC/DC

converter (×1,×1.5 and ×2).

 High efficiency achieved (90% or more at

maximum).

 Various protection functions such as output voltage

protection, over current limiter and thermal shutdown circuit are mounted.

●Key Specifications

 Operating power supply voltage range: 2.7V to 5.5V  LED maximum current: 30mA (Typ.)  Oscillator frequency: 1.0MHz(Typ.)  Quiescent Current: 0.1μA (Typ.)  Operating temperature range: -30℃ to +85℃

●Package W(Typ.) x D(Typ.) x H(Max.)

●Applications

This driver is applicable for various fields such as mobile phones, portable game machines and white goods.

VQFN016V3030

3.00mm x 3.00mm x 1.00mm

●Typical Application Circuit

White LED Application (Recommended)

●Pin Configuration [Top View]

C2P

GND

C2N

C1N

LED1

LED2

LED3

LED4

15 16

GND

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays www.rohm.com

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8 7 6

C1P VBAT

VOUT

BD1601MUV

●Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Ratings Unit

Power supply voltage VMAX 7 V

Operating temperature range Topr -30 to +85 ℃

Storage temperature range Tstg -55 to +150 ℃

Datasheet

Power dissipation Pd 700

(*1) When a glass epoxy substrate (70mm × 70mm × 1.6mm) has been mounted, this loss will decrease 5.6mW/℃ if Ta is higher than or equal to 25℃.

(*1)

●Recommended Operating Ratings (Ta = -30 to 85℃)

Parameter Symbol Ratings Unit

Operating power supply voltage

Vin 2.7 to 5.5 V

●Electrical Characteristics Unless otherwise noted, Ta = +25℃, VBAT=3.6V

Parameter Symbol

Min. Typ. Max.

Limits

Units Condition

Overall Quiescent Current Iq - 0.1 1 μA EN=0V

Current Consumption1 I dd1 - 1.0 2.4 mA x1.0 Mode, Except LED current

Current Consumption2 I dd2 - 2.5 3.5 mA x2.0 Mode, Except LED current Charge Pump Oscillator frequency fOSC 0.8 1.0 1.2 MHz Current Source LED maximum current ILED-max 28.5 30 31.5 mA

LED current accuracy ILED-diff - - 5.0 %

LED current matching

(*1)

ILED-match - 0.5 3.0 %

LED control voltage VLED - 0.2 0.25 V

When LED current 15.5mA setting and LED terminal voltage 1.0V When LED current 15.5mA setting and LED terminal voltage 1.0V minimum voltage at LED1 to LED4 pins

Logic control terminal Low threshold voltage VIL - - 0.4 V

High threshold voltage VIH 1.4 - - V

High level Input current IIH - 0.1 2 μA EN=VBAT

Low level Input current IIL -2 -0.1 - μA EN=0V

Minimum EN High time THI 50 - - ns

Minimum EN Low time TLO 0.05 - 100 μs

EN Off Timeout TOFF - 512 640 μs

(*1) The following expression is used for calculation: ILED-match={(Imax-Imin)/(Imax+Imin)} × 100 Imax= Current value in a channel with the maximum current value among all channels Imin=Current value in a channel with the minimum current value among all channels

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●Pin Descriptions

Datasheet

Pin No. Pin name In/Out Type

1 NC - - No connect 2 NC - - No connect 3 EN In C ON/OFF and dimming control 4 GND - D GND 5 NC - - No connect 6 VOUT Out A Charge pump output 7 VBAT - A Power supply 8 C1P In/Out A Flying capacitor pin positive (+) side

9 C1N In/Out B Flying capacitor pin negative (-) side 10 C2N In/Out B Fl ying capacitor pin negative ( -) side 11 C2P In/Out A Flying capacitor pin positive (+) side 12 GND - D GND 13 LED1 Out B LED current driver output 1 14 LED2 Out B LED current driver output 2 15 LED3 Out B LED current driver output 3 16 LED4 Out B LED current driver output 4

●Pin ESD Type

Type-A

Thermal

PAD

- D

Type-B

Heat radiation PAD of back side Connect to GND

VBAT Type-C

Function

VBAT

PAD

GND

Type-D

PAD

VBAT

PAD

GND

Figure 1. Pin ESD Type

PAD

GND

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VBAT

●Block Diagram

Datasheet

C1N C1P C2N C2P

VOUT

Charge Pump

Mode Control

×1, ×1.5, ×2

Charge pump

Over Voltage

Protect

OSC

Enable/

Brightness

Control

TSD

Current

DAC

Vout Control

LED1

LED2

LED3

LED4

GND

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●Typical Performance Curves

Figure 2. Circuit Current

(Standby)

Figure 4. Efficiency

(20mA × 4Lights)

Datasheet

Figure 3. Circuit Current

(Operation in × 1.0Mode)

Figure 5. Efficiency

(5mA × 4Lights)

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●Typical Performance Curves - continued

Figure 8. LED Current Characteristics

Figure 6. Efficiency

(15mA × 4 Lights)

(LED current 15.5mA)

Datasheet

Figure 7. Efficiency

(30mA × 4Lights)

Figure 9. LED Current Characteristics

(Differential Linearity error)

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●Typical Performance Curves - continued

Figure 10. LED Current Characteristics

(Integral Linearity Error)

Figure 12. LED Current – Input voltage

(LED current 15.5mA)

Datasheet

Figure 11. LED current matching

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●Function Description

(1) LED driver

▪ UPIC interface

BD1601MUV is a single line digital interface control (Uni-port Interface Control=UPIC) that can control the power ON/OFF and LED current value through the EN pin only. The LED current increments by about 0.5mA depending on the number of leading edges. When the number of leading edge is added at the maximu m output current of 30mA (64 leading edges), the current is almost equal to 0.5mA at startup time. To maintain any output current, the EN pin must be kept at “H” level. To power off, the EN pin must be kept at “L” level for more than 640µsec.

Datasheet

OFF

(Internal)

State

LED

C1 C2 C3 C4

Soft Start

1.4mA 1.4mA

1.9mA

2.3mA

C63 C64

29.5mA

30mA

C1 C2

0.9mA

0.5mA OFFOFF

Figure 13. Brightness Control Method

OFF

Figure 14. UPIC Interface

▪ LED current level

The LED current state can be changed by the EN control signal. When the current level is Cn, the basic LED current (ILED) can be obtained from the following expression (where, n indicates a state number).

= 30 / 64 ×n [mA]

LED

State Output current

[mA]

State Output current

[mA]

State Output current

[mA]

State Output current

C1 0.5 C14 8.0 C33 15.5 C49 23.0 C2 0.9 C18 8.4 C34 15.9 C50 23.4 C3 1.4 C19 8.9 C35 16.4 C51 23.9 C4 1.9 C20 9.4 C36 16.9 C52 24.4 C5 2.3 C21 9.8 C37 17.3 C53 24.8 C6 2.8 C22 10.3 C38 17.8 C54 25.3 C7 3.3 C23 10.8 C39 18.3 C55 25.8 C8 3.8 C24 11.3 C40 18.8 C56 26.3

C9 4.2 C25 11.7 C41 19.2 C57 26.7 C10 4.7 C26 12.2 C42 19.7 C58 27.2 C11 5.2 C27 12.7 C43 20.2 C59 27.7 C12 5.6 C28 13.1 C44 20.6 C60 28.1 C13 6.1 C29 13.6 C45 21.1 C61 28.6 C14 6.6 C30 14.1 C46 21.6 C62 29.1 C15 7.0 C31 14.5 C47 22.0 C63 29.5 C16 7.5 C32 15.0 C48 22.5 C64 30.0

[mA]

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(2) Charge pump

a) Description of operations

Pin voltage comparison takes place at VOUT control section, and then VOUT generation takes place so that the LED cathode voltage with the highest Vf is set to 0.2V. A boost rate is changed automatically to a proper one at the Charge Pump Mode Control section so that operation can take place at possible low boost rate. When the current taken from VBAT exceeds 600mA, the overcurrent limiter is activated and this IC is reset. In addition, if the output voltage falls below 1.5V, this IC is reset for short-circuit at output.

b) Soft start function

BD1601MUV have a soft start function that prevents the rush current.

EN/LED*

VOUT

LED

Datasheet

OFF

Soft Start Ordinal mode

Figure 15. Soft Start

c) Automatic boost rate change

The boost rate automatically switches to the best mode.

* (×1 mode -> ×1.5 mode) or (×1.5 mode -> ×2 mode)

If a battery voltage drop occursBD1601MUV cannot maintain the LED constant current, and then mode transition begins.

* (×1.5 mode -> ×1 mode) or (×2 mode -> ×1.5 mode)

If a battery voltage rise occurs, VOUT and VBAT detection are activated, and then mode transition begins.

(3) UVLO (Ultra low Voltage Lock Out)

If the input voltage falls below 2.2V, BD1601MUV is shut down to prevent malfunction due to ultra-low voltage.

(4) OVP (Over Voltage Protection)

This circuit protects this IC agai nst damage wh en the C /P outpu t vo lt ag e (VOUT) ri se s extremely fo r some ex terna l facto rs.

(5) Thermal shutdown (TSD)

To protect this IC against thermal damage or heat-driven uncontrolled operations, this circuit turns off the output if the chip temperature rises over 175℃. In addition, it turns on the output if the temperature returns to the normal temperature.

(6) Power sequence

VBAT

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Figure 16. Power sequence

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●Application Circuit Example

White LED Application(VOUT not used)

Battery

C1N

Datasheet

C2N

C1P

C2P

Cin

=1μF

Pulse Generator

VBAT

Charge Pump

Mode Control

Enable/

Brightness

Control

×1, ×1.5, ×2

Charge pump

Over Voltage

Protect

OSC

TSD

Current

DAC

VOUT

Cout =1μF

VDD

Vout Control

LED1

LED2

LED3

LED4

GND

Figure 17. Block Diagram and Circuit Example

●Selection of Components Externally Connected

Capacitor (Use a ceramics capacitor with good frequency and temperature characteristics.)

Symbol Recommended value Recommended parts Type

Cout,Cin,C1,C2 1μF GRM188B11A105KA61B(MURATA) Ceramics capacitor

Connect an input bypass capacitor Cin between VBAT and GND pin and an output capacitor Cout between VOUT and GND pin in proximity. Place both C1P-C1N and C2P-C2N capacitors in proximity to the chip. Furthermore, select a ceramics capacitor with a sufficient rating for voltage to be applied.

When the parts not listed above are used, the equivalent parts must be used.

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Datasheet

●Recommended PCB Layout

In PCB design, wire the power suppl y line in a way th at the PCB im pedance goes low and provide a bypass capacitor if needed. Heat radiation of back side PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin. Moreover, connect ground plane of board using via as shown in the patterns of below page. The efficiency of heat radiation improves according to the area of ground plane.

To substrat e

GND

Cout

GND

Cin

To substrat e

VCC

Figure 18. Application Layout Image (Top View) Figure 19. BD1601MUV Front (Top View)

Cout

VOUT

VBAT

VOUT

CIN

VBAT

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●Operational Notes

(1) Absolute Maximum Ratings

An excess in the absolute maximum ratings, such as supply voltage, temperatur e range of operating conditions, etc., can break down devices, thus making impossible to identify breakin g mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum rat ings is assumed, consid eration should be giv en to take physical safety measures including the use of fuses, etc.

(2) Operating conditions

These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter.

(3) Reverse connection of power supply connector

The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s pow er supply terminal.

(4) Power supply line

Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and t he GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.

(5) GND voltage

Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND volt age including an actual electric transient.

(6) Short circuit between terminals and erroneous mounting

In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounti ng can break down the ICs. Furthermore, if a short circuit occurs due to f oreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down.

(7) Operation in strong electromagnetic field

Be noted that using ICs in the strong electromagnetic field can malfunction them.

(8) Inspection with set PCB

On the inspection with the set PCB, if a capacitor is connected t o a low-im pedance IC ter minal, th e IC can suffer stress. Therefore, be sure to discharge from the set PCB b y each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dism ount it from the jig. In addition, for protection against static electricit y, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB.

(9) Input terminals

In terms of the construction of IC, parasitic elements are inevitably formed i n relation to potential. The operation of the parasitic element can cause interference with circuit operation, t hus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to hand le the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to t he IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.

(10) Ground wiring pattern

If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large c urrent will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuatio ns in the GND wiring pattern of external parts as well.

(11) External capacitor

In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to t emperature, etc.

(12) Thermal shutdown circuit (TSD)

When junction temperatures become 175 OFF. The thermal shutdo wn circuit, which is aimed at isolating the LSI from thermal runa way as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not cont inuously use the LSI with this circuit operati ng or use the LSI assuming its operation.

(13) Thermal design

Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use.

℃ (typ) or higher, the thermal shutdown circuit operates and turns a switch

Datasheet

Status of this document The Japanese version of this document is formal specificati on. A customer may use this translation version onl y for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority.

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)

●Ordering Information

B D 1 6 0 1 M U V - E 2

Datasheet

Part Number Package

MUV: VQFN016V3030

Packaging and forming specification E2: Embossed tape and reel

●Marking Diagram

VQFN016V3030 (TOP VIEW

Part Number Marking

BD1 601

LOT Number

1PIN MARK

●Physical Dimension Tape and Reel Information

VQFN016V3030

3.0±0.1

0.4±0.1

1.0MAX

0.08 S

0.75

C0.2

1.4±0.1

12 9

1PIN MARK

0.5

0.25

3.0±0.1

+0.03

+0.05

−0.04

0.02

−0.02

1.4±0.1

(0.22)

(Unit : mm)

Embossed carrier tapeTape

Quantity

Direction of feed

3000pcs E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

Direction of feed

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●Revision History

Date Revision Changes

05.Nov.2012 001 New Release

Datasheet

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Datasheet

Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment , OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way respons ible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any propert y, which a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

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[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl

2S, NH3, SO2, and NO2

H [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-solub le cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power ratin g under steady-state loading condition may negatively affect product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When us ed in sealed area, confirm the actual ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure in duced under deviant condition from what is defined in this document.

Notice - Rev.003

Datasheet

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability.

2) In principle, the reflow soldering method mu st be used; if flow soldering method is preferred, please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics.

2) You agree that application no tes, reference designs, and associated data and information contained in this docum ent are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgmen t in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dr y condition (e.g. Gro unding of human bod y / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderabilit y before using Products of which storage time is exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a c arton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after ope ning a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only.

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1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe an y intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.:

No lice

nse, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Datasheet

Notice - Rev.003

Datasheet

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

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consent of ROHM.

4) In no event shall you use in any way whatsoever the Pr oducts and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Datasheet

Notice - Rev.003

ROHM BD1601MUV Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual