ROHM BD11600NUX Technical data

USB Switch ICs

DPDT Type (Double Pole Double Throw)

BD11600NUX

●Description

BD11600NUX is DPDT analog switches handling with USB2.0 high-speed that have both a low resistance and a low capacitance. Moreover, this is widely guaranteed from 2.5V to 5.5V as for the range of the power-supply voltage. This has a low consumption mode by making OE “H” and the multi-selector by making the combination of OE “L” and S. The electrostatic discharge protection circuit is built-in in all terminals.

●Features

1) VCC Operation from 2.5V to 5.5V.

2) 3Ω switches between the input to the output.

3) Low Capacity 2ch Analog SW.

4) 10-Pin SON Package. (3.0mm x 2.0mm, Height=0.6mm, 0.5mm pitch)

●Applications

Digital Still Cameras, Digital Video Camcorders, Portable Navigation Devices, TV, Portable DVD Players, Portable Game Systems, Personal computers, PDA, Mobile phones

●Line up matrix

Parameter

Supply Quiescent Current 18 µA

Input voltage range 2.5～5.5 V

Switch ON Resistance ( VIN=0 V ) 3 Ω 2.5 Ω

Switch ON Capacitance 6 pF

Configuration DPDT DPST

Package VSON010X3020 VSON008X2020

●Absolute maximum ratings (Ta=25℃)

BD11600NUX BD11601NUX

No.11103EAT03

Parameter Symbol Ratings Unit Conditions

Input supply voltage Vmax -0.5～7.0 V D+,D-,1D+,1D-,2D+,2D- Pins

Input supply voltage Vmax -0.3～7.0 V Other Pins

Power dissipation Pd 1.925 W *1

Operating temperature range Topr -40～+85 ℃

Storage temperature range Tstr -55～+150 ℃

*1 When using more than at Ta=25℃, it is reduced 15.4 mW per 1℃. ROHM specification board 70mm×70mm mounting.

●Operating conditions (Ta=-40～+85℃)

Parameter Symbol Ratings Unit Conditions

Input voltage range (VCC) VCC 2.5～5.5 V

* This product does not especially designed to be protected from radioactivity.

www.rohm.com

1/10

2011.08 - Rev.

BD11600NUX

●Electrical characteristics (Unless otherwise noted, Ta = 25C, VCC=5.0V)

Parameter Symbol

Supply Quiescent Current 1 ICC1 - 1 3 µA SW1, 2=OFF

Supply Quiescent Current 2 ICC2 - 18 40 µA SW1=ON

Supply Quiescent Current 3 ICC3 - 19 40 µA SW2=ON

Min. Typ. Max.

Limits

Unit Conditions

Technical Note

Switch ON Resistance 1 (SW1, 2)

Switch ON Resistance 2 (SW1, 2)

Off-Leakage Current Ioff -2 0 2 µA SW1, 2=OFF

On-Leakage Current Ion -2 0 2 µA VCC>VIN, SW1, 2=ON

Switch Input Range VIN -0.5 - 5.5 V SW1, 2=ON

Switch OFF Capacitance (SW1, 2)

Switch ON Capacitance (SW1, 2)

Input “L” level (S, OE )

Input “H” level (S, OE )

Ron1 - 3 6 Ω VIN=0V

Ron2 - 3.5 6 Ω VIN=2.4V

Coff - 4 - pF

Con - 6 - pF

VIL - - 0.5 V

VIH 1.1 - - V

www.rohm.com

2/10

2011.08 - Rev.

BD11600NUX

●Electrical characteristic curves (Reference data)

Eye Pattern Full Speed

Fig.1

2.5

1.5

ICC1 (uA)

Ta=105°C

Ta=25°C

0.5

0 0.5 1 1.5 2 2 .5 3 3.5 4 4 .5 5 5.5 6 6.5 7

ICC vs Input Voltage (SW OFF)

VCC (V)

Fig.3

Ta=-60°C

VCC=0V~7V S=L, OE=H

RON [Ω]

01234567

Ron vs Input Voltage

Fig.5

1D+ [V]

Ta=105

℃

Ta=25

℃

Ta=-60

℃

VCC=5V,IO(D+)=-10mA, VIN=0 ~7V,S=L,O E=L

Technical Note

Fig.2

Eye Pattern High Speed

ICC2 (uA)

00.511.522.533.544.555.566.57

ICC vs Input Voltage (SW ON)

I_1D + (uA)

01234567

Leak current vs Input Voltage(SW OFF)

Ta=105°

VCC (V)

Fig.4

1D+ (V)

Fig.6

Ta=25°

Ta=-60°

Ta=25°C Ta=-60°C Ta=105°C

VCC=0V~7V S=L, OE=L

www.rohm.com

3/10

2011.08 - Rev.

BD11600NUX

●Block diagram and pin configuration

Fig.7

Block diagram

●Package Dimensions

１D-

2D+

2D-

GND

Fig.8

Pin configuration

Technical Note

VCC

10１D+

D+

D-

B D 1 1

0 0 N

LOT No.

Package Dimensions

Fig.9

www.rohm.com

4/10

2011.08 - Rev.

BD11600NUX

●Pin Description

Pin NO.

1 A 1D+ O

Terminal

circuit

Technical Note

Pin Name I／O Function

2 B 1D- O

3 C 2D+ O

4 D 2D- O

5 - GND - Ground Pin.

6 E

7 F D- I

8 G D+ I

9 H S I Select Input Pin.

10 - VCC - Power Supply.

●Truth Table

●Equivalent Circuit

H L OFF OFF ALL OFF

H H OFF OFF ALL OFF

L L ON OFF 1D+⇔D+, 1D-⇔D-

L H OFF ON

Analog SW terminal.

S SW1 SW2 Signal Pass

I Bus-Switch Analog Pin.

Analog SW terminal.

2D+⇔D+, 2D-⇔D-

A,B,C,D

E,H

F,G

VCC

www.rohm.com

5/10

2011.08 - Rev.

BD11600NUX

●How to select parts of application

High

TRANSCEIVER

High

TRANSCEIVER

Speed

USB

Speed

USB

VCC

1D+

1D-

2D+

2D-

SW1

SW2

Control

D+

D-

OE S

GND

USB

Connecto

Fig.10

Application circuit of multi-USB TRANSCEIVER

VCC

1D+

1D-

2D+

2D-

USB

HOST1

USB

HOST2

High

Speed

USB

TRANSCEIVER

D+

D-

GND

SW1

SW2

Control

Fig.11

Application circuit of two communicating with two USB HOST

Technical Note

www.rohm.com

6/10

2011.08 - Rev.

BD11600NUX

●Parameter Measurement Information

Technical Note

VCC

1D+

2D+

VIN

Control

GND

D+

IIN

Fig.12

SW1 ON-State ICC

ON-State Resistance (Ron)

Fig.13

OFF-State Leakage current

Fig.14

ON-State Leakage current

Fig.15

www.rohm.com

7/10

2011.08 - Rev.

BD11600NUX

●Notes for use

(1) Absolute maximum ratings

If applied voltage (VCC), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures.

(2) Recommended operating range

This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics, it is those that are guaranteed under the conditions for each parameter. Even when these are within the recommended operating range, voltage and temperature characteristics are indicated.

(3) Reverse connection of power supply connector

There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse connection, take measures such as externally placing a diode between the power supply and the power supply pin of the LSI.

(4) Power supply lines

In the design of the board pattern, make power supply and GND line wiring low impedance. When doing so, although the digital power supply and analog power supply are the same potential, separate the digital power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well. Furthermore, for all power supply pins of the LSI, in conjunction with inserting capacitors between power supply and GND pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss occurring at low temperatures is not a problem for various characteristics of the capacitors used.

(5) GND voltage

Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition, confirm that there are no pins for which the potential becomes less than a GND by actually including transition phenomena.

(6) Shorts between pins and misinstallation

When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is installed erroneously, there is a risk of LSI damage. There also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or GND.

(7) Operation in strong magnetic fields

Be careful when using the LSI in a strong magnetic field, since it may malfunction.

(8) Inspection in set board

When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to low impedance LSI pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the assembly process and take appropriate care in transport and storage.

(9) Input pins

Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage. Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other ways such that parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the LSI. Furthermore, when the power supply voltage is being applied, make each input pin a voltage less than the power supply voltage as well as within the guaranteed values of electrical characteristics.

(10) Ground wiring pattern

When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND voltage to change. Take care that the GND wiring pattern of externally attached components also does not change.

(11) Externally attached capacitors

When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.

(12) Thermal design

Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use.

Technical Note

www.rohm.com

8/10

2011.08 - Rev.

BD11600NUX

●Power Dissipation

2.4

2.2

1.8

Technical Note

Pd=1.925W

1.6

-15.4mW/℃

1.4

1.2

0.8

0.6

Power dissipation :Pd [W]

0.4

0.2

Ta_max=85℃

0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150

Ambient temperature :Ta [℃]

Fig.16

Power dissipation

www.rohm.com

9/10

2011.08 - Rev.

BD11600NUX

●Ordering part number

B D 1 1 6 0 0 N U X - E 2

Part No.

VSON010X3020

1PIN MARK

0.05 S C0.2

Part No.

2.0±0.1

0.6MAX

0.4±0.1

3.0±0.1

2.0±0.1

0.5±0.1

2.39±0.1

+0.03

−0.02

(0.12)

0.02

0.64±0.1

+0.05

0.25

−0.04

(Unit : mm)

Package NUX:VSON010X3020

Embossed carrier tapeTape

Quantity

Direction of feed

4000pcs E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

1pin

Packaging and forming specification E2: Embossed tape and reel

Order quantity needs to be multiple of the minimum quantity.

∗

Technical Note

Direction of feed

www.rohm.com

10/10

2011.08 - Rev.

Notes

No copying or reproduction of this document, in par t or in whole, is permitted without the consent of ROHM Co.,Ltd.

The content specied herein is subject to change for improvement without notice.

The content specied herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specications, which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.

The technical information specied herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.

The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).

The Products specied in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injur y (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specied herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.

Notice

Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

R1120

ROHM BD11600NUX Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual