ROHM BA3662CP-V5 Technical data

A

Standard Variable Output LDO Regulators

300mA Standard
Variable Output LDO Regulator

BA3662CP-V5

No.10023EAT05

●Description

The BA3662CP-V5 is low-saturation regulator. The output voltage can be arbitrarily configured using the external resistance.
This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a
thermal shutdown circuit that protects the IC from thermal damage due to overloading.

●Features

1) Output Current: 300mA

2) High Output Voltage Precision : ±2%

3) Low saturation with PNP output

4) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits

5) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading

6) Built-in over- voltage protection circuit that prevents the destruction of the IC due to power supply surges

7) TO220CP-V5 packaging

●Applications

Audiovisual equipments, FPDs, televisions, personal computers or any other consumer device

●Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Ratings Unit

1

Supply Voltage

Output Control Voltage V

※

Vcc -0.3～+35.0 V

-0.3～+Vcc V

CTL

2

Power Dissipation

※

Pd 2000 mW

Operating Temperature Range Topr -40～+125 ℃

Storage Temperature Range Tstg -55～+150 ℃

Maximum Junction
Temperature

Peak Supply Voltage

※ 1 Not to exceed Pd.
※ 2 TO220CP-V5:Derating in done at 16mW/℃ for operating above Ta≧25℃.(without heat sink)
※ 3 Applied voltage : 200msec or less (tr≥1msec)

NOTE : This product is not designed for protection against radioactive rays.

Tjmax +150 ℃

Vcc

3

※

peak

+50 V

tr≧1msec

50V

35V

0V

MAX200msec

(Voltage Supply more than 35V)

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●Operating conditions (Ta=-40～+125℃)

Parameter Symbol Min. Max. Unit

Supply Voltage Vcc 4.0 25.0 V

Technical Note

Output Control Voltage V

0 Vcc V

CTL

Output Current Io 0 0.3 A

Output Voltage Vo 3.0 15.0 V

●Protect features

Parameter Symbol Min. Typ. Max. Unit

Over Voltage protection Vcc 26 28 30 V

●Electrical characteristics
(Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=200mA,R1=2.2kΩ, R2=6.8kΩ)

Parameter Symbol Min. Typ. Max. Unit Conditions

Shut Down Current Isd － 0 10 µA VCTL=0V

Bias Current Ib － 2.5 5.0 mA VCTL=2V, Io=0mA

C Terminal Voltage Vc 1.200 1.225 1.250 V Io=50mA

Dropout Voltage ⊿Vd － 0.3 0.5 V Vcc=Vo×0.95

Ripple Rejection R.R. 45 55 － dB

f=120Hz, ein
Io=100mA

※

1

=1Vrms,

Line Regulation Reg.I － 20 100 mV Vcc=6→25V

Load Regulation Reg.L － 40 80 mV Io=5mA→200mA

Temperature Coefficient of
Output Voltage

Tcvo － ±0.02 － %/℃ Io=5mA,Tj=0～125℃

Short Current Ios － 0.1 － A Vcc=25V,Vo=0V

ON Mode Voltage VthH 2.0 － － V ACTIVE MODE, Io=0mA

OFF Mode Voltage VthL － － 0.8 V OFF MODE, Io=0mA

Input High Current ICTL 100 200 300 µA VCTL=5V, Io=0mA

※ 1 ein : Input Voltage Ripple

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BA3662CP-V5

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●Reference data
BA3662CP-V5(5.0V preset voltage)
(Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=200mA,R1=2.2kΩ, R2=6.8kΩ)

3.0

]

mA

[

2.5

2.0

FEEDBACK_R

Ib+I

：

1.5

1.0

0.5

CIRCUIT CURRENT

0.0

02 46 81012141618202224

SUPPLY VOLTAGE ： Vcc

Fig.1 Circuit Current

[V]

6

5

Vo [V]

：

4

3

2

OUTPU T VOLTAGE

1

0

0 100 200 300 400 500 600

OUTPUT CURRENT ： IO[mA]

Fig.4 Load Regulation

6.0

5.5

Vo [V]

：

5.0

4.5

OUT PUT VO LTAGE

4.0

3.5

-40 -20 0 20 40 60 80 100

AMBIENT TEM PERATU RE ： Ta

[℃]

6

5

Vo [V]

：

4

3

2

OUT PUT VO LTAGE

1

0

0 2 4 6 8 10 12 14 16 18 20 22 24

SUPPLY VOLT AGE ： Vcc [V]

Fig.2 Line Regulation

300

250

Vd [mV]

Δ

200

：

150

100

50

DROPOU T VOLTAGE

0

0 50 100 150 200 250 300

OUTPUT CURRENT ： IO [mA]

Fig.5 Dropout Voltage Io-△Vd Characteristics

(Vcc=4.75V)

20

[mA]

16

FEEDBACK_R

12

Ib+I

：

8

4

CIRCUIT CURRENT

0

0 50 100 150 200 250 300

OUTPUT CURRENT ： Io [mA]

Fig.8 Circuit Current (Io=0mA→300mA)

(IFEEDBACK_R≒555µA)

6

5

Vo [V]

：

4

3

2

OUT PUT VO LTAGE

1

0

0 2 4 6 8 1012141618202224

Fig.10 CTL Voltage vs Output Voltage

CONTROL VOLTAGE ： V

[V]

CTL

6

5

Vo [V]

4

：

3

2

OUT PUT VOLTAG E

1

0

0 5 10 15 20 25 30 35

SUPPLY VOLT AGE ： Vcc [V]

Fig.11 Overvoltage Operating

(lo = 200mA)

Technical Note

6

5

Vo [V]

：

4

3

2

OUT PUT VOLT AGE

1

0

0 2 4 6 8 1012141618202224

SUPPLY VOLTAGE ： Vcc [V]

Fig.3 Line Regulation

(Io=200mA)

80

70

60

R.R. [dB]

：

50

40

30

20

RIPPLE REJECTION

10

0

10 100 1000 10000 100000 1000000

FREQUENCY ： f [Hz]

Fig.6 Ripple Rejection

(lo=100mA)

1000

900

800

[µA]

CTL

700

I

：

600

500

400

300

200

CIRCUIT CURRENT

100

0

0 2 4 6 8 10 12 14 16 18 20 22 24

CONTROL VOLTAGE ：V

Fig.9 CTL Voltage vs CTL Current Fig.7 Output Voltage

6

5

Vo [V]

4

：

3

2

OUT PUT VOLT AGE

1

0

130 140 150 160 170 180 190

AMBIENT TEM PERATU RE ： Ta [℃]

Fig.12 Thermal Shutdown

Circuit Characteristics

CTL

[V]

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2010.10 - Rev.

BA3662CP-V5

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●Measurement Circuit for Reference Data

1µF

A

5V

Vo

Vcc

6.8k

Ω

CTL

ADJ

GND

IFEEDBACK _R

+

22µF

2.2k

Ω

Measurement Circuit of Fig.1

Vo

1µ F

Vcc

6.8kΩ

CTL

ADJ

GND

2.2k

5V

Ω

A A

+

22µF

10V

Measurement Circuit of Fig.4

Vo

1µF

10V 10V

Vcc

6.8k

Ω

CTL

ADJ

GND

5V

+

V

22µF

2.2k

Ω

Measurement Circuit of Fig.7

Vo

1µ F

Vcc

6.8kΩ

CTL

ADJ

GND

+

V

22µF

2.2k

Ω

10V

Measurement Circuit of Fig.10

Technical Note

Vo

Vcc

6.8k

1µF

CTL

ADJ

GND

Ω

+

V

22µF

2.2k

Ω

1µF

5V

Measurement Circuit of Fig.2

V

Vo

Vcc

6.8kΩ

ADJ

+

22µF

2.2k

Ω

4.75V

1µ F

CTL

GND

5V

Measurement Circuit of Fig.5

1µF

Vcc

CTL

5V

GND

A

Vo

ADJ

IFEEDBACK _R

6.8k

2.2kΩ

Ω

+

22µF

Measurement Circuit of Fig.8

Vo

Vcc

6.8k

2.2kΩ

Ω

+

22µ F

1µ F

CTL

ADJ

10V

GND

5V

Measurement Circuit of Fig.11

200mA

1Vrms

1µ F

～

10V

5V

Measurement Circuit of Fig.6

1µF

10V

Measurement Circuit of Fig.9

V

1µ F

10V

Measurement Circuit of Fig.12

Vo

Vcc

CTL

ADJ

GND

Measurement Circuit of Fig.3

Vcc

CTL

ADJ

GND

Vcc

A

CTL

GND

Vcc

CTL

GND

5V

6.8k

Ω

+

V

22µF

2.2k

Ω

Vo

6.8k

Ω

+

22µF

2.2k

Ω

Vo

6.8k

Ω

ADJ

2.2k

Ω

Vo

6.8k

Ω

ADJ

2.2kΩ

+

22µF

+

22µ F

200mA

100mA

V

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BA3662CP-V5

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●Block Diagrams

Vcc

Vref

2

1

CTL

Pin No. Pin Name Function

1 CTL Output Control Pin

2 Vcc Power Supply Pin

3 GND GND

4 Vo Output Pin

5 C Adjustable Pin

●To p Vi e w〈Package dimension〉

OVP

TSD OCP

3

GND

Fig.13

Driver

Vref
OVP
OCP

TSD

Driver

:Bandgap Reference
:Over Voltage pro tection
:Over Current pr otection
:Thermal Shut Down
:Power Transistor Driver

5

R1

4

C

R2

Technical Note

VO

+

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Technical Note

●Input / Output equivalent circuit diagrams

Pin CTL Pin Vo Pin C Pin

Vcc

Vcc

CTL

IC

25kΩ

25kΩ

10

k

Ω

Vcc

Vo

5.5 k

Ω

●Output voltage configuration method

Please connect resistors R1 and R2 (which determines the output voltage) as shown in Fig.14.
Please be aware that the offset due to the current that flows from the C terminal becomes large when resistors with large
values are used. The use of resistors with R1=2kΩ to 15kΩ is recommended.

Vo

R2

Vo ≒ Vc × (R1+R2) / R1

IC

Vc≒1.225V

(TYP.)

C pin

R1

Fig.14

C

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BA3662CP-V5

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Technical Note

●Thermal design

W)

（

25

20

15

(1) 20.0

(1)When using a maximum heat sick : θjc=6.25(℃/W)
(2)When using an IC alone : θja=62.5(℃/W )

10

Power Diss ipation Pd

5

(2) 2.0

0

0 25 50 75 100 125 150

Ambient Temperature Ta(℃)

Fig.15

When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.15.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC
at temperatures less than the maximum junction temperature Tjmax.

Fig.15 shows the acceptable loss and heat reducing characteristics of the TO220CP-V5 package. Even when the ambient
temperature Ta is a normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC
at temperatures less than the acceptable loss Pd.

The calculation method for power consumption Pc(W) is as follows.

Pc=(Vcc－Vo)×Io+Vcc×Ib
Acceptable loss Pd≧Pc

Solving this for load current Io in order to operate within the acceptable loss,

Io≦

Pd－Vcc×Ib

Vcc－Vo

Vcc:

Vo:

Io:
Ib:

Ishort:

Input voltage
Output voltage
Load current
Circuit current
Short current

(Please refer to Figs.8 for Ib.)
It is then possible to find the maximum load current Io

Max with respect to the applied voltage Vcc at the time of thermal

design.

Calculation Example)

When Ta=85℃,Vcc=10V,Vo=5V

Io≦

Io≦192mA (Ib:8mA)

1.04－10×Ib

5

With the IC alone :θja=62.5℃/W → -16mW/℃

℃=2.0W → 85℃=1.04W

25

Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :

Pc=Vcc×(Ib+Ishort) (Please refer to Fig.4 for Ishort.)

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●Notes for use

1. Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may
result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode)
when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider
adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.

2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external
circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.

3. GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins
are at a voltage below the GND at any time, regardless of transient characteristics.

4. Ground wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused
by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage. The
power supply and ground lines must be as short and thick as possible to reduce line impedance.

5. Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor
soldering or foreign objects) may result in damage to the IC.

6. Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications
where strong electromagnetic fields may be present.

7. Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to
stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

8. Thermal consideration
Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions.
Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc)

Tjmax : Maximum junction temperature=150[℃], Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage,

Vo : Output Voltage, Io : Load, Ib : Bias Current

Package Power dissipation : Pd (W)=(Tjmax－Ta) /θja
Power dissipation : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib

9. Vcc pin
Insert a capacitor(capacitor≧0.33µF～) bet
application. Be sure to allow a sufficient margin for input voltage levels.

ween the Vcc and GND pins. The appropriate capacitance value varies by

Technical Note

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(

)

Technical Note

10. Vo Terminal
Please attach an anti-oscillation capacitor between Vo and GND. The capacitance of the capacitor may significantly
change due to factors such as temperature changes, which may cause oscillations. Please use a tantalum capacitor or
aluminum electrolytic capacitor with favorable characteristics and small external series resistance (ESR) even at low
temperatures. The output oscillates regardless of whether the ESR is large or small. Please use the IC within the stable
operating region while referring to the ESR characteristics reference data shown in Fig.16. In cases where there are
sudden load fluctuations, the large capacitor is recommended. Below figure, it is ESR-to-Io stability Area characteristics,
measured by 22µF-ceramic-capacitor and resistor connected in series.
This characteristic is not equal value perfectly to 22µF-aluminum electrolytic capacitor in order to measurement method.
Note, however, that the stable range suggested in the figure depends on the IC and the resistance load involved, and can
vary with the board’s wiring impedance, input impedance, and/or load impedance. Therefore, be certain to ascertain the
final status of these items for actual use.
Keep capacitor capacitance within a range of 22µF～1000µF. It is also recommended that a 0.33µF bypass capacitor be
connected as close to the input pin-GND as location possible. However, in situations such as rapid fluctuation of the input
voltage or the load, please check the operation in real application to determine proper capacitance.

Vcc=10V Vo=5V
Ta =2 5 ℃
R1=2kΩ～15kΩ
Cin=0.33µF Cout=22µF

100

10

（Ω）

1

Cout_ESR

0.1
0

Fig.16 Cout_ESR vs Io (reference data)

Unstable operating region

Stable operating region

Unstable operating region

Io[mA]

Cout(22µF)

(0.001Ω～)

Vcc

10V

200 100

300

Cin

(0.33µF)

Vcc

CTL

VCTL

(5V)

GND

※Operation Note 10 Measurement circuit

Vo

ADJ

ESR

R2

R1

(2k～15kΩ)

Io (ROUT)

11. Over current protection circuit (OCP)
The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity.
This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current
(without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These
protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should
not be used in applications characterized by the continuous or transitive operation of the protection circuits.

12. Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of
thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after
this function has activated, or in applications where the operation of this circuit is assumed.

13. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal
state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in
case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent
reverse current flow, or insert bypass diodes between Vcc and each pin.

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Technical Note

14. Positive voltage surges on VCC pin
A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 50V on
the VCC pin.

Vcc

GND

15. Negative voltage surges on VCC pin
A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the
VCC pin.

Vcc

GND

16. Output protection diode
Loads with large inductance components may cause reverse current flow during startup or shutdown. In such cases, a
protection diode should be inserted on the output to protect the IC.

17. Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes
and/or transistors. For example (refer to the figure below):

○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode
○When GND > Pin B, the PN junction operates as a parasitic transistor

Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.

(Pin A)

Resistor

(Pin B)

P+

N

P

P

N

GND GND

P+

N

Parasitic elements

Parasitic elements
or transistors

Example of Simple Monolithic IC Architecture

Transistor (NPN)

C

P+

N

B

E

N

P

N

P substrate

P+

(Pin B)

C

B

E

GND

N

(Pin A)

Parasitic elements
or transistors

Parasitic elements

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BA3662CP-V5

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Technical Note

●Ordering part number

B A 3 6 6 2 C P - V 5 E 2

Part No. Part No.

TO220CP-V5

+0.4

0.2

-

15.2

12.0± 0.2

8.0± 0.2

4.92± 0.2

1.0± 0.2

+0.3

10.0

-

0.82± 0.1

0.92

0.1

φ3.2± 0.1

1.7781.444

4.5±0.1

2.8

(2.85)

4.12

+0.2

-

0.1

0.42± 0.1

1.58

13.60

(1.0)

(Unit : mm)

16.92

Package

CP-V5: TO220CP-V5

<Tape and Reel information>

Embossed carrier tapeTape

Quantity
Direction

of feed

500pcs
E2

The direction is the 1pin of product is at the lower left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

Packaging and forming specification
E2: Embossed tape and reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

Direction of feed

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Notes

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consent of ROHM Co.,Ltd.

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The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.

The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.

Notice

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Please be sure to implement in your equipment using the Products safety measures to guard
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