High Speed with High Voltage
Operational Amplifiers
Datasheet
BA3472, BA3472R, BA3474, BA3474R
●General Description
General-purpose BA3472,BA3472R,BA3474,BA3474R
integrate two/four Independent Op-amps and phase
compensation capacitors on a single chip and have some
features of high-gain, and wide operating voltage range of
+3[V] to +36[V](single power supply). Especially,
characteristics are high slew rate (10[V/μs]) and high
Maximum frequency (4[MHz]).
●Features
Operable with a single power supply
Wide operating supply voltage
Standard Op-Amp. Pin-assignments
Internal phase compensation
High open loop voltage gain
Internal ESD protection
Operable low input voltage around GND level
Wide output voltage range
●Packages (Typ.) (Typ.) (Max.)
MSOP8 2.90mm x 4.00mm x 0.90mm
SSOP-B8 3.00mm x 6.40mm x 1.35mm
SSOP-B14 5.00mm x 6.40mm x 1.35mm
SOP8 5.00mm x 6.20mm x 1.71mm
SOP14 8.70mm x 6.20mm x 1.71mm
●Selection Guide
●Key Specifications
Wide Operating Supply Voltage:
Single supply +3.0[V] to +36.0[V]
Dual supply ±1.5[V] to ±18.0[V]
Wide Temperature Range:
BA3474F -40[°C] to +75[°C]
BA3472F BA3472FV
BA3472FVM BA3474FV -40[°C] to +85[°C]
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause
deterioration of characteristics.
(*1) The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
Input Offset Current (*2) Iio 25℃- 6 75 nAVicm=0[V],VOUT=0[V]
Input Bias Current (*2) Ib 25℃- 100 500 nAVicm=0[V],VOUT=0[V]
Supply Current ICC 25℃- 4 5.5 mARL=∞
High Level Output Voltage VOH 25℃
3.7 4 -
13.7 14 - RL=10[kΩ]
VCC=5[V],RL=2[kΩ]
V
13.5 - - RL=2[kΩ]
- 0.1 0.3 V VCC=5[V],RL=2[kΩ]
Low Level Output Voltage VOL 25℃
- -14.7-14.3RL=10[kΩ]
- - -13.5RL=2[kΩ]
Large Signal Voltage Gain AV 25℃80 100 - dBRL≧2[kΩ],VOUT=±10 [V]
Input Common-mode
Voltage Range
Vicm 25℃0 - VCC-2.0V
VCC=5[V],VEE=0[V],
VOUT=VCC/2
Common-mode Rejection Ratio CMRR 25℃60 97 - dBVicm=0[V],VOUT=0[V]
Power Supply Rejection Ratio PSRR 25℃60 97 - dBVicm=0[V],VOUT=0[V]
VCC=5[V],VIN+=1[V],
Output Source Current (*3) IOH 25℃10 30 - mA
VIN-=0[V],VOUT=0[V]
Only 1ch is short circuit
VCC=5[V],VIN+=0[V],
Output Sink Current (*3) IOL 25℃20 30 - mA
VIN-=1[V],VOUT=5[V],
Only 1ch is short circuit
Maximum Frequency ft 25℃- 4 - MHz-
Slew Rate SR 25℃- 10 - V/μs
Av=1,Vin=-10 to +10[V],
RL=2[kΩ]
Channel Separation CS 25℃- 120 - dB-
(*2) Absolute value
(*3) Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
Large Signal Voltage Gain AV 25℃80 100 - dBRL≧2[kΩ],VOUT=±10 [V]
Input Common-mode
Voltage Range
Vicm 25℃0 - VCC-2.0V
VCC=5[V],VEE=0[V],
VOUT=VCC/2
Common-mode Rejection Ratio CMRR 25℃60 97 - dBVicm=0[V],VOUT=0[V]
Power Supply Rejection Ratio PSRR 25℃60 97 - dBVicm=0[V],VOUT=0[V]
Output Source Current
(*5)
IOH 25℃10 30 - mA
VCC=5[V],VIN+=1[V],
VIN-=0[V], VOUT=0[V]
Only 1ch is short circuit
VCC=5[V],VIN+=0[V],
VIN-=1[V], VOUT=5[V]
Output Sink Current
(*5)
IOL 25℃20 30 - mA
Only 1ch is short circuit
Maximum Frequency ft 25℃- 4 - MHz-
Slew Rate SR 25℃- 10 - V/μs
Av=1,Vin=-10 to +10[V],
RL=2[kΩ]
Channel Separation CS 25℃- 120 - dB-
(*4) Absolute value
(*5) Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
Large Signal Voltage Gain AV 25℃80 100 - dBRL≧2[kΩ], VOUT=±10 [V]
Input Common-mode Voltage
Range
Vicm 25℃0 - VCC-2.0V
VCC=5[V],VEE=0[V],
VOUT=VCC/2
Common-mode Rejection Ratio CMRR 25℃60 97 - dBVicm=0[V],VOUT=0[V]
Power Supply Rejection Ratio PSRR 25℃60 97 - dBVicm=0[V],VOUT=0[V]
Output Source Current
(*7)
IOH 25℃10 30 - mA
VCC=5[V],VIN+=1[V],
VIN-=0[V], VOUT=0[V]
Only 1ch is short circuit
VCC=5[V],VIN+=0[V],
VIN-=1[V], VOUT=5[V]
Output Sink Current
(*7)
IOL 25℃20 30 - mA
Only 1ch is short circuit
Maximum Frequency ft 25℃- 4 - MHz-
Slew Rate SR 25℃- 10 - V/μs
Av=1,Vin=-10 to +10[V],
RL=2[kΩ]
Channel Separation CS 25℃- 120 - dB-
(*6) Absolute value
(*7) Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
VIN-=0[V],VOUT=0[V],
Only 1ch is short circuit
VCC=5[V],VIN+=0[V],
IOL
25℃
20 30 - mA
VIN-=1[V],VOUT=5[V],
Only 1ch is short circuit
ft 25℃- 4 - MHz
-
Slew Rate
Channel Separation
(*8) Absolute value
(*9) Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
Described below are descriptions of the relevant electrical terms
Please note that item names, symbols and their meanings may differ from those on another manufacturer’s documents.
1. Absolute maximum ratings
The absolute maximum ratings are values that should never be exceeded, since doing so may result in deterioration of
electrical characteristics or damage to the part itself as well as peripheral components.
1.1 Power supply voltage (VCC-VEE)
Expresses the maximum voltage that can be supplied between the positive and negative supply terminals without
causing deterioration of the electrical characteristics or destruction of the internal circuitry.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without
damaging the IC.
1.3 Input common-mode voltage range (Vicm)
Signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing
deterioration of the characteristics or damage to the IC itself. Normal operation is not guaranteed within the
common-mode voltage range of the maximum ratings – use within the input common-mode voltage range of the
electric characteristics instead.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by a particular mounted board at ambient temperature (25℃). For
packaged products, Pd is determined by the maximum junction temperature and the thermal resistance.
2. Electrical characteristics
2.1 Input offset voltage (Vio)
Signifies the voltage difference between the non-inverting and inverting terminals. It can be thought of as the input
voltage difference required for setting the output voltage to 0 V.
2.2 Input offset current (Iio)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
2.3 Input bias current (Ib)
Denotes the current that flows into or out of the input terminal, it is defined by the average of the input bias current at
the non-inverting terminal and the input bias current at the inverting terminal.
2.4 Circuit current (ICC)
Indicates the current of the IC itself that flows under specified conditions and during no-load steady state.
2.5
maximum output voltage (VOM)
Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into
high-level output voltage and low-level output voltage.
2.6 Large signal voltage gain (AV)
The amplifying rate (gain) of the output voltage against the voltage difference between non-inverting and inverting
terminals, it is (normally) the amplifying rate (gain) with respect to DC voltage.
AV = (output voltage fluctuation) / (input offset fluctuation)
2.7 Input common-mode voltage range (Vicm)
Indicates the input voltage range under which the IC operates normally.
2.8 Common-mode rejection ratio (CMRR)
Signifies the ratio of fluctuation of the input offset voltage when the in-phase input voltage is changed (DC fluctuation).
CMRR = (change in input common-mode voltage) / (input offset fluctuation)
2.9 Power supply rejection ratio (PSRR)
Denotes the ratio of fluctuation of the input offset voltage when supply voltage is changed (DC fluctuation).
SVR = (change in power supply voltage) / (input offset fluctuation)
2.10 Channel separation (CS)
Expresses the amount of fluctuation of the input offset voltage or output voltage with respect to the change in the
output voltage of a driven channel.
2.11 Slew rate (SR)
Indicates the time fluctuation ratio of the output voltage when an input step signal is supplied.
2.12 Maximum frequency (ft)
Indicates a frequency where the voltage gain of Op-Amp is 1.
2.13 Total harmonic distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.14 Input referred noise voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja[℃/W].The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.98 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:
θja = (Tj-Ta) / Pd [℃/W] ・・・・・ (Ⅰ)
Derating curve in Fig.98 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Fig.99(c) ~ (f) shows a derating curve for an example of BA3472, BA3474, BA3472R,
BA3474R.
θja = ( Tj ーTa ) / Pd [℃/W]
Ambient temperature
周囲温度
Ta [℃]
Power dissipation of LSI
LSI
の消費電力
Pd (max)
P2
P1
[W]
θja2 < θja1
θ' ja2
θ ja2
Chip surface temperature
Power dissipation Pd [W]
チップ表面温度
消費電力P [W]
(a) Thermal resistance
1000
780mW(*10)
800
690mW(*11)
590mW(*12)
600
Pd [mW]
400
許容損失
POWER DISSIPATION Pd [mW]
1000
Pd [mW]
許容損失
POWER DISSIPATION Pd [mW]
BA3472FVM
200
0
0255075100125
Ambient Temperature: Ta [℃]
周囲温度
(c)BA3472
937mW(*17)
800
713mW(*16)
625mW(*15)
600
590mW(*12)
400
200
0
0255075100125
Ambient Temperature: Ta [℃] Ambient Temperature: Ta [℃]
1) Unused circuits
When there are unused circuits it is recommended that they are connected
as in Fig.100, setting the non-inverting input terminal to a potential within
input common-mode voltage range (Vicm).
2) Input terminal voltage
Applying GND + 36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, irrespective of
the supply voltage. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage is
within the common mode input voltage range of the electric characteristics.
3) Power supply (single / dual)
The op-amp operates when the specified voltage supplied is between VCC
and VEE. Therefore, the single supply op-amp can be used as dual supply
op-amp as well.
4) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in
chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation
(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating
curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and
the power supply, or the output and GND may result in IC destruction.
6) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
7) Radiation
This IC is not designed to withstand radiation.
8) IC handing
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezoelectric (piezo) effects.
9) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the
power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly
process as well as during transportation and storage.
10) Output capacitor
Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE,
causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation
due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance
less than 0.1µF.
Please keep this
potential in Vicm
Fig.100 Unused circuit example
+
-
Datasheet
VCC
VEE
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA
equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be
used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft,
nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose
malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the
ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life,
sufficient fail-safe measures must be taken, including the following:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits in the case of single-circuit failure
2) The products are designed for use in a standard environment and not in any special environments. Application of the
products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of
product performance, prior to use, is recommended if used under the following conditions:
[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents
[b] Use outdoors where the products are exposed to direct sunlight, or in dusty places
[c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl
and NO
[d] Use in places where the products are exposed to static electricity or electromagnetic waves
[e] Use in proximity to heat-producing components, plastic cords, or other flammable items
[f] Use involving sealing or coating the products with resin or other coating materials
[g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering
[h] Use of the products in places subject to dew condensation
2
2, H2S, NH3, SO2,
3) The products are not radiation resistant.
4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised.
5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta).
When used in sealed area, confirm the actual ambient temperature.
7) Confirm that operation temperature is within the specified range described in product specification.
8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed.
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect
product performance and reliability.
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
Company in advance.
Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics
of the products and external components, including transient characteristics, as well as static characteristics.
2) The application examples, their constants, and other types of information contained herein are applicable only when
the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient
consideration to external conditions must be made.
Notice - Rev.001
Datasheet
●Precaution for Electrostatic
This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper
caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products.
Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from
charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the products are stored in the following places:
[a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] Where the temperature or humidity exceeds those recommended by the Company
[c] Storage in direct sunshine or condensation
[d] Storage in high Electrostatic
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is
exceeding recommended storage time period .
3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may
occur due to excessive stress applied when dropping of a carton.
4) Use products within the specified time after opening a dry bag.
●Precaution for product label
QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a
internal part number that is inconsistent with an product part number.
●Precaution for disposition
When disposing products please dispose them properly with a industry waste company.
●Precaution for Foreign exchange and Foreign trade act
Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act,
please consult with ROHM in case of export.
●Prohibitions Regarding Industrial Property
1) Information and data on products, including application examples, contained in these specifications are simply for
reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other
rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for:
[a] infringement of the intellectual property rights of a third party
[b] any problems incurred by the use of the products listed herein.
2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial
property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use,
sell, or dispose of the products.
Datasheet
Notice - Rev.001
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