Rohde&Schwarz R&S®TS-PCA3 Compact TSVP System Manual System Manual
R&S®TSVP
Production Test Platform
System Manual
(;ÜPL2)
1178322802
Version 05
This manual describes the following R&S®TSVP models:
●
R&S® CompactTSVP (1152.2518.02)
●
R&S®PowerTSVP (1157.8043.02)
© 2021 Rohde & Schwarz GmbH & Co. KG
Mühldorfstr. 15, 81671 München, Germany
Phone: +49 89 41 29 - 0
Email: info@rohde-schwarz.com
Internet: www.rohde-schwarz.com
Subject to change – data without tolerance limits is not binding.
R&S® is a registered trademark of Rohde & Schwarz GmbH & Co. KG.
Trade names are trademarks of the owners.
1178.3228.02 | Version 05 | R&S®TSVP
The following abbreviations are used throughout this manual: R&S®xyz1234 is abbreviated as R&S xyz1234.
1
Risk of injury and instrument damage
The instrument must be used in an appropriate manner to prevent
personal injury or instrument damage.
● Do not open the instrument casing.
● Read and observe the "Basic Safety Instructions" delivered as
printed brochure with the instrument.
● Read and observe the safety instructions in the following sections.
Note that the data sheet may specify additional operating conditions.
● Keep the "Basic Safety Instructions" and the product documentation
in a safe place and pass them on to the subsequent users.
Riesgo de lesiones y daños en el instrumento
El instrumento se debe usar de manera adecuada para prevenir
descargas eléctricas, incendios, lesiones o daños materiales.
● No abrir la carcasa del instrumento.
● Lea y cumpla las "Instrucciones de seguridad elementales"
suministradas con el instrumento como folleto impreso.
● Lea y cumpla las instrucciones de seguridad incluidas en las
siguientes secciones. Se debe tener en cuenta que las
especificaciones técnicas pueden contener condiciones adicionales
para su uso.
● Guarde bien las instrucciones de seguridad elementales, así como
la documentación del producto, y entréguelas a usuarios
posteriores.
Safety Instructions
Instrucciones de seguridad
Sicherheitshinweise
Consignes de sécurité
1171.1307.42 - 05
2
Gefahr von Verletzungen und Schäden am Gerät
Betreiben Sie das Gerät immer ordnungsgemäß, um elektrischen
Schlag, Brand, Verletzungen von Personen oder Geräteschäden zu
verhindern.
● Öffnen Sie das Gerätegehäuse nicht.
● Lesen und beachten Sie die "Grundlegenden Sicherheitshinweise",
die als gedruckte Broschüre dem Gerät beiliegen.
● Lesen und beachten Sie die Sicherheitshinweise in den folgenden
Abschnitten; möglicherweise enthält das Datenblatt weitere
Hinweise zu speziellen Betriebsbedingungen.
● Bewahren Sie die "Grundlegenden Sicherheitshinweise" und die
Produktdokumentation gut auf und geben Sie diese an weitere
Benutzer des Produkts weiter.
Risque de blessures et d'endommagement de l'appareil
L'appareil doit être utilisé conformément aux prescriptions afin d'éviter
les électrocutions, incendies, dommages corporels et matériels.
● N'ouvrez pas le boîtier de l'appareil.
● Lisez et respectez les "consignes de sécurité fondamentales"
fournies avec l’appareil sous forme de brochure imprimée.
● Lisez et respectez les instructions de sécurité dans les sections
suivantes. Il ne faut pas oublier que la fiche technique peut indiquer
des conditions d’exploitation supplémentaires.
● Gardez les consignes de sécurité fondamentales et la
documentation produit dans un lieu sûr et transmettez ces
documents aux autres utilisateurs.
1171.1307.42 - 05
R&S®TSVP
Contents
Contents
1 System Overview................................................................................... 5
2 Introduction Production Test Platforms.............................................. 7
3 Introduction Software..........................................................................26
4 Introduction Modules...........................................................................36
5 Introduction Specific Modules............................................................68
6 Use Case Examples............................................................................. 70
7 Installation of R&S CompactTSVP and R&S GTSL...........................74
3System Manual 1178.3228.02 ─ 05
R&S®TSVP
Contents
4System Manual 1178.3228.02 ─ 05
R&S®TSVP
System Overview
System Architecture
1 System Overview
1.1 Usage
There is a heightened interest in testing departments to configure the required functions in compact units as flexibly as possible so that future requirements can be covered without any need for large additional investments.
Moreover, constantly reduced product development times call for powerful, easy-tooperate and standardized software components which can be integrated as reusable
modules in a multitude of applications.
Customer requirements, particularly in the telecommunications and automotive electronics sector, emphasize power density and modularity, thus clearly pointing to platform-based Test & Measurement equipment that is favourably priced and suitable for
industry.
1.2 System Architecture
TSVP test platform was to provide users with an extremely wide portfolio of T & M
methods of modern test equipment. This was accomplished by consistently using open
industrial standards such as CompactPCI / PXI and CAN. In addition to Rohde &
Schwarz modules, other commercially available hardware components that support
these standards can be integrated into the system without any modifications.
The measurement and switching modules are designed for flexible use in the function
test of electronics modules. This test can be optionally expanded to a combination test
by means of in-circuit testing of components. This is a unique capability based on the
CompactPCI/PXI standard.
5System Manual 1178.3228.02 ─ 05
R&S®TSVP
System Overview
System Architecture
Figure 1-1: Modular System Architecture of the TSVP Test Platform
6System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S CompactTSVP (R&S®TS-PCA3)
2 Introduction Production Test Platforms
2.1
R&S CompactTSVP (R&S
The Test System Versatile Platform R&S TS-PCA3 is a standardized modular plat-
form for the program-controlled testing of modules and terminals in the factory or laboratory. With its flexible configuration and the use of worldwide standards, it can be perfectly adapted to suit the needs of the user.
The functionality is achieved with the R&S TS-PSYS1. It is found in the rear I/O slot 15
of the R&S TS-PCA3. The R&S TS-PSYS1 system module is controlled via cPCI-interface.
System functions such as voltage and temperature monitoring, switchable trigger signals and optocoupler interface are used to integrate the CompactTSVP and PowerTSVP in a complete system.
The module is available in two variants:
●
TS-PSYS1 1157.4004.02 (obsolete)
●
TS-PSYS1 1157.9910.10
The R&S TS-PSYS1 has CAN controller (CAN2 User). Buses of the controller are
available on X30 connector. They allow, with help of the jumper on connector X40 to
connect the module with the front module TS-PMB located in the slot 15. The CAN2
controller is operated via SW module RSCAN.
Larger ATE (Automatic Test Equipment) systems can be created by combining R&S
TS-PCA3 and PowerTSVP (TS-PWA3). The production test platform is intended for
use with a control processor which performs the test on the test devices by means of
peripheral modules. This control processor is known as the system controller and
should preferably be in the R&S TS-PCA3. However a standard PC can also be used
running across a suitable interface with the controller. The system controller executes
user-created sequences that define the test procedures and specification limits.
®
TS-PCA3)
The modules plugged into the R&S TS-PCA3 can be used for the creation of test and
control signals and for the measuring related evaluation of the response from the UUT.
For this purpose they are able to pass signals between each other and select signals
under program control and pass them to external measuring systems.
The peripheral modules can be quickly and flexibly adapted to the test devices by preceding the R&S TS-PCA3 with an adapter frame which connects the signals securely
and with a low rate of wear.
If the production test requires switching functions with a large number of channels or
the switching of high currents, then the R&S TS-PCA3 can be supplemented by a R&S
TS-PWA3. The R&S TS-PWA3 is controlled via the CAN-Bus of the R&S TS-PCA3 by
the system controller.
7System Manual 1178.3228.02 ─ 05
R&S®TSVP
2.1.1 Design
2.1.1.1 Slot Layout
Introduction Production Test Platforms
R&S CompactTSVP (R&S®TS-PCA3)
Plan View
Figure 2-1: Plan View (Example)
8System Manual 1178.3228.02 ─ 05
R&S®TSVP
2.1.1.2 Backplanes
Introduction Production Test Platforms
R&S CompactTSVP (R&S®TS-PCA3)
Side View
Figure 2-2: Side View
The R&S TS-PCA3 contains the following backplanes:
●
cPCI backplane with PICMG Power Interface and Rear I/O support
●
Analog bus backplane
●
Power backplane with PICMG Power Interface (optional)
Figure 2-3 shows the backplanes with the bus systems.
Figure 2-3: Backplanes and Bus Systems
cPCI Backplane
The cPCI backplane is implemented as follows:
●
●
●
●
3 U
72 HP
32 bit
33 MHz
9System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S CompactTSVP (R&S®TS-PCA3)
●
V
= 5 V
i/o
The backplane fulfils the Hot-Swap capability according to Standard PICMG 2.1 Rev.
2.0 for the exchange of measuring and control cards during operation. The 32 bit area
conforms to PICMG 2.0 Rev. 3.0. It should be noted that ROHDE & SCHWARZ
TSVP modules (R&S TS-XXX) are not capable of hot swapping.
Connector X0 (P47) serves as a power interface for a cPCI standard PSU. An additional PSU can be plugged onto an optional power backplane, in which case the connection with the cPCI backplane is made with an ATX power supply cable.
Slots 1 to 8 are the first bus segment. Slots 9 to 15 form the second bus segment that
is connected to the first with a PCI-PCI bridge. Slot 15 with its rear exit for the P1 signals is designed to control the system module.
The Rear I/O conforms to IEEE 1101.11-1998. The P20 connectors at slots 3 and 4 are
manufactured to cPCI standard, 32 bit with Rear I/O. Voltages up to 125 VDC can be
applied at pins provided in the Rear I/O area.
Signals PXI_TRIG0 ... 7 and PXI_CLK10 according to standard PXI R2.0 are available
at the P20 connections in slots 5 to 16.
Local bus
The PXI local bus is not implemented. If necessary, wiring can be created between
adjacent slots by plugging in a customer-specific connection board (plugged into the
backplane).
CAN-Bus
The CAN bus *[1] is integrated as a further system bus in addition to the IPMB0 (slots
3 to 14) according to System Management Specification PICMG 2.9 R1.0, and is available at slots 5 to 16 (starting with backplane version V4.x in slots 3 and 4 as well). Signals CAN_L and CAN_H can be terminated at the bus end with a jumper and 120 Ohm
resistor (see Figure 2-4). Alternatively the bus can be extended externally with an X80
expansion connector.
* [1] to standard CAN 2.0b (1Mbit)
If the optional R&S TS-PXB2 backplane extension is used, the CAN bus is also available at slots A1 and A2. The R&S TS-PXB2 is connected to the main backplane via
X80. The use of the backplane extension does not change the termination principle.
Figure 2-4: CAN Bus Termination
10System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S CompactTSVP (R&S®TS-PCA3)
Table 2-1: CAN Bus
Number
Lines
2 5 CAN_H: P20/C1
U
max
(VDC)
Pin
CAN_L: P20/D1
In the old design V1.0 - V3.0, the CAN bus is bussed directly, guided via PXI local bus
lines LBL10 and LBL11. In the most unfavorable case, this resulted in conflicts with
other PXI modules that were using the lines in a different way.
In the new design V4.0, the CAN bus is switched. The two signals are only switched by
PhotoMOS relays on the backplane to the pins of a slot if a CAN module is detected in
that slot. In that case the switch behaves like an isolating relay and does not affect the
signals of the LBxx. It is able to isolate voltages up to ±60 V DC.
PCI slots 3 + 4 now have this switch in the backplane and are thus CAN-capable. The
CAN bus is continuously connected on slots 15 + 16 and (optional) on A1 +A2 without
switching.
A 330 Ω pull-up resistor between P2/D18 and +5 V on each module is responsible for
detecting a CAN module and activating the CAN bus. Normal cPCI or PXI modules
according to specification apply this pin to GND or leave it open. This ensures the CAN
bus is never in conflict with analogue voltages of the local bus.
Figure 2-5: Wiring CAN bus
External additional signals (AUX)
Two additional external signals (for example power supply voltages) can be fed into a
module via J20 on slots 5 through 16. The signals can be fed in the area of the CPCI
power pack by the CPCI power supply, an internal AC/DC module or another external
11System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S CompactTSVP (R&S®TS-PCA3)
signal sources. This can be used to provide a primary voltage to generate local supply
voltages (DC/DC converter), etc.
Table 2-2: External Additional Signals
Number
Lines
2 60 2 Input for ext. signals:
U
max
(VDC)
I
/ Slot (ADC) Pin
max
J20: AUX1 B20, E19
J20: AUX2 A20, D19
+5-V and +12-V lines from the P47 connector are routed on the screw bolts above slot
4. This makes it easy to connect AUX1 with +5 V and AUX2 with +12 V via current rail
or cable (see Figure 2-6).
Figure 2-6: Mountable Threaded Studs on the cPCI Backplane
The AUX pins assigned to slots 5 - 16 make it possible to direct two voltages from the
current rail on the upper backplane if a screw there connects the backplane signals
with the current rail. Currently in backplanes V1.1 through V3.0 two pins are hard connected to carry a higher current.
This is changed in backplane V4.0 so the two pins are not connected in normal state.
One pin (for example AUX1L) on the solder side is directed to the current rail and one
pin (AUX1R) on the module side is directed to the current rail as well. The connection
is not made until a screw with a nut is screwed in and connects the current rail and the
two copper rings in the layout. It may be preferably to insert a toothed washer to
ensure better contact.
Functionally this is no different than the previous version. The PXI specification is
observed except for the lack of a local bus daisy chain. Full current must not be drawn
unless the two pins are connected in parallel.
12System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S CompactTSVP (R&S®TS-PCA3)
Figure 2-7: Connecting the current rail to AUX signals
Analog Bus Backplane
To simplify cabling, the R&S TS-PCA3 contains an analog bus with 8 signals. The analog bus backplane is located in the front above the cPCI backplane. A special layout
meets the need for high crosstalk damping and low capacitance of the signal lines to
GND.
The C module (2 mm connector system) is used as the connectors (X1...X16). Plug-in
modules with no analog bus connector access the analog bus via a 26-pin connector
(X22) and R&S switch modules. Signals IL1_x and IL2_x (Instrument Line) are passed
from slots 5 to 16 to connector X22.
The analog bus signals pass from connector X21 to connector X2 at the back of the
R&S TS-PCA3. The electrical characteristics of the analog lines are:
●
Voltage 125 VDC max.
●
Current 1 A max.
Concept of the Analog Bus
Figure 2-8: Principle of the Analog Bus
The analog bus in the R&S TS-PCA3 connects I/O channels of different plug-in modules to each other. These I/O channels may be connections of instruments (measuring
and stimuli devices) and connections of the test device. Up to 8 signals can be connected simultaneously (see Figure 2-8).
The analog bus can be used flexibly with the ROHDE & SCHWARZ- specific plug-in
modules. 8 equivalent lines are basically available (ABa1, ABa2, ABb1, ABb2, ABc1,
ABc2, ABd1, ABd2). External instruments are usually connected to the R&S TS-PCA3
13System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S CompactTSVP (R&S®TS-PCA3)
with a rear I/O connection. The signals for the test device are made available at the
front-end connector of the various plug-in modules on the R&S TS-PCA3.
The analog bus can be used in different ways:
●
as 1 bus with 8 lines
●
in 2 part-buses with 4 lines each
The split of the analog bus into part-buses depends on the plug-in modules which are
used.
The analog bus concept of the R&S TS-PCA3 fully meets the requirements that are
frequently made in metrology:
●
A small number of bus lines for a high number of I/O channels (e.g. In-Circuit-Test
with 3 to 6 bus lines.)
●
As many signals as possible simultaneously for a moderate number of I/O channels (e.g. function test with 8 lines of 50 to 100 I/O channels).
●
Parallel test with split analog bus.
Line paths or higher-frequency signals are usually connected locally by special switching modules and not via the analog bus.
Typical Use of the Analog Bus
The use of the analog bus and individual bus lines is illustrated with available R&S
modules and standard modules (see Figure 2-9).
Figure 2-9: Use of the Analog Bus in the R&S TS-PCA3 (Example)
Power Backplane
The use of a second cPCI PSU in slots A1, A2 requires the optional Power Backplane
(conforms to standard PICMG 2.0). From the Power Backplane, a cable with three connectors leads to a 24-pin ATX connector on the cPCI backplane. The three connectors
are as follows:
14System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S CompactTSVP (R&S®TS-PCA3)
●
X12, 20-pin
●
X13, 10-pin
●
X16, 4-pin
The second PSU can be used to boost the power of the standard PSU when connected in parallel. Alternatively it can be used to supply the device on test.
Backplane Extension R&S TS-PXB2 (Option)
The R&S TS-PXB2 option expands the Test System Versatile Platform R&S TS-PCA3
by 2 CAN bus slots (A1 and A2). It can be integrated ex works only.
The two slots are intended for the R&S TS-PIO3B or R&S TS-PTR options. The R&S
TS-PIO3B is an 8-channel, 8-bit Open Collector Digital I/O card with additional functions.
The R&S TS-PTR is a passive feedthrough circuit board. It can be used to feed as
many as 24 signals through the device.
Ports 5, 6 and 7 of the R&S TS-PIO3B in slot A1 are routed to connector X1 on the
rear panel.
Ports 5, 6 and 7 of the R&S TS-PIO3B in slot A2 are available on connector DIO on the
rear I/O slot A4.
In addition, the system CAN bus is available at the CAN connector on the rear I/O slot
A4.
The option R&S TS-PXB2 cannot be used together with the power backplane. The
jumpers and the assignment of the connectors in the rear I/O area are described in
Chapter 2.1.1.4, "Permitted Module Configuration", on page 15.
2.1.1.3 Function Description
The functionality of the R&S TS-PCA3 depends essentially on the installed plug-in
modules and the related software. The R&S TS-PCA3 is basically suitable for all types
of production tests.
An adapter interface can be flange-mounted to the front of the R&S TS-PCA3 for the
rapid and high-pole adaption of test devices.
2.1.1.4 Permitted Module Configuration
Because of the different properties of plug-in modules, there are restrictions on the use
of plug-in slots.
Figure 2-10 and Figure 2-11 shows an overview of which modules can be operated in
which plug-in slots.
15System Manual 1178.3228.02 ─ 05
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Introduction Production Test Platforms
R&S CompactTSVP (R&S®TS-PCA3)
Figure 2-10: Module Configuration R&S TS-PCA3 (Backplane Version 2.1 and 3.x)
16System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S PowerTSVP (R&S®TS-PWA3)
2.2
Figure 2-11: Module Configuration R&S TS-PCA3
R&S PowerTSVP (R&S
®
TS-PWA3)
The Test System Versatile Platform R&S TS-PWA3 is a standardized modular plat-
form for the program-controlled testing of modules and terminals in the factory or laboratory. With its flexible configuration and the use of worldwide standards, it can be perfectly adapted to suit the needs of the user.
The R&S TS-PWA3 is primarily intended as a flexible switching unit for measurement
signals, signal sources and UUT loads. This facilitates the migration of existing and
proprietary "Rack and Stack" systems to a production test platform.
The functionality is achieved with the R&S TS-PSYS2. It is found in the rear I/O slot 15
of the R&S TS-PWA3.
The module is available in two variants:
●
TS-PSYS2 1157.8508.02 (obsolete)
17System Manual 1178.3228.02 ─ 05
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Introduction Production Test Platforms
R&S PowerTSVP (R&S®TS-PWA3)
●
TS-PSYS2 1157.9910.20
The R&S TS-PSYS2 1157.9910.20 module is identically constructed as the R&S TSPSYS1 1157.9910.10 module of the R&S TS-PCA3. The difference is in the programming of the flash memory. If the module operates in a PowerTSVP, the function of the
PCI port is automatically deactivated. Also, in this mode the CAN controller is not available.
R&S TS-PCA3 and R&S TS-PWA3 can be combined to create more complex ATE
(Automatic Test Equipment) systems with a high number of test pins. The R&S TSPWA3 is controlled either by the system controller of a R&S TS-PCA3 (cPCI system)
or by an external PC. A serial bus system (CAN bus) is used to trigger the modules in
the R&S TS-PWA3. External cabling is used to make the connection with the measurement and trigger bus of the R&S TS-PCA3.
The R&S TS-PWA3 can be fitted with special ROHDE & SCHWARZ switching and load
modules. The unit provides an analog bus that can be used to make complex connections. The modules can also be used without any modification in the R&S TS-PCA3.
The peripheral modules can be quickly and flexibly adapted to the UUTs by preceding
the Test System Versatile Platform with an adapter frame which connects the signals
securely and with a low rate of wear.
18System Manual 1178.3228.02 ─ 05
R&S®TSVP
2.2.1 Design
2.2.1.1 Slot Layout
Introduction Production Test Platforms
R&S PowerTSVP (R&S®TS-PWA3)
Plan View
Figure 2-12: Plan View (Example)
19System Manual 1178.3228.02 ─ 05
R&S®TSVP
2.2.1.2 Backplanes
Introduction Production Test Platforms
R&S PowerTSVP (R&S®TS-PWA3)
Side View
Figure 2-13: Side View
The R&S TS-PWA3 contains the following backplanes:
●
Control backplane with PICMG Power Interface and Rear I/O support
●
Analog bus backplane
Figure 2-14 shows the backplanes with the bus systems.
Figure 2-14: Backplanes and Bus Systems
Control Backplane
The control backplane is implemented for 16 plug-in modules to R&S format with front
slots. The P2 connector of the cPCI system is used for the control interface. Pin
assignment is R&S-specific (designation: P20) and compatible with the R&S CompactTSVP, so plug-in modules for the R&S PowerTSVP can also be operated in the
R&S CompactTSVP.
20System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S PowerTSVP (R&S®TS-PWA3)
Connector X0 (P47) serves as a power interface for a cPCI standard PSU. An additional PSU can be plugged onto an optional power backplane, in which case the connection with the control backplane is made with an ATX power supply cable.
Support for the Rear I/O concept according to Standard IEEE 1101.11-1998 is implemented for P20. Voltages up to 125 VDC can be routed in the Rear I/O area.
The PXI trigger bus according to PXI R2.0 is also implemented.
The CAN bus (according to standard CAN 2.0b (1Mbit)) is integrated as the management bus, and is available at all slots. Signals CAN_L and CAN_H can be terminated
with jumpers and resistors (Figure 2-15). Instead of being terminated, the bus can be
extended externally using the extension connector X80.
If the optional R&S TS-PXB2 backplane extension is used, the CAN bus is also available at slots A1 and A2. The R&S TS-PXB2 is connected to the main backplane via
X80. The use of the backplane extension does not change the termination principle.
Figure 2-15: CAN Bus Termination
Table 2-3: CAN Bus
Number Lines U max (VDC) Pin
2 5 CAN_H: P20/C1
CAN_L: P20/D1
Two additional external signals (e.g. supply voltages) can be fed in via a plug-in module in P20. This input can come from an internal AC/DC module or from other external
signal sources. One way in which this feature can be used is to provide a primary voltage for generating local supply voltages (DC/DC converter).
Table 2-4: External Additional Signals
Number Lines U max (VDC) Imax/Slot(ADC) Pin
2 60 2 input for ext. signals:
P20: AUX1 B20, E19
P20: AUX2 A20, D19
Lines with +5 V and +12 V are taken from connector X0 (P47) to optional threaded
studs. This makes it easy to connect AUX1 to +5 V and AUX2 to +12 V, e.g. using an
optional bus bar or cable (see Figure 2-16).
21System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S PowerTSVP (R&S®TS-PWA3)
Figure 2-16: Mountable Threaded Studs on the Control Backplane
Analog Bus Backplane
To simplify cabling, the R&S TS-PWA3 contains an analog bus with 8 signals. The analog bus backplane is located in the front above the cPCI backplane. A special layout
meets the need for high crosstalk damping and low capacitance of the signal lines to
GND.
The C module (2 mm connector system) is used as the connectors (X1...X16). Plug-in
modules with no analog bus connector access the analog bus via a 26-pin connector
(X22) and R&S switch modules. Signals IL1_x and IL2_x (Instrument Line) are passed
from slots 5 to 16 to connector X22.
The analog bus signals pass from connector X21 to connector X2 at the back of the
R&S TS-PWA3. The electrical characteristics of the analog lines are:
●
Voltage 125 VDC max.
●
Current 1 A max.
22System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S PowerTSVP (R&S®TS-PWA3)
Concept of the Analog Bus
Figure 2-17: Principle of the Analog Bus
The analog bus in the R&S TS-PWA3 connects I/O channels of different plug-in modules to each other. These I/O channels may be connections of instruments (measuring
and stimuli devices) and connections of the test device. Up to 8 signals can be connected simultaneously (see Figure 2-17).
The analog bus can be used flexibly with the ROHDE & SCHWARZ- specific plug-in
modules. 8 equivalent lines are basically available (ABa1, ABa2, ABb1, ABb2, ABc1,
ABc2, ABd1, ABd2). External instruments are usually connected to the R&S TS-PWA3
with a rear I/O connection. The signals for the test device are made available at the
front-end connector of the various plug-in modules on the R&S TS-PWA3.
The analog bus can be used in different ways:
●
as 1 bus with 8 lines
●
in 2 part-buses with 4 lines each
The split of the analog bus into part-buses depends on the plug-in modules which are
used and the application that is to be implemented.
The analog bus concept of the R&S TS-PWA3 fully meets the requirements that are
frequently made in metrology:
●
A small number of bus lines for a high number of I/O channels (e.g. In-Circuit-Test
with 3 to 6 bus lines.)
●
As many signals as possible simultaneously for a moderate number of I/O channels (e.g. function test with 8 lines of 50 to 100 I/O channels).
●
Parallel test with split analog bus.
Line paths or higher-frequency signals are usually connected locally by special switching modules and not via the analog bus.
Typical Use of the Analog Bus
The use of the analog bus and individual bus lines is illustrated with available R&S
modules and standard modules (see Figure 2-18).
23System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Production Test Platforms
R&S PowerTSVP (R&S®TS-PWA3)
Figure 2-18: Use of the Analog Bus in the R&S TS-PWA3 (Example)
Power Backplane
The use of a second cPCI PSU in slots A1, A2 requires the optional Power Backplane
(conforms to standard PICMG 2.0). From the Power Backplane, a cable with three connectors leads to a 24-pin ATX connector on the cPCI backplane. The three connectors
are as follows:
●
X12, 20-pin
●
X13, 10-pin
●
X16, 4-pin
The second PSU can be used to boost the power of the standard PSU when connected in parallel. Alternatively it can be used to supply the device on test.
Backplane Extension R&S TS-PXB2 (Option)
The R&S TS-PXB2 option expands the Test System Versatile Platform R&S TS-PWA3
by 2 CAN bus slots (A1 and A2). It can be integrated ex works only.
The two slots are intended for the R&S TS-PIO3B or R&S TS-PTR options. The R&S
TS-PIO3B is an 8-channel, 8-bit Open Collector Digital I/O card with additional functions.
The R&S TS-PTR is a passive feedthrough circuit board. It can be used to feed as
many as 24 signals through the device.
Ports 5, 6 and 7 of the R&S TS-PIO3B in slot A1 are routed to connector X1 on the
rear panel.
Ports 5, 6 and 7 of the R&S TS-PIO3B in slot A2 are available on connector DIO on the
rear I/O slot A4.
In addition, the system CAN bus is available at the CAN connector on the rear I/O slot
A4.
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R&S®TSVP
2.2.1.3 Function Description
2.2.1.4 Permitted Module Configuration
Introduction Production Test Platforms
R&S PowerTSVP (R&S®TS-PWA3)
The option R&S TS-PXB2 cannot be used together with the power backplane. The
jumpers and the assignment of the connectors in the rear I/O area are described in
Chapter 2.2.1.4, "Permitted Module Configuration", on page 25.
The functionality of the R&S TS-PWA3 depends essentially on the installed plug-in
modules and the related software. The R&S TS-PWA3 is basically suitable for all types
of production tests.
An adapter interface can be flange-mounted to the front of the R&S TS-PWA3 for the
rapid and high-pole adaption of test devices.
Because of the different properties of plug-in modules, there are restrictions on the use
of plug-in slots.
Figure 2-19 shows an overview of which modules can be operated in which plug-in
slots.
Figure 2-19: Module Configuration R&S TS-PWA3
25System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Software
R&S GTSL
3 Introduction Software
3.1 R&S GTSL
The Generic Test Software Library R&S GTSL is a collection of libraries for specific test
tasks like measurements, switching and signal generation. An ASCII file contains the
relevant configuration data which can be assigned to certain test sequences. So measurement parameters can be changed and adjusted easy and quickly with a standard
editor.
An arbitrary test sequencer software may be used to control the test sequence. This
software combines the individual test sequences to form an executable test program. It
also adds all other functions important to the production operation, such as user
administration, execution of multiple test sequences in multi-threading or parallel operation, collection and storage of relevant measurement results and report generation.
3.1.1 Functional Description
Figure 3-1: R&S GTSL layer model
In terms of its structure, the Generic Test Software Library R&S GTSL developed by
ROHDE & SCHWARZ is divided into different supply components and software layers.
A distinction is made between the software components supplied by ROHDE &
SCHWARZ and the components which must be supplied or adapted by the customer.
The software components to be provided by the customer may for example include the
following elements (specific to the customer and to the unit under test).
●
device drivers
●
calibration data
●
test libraries
26System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Software
R&S GTSL
●
test sequences
The software used in the R&S GTSL is divided into three different layers.
●
The lowest level of the R&S GTSL accommodates the device drivers needed for
the hardware used (Device Driver Layer). These include the device drivers for the
following hardware:
– hardware developed and used by ROHDE & SCHWARZ.
– standard hardware.
●
The middle level of the R&S GTSL accommodates the different test libraries
(Library Layer). These test libraries provide the functions needed to execute test
sequences. At this level, further information concerning the two files
PHYSICAL.INI and APPLICATION.INI is transferred to the Resource Manager
Library. The different device drivers of the lowest level are called from this level.
●
The highest level accommodates the test sequences for the execution of the individual test functions (Application Layer). The test sequences call functions from the
libraries in the middle level.
3.1.2 Configuration Files
PHYSICAL.INI
In the file PHYSICAL.INI (Physical Layer Configuration File), all hardware assemblies
available in the Generic Test Software Library are described along with the corresponding definitions and settings. This file also contains definitions which are applicable to all
test applications to be executed on the system (e.g. type definition). The information
entered in this file is used by all test libraries and thus by each test step.
The PHYSICAL.INI file normally exists only once in the system as it reflects the exact
physical structure. The file must only be modified in the event of a hardware change.
The Resource Manager calls and administers the information from the PHYSICAL.INI
file.
APPLICATION.INI
In the APPLICATION.INI file (Application Layer Configuration File) is a description of
how the individual test libraries and the test functions use the hardware components.
Different hardware components can be combined into groups (bench). This bench can
then be used within the test function. Furthermore, definitions are made in this file
which apply to certain test applications to be executed on the system (e.g. definition of
designations in the case of multi-channel operation).
The Resource Manager calls and administers the information from the
APPLICATION.INI file.
3.1.3 GTSL Test Libraries
●
AUDIOANL.DLL, Audio Analysis
27System Manual 1178.3228.02 ─ 05
R&S®TSVP
Introduction Software
R&S GTSL
Used for RMS calculation, frequency calculation, distortion, filter- and comparator
analysis
●
DCPWR.DLL, DC Power Supply
Used for R&S TS-PSU and power supplies with IVI compliant device drivers and
for control of internal and external power supply units
●
DIOMGR.DLL, Digital I/O Manager
Used for R&S TS-PDFT, R&S TS-PIO3B and modules using „IVI digital“ compliant
device drivers.
Allows the creation of digital i/o bus topologies including more modules and a digital pattern configuration
●
DMM.DLL, Digital Multi-meter
Used for R&S TS-PSAM and devices using „IVI DMM“ compliant device drivers
Allows the configuration and execution of analogue measurements (DCV, ACV,
DCC,ACC, resistor)
●
FUNCGEN.DLL, Function Generator
Used for R&S TS-PFG and devices using „IVI generator“ compliant drivers
Allows the creation of usual signals as sine, rectangle, triangle, the creation of arbitrary waveforms and the handling of sequences
●
SIGANL.DLL, Signal Analyzer
Used for R&S TS-PAM and devices using „IVI scope“ compliant drivers
Allows the creation of WFA measurements and the readout of data and measurement results
●
RSMGR.DLL, Resource Manager
Used for adminstration functions for any hardware defined in the PHYSICAL.INI
file
●
ROUTE.DLL, Signal Routing
Used for supporting functions for complex path management
Includes any switching module
NOTE:
Not in combination with SWMGR.DLL
●
SWMGR.DLL, Switch Manager
Used for supporting functions for switching of single paths at single modules
NOTE:
Not in combination with ROUTE.DLL
●
ICT.DLL and ICCHECK.DLL, In-Circuit Test
Used for supporting functions for In-Circuit and IC-Check test methods
●
FTBLIB.DLL, Factory Toolbox
Used for supporting functions for R&S TS-PIO3B and extensions
●
SFT.DLL, Self Test Support
Used for controlling functions for the execution of TSVP modules self test
●
TOOLKITTESTSTAND.DLL, Toolkit TestStand
Used for supporting functions for test sequencer "TestStand" from National Instruments Corp.
●
OPERINT.DLL, Operator Interface
Offers a configurable "TestStand" operator interface
28System Manual 1178.3228.02 ─ 05
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