Rockwell Collins 8222577 User Manual
MICROWAVE COMPONENTS AND SUBSYSTEMS
Concord, Ontario, CANADA L4K 3Y8
ITS ELECTRONICS INC.
0DU48
ITS Electronics Inc.
200 Edgeley Blvd., Unit #24-27
Tel: (905) 660-0405
Fax: (905) 660-0406
Linear High Power Amplifier
COMPONENT MAINTENANCE MANUAL
WITH
ILLUSTRATED PARTS LIST
ITS Electronics Part Number Rockwell Collins Part Number
PA-1A6-6048-8M 822−2577−XXX
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The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
XX-XX-XX
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
COMPONENT MAINTENANCE MANUAL
PART NUMBER PA-1A6-6048-8M
Revision
Number
Revision
Date
Date
Filed
ITS ELECTRONICS INC.
RECORD OF REVISIONS
By
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The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
ITS ELECTRONICS INC.
COMPONENT MAINTENANCE MANUAL
PART NUMBER PA-1A6-6048-8M
RECORD OF TEMPORARY REVISIONS
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The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
ITS ELECTRONICS INC.
COMPONENT MAINTENANCE MANUAL
PART NUMBER PA-1A6-6048-8M
SERVICE BULLETIN LIST
Service Bulletin /
Revision Number
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Incorporated
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The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
ITS ELECTRONICS INC.
COMPONENT MAINTENANCE MANUAL
PART NUMBER PA-1A6-6048-8M
TABLE OF CONTENTS
SUBJECT TITLE PAGE
Description and Operation 6
Testing and Fault Isolation 12
Automatic Test Requirements Not Applicable
Disassembly 24
Cleaning 32
Check 32
Repair 32
Assembly 33
Fits and Clearances Not Applicable
Special Tools, Fixtures, and Equipment Not Applicable
Illustrated Parts List 39
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The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
1 Introduction
ITS ELECTRONICS INC.
This manual provides instructions to perform fault isolation, test and maintenance on
the HPA−901B, ITS product P/N: PA-1A6-6048-8M, Rockwell Collins Part Number
(RCPN) 822−2577−XXX, linear High Power Amplifier (HPA).
1.1 Abbreviations
AMSS Aeronautical Mobile Satellite Services
ARINC Aeronautical Radio, Inc.
ATP Acceptance Test Procedures
BIT Built-in Test
DUT Device under Test
HPA High Power Amplifier
Hz Hertz
ITS ITS Electronics, Inc.
LED Light Emitting Diode
LRU Line Replaceable Unit
MCU Modular Concept Unit
MHz Megahertz
PC Personal Computer
PSMCPT Power Supply, Monitoring, Control and Pilot Tone
RAM Random-access Memory
RF Radio Frequency
RMS Root Mean Square
ROM Read-Only Memory
SDI Source Destination Identifier
SRU Shop Replaceable Unit
VA Volt-Ampere
VAC Volt Alternating Current
VSWR Voltage Standing Wave Ratio
W Watt
2 Description and Operation
2.1 General
The HPA is an 8-MCU 60 watt (W) L-Band linear high power amplifier. It is
intended for use as part of a system that provides the Aeronautical Mobile
Satellite Services (AMSS).
2.2 Electrical Description
The HPA will operate from an aircraft supplied power of 115 volt alternating
current (VAC) root mean square (RMS), single phase, 400 hertz (Hz) nominal,
Page 6 of 42
The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
ITS ELECTRONICS INC.
600 volts−amperes (VA) maximum, 500 VA nominal. Its operation frequency
range is 1626.5 to 1660.5 megahertz (MHz).
The HPA is a forced-air cooled in accordance with ARINC 600. The
architecture, internal layout, front and rear views are shown in Figure 2.1,
Figure 2.2 and Figure 2.3. Its front and rear panel connector details are shown
in Figure 2.4 and Figure 2.5.
Upon application of power, and at other times when the test mode is
commanded via the ARINC 429 serial input bus, the HPA will perform
microprocessor RAM and ROM tests. Continuous monitoring of the following
functions is performed:
• Power Supply
• Control Bus Input
• RF Power Input
• VSWR
• Temperature
Four front−panel LED indicators are identified as follows:
• OVER TEMP: Illuminated when an overtemperature condition exists
(thermal limiting)
• POWER SUPPLY FAULT: Illuminated when an internal power supply
fault is detected
• RF FAULT: Illuminated when an internal RF fault is detected
• CONTROLLER FAULT: Illuminated when an internal control function
fault is detected.
The HPA has two external electrical connectors:
• Front Panel Connector
• Rear Panel Connector
The Front Panel Connector is MS3102 type circular connector. It is not wired or
used on the aircraft. This connector is for the HPA testing at the manufacturer
or another shop facility. This connector pin-out is indicated as in Figure 2.4.
The Rear Panel Connector is of the “low insertion force, shell size 2” type, as
defined in ARINC Specification 600. This connector is wired on the aircraft. It
provides main interface with ARINC 429 buses, discrete Mute control and SDI.
This connector pin-out is indicated as in Figure 2.5.
Page 7 of 42
The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
ITS ELECTRONICS INC.
Figure 2.1 HPA Architecture and Internal Layout
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It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
ITS ELECTRONICS INC.
Figure 2.2 HPA Front View
Figure 2.3 HPA Rear View
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It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
Pin Function Internal
A RS-232
Transmit
B RS-232 Receive To Controller
C RS-232 Ground To Controller
ITS ELECTRONICS INC.
Connection
To Controller
Figure 2.4 HPA Front Panel and Test Connector Details
Pin Function
ARINC 429
TP1A
Input A
ARINC 429
TP1B
Input B
ARINC 429
TP1C
Output A
ARINC 429
TP1D
Output B
HPA Mute
TP3A
Top/Port A
HPA Mute
TP3B
Top/Port B
HPA Mute
TP3C
Starboard A
HPA Mute
TP3D
Starboard B
TP5A SDI #1
TP5B SDI #2
TP5D SDI Common
Internal
Connection
To Controller
To Controller
To Controller
To Controller
To Controller
To Controller
To Controller
To Controller
To Controller
To Controller
To Controller
Figure 2.5 HPA Rear Connector Details
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The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
TPC1 RF Input To RF Module
MPC1 RF Output To RF Module
115 VAC Input
BP1
(Hot)
115 VAC Input
BP7
(Cold)
BP8 Chassis Ground
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
To Power
Supply
To Power
Supply
To Power
Supply
MICROWAVE COMPONENTS AND SUBSYSTEMS
ITS ELECTRONICS INC.
2.3 Mechanical Description
The HPA mechanical outline details are described in Figure 2.6 (Drawing
Number is ODH4800000).
Figure 2.6 HPA Mechanical Outline
The HPA mechanical construction is illustrated in Figure 2.1.
The HPA is intended for installations on the aircraft in the Equipment Racks
that are compliant to the requirements of ARINC Specification 600. Therefore,
the HPA Enclosure is designed to conform to the ARINC Specification 600. The
Enclosure size is 8 Modular Concept Units (8-MCU).
The Enclosure assembly is comprised of:
• bottom, left and right side panel/chassis
• front panel
• rear panel
• top panel
• two handles
• two hold-down hooks
• associated hardware
Page 11 of 42
The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
ITS ELECTRONICS INC.
All Enclosure parts are metallic. The panels’ material is aluminum alloy. Interior
and bottom surface finish is chemical conversion coating. Exterior (except
bottom) surface finish is paint.
The HPA cooling medium is forced air moving through the HPA in the upward
or downward direction. To provide the interface between the HPA and the
aircraft cooling system, the Enclosure top and bottom panels have air
inlet/outlet apertures (sets of multiple individual openings).
The two Shop Replaceable Units are mounted to the sides of the Enclosure.
A low insertion force, shell size 2 Connector, as defined in ARINC Specification
600, is mounted to the rear panel.
An MS3201 type Connector is mounted to the front panel.
The four LEDs are mounted to the front panel.
The two handles and two hold-down hooks are mounted to the front panel.
The forced air enters either from the inlet of the top lid or from the bottom lid
and goes through the heat sinks of the two SRUs to cool the internal
components. The hot air exits from the outlet of the opposite lid.
2.4 The HPA Family Tree and Block Diagram
The HPA consists of the following SRUs:
• Power Supply, Monitoring, Control and Pilot Tone (PSMCPT) Module
(Part No. H4800200)
• RF Module (Part No. H4800900)
3 LRU on-line Fault Diagnosis
HPA has BIT to provide seven-byte information for fault diagnosis purpose. The
details of the BIT information are in Table 3.1. Each state has its own hex-value
“mask” when turned on. The masks of the turned on states aggregate to the hex
value of a byte. For example, if “Low Input Power” (mask “02”) and “Input Power
Overdrive” (mask “04”) are turned on, the hex value of the first byte will be “06” (i.e.
“02”+”04”).
In Table 3.1, only the states marked in the “Fault” column turned on will represent
LRU failure.
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The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
MICROWAVE COMPONENTS AND SUBSYSTEMS
ITS ELECTRONICS INC.
Flag
Pwr 1
t1 2
t2 3
Ov 4
Uv 5
Byte
No.
Mask
01 Return Loss
02 Low Input Power
04 Input Power Overdrive
08 Output Power Too High X
10 N/A
20 N/A
40 N/A
80 N/A
01 HPA 1 Over-Temp Warning
02 HPA 1 Over-Temp Mute X
HPA 1 Over-Temp
04
08 HPA 1 Under-Temp
10 HPA 2 Over-Temp Warning
20 HPA 2 Over-Temp Mute X
40
80 HPA 2 Under-Temp
01 MCU Over-Temp Warning
02 MCU Over-Temp Mute X
04
08 MCU Under-Temp
10 N/A
20 N/A
40 N/A
80 N/A
01 9V Over-Voltage
02 32V Over-Voltage
04 Spare Over-Voltage
08 N/A
10
20
40
80 N/A
01 9V Under-Voltage
02 32V Under-Voltage
04 Spare Under-Voltage
08 N/A
10
20 N/A
Shutdown X X
HPA 2 Over-Temp
Shutdown X X
MCU Over-Temp
Shutdown X X
32V Over-Current
Measured X X
32V Over-Current Low
Cutoff X
32V Over-Current High
Cutoff X X
32V Under-Current
Measured
Description
Mute +32V Shutdown Fault
Effect
x
x
x
x
x
x
x
x
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The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied.
It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
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