Rockwell Automation T8480 User Manual

Download

TrustedTM

PD-T8480

Trusted

TMR Analogue Output

Module – 40 Channel

Introduction

The Trusted tests are performed throughout the module including measurements for current, and voltage on each portion of the voted output channel. Tests are also performed for stuck on and stuck off failures. Fault tolerance is achieved through a Triple Modular Redundant (TMR) architecture within the module for each of the 40 output channels.

Automatic line-monitoring of the field device is provided. This feature enables the module to detect both open and short circuit failures in field wiring and load devices.

The module provides on-board Sequence of Events (SOE) reporting with a resolution of 1ms. An output change of state triggers an SOE entry. Output states are automatically determined by voltage and current measurements on board the module.

TMR Analogue Output module interfaces to 40 field devices. Triplicated diagnostic

Features

• 40 Triple Modular Redundant (TMR) output channels per module.

• Comprehensive, automatic diagnostics and self-test.

• Automatic line monitoring per point to detect open circuit and short circuit field wiring and

load faults.

• 2500V dc optical isolation barrier.

• On-board Sequence of Events (SOE) reporting with 1ms resolution. Module can be hot-

replaced on-line using dedicated Companion (adjacent) Slot or SmartSlot (one spare slot for many modules) configurations.

• Front panel output status LEDs for each point indicate output status and field wiring faults

• Front panel module status LEDs indicate module health and operational mode (Active,

Standby, Educated)

5V Certified for non-interfering applications

• T

• Outputs are powered in isolated groups of eight

Issue 13 Apr 10 PD-T8480 1

Trusted

Issue Record

ssue

Number Date Revised by Technical CheckAuthorised by Modification

7 Aug 05 J W Clark Format /Text editing

8 Dec 06 V Middleton N Owens P Stock Weights & Dims

9 Jul 07 N Owens I Vince P Stock Certification

10 Sep 07 N Owens I Vince P Stock Specification

11 Nov 07 N Owens A Holgate P Stock STATE descriptions

12 Feb 08 N Owens A Holgate P Stock Channel LED colours

13 Apr 10 S Blackett A Holgate N Owens Rack 7 table minor

Module T8480

change

Issue 13 Apr 10 PD-T8480 2

Trusted

Module T8480

This page is intentionally blank

Issue 13 Apr 10 PD-T8480 3

Trusted

Module T8480

Table of Contents

1. Description ...................................................................................................................................8

1.1. Output Field Termination Unit (OFTU).......................................................................................10

1.2. Analogue OUTPUT Field Interface Unit (AOFIU) ......................................................................10

1.3. Host Interface Unit (HIU) ...........................................................................................................11

1.4. Front Panel Unit (FPU) ..............................................................................................................11

1.5. Line monitoring and output states..............................................................................................12

1.6. Housekeeping ............................................................................................................................12

1.7. Fault Detection/Testing..............................................................................................................12

1.8. Sequence of Events Characteristics..........................................................................................13

1.9. Output Driver Structure ..............................................................................................................13

1.9.1. Output Channel Diagnostics ......................................................................................................14

1.9.2. Group Fail Safe Switches ..........................................................................................................15

2. Installation..................................................................................................................................16

2.1. Module Insertion/Removal .........................................................................................................16

2.2. Cable Selection..........................................................................................................................16

2.3. Module Pinout Connections .......................................................................................................17

2.4. Trusted

3. Application .................................................................................................................................19

3.1. Module Configuration.................................................................................................................19

3.2. T8480 Complex Equipment Definition .......................................................................................19

3.2.1. Rack 1: AO ................................................................................................................................20

3.2.2. Rack 2: State .............................................................................................................................20

3.2.3. Rack 3: AI ..................................................................................................................................21

3.2.4. Rack 4: CI ..................................................................................................................................22

3.2.5. Rack 5: LINE_FLT .....................................................................................................................22

3.2.6. Rack 6: DISCREP......................................................................................................................22

3.2.7. Rack 7: HKEEPING ...................................................................................................................23

3.2.8. Rack 8: INFO .............................................................................................................................24

3.3. Sequence of Events Configuration ............................................................................................25

3.4. SYSTEM.INI File Configuration .................................................................................................25

4. Operation ...................................................................................................................................26

Module polarisation/Keying. ......................................................................................18

4.1. Front Panel ................................................................................................................................26

4.2. Module Status LEDs ..................................................................................................................27

4.3. I/O Status LEDs .........................................................................................................................28

5. Fault Finding and Maintenance..................................................................................................29

5.1. Fault Reporting ..........................................................................................................................29

5.2. Field Wiring Faults .....................................................................................................................29

Issue 13 Apr 10 PD-T8480 4

Trusted

5.3. Module Faults ............................................................................................................................29

5.4. Companion Slot .........................................................................................................................30

5.5. SmartSlot ...................................................................................................................................30

5.6. Cold Start ...................................................................................................................................30

5.7. Transfer between Active and Standby Modules ........................................................................31

6. Specifications.............................................................................................................................32

Module T8480

Figures

Figure 1 Module Architecture....................................................................................................................8

Figure 2 Functional Block Diagram ..........................................................................................................9

Figure 3 Output Driver Structure.............................................................................................................13

Figure 4 Simplified Driver Circuit Diagram .............................................................................................14

Figure 5 Module polarisation ..................................................................................................................18

Figure 6 Module Front Panel ..................................................................................................................26

Tabl e s

Table 1 Line Monitoring Fault Status ......................................................................................................12

Table 2 Field Connector Pinout ..............................................................................................................17

Table 3 Complex Equipment Definition ..................................................................................................19

Table 4 OEM Parameters .......................................................................................................................20

Table 5 Rack 1: AO descriptions ............................................................................................................20

Table 6 Rack 1: Output Current descriptions .........................................................................................20

Table 7 Rack 2: STATE descriptions......................................................................................................20

Table 8 Rack 2: STATE value descriptions ............................................................................................21

Table 9 Rack 3: AI descriptions ..............................................................................................................21

Table 10 Rack 4: CI descriptions............................................................................................................22

Table 11 Rack 5: LINE_FLT descriptions...............................................................................................22

Table 12 Rack 6: DISCREP descriptions ...............................................................................................22

Table 13 Rack 7: Housekeeping descriptions ........................................................................................23

Table 14 Rack 8: INFO descriptions.......................................................................................................24

Table 15 Rack 8: INFO bit descriptions ..................................................................................................24

Table 16 Rack 8: FCR bit descriptions ...................................................................................................25

Table 17 Module Status LEDs ................................................................................................................27

Table 18 I/O Status LEDs .......................................................................................................................28

Issue 13 Apr 10 PD-T8480 5

Trusted

Module T8480

Notice

The content of this document is confidential to ICS Triplex Technology Ltd. companies and their partners. It may not be given away, lent, resold, hired out or made available to a third party for any purpose without the written consent of ICS Triplex Technology Ltd.

This document contains proprietary information that is protected by copyright. All rights are reserved.

icrosoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered

M trademarks of Microsoft Corporation.

The information contained in this document is subject to change without notice. The reader should, in all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been made. From time to time, amendments to this document will be made as necessary and will be distributed by ICS Triplex Technology Ltd.

Information in this documentation set may be subject to change without notice and does not represent a commitment on the part of ICS Triplex Technology Ltd.

The contents of this document, which may also include the loan of software tools, are subject to the confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.

No part of this documentation may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of ICS Triplex Technology Ltd.

Disclaimer

The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the text of this manual.

The user of, and those responsible for applying this equipment, must satisfy themselves as to the acceptability of each application and use of this equipment.

This document is based on information available at the time of its publication. While efforts have been made to be accurate, the information contained herein does not purport to cover all details or variations in hardware or software, nor to provide for every possible contingency in connection with installation, operation, or maintenance. Features may be described herein which are present in all hardware or software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this document with respect to changes subsequently made.

ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of the information contained herein. No warranties of merchantability or fitness for purpose shall apply.

Issue 13 Apr 10 PD-T8480 6

Trusted

Module T8480

Revision and Updating Policy

All new and revised information pertinent to this document shall be issued by ICS Triplex Technology Ltd. and shall be incorporated into this document in accordance with the enclosed instructions. The change is to be recorded on the Amendment Record of this document.

Precautionary Information

WARNING

Warning notices call attention to the use of materials, processes, methods, procedures or limits which must be followed precisely to avoid personal injury or death.

CAUTION

Caution notices call attention to methods and procedures which must be followed to avoid damage to the equipment.

Notes:

Notes highlight procedures and contain information to assist the user in the understanding of the information contained in this document

Warning

RADIO FREQUENCY INTERFERENCE

Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be exercised with regard to the use of portable communications equipment around such equipment. Signs should be posted in the vicinity of the equipment cautioning against the use of portable communications equipment.

MAINTENANCE

Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or damage to the system may be caused.

Caution

HANDLING

Under no circumstances should the module housing be removed.

Associated Documents

Product Descriptions (PD) provide product specific information.

The Safety Manual contains the recommended safety requirements for the safety system design.

The PD8082B – Toolset Suite provides specific guidance on system configuration and application generation.

The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic procedures.

For technical support email: support@icstriplex.com

Issue 13 Apr 10 PD-T8480 7

Trusted

Module T8480

1. Description

The TMR 4-20 mA Analogue Output module is a member of the TrustedTM range of Input/Output (I/O) modules. All Trusted all I/O modules interface to the Inter-Module Bus (IMB) which provides power and allows communication with the TMR Processor. In addition, all modules have a field interface that is used to connect to module specific signals in the field. All modules are Triple Modular Redundant (TMR).

I/O modules share common functionality and form. At the most general level,

Figure 1 Module Architecture

All High Integrity I/O modules are made up of 4 sections: Host Interface Unit (HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU), and the Front Panel Unit (or FPU).

Issue 13 Apr 10 PD-T8480 8

Trusted

Module T8480

Fig 2 shows a simplified block diagram of the Trusted

F S D

OFIU_LV

SIGNAL

ISOLATION

OFIA

A/Ds

24V dc Analogue Output module.

OFTU_LV

SOL

GFSS

ISOL

FIELD

HIU

OFIU_LV

SIGNAL

ISOLATION

OFIU_LV

SIGNAL

ISOLATION

FIA

A/Ds

FIA

A/Ds

F S D

PWR ISOL

F S D

Output

LOADS

Termination

FIELD RET

0 V

Figure 2 Functional Block Diagram

Issue 13 Apr 10 PD-T8480 9

Trusted

Module T8480

1.1. Output Field Termination Unit (OFTU)

The Output Field Termination Unit (OFTU) is the section of the I/O module that connects all three AO FIUs to a single field interface. The OFTU provides the Group Fail-safe switches and passive components necessary for signal conditioning, over-voltage protection, and EMI/RFI filtering. When installed in a Trusted Field I/O Cable Assembly attached at the rear of the chassis.

The OFTU receives regulated power and drive signals from the HIU and provides magnetically isolated power to each of the three AO FIU’s.

The SmartSlot link is passed from the HIU to the field connections via the OFTU. These signals go directly to the field connector and maintain isolation from the I/O signals on the FTU. The SmartSlot link is the intelligent connection between active and standby modules for co-ordination during module replacement.

Controller or Expander Chassis, the OFTU field connector interconnects to the

1.2. Analogue OUTPUT Field Interface Unit (AOFIU)

The Analogue Output Field Interface Unit (AOFIU) is the section of the module that contains the specific circuits necessary to interface to the field I/O signals. Each module has three AO FIUs, one per slice. For the TMR 24V dc Analogue Output Module, the AOFIU contains one slice of the output driver circuit, for each of the 40 field outputs.

The AOFIU receives isolated power from the OFTU for logic. The AOFIU provides additional power conditioning for the operational voltages required by the AOFIU circuitry. An isolated 6.25Mbit/sec serial link connects each AOFIU to one of the HIU slices.

The AOFIU also measures a range of on-board “house-keeping” signals that assist in monitoring the performance and operating conditions of the module. These signals include power supply voltages, current consumption, on-board reference voltages, and board temperature.

Issue 13 Apr 10 PD-T8480 10

Trusted

FCR Interconnect Bus between slices to vote incoming IMB data and distribute outgoing I/O

Redundant power sharing of dual 24V dc chassis supply voltage and power regulation for logic

ordination during module

board housekeeping, which monitors reference voltages, current consumption, board

Module T8480

1.3. Host Interface Unit (HIU)

The HIU is the point of access to the Inter-Module Bus (IMB) for the module. It also provides power distribution and local programmable processing power. The HIU is the only section of the I/O module to directly connect to the IMB backplane. The HIU is common to most high integrity I/O types and has type dependent and product range common functions. Each HIU contains three independent slices, commonly referred to as A, B, and C.

All interconnections between the three slices incorporate isolation to prevent any fault interaction between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one slice has no effect on the operation of the other slices.

The HIU provides the following services common to the modules in the family:

• High Speed Fault-Tolerant Communications with the TMR Processor via the IMB interface.

•

module data to IMB.

• Optically isolated serial data interface to the FIU slices.

•

power to HIU circuitry.

• Magnetically Isolated power to the HIU slices.

• Serial data interface to the FPU for module status LEDs.

• SmartSlot link between active and standby modules for co-

replacement.

• Digital Signal Processing to perform local data reduction and self-diagnostics.

• Local memory resources for storing module operation, configuration, and field I/O data.

• On-

temperature, and condensation.

1.4. Front Panel Unit (FPU)

The Front Panel Unit (FPU) contains the necessary connectors, switches, logic, and LED indicators for the front panel. For every module, the FPU contains the Slice Healthy, Active/Standby, the Educated indicators (LEDs), and the module removal switches. Additional bi-colour LEDs provide status indication for the individual I/O signals. Serial data interfaces connect the FPU to each of the HIU slices to control the LED status indicators and monitor the module removal switches.

Issue 13 Apr 10 PD-T8480 11

Trusted

Module T8480

1.5. Line monitoring and output states

The module automatically monitors the output channel current and voltage to determine the state of the output channel. The numerical output state and line fault status are reported back to the application and are represented below.

Description

Field Short Circuit

(Not presently supported)

Output Energized (On) 4 0

No Load, Field Open Circuit

(Vload > 16.5V)

Output De-energised

(command < -1024)

No Field Supply Voltage

(Vfield < 18V)

Table 1 Line Monitoring Fault Status

Numerical Output State

N/A N/A

3 1

2 0

1 1

Line Fault Status

1.6. Housekeeping

The output module automatically performs local measurements of several on-board signals that can be used for detailed troubleshooting and verification of module operating characteristics. Measurements are made within each slice’s HIU and FIU.

1.7. Fault Detection/Testing

Extensive diagnostics provide the automatic detection of module faults. The TMR architecture of the output module and the diagnostics performed ensure the validity of all critical circuits. Using the TMR architecture provides a Fault Tolerant method to withstand the first fault occurrence on the module and continue normal output controls without interruption in the system or process. Faults are reported to the user through the Healthy status indicators on the front panel of the module and through the information reported to the TMR Processor. Under normal operations all three Healthy indicators are green. When a fault occurs, one of the Healthy indicators will be flashing red. It is recommended that this condition is investigated and if the cause is within the module, it should be replaced.

Module replacement activities depend on the type of spare module configuration chosen when the system was configured and installed. The module may be configured with a dedicated Companion Slot or with a SmartSlot for a spare replacement module.

From the IMB to the field connector, the I/O module contains extensive fault detection and integrity testing. As an output device, most testing is performed in a non-interfering mode. Data input from the IMB is stored in redundant error-detecting RAM on each slice portion of the HIU. Received data is voted on by each slice. All data transmissions include a confirmation response from the receiver.

Periodically, the TMR Processor commands the onboard DSPs to perform a Safety Layer Test. The SLT results in the DSP verifying with the TMR Processor its ability to process data with integrity. In addition, the DSP uses Cyclical Redundancy Checks (CRC) to verify the variables and configuration stored in Flash memory.

Issue 13 Apr 10 PD-T8480 12

Trusted

Module T8480

Between the HIU and FIU are a series of optically isolated links for data and power. The data link is synchronized and monitored for variance. Both FIU and HIU have onboard temperature sensors to characterize temperature-related problems.

The power supplies for both the HIU and FIU boards are redundant, fully instrumented and testable. Together these assemblies form a Power Integrity Sub System.

1.8. Sequence of Events Characteristics

The module automatically measures the field voltage and current to determine the state of each output channel. An event occurs when the output transitions from one state to another. When a channel changes state, the on-board timer value is recorded. When the TMR Processor next reads data from the output module, the channel state and real-time clock value are retrieved. The TMR Processor uses this data to log the state change into the system Sequence of Events (SOE) log. The user may configure each output to be included in the system SOE log. Full details of SOE are contained in PD8013 Trusted

SOE and Process Historian.

1.9. Output Driver Structure

The Analogue Output Module provides a TMR driver topology where the load is driven by a total of three fully monitored, fail-safe (6 element) driver channels, one physically resident on each AOFIU in the module. Any single driver or entire slice failure is designed to leave two of the three fail-safe driver channels operational to supply regulated current to the load.

TOP_RAIL

LOAD_A

ENSE_A

PRM_A PRM_CPRM_B

ENABLE_C ENABLE_A ENABLE_B

OAD

ENSE_B

FIELD_RTN

LOAD_B

LOAD

= I

LOAD_A

LOAD_C

ENSE_C

+ I

LOAD_B

LOAD_C

Figure 3 Output Driver Structure

The upper transistors shown in Figure 3 operate in the linear mode, and are controlled by the AOFIU on which they are physically resident. controlled by the “upstream” neighbouring FIU.

The lower switches are N.C. (Normally Closed), and are

Their “home” FIU.

The home FIU, supplies an independent control signal for the “downstream” FIU FSS.

Issue 13 Apr 10 PD-T8480 13

Trusted

Module T8480

Note: In this context, N.O. is defined as being in the off state in the absence of control signal power,

and similarly, N.C. is the on state in the absence of control signal power. These switches are

onstructed from enhancement mode MOSFETs and are both guaranteed to be off in the

bsence of module power to create gate voltage signals to bias them on

unlike

(

electromechanical relays for example).

The reason that the lower switches are specified to be on in the absence of control signal power is to allow two channels to power the load should an entire slice fail. Even if an entire slice fails, the surviving output circuits will carry the necessary control. The structure of each OFIU output driver is shown below:

24V

IELD

TOP_RAIL

POWER

HIU

FROM

FROM UPSTREAM

SLICE

OMMAND

RESPONSE

UPSTREAM

ENABLE

OPTO

FPGA

PRM

GFSS

FET 1

FET 2

FET

LOAD

ADC

VSENSE

DOWNSTREAM ENABLE

Figure 4 Simplified Driver Circuit Diagram

A sense resistor provides a means of continuously monitoring the output current, as measured with an A/D channel. Closed loop control logic in the FPGA provides a Pulse-Ratio-Modulated drive signal to the gate of FET 1 to maintain a constant current equal to the commanded output, based on the A/D feedback.

A level translator transistor is used to drive the gate of FET 2. It provides FET 2 with a negative gate voltage, to minimize its on resistance, and serves to hold FET 2 on in the event that the secondary gate control loses power.

1.9.1. Output Channel Diagnostics

The measured output channel current is continuously monitored relative to the commanded output current, and compared to the current reported from each independent slice. In the event that there is a discrepancy that falls outside the authority of the control loop to overcome, then remedial action is engaged which disables FET 2 for the affected slice and causes the surviving slices to compensate in order to maintain the commanded current to the load.

The voltage across the load is also measured by each slice, and continuously compared for equality. If there is a discrepancy between the slices, then the discrepant slice is removed from service, and the survivors compensate to maintain the commanded current to the load.

Each channel is continuously monitored to determine the presence of field faults, such as an open circuit, or lack of field loop power.

For an un-faulted transistor.

Issue 13 Apr 10 PD-T8480 14

Trusted

Note that short circuits are not considered to be a fault condition for an analogue current output channel such as provided by this module. The module is designed to drive 20 mA indefinitely into 0 volts. The channel voltages are provided to the application, where such a fault determination may be made if it is required.

Module T8480

1.9.2. Group Fail Safe Switches

To ensure safe operation, the output module is equipped with a series of switches that provide source power to a group of 8 output channels. The output module Group Fail Safe Switch (GFSS) is intended as a final control switch which can de-energise any outputs that cannot be de-energised in the normal way. For safety, the presence of two or more faults within the output module will cause the Group Fail Safe Switches to de-energise, resulting in all of the outputs in its group to de-energise.

There are three switches in parallel, which comprise the GFSS, one associated with each 'slice' of the power group. The GFSS’ are controlled via a signal from one of the other two neighbouring slices. This means that if one slice determines from the output states that an output is not in a de-energised state when it should be, then it can command its own GFSS and those of the other slices GFSS to deenergise. This results in two of the three elements of the GFSS structure to de-energise, leaving only one GFSS element energised. If two slices do the same thing then the last GFSS output will deenergise. For example, this would occur if two or more output switch elements fail in a 'stuck-on' state such that the output cannot de-energise.

The GFSS control signal is generated by a charge pump driven from the comms clock to the slice power group. If the clock fails then the GFSS bias collapses. This means that even if the ability of the slice to communicate with a power group is lost, the GFSS can still be de-energised by stopping the comms clock. If a slice fails, the watchdog on the HIU will time out and reset the slice, this will shutdown the OFIU power supply and the associated GFSS control signal will also de-energise.

Issue 13 Apr 10 PD-T8480 15

Trusted

Module T8480

2. Installation

2.1. Module Insertion/Removal

CAUTION:

The module contains static sensitive parts. static handling precautions must be observed. Specifically ensure that exposed connector pins ARE NOT TOUCHED. Under no circumstances should the module housing BE REMOVED.

Before installation, visually inspect the module for damage. Ensure that the module housing appears undamaged and inspect the I/O connector at the back of the module for bent pins. If the module appears damaged or any pins are bent, do not install the module. Do not try to straighten bent pins. Return the module for replacement.

Ensure that the module is of the correct type.

Record the module type, revision and serial number of the module before installation.

To install the module:

1. Ensure that the field cable assembly is installed and correctly located.

2. If I/O module keys are used, verify that all keys are installed in the correct positions and properly seated in their slots.

3. Release the ejector tabs on the module using the release key. Ensure that the ejector tabs are fully open.

4. Holding the ejectors, carefully insert the module into the intended slot.

5. Push the module fully home by pressing on the top and bottom of the module fascia.

Close the module ejectors, ensuring that they click into their locked position.

The module should mount into the chassis with a minimum of resistance. If the module does not mount easily, do not force it. Remove the module and check it for bent or damaged pins. If the pins have not been damaged, try reinstalling the module.

2.2. Cable Selection

I/O cables suitable for use with the TrustedTM TMR Analogue Output Module are detailed in the following Product Descriptions.

1. PD-TC200 – Trusted

2. PD-TC500 – Trusted

The Product Descriptions detailed above also detail the types of Field Termination Assembly (FTA) or Versatile Field termination Assembly (VFTA) which may be used with type of module.

Custom length multi-core FTA cables are 0.5mm have 4R loop impedance at 0.5A, this equates to a 2Vdc volt drop.

I/O Companion Slot Cables

I/O SmartSlot Cables

with a resistance of 40R/km. eg a 50m cable will

Issue 13 Apr 10 PD-T8480 16

Trusted

Module T8480

2.3. Module Pinout Connections

C B A

1 Smart Slot Link C Smart Slot Link B Smart Slot Link A

3 Chan 5 (+) Pwr Group 1 (+) Chan 1 (+)

4 Chan 6 (+) Pwr Group 1 (+) Chan 2 (+)

5 Pwr Group 1 Rtn Pwr Group 1 (+) Pwr Group 1 Rtn

6 Chan 7 (+) Pwr Group 1 (+) Chan 3 (+)

7 Chan 8 (+) Pwr Group 1 (+) Chan 4 (+)

9 Chan 13 (+) Pwr Group 2 (+) Chan 9 (+)

10 Chan 14 (+) Pwr Group 2 (+) Chan 10 (+)

11 Pwr Group 2 Rtn Pwr Group 2 (+) Pwr Group 2 Rtn

12 Chan 15 (+) Pwr group 2 (+) Chan 11 (+)

13 Chan 16 (+) Pwr Group 2 (+) Chan 12 (+)

15 Chan 21 (+) Pwr Group 3 (+) Chan 17 (+)

16 Chan 22 (+) Pwr Group 3 (+) Chan 18 (+)

17 Pwr Group 3 Rtn Pwr Group 3 (+) Pwr Group 3 Rtn

18 Chan 23 (+) Pwr Group 3 (+) Chan 19 (+)

19 Chan 24 (+) Pwr Group 3 (+) Chan 20 (+)

21 Chan 29 (+) Pwr Group 4 (+) Chan 25 (+)

22 Chan 30 (+) Pwr Group 4 (+) Chan 26 (+)

23 Pwr Group 4 Rtn Pwr Group 4 (+) Pwr Group 4 Rtn

24 Chan 31 (+) Pwr Group 4 (+) Chan 27 (+)

25 Chan 32 (+) Pwr Group 4 (+) Chan 28 (+)

27 Chan 37 (+) Pwr Group 5 (+) Chan 33 (+)

28 Chan 38 (+) Pwr Group 5 (+) Chan 34 (+)

29 Pwr Group 5 Rtn Pwr Group 5 (+) Pwr Group 5 Rtn

30 Chan 39 (+) Pwr Group 5 (+) Chan 35 (+)

31 Chan 40 (+) Pwr Group 5 (+) Chan 36 (+)

Table 2 Field Connector Pinout

Issue 13 Apr 10 PD-T8480 17

Trusted

identified below)

Module T8480

2.4. TrustedTM Module polarisation/Keying.

All Trusted The polarisation comprises two parts. The module and the associated field cable.

ach module type has been keyed during manufacture. The organisation responsible for the

E integration of the Trusted so that they correspond with the bungs fitted to the associated module prior to fitting.

Modules have been Keyed to prevent insertion into the wrong position within a chassis.

system must key the cable by removing the keying pieces from the cable

Cable Exit

Polarising/Keying Pins. (Remove using side cutters where

Trusted Cable hood

Release button

Smart Swap Connector if Fitted

Figure 5 Module polarisation

For Cables with Companion slot installations both keying strips must be polarised.

For This Module (T8480) remove keying pins 1,6,7

Issue 13 Apr 10 PD-T8480 18

Trusted

Module T8480

3. Application

3.1. Module Configuration

There is no configuration required to the physical output module. All configurable characteristics of the module are performed using tools on the EWS and become part of the application or system.ini file that is loaded into the TMR Processor. The TMR Processor automatically configures the output module after applications are downloaded and during Active/Standby changeover.

The IEC1131 TOOLSET provides the main interface to configure the output module. Details of the configuration tools and configuration sequence are provided in PD-8082B Trusted There are three procedures necessary to configure the output module. These are:

1. Define the necessary I/O variables for the field output data and module status data using the Dictionary Editor of the IEC1131 TOOLSET.

2. Create an I/O module definition in the I/O Connection Editor for each I/O module. The I/O module definition defines physical information, e.g. Chassis and Slot location, and allows variables to be connected to the I/O channels of the module.

3. Using the Trusted per-channel default or fail-safe states, and other module settings.

System Configuration Manager, define custom LED indicator modes,

Toolset Suite.

3.2. T8480 Complex Equipment Definition

The T8480 I/O Complex Equipment Definition includes 8 I/O boards, referenced numerically by Rack number:

Rack I/O Board Description Data Type Direction No. of

Channels

1 AO

OEM Parameters

Field Output Status

2 STATE Field Output State

3 AI Output voltage

4 CI Output current

5 LINE_FLT Line Fault Status

6 DISCREP Channel Discrepancy

7 HKEEPING Housekeeping Registers

8 INFO I/O Module Information

Analogue

Integer

Boolean

Integer

- -

Out 40

In 40

In 3

In 57

In 11

Table 3 Complex Equipment Definition

There are two OEM parameters included in the first rack (AO Board). These OEM parameters define the primary module position; declaring the module’s chassis and slot location. There is no need to define the secondary module position within the IEC1131 TOOLSET. Where systems may be required to start-up with modules in the secondary position as the active module, e.g. primary module is not installed when application is started, the secondary module’s position should be declared in the module definition of the System Configuration Manager.

Issue 13 Apr 10 PD-T8480 19

Trusted

Module T8480

OEM Parameter Description Notes

ICS_CHASSIS The number of the

Trusted

Chassis where

he Trusted

T Trusted

Controller Chassis is 1, and

Expander Chassis are 2 to 15 the Primary I/O module is installed

TICS_SLOT The slot number in the

chassis where the Primary I/O module is installed

The I/O module slots in the Trusted chassis are numbered from 1 to 8. The I/O Module slots in the Trusted

Controller

Expander Chassis

are numbered from 1 to 12

Table 4 OEM Parameters

3.2.1. Rack 1: AO

This board provides the connection to the logical output control signal for each of the field outputs.

Channel Description

1 Field output channel 1 command

2 Field output channel 2 command

40 Field output channel 40 command

Table 5 Rack 1: AO descriptions

The output command scaling is designed to be consistent with the T8431 Analogue Input module. This relationship is described by the table below:

Command Output Current

-1024 Off (Minimum leakage current flowing)

0 4 mA

4096 20 mA

Table 6 Rack 1: Output Current descriptions

3.2.2. Rack 2: State

This board provides the majority voted numerical output state. This indicates the operational status of the output channel and associated field connection.

Channel Description

1 Field output channel 1 state

2 Field output channel 2 state

40 Field output channel 40 state

Table 7 Rack 2: STATE descriptions

Issue 13 Apr 10 PD-T8480 20

Trusted

Module T8480

alue

escription

7 Channel fault

6 Current demand cannot be met

5 Unused

4 Output energised (0+mA)

3 Open circuit in field wiring or load

2 Output de-energised (demand < 0mA)

1 No field supply voltage

0 Unused

Table 8 Rack 2: STATE value descriptions

3.2.3. Rack 3: AI

The AI board returns the field loop voltage at the output.

Channel Description

1 Field output channel 1 voltage

2 Field output channel 2 voltage

40 Field output channel 40 voltage

Table 9 Rack 3: AI descriptions

The voltage is the median value taken from the triplicated module. The voltage level is reported as an integer, with the units being

V. This may be used directly, scaled arithmetically or scaled using the

1000

IEC1131 TOOLSET conversion tables.

To scale the value arithmetically simply divide the returned ‘integer’ by 1000 to return the voltage as either a REAL or INTEGER as required.

The IEC1131 TOOLSET conversion tables may be used to convert the value to engineering units, in this case voltage. The full-scale range for this number format is decimal ±32, corresponding to physical range –32000 to +32000.

Issue 13 Apr 10 PD-T8480 21

Trusted

Module T8480

3.2.4. Rack 4: CI

The CI board returns the field loop current at the output.

Channel Description

1 Field output channel 1 current

2 Field output channel 2 current

40 Field output channel 40 current

Table 10 Rack 4: CI descriptions

The current is the sum value taken from the triplicated module. The current level is reported as an integer, with the units being IEC1131 TOOLSET conversion tables.

To scale the value arithmetically simply divide the returned ‘integer’ by 1000 to return the current as either a REAL or INTEGER as required.

The IEC1131 TOOLSET conversion tables may be used to convert the value to engineering units, in this case current. The full-scale range for this number format is decimal ±32, corresponding to physical range –32000 to +32000.

A. This may be used directly, scaled arithmetically or scaled using the

1000

3.2.5. Rack 5: LINE_FLT

Channel Description

1 Field output channel 1 line fault

2 Field output channel 2 line fault

40 Field output channel 40 line fault

Table 11 Rack 5: LINE_FLT descriptions

The line fault input state is reported as true (logic ‘1’) for a line fault condition (open circuit, short circuit, and no field supply voltage). The logic state is the majority voted value.

3.2.6. Rack 6: DISCREP

Channel Description

1 Discrepancy status outputs 1 to 16 (output

1 is LSB)

2 Discrepancy status outputs 17 to 32

(output 17 is LSB)

3 Discrepancy status outputs 33 to 40

(output 33 is LSB)

Table 12 Rack 6: DISCREP descriptions

Each of the words reports the discrepancy status of 16 output channels. The corresponding bit within the word is set to ‘1’ when a discrepancy condition is detected on that output channel’s output state (rack 2).

Issue 13 Apr 10 PD-T8480 22

Trusted

1A2B3

5B6

8B9

10A11B12

13A14B15

16A17B18

19A20B21

22A23B24

25A26B27

28A29B30

31A32B33

34A35B36

37A38B39

40A41B42

43A44B45

46A47B48

49A50B51

52A53B54

55A56B57

Module T8480

3.2.7. Rack 7: HKEEPING

Channel

Description

FCR Units (Full Scale Range)

24V2 Output Voltage -32768 32767 mV

Internal supply voltage (post regulator) -32768 32767 mV

Internal supply current (post regulator) 0 65535 mA

Output voltage (post isolation) -32768 32767 mV

24V1 Output Voltage -32768 32767 mV

HIU Board Temperature