Rockwell Automation T8472 User Manual

Trusted

PD-T8472

TMR 120VAC Digital Output

Module – 16 Channel

Introduction

The Trusted tests are performed throughout the module including measurements for current and voltage on each portion of the voted output channel. Tests are also performed for stuck on and stuck off failures. Fault tolerance is achieved through a Triple Modular Redundant (TMR) architecture within the System Side and ‘Quad Element’ redundancy for each of the 16 output channel circuits.

The module provides on-board Sequence of Events (SOE) reporting with a resolution of 1ms. An output change of state triggers an SOE entry. Output states are automatically determined by multiple voltage and current measurements for each of the 16 channels of the module.

120VAC Digital Output module interfaces to 16 field devices. Triplicated diagnostic

Features

• Triplicated TMR system architecture, with fault tolerant output switching.

• 16 Output Channels: 120Vac, 0.5A per channel, field powered as two groups of 8

• Comprehensive, automatic diagnostics and self-test.

• Short circuit monitoring per channel when energised (requires regular proof testing for

safety related normally de-energised outputs, e.g. F&G)

• Open circuit monitoring when energised or de-energised2500Vdc optical and magnetic isolation barrier.

• Automatic channel over-current protection, no fuses required.

• On-board Sequence of Events (SOE) reporting with 1ms resolution.

• Module can be hot-replaced on-line using dedicated ‘Companion Slot’ (adjacent slot) or

SmartSlot (one spare slot for many modules) configurations.

• Front panel output status LED’s for each channel indicate output status and field wiring faults.

• Front panel module status LED’s indicate module health and operational mode (Active, Standby, Educated)

=V Certified IEC 61508, SIL 3

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Table of Contents

1. Description...................................................................................................................................... 6

Field Termination Unit (FTU) .......................................................................................................... 7

1.1.

Field Interface Unit (FIU) ................................................................................................................ 7

1.2.

1.3.

Host Interface Unit (HIU) ................................................................................................................ 8

Front Panel Unit (FPU) ................................................................................................................... 8

1.4.

Line monitoring and output states .................................................................................................. 9

1.5.

Housekeeping ................................................................................................................................ 9

1.6.

Fault Detection / Testing ................................................................................................................ 9

1.7.

Sequence of Events Characteristics ............................................................................................ 10

1.8.

1.9. Output Switch Structure................................................................................................................ 10

2. Installation .................................................................................................................................... 11

2.1. Module Insertion/Removal ............................................................................................................ 11

2.2. Field Power Connection ............................................................................................................... 12

2.2.1. Cable Impedance ......................................................................................................................... 12

2.3. Termination .................................................................................................................................. 12

2.4. Module Pinout Connections .......................................................................................................... 12

2.5. Trusted module polarisation / keying ............................................................................................ 13

3. A p p l i c a t i o n . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3.1. Module Configuration ................................................................................................................... 14

3.2. T8472 Complex Equipment Definition .......................................................................................... 14

3.2.1. Rack 1: DO ................................................................................................................................... 15

3.2.2. Rack 2: STATE ............................................................................................................................. 15

3.2.3. Rack 3: AI - Channel Field Voltage .............................................................................................. 16

3.2.4. Rack 4: CI – Channel Field Current ............................................................................................. 17

3.2.5. Rack 5: LINE_FLT ........................................................................................................................ 17

3.2.6. Rack 6: DISCREP ........................................................................................................................ 17

3.2.7. Rack 7: Housekeeping ................................................................................................................. 18

3.2.8. Rack 8: INFO ................................................................................................................................ 19

3.3. Sequence of Events Configuration ............................................................................................... 20

3.4. SYSTEM.INI File Configuration .................................................................................................... 20

4. O p e r a t i o n . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

4.1. Front Panel Indications ................................................................................................................. 21

4.2. Module Status LEDs ..................................................................................................................... 22

4.3. I/O Status LEDs ............................................................................................................................ 23

5. Fault Finding and Maintenance .................................................................................................... 24

5.1. Fault Reporting ............................................................................................................................. 24

5.2. Field Wiring Faults ........................................................................................................................ 24

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5.3. Module Faults ............................................................................................................................... 24

5.4. Companion Slot ............................................................................................................................ 24

5.5. S m a r t S l o t . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.6. Cold Start ...................................................................................................................................... 25

5.7. Active and Standby Transfers ...................................................................................................... 26

6. 120VAC Digital Output Module Specification ............................................................................... 27

Module T8472

Figures

Figure 1 Module Architecture .................................................................................................................... 6

Figure 2 FIU Architecture.......................................................................................................................... 7

Figure 5 Module polarisation .................................................................................................................. 13

Figure 6 Module Front Panel .................................................................................................................. 21

Tables

Table 1 Line Monitoring Fault Status ........................................................................................................ 9

Table 3 Complex Equipment Definition .................................................................................................. 14

Table 4 OEM Parameters ....................................................................................................................... 15

Table 5 Rack 1: DO descriptions ............................................................................................................ 15

Table 6 Rack 2: STATE descriptions...................................................................................................... 15

Table 7 Rack 2: STATE Output descriptions .......................................................................................... 16

Table 8 Rack 3: AI descriptions .............................................................................................................. 16

Table 9 Rack 4: CI descriptions .............................................................................................................. 17

Table 10 Rack 5: LINE_FLT descriptions ............................................................................................... 17

Table 11 Rack 6: DISCREP bit descriptions .......................................................................................... 17

Table 12 Rack 7: Housekeeping descriptions ........................................................................................ 18

Table 13 Rack 8: INFO descriptions ....................................................................................................... 19

Table 14 Rack 8: INFO bit descriptions .................................................................................................. 19

Table 15 Rack 8: FCR bit descriptions ................................................................................................... 20

Table 16 Module Status LEDs ................................................................................................................ 22

Table 17 Default I/O Status LEDs .......................................................................................................... 23

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Notice

he content of this document is confidential to ICS Triplex Technology Ltd. companies and their

T partners. It may not be given away, lent, resold, hired out or made available to a third party for any purpose without the written consent of ICS Triplex Technology Ltd.

This document contains proprietary information that is protected by copyright. All rights are reserved.

Microsoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered trademarks of Microsoft Corporation.

The information contained in this document is subject to change without notice. The reader should, in all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been made. From time to time, amendments to this document will be made as necessary and will be distributed by ICS Triplex Technology Ltd.

Information in this documentation set may be subject to change without notice and does not represent a commitment on the part of ICS Triplex Technology Ltd..

The contents of this document, which may also include the loan of software tools, are subject to the confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.

No part of this documentation may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of ICS Triplex Technology Ltd.

Disclaimer

The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the text of this manual.

The user of, and those responsible for applying this equipment, must satisfy themselves as to the acceptability of each application and use of this equipment.

This document is based on information available at the time of its publication. While efforts have been made to be accurate, the information contained herein does not purport to cover all details or variations in hardware or software, nor to provide for every possible contingency in connection with installation, operation, or maintenance. Features may be described herein which are present in all hardware or software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this document with respect to changes subsequently made.

ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of the information contained herein. No warranties of merchantability or fitness for purpose shall apply.

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Revision and Updating Policy

All new and revised information pertinent to this document shall be issued by ICS Triplex Technology Ltd. and shall be incorporated into this document in accordance with the enclosed instructions. The change is to be recorded on the Amendment Record of this document.

Precautionary Information

WARNING

Warning notices call attention to the use of materials, processes, methods, procedures or limits which must be followed precisely to avoid personal injury or death.

CAUTION

Caution notices call attention to methods and procedures which must be followed to avoid damage to the equipment.

Notes:

Notes highlight procedures and contain information to assist the user in the understanding of the information contained in this document

Warning

RADIO FREQUENCY INTERFERENCE

Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be exercised with regard to the use of portable communications equipment around such equipment. Signs should be posted in the vicinity of the equipment cautioning against the use of portable communications equipment.

MAINTENANCE

Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or damage to the system may be caused.

Caution

HANDLING

Under no circumstances should the module housing be removed.

Associated Documents

Product Descriptions (PD) provide product specific information.

The Safety Manual contains the recommended safety requirements for the safety system design.

The PD8082B – Toolset Suite provides specific guidance on system configuration and application generation.

The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic procedures.

For technical support email: support@icstriplex.com

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SmartSlot

Switched Outputs

MON

TMR IMB

Module T8472

1. Description

The TMR 120VAC Digital Output module is a member of the TrustedTM range of Input/Output (I/O) modules. All Trusted

I/O modules share common functionality and form. At the most general level, all I/O modules interface to the Inter-Module Bus (IMB) which provides power and allows communication with the TMR Processor. In addition, all modules have a field interface that is used to connect to module specific signals in the field. All modules system circuits are Triple Modular Redundant (TMR). The AC Output Module has 16 Quad fully isolated and monitored channel AC output switches. configured as two Groups of 8, each group having its own field supply input and field supply monitoring.

FTU

FIU

Bus

INTERNAL VOTER BUS

SmartSlot Link

HIU

Ch 1

Link

FIELD SUPPL

SLICE

Ch 16

2oo3

Voters

Ch 3

Group 1 (G1)

Ch 4

FIELD

SLICE

SUPPL Y Ch

Ch 9

Ch 10

SLICE

Group 2 (G2)

Ch1 -Ch16 Dual

FPU

FRONT PANEL DISPLAY

2500 Vdc ISOLATION

Redundant Isolated AC O/P Channel Switches

Figure 1 Module Architecture

This ‘High Integrity I/O module’ comprises 4 PCB’s: Host Interface Unit (HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU), and the Front Panel Unit (or FPU).

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QAQBQC

SLICE

Module T8472

1.1. Field Termination Unit (FTU)

The Field Termination Unit (FTU) contains the circuitry for the ‘Quad Element’ Channel Switches Ch 9 to Ch 16. (Circuitry for Switches Ch1 to Ch 8 are located on the FIU.)

The FTU contains the Field Output Connector, therefore all Field Connections come from or route via the FTU.

When installed in a Chassis, the FTU field connector accepts the Field I/O Cable Assembly attached at the rear of the chassis.

1.2. Field Interface Unit (FIU)

The Field Interface Unit (FIU) is the section of the module that contains the specific circuits necessary to interface to the particular types of field I/O signals. Unlike other Trusted has four FIUs. References to OFIU refer to specifically OUTPUT Module functions. Each FIU slice operates one switch element (QA,QB, QC or QD) in each of the 16 output channels, as shown in the figure below:

TMR

TMR (Quad

FIU-

{ }

(Quad Element Switches)

I/O modules, the T8472

Field Supply Live

Switched Channel Field Output

HIU FIU

TMR (Inter Modular

Figure 2 FIU Architecture

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2500V dc ISOLATIO

FTU

Field Load

Field Supply Return

Trusted

he switch commands from each HIU slice are voted by each FIU switch interface circuit and

T conversely, each FIU slice relays diagnostic information back to the three HIU slices for further processing. The overall functions of the FIU are summarised below:

Control function – The FIU receives and decodes ON/OFF commands from the HIU for each of the switch elements and forwards the commands to the appropriate switches.

onitoring function – The FIU receives and processes measurement data from each of the switch

M elements and forwards the results to the HIU.

Isolation – The FIU provides galvanic isolation between logic and field.

The majority voting carried out in the FIU ensures that any single slice failure in the HIU does not degrade the output switch operation. Under those circumstances, all output switches would continue to function correctly so long as two out of the three control circuits were operational. A second slice failure would therefore ensure the quad output switches degraded to a known (‘OFF’ or ‘Normally – Open’) state.

Module T8472

1.3. Host Interface Unit (HIU)

The HIU is the point of access to the Inter-Module Bus (IMB) for the module, it is the only section of the I/O module to directly connect to the IMB backplane. The HIU also provides power distribution and local programmable processing power. The HIU is common to most high integrity I/O types and has type dependent and product range common functions. Each HIU contains three independent sections, known as ‘slices’, commonly referred to as A, B, and C. All interconnections between the three slices incorporate isolation to prevent any fault interaction between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one slice has no effect on the operation of the other slices.

The HIU provides the following services common to the modules in the family:

• High Speed Fault-Tolerant Communications with the TMR Processor via the IMB interface.

• FCR Interconnect Bus between slices to vote incoming IMB data and distribute outgoing I/O

module data to IMB.

• Optically isolated serial data interface to the FIU slices.

• Redundant power sharing of dual 24V dc chassis supply voltage and power regulation for logic

power to HIU circuitry.

• Serial data interface to the FPU for module status LED’s.

• Digital Signal Processing to perform local data reduction and self-diagnostics.

• Local memory resources for storing module operation, configuration, and field I/O data.

• On-board housekeeping, which monitors reference voltages, current consumption and board

temperature.

1.4. Front Panel Unit (FPU)

The Front Panel Unit (FPU) contains the necessary connectors, switches, logic, and LED indicators for the front panel. For every module, the FPU contains the Slice Healthy, Active/Standby, the Educated indicators (LED’s), and the module removal switches. Additional bi-colour LED’s provide status indication for the individual I/O signals. Serial data interfaces connect the FPU to each of the HIU slices to control the LED status indicators and monitor the module removal switches

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1.5. Line monitoring and output states

The module automatically monitors the output channel current and voltage (indirectly) to determine the state of the output channel. The numerical output state and line fault status are reported back to the application and are represented below.

Description

Field Short Circuit

Output Energised (On) 4 0

No Load, Field Open Circuit 3 1

Output De-energised (Off) 2 0

No Field Supply Voltage 1 1

1 Short circuits are not detected when the output is de-energized.

Table 1 Line Monitoring Fault Status

Numerical Output State

5 1

Line Fault Status

1.6. Housekeeping

The output module automatically performs local measurements of on-board signals that can be used for troubleshooting and verification of module operating characteristics. Measurements are made within each slice’s HIU and FIU.

1.7. Fault Detection / Testing

Extensive diagnostics provide the automatic detection of module faults. The TMR architecture of the output module and the diagnostics performed ensure the validity of all critical circuits. Using the TMR architecture provides a Fault Tolerant method to withstand the first fault occurrence on the module and continue normal output controls without interruption in the system or process. Faults are reported to the user through the Healthy status indicators on the front panel of the module and through the information reported to the TMR Processor. Under normal operations all three Healthy indicators are green. When a fault occurs, one of the Healthy indicators will be flashing red. It is recommended that this condition is investigated and if the cause is within the module, it should be replaced.

Module replacement activities depend on the type of spare module configuration chosen when the system was configured and installed. The module may be configured with a dedicated Companion Slot or may use a separate Smart Slot. The I/O module contains extensive fault detection and integrity testing. As an output device, all testing is performed in a non-interfering mode. Data input from the IMB is stored in redundant error-correcting RAM (Random Access Memory) on each slice portion of the HIU. Received data is voted on by each slice. All data transmissions include a confirmation response from the receiver.

Periodically, the TMR Processor commands the onboard DSPs (digital signal processors) to perform a Safety Layer Test (SLT). The SLT results in the DSP verifying with the TMR Processor its ability to process data with integrity. In addition, the DSP uses Cyclical Redundancy Checks (CRC) to verify the variables and configuration stored in Flash memory.

Between the FIU and the Field Output Switch Element circuits are a series of magnetically isolated links for data and power. The data link is synchronised and monitored for variance. The HIU has onboard temperature sensors to characterise temperature-related problems. The power supply for the HIU board is redundant, fully monitored and testable.

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