Rockwell Automation T8451 User Manual

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PD-T8451

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Trusted

TMR 24Vdc Digital Output

Module – 40 Channel

Introduction

The TrustedTM TMR 24V dc Digital Output module interfaces to 40 field devices. Triplicated diagnostic
tests are performed throughout the module including measurements for current, and voltage on each
portion of the voted output channel. Tests are also performed for stuck on and stuck off failures. Fault
tolerance is achieved through a Triple Modular Redundant (TMR) architecture within the module for
each of the 40 output channels.

Automatic line-monitoring of the field device is provided. This feature enables the module to detect
both open and short circuit failures in field wiring and load devices.

The module provides on-board Sequence of Events (SOE) reporting with a resolution of 1ms. An
output change of state triggers an SOE entry. Output states are automatically determined by voltage
and current measurements on board the module.

This module is not approved for direct connection to hazardous areas and should be used in
conjunction with Intrinsic Safety Barrier devices.

Features

• 40 Triple Modular Redundant (TMR) output points per module.

• Comprehensive, automatic diagnostics and self-test.

• Automatic line monitoring per point to detect open circuit and short circuit field wiring and

load faults.

• 2500V dc optical isolation barrier.

• Automatic over-current protection (per channel), no fuses required.

• On-board Sequence of Events (SOE) reporting with 1ms resolution.

• Module can be hot-replaced on-line using dedicated Companion (adjacent) Slot or

SmartSlot (one spare slot for many modules) configurations.

• Front panel output status LEDs for each point indicate output status and field wiring faults.

• Front panel module status LEDs indicate module health and operational mode (Active,

Standby, Educated)

6V Certified IEC 61508 SIL 3

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• Outputs are powered in isolated groups of eight.

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Number Date Revised by Technical CheckAuthorised by Modification

8 July 05 J W Clark Reformat

9 Aug 06 N Owens I Vince P Stock Channel States

10 Dec 06 V Middleton N Owens P Stock Weights & Dims

11 Nov 07 N Owens A Holgate P Stock STATE descriptions

12 Apr 10 S Blackett A Holgate N Owens Rack 7 table minor

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Table of Contents

1. Description......................................................................................................................................8

1.1. Field Termination Unit (FTU) ..........................................................................................................9

1.2. Field Interface Unit (FIU) ................................................................................................................9

1.3. Host Interface Unit (HIU) ..............................................................................................................10

1.4. Front Panel Unit (FPU) .................................................................................................................10

1.5. Line monitoring and output states ................................................................................................11

1.6. Housekeeping ..............................................................................................................................11

1.7. Fault Detection/Testing ................................................................................................................11

1.8. Sequence of Events Characteristics ............................................................................................12

1.9. Output Switch Structure................................................................................................................12

1.9.1. Switch Diagnostics .......................................................................................................................13

1.9.2. Short Circuit Protection Issues .....................................................................................................14

1.9.3. Group Fail Safe Switches .............................................................................................................14

2. Installation ....................................................................................................................................15

2.1. Module Insertion/Removal............................................................................................................15

2.2. Cable Selection ............................................................................................................................15

2.3. Termination ..................................................................................................................................15

2.4. Module Pinout Connections..........................................................................................................16

2.5. TrustedTM Module Polarisation/keying..........................................................................................17

3. Application ....................................................................................................................................18

3.1. Module Configuration ...................................................................................................................18

3.2. T8451 Complex Equipment Definition..........................................................................................18

3.2.1. Rack 1: DO...................................................................................................................................19

3.2.2. Rack 2: STATE.............................................................................................................................19

3.2.3. Rack 3: AI.....................................................................................................................................20

3.2.4. Rack 4: CI.....................................................................................................................................21

3.2.5. Rack 5: LINE_FLT........................................................................................................................21

3.2.6. Rack 6: DISCREP ........................................................................................................................21

3.2.7. Rack 7: HKEEPING......................................................................................................................22

3.2.8. Rack 8: INFO................................................................................................................................23

3.3. Sequence of Events Configuration...............................................................................................24

3.4. SYSTEM.INI File Configuration ....................................................................................................24

4. Operation......................................................................................................................................25

4.1. Front Panel ...................................................................................................................................25

4.2. Module Status LEDs.....................................................................................................................26

4.3. I/O Status Indicators .....................................................................................................................27

5. Fault Finding and Maintenance ....................................................................................................28

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5.1. Fault Reporting .............................................................................................................................28

5.2. Field Wiring Faults........................................................................................................................28

5.3. Module Faults ...............................................................................................................................28

5.4. Companion Slot............................................................................................................................29

5.5. SmartSlot......................................................................................................................................29

5.6. Cold Start......................................................................................................................................29

5.7. Transfer between Active and Standby Modules...........................................................................30

6. Specifications ...............................................................................................................................31

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Figures

Figure 1 Module Architecture....................................................................................................................8

Figure 2 Functional Block Diagram ..........................................................................................................9

Figure 3 Output Switch Structure............................................................................................................12

Figure 4 Simplified Switch Circuit Diagram ............................................................................................13

Figure 5 Module polarisation ..................................................................................................................17

Figure 6 Module Front Panel ..................................................................................................................25

Tab l es

Table 1 Line Monitoring Fault Status ......................................................................................................11

Table 2 Field Connector Pinout ..............................................................................................................16

Table 3 Complex Equipment Definition ..................................................................................................18

Table 4 OEM Parameters .......................................................................................................................19

Table 5 Rack 1: DO descriptions ............................................................................................................19

Table 6 Rack 2: STATE descriptions......................................................................................................19

Table 7 Rack 2: STATE Output description............................................................................................20

Table 8 Rack 3: AI descriptions ..............................................................................................................20

Table 9 Rack 4: CI descriptions..............................................................................................................21

Table 10 Rack 5: LINE_FLT descriptions...............................................................................................21

Table 11 Rack 6: DISCREP bit descriptions ..........................................................................................21

Table 12 Rack 7: Housekeeping descriptions ........................................................................................22

Table 13 Rack 8: INFO descriptions.......................................................................................................23

Table 14 Rack 8 INFO bit descriptions ...................................................................................................23

Table 15 Rack 8: FCR bit descriptions ...................................................................................................24

Table 16 Module Status LEDs ................................................................................................................26

Table 17 I/O Status LEDs .......................................................................................................................27

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Notice

The content of this document is confidential to ICS Triplex Technology Ltd. companies and their
partners. It may not be given away, lent, resold, hired out or made available to a third party for any
purpose without the written consent of ICS Triplex Technology Ltd.

This document contains proprietary information that is protected by copyright. All rights are reserved.

icrosoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered

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trademarks of Microsoft Corporation.

The information contained in this document is subject to change without notice. The reader should, in
all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been
made. From time to time, amendments to this document will be made as necessary and will be
distributed by ICS Triplex Technology Ltd.

Information in this documentation set may be subject to change without notice and does not represent
a commitment on the part of ICS Triplex Technology Ltd.

The contents of this document, which may also include the loan of software tools, are subject to the
confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.

No part of this documentation may be reproduced or transmitted in any form or by any means,
electronic or mechanical, including photocopying and recording, for any purpose, without the express
written permission of ICS Triplex Technology Ltd.

Disclaimer

The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the
text of this manual.

The user of, and those responsible for applying this equipment, must satisfy themselves as to the
acceptability of each application and use of this equipment.

This document is based on information available at the time of its publication. While efforts have been
made to be accurate, the information contained herein does not purport to cover all details or variations
in hardware or software, nor to provide for every possible contingency in connection with installation,
operation, or maintenance. Features may be described herein which are present in all hardware or
software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this
document with respect to changes subsequently made.

ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with
respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of
the information contained herein. No warranties of merchantability or fitness for purpose shall apply.

Revision and Updating Policy

All new and revised information pertinent to this document shall be issued by ICS Triplex Technology
Ltd. and shall be incorporated into this document in accordance with the enclosed instructions. The
change is to be recorded on the Amendment Record of this document.

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Precautionary Information

WARNING

Warning notices call attention to the use of materials, processes, methods, procedures or limits which
must be followed precisely to avoid personal injury or death.

CAUTION

Caution notices call attention to methods and procedures which must be followed to avoid damage to
the equipment.

Notes:

Notes highlight procedures and contain information to assist the user in the understanding of the
information contained in this document

Warning

RADIO FREQUENCY INTERFERENCE

Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be
exercised with regard to the use of portable communications equipment around such equipment.
Signs should be posted in the vicinity of the equipment cautioning against the use of portable
communications equipment.

MAINTENANCE

Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or
damage to the system may be caused.

Caution

HANDLING

Under no circumstances should the module housing be removed.

Associated Documents

Product Descriptions (PD) provide product specific information.

The Safety Manual contains the recommended safety requirements for the safety system design.

The PD8082B – Toolset Suite provides specific guidance on system configuration and application
generation.

The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic
procedures.

For technical support email: [e-mail]

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1. Description

The TMR 24V dc Digital Output module is a member of the TrustedTM range of Input/Output (I/O)

odules. All Trusted

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all I/O modules interface to the Inter-Module Bus (IMB) which provides power and allows
communication with the TMR Processor. In addition, all modules have a field interface that is used to
connect to module specific signals in the field. All modules are Triple Modular Redundant (TMR).

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/O modules share common functionality and form. At the most general level,

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Figure 1 Module Architecture

All High Integrity I/O modules are made up of 4 sections: Host Interface Unit (HIU), the Field Interface
Unit (FIU), the Field Termination Unit (FTU), and the Front Panel Unit (or FPU).

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Fig 2 shows a simplified block diagram of the Trusted

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24V dc Digital Output module.

Figure 2 Functional Block Diagram

1.1. Field Termination Unit (FTU)

The Field Termination Unit (FTU) is the section of the I/O module that connects all three FIUs to a
single field interface. The FTU provides the Group Fail-safe switches and passive components
necessary for signal conditioning, over-voltage protection, and EMI/RFI filtering. When installed in a
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Controller or Expander Chassis, the FTU field connector interconnects to the Field I/O Cable

Assembly attached at the rear of the chassis.

The SmartSlot link is passed from the HIU to the field connections via the FTU. These signals go
directly to the field connector and maintain isolation from the I/O signals on the FTU. The SmartSlot
link is the intelligent connection between active and standby modules for co-ordination during module
replacement.

1.2. Field Interface Unit (FIU)

The Field Interface Unit (FIU) is the section of the module that contains the specific circuits necessary
to interface to the particular types of field I/O signals. Each module has three FIUs, one per slice. For
the TMR 24V dc Digital Output Module, the FIU contains one stage of the output switch structure, and
sigma-delta (JK) output circuit for each of the 40 field outputs. Two additional JK circuits provide
optional monitoring of the external field I/O supply voltage.

The FIU receives isolated power from the HIU for logic. The FIU provides additional power
conditioning for the operational voltages required by the FIU circuitry. An isolated 6.25Mbit/sec serial
link connects each FIU to one of the HIU slices.

The FIU also measures a range of on-board “house-keeping” signals that assist in monitoring the
performance and operating conditions of the module. These signals include power supply voltages,
current consumption, on-board reference voltages, board temperature, and condensation

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FCR Interconnect Bus between slices to vote incoming IMB data and distribute outgoing I/O

voltage and power regulation for logic

ordination during module

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1.3. Host Interface Unit (HIU)

The HIU is the point of access to the Inter-Module Bus (IMB) for the module. It also provides power
distribution and local programmable processing power. The HIU is the only section of the I/O module
to directly connect to the IMB backplane. The HIU is common to most high integrity I/O types and has
type dependent and product range common functions. Each HIU contains three independent slices,
commonly referred to as A, B, and C.

All interconnections between the three slices incorporate isolation to prevent any fault interaction
between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one
slice has no effect on the operation of the other slices.

The HIU provides the following services common to the modules in the family:

• High Speed Fault-Tolerant Communications with the TMR Processor via the IMB interface.

•

module data to IMB.

• Optically isolated serial data interface to the FIU slices.

• Redundant power sharing of dual 24V dc chassis supply

power to HIU circuitry.

• Magnetically Isolated power to the FIU slices.

• Serial data interface to the FPU for module status LEDs.

• SmartSlot link between active and standby modules for co-

replacement.

• Digital Signal Processing to perform local data reduction and self-diagnostics.

• Local memory resources for storing module operation, configuration, and field I/O data.

• On-board housekeeping, which monitors reference voltages, current consumption and

temperature.

1.4. Front Panel Unit (FPU)

The Front Panel Unit (FPU) contains the necessary connectors, switches, logic, and LED indicators for
the front panel. For every module, the FPU contains the Slice Healthy, Active/Standby, the Educated
indicators (LEDs), and the module removal switches. Additional bi-colour LEDs provide status
indication for the individual I/O signals. Serial data interfaces connect the FPU to each of the HIU
slices to control the LED status indicators and monitor the module removal switches.

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