Rockwell Automation T8448 User Manual

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PD-T8448

Trusted

TMR Zone Interface

Module – 40 Channel

Introduction

The TrustedTM TMR Zone Interface module has been designed to provide a configurable interface specifically for use in Fire and Gas protection systems. The module interfaces to up to 40 Fire and Gas field device inputs or actuators. Each of the 40 I/O Channels can be individually configured as Analogue Input, Digital Input or Digital Output to provide all of the interfaces needed to protect one or more Fire and Gas Zones. Interfacing to the field devices is through a Versatile Field Termination Assembly type 8842, which provides the field loop conditioning for each of the types of signal, and enables the connection of reset signals for latching type detectors without the need for external hardware. The module is separated into 5 power groups each with 8 channels. Power groups can be combined together to provide a configurable number of channels for each Fire/Gas Zone. All of these functions provide data to the Trusted

TMR system which acts as the logic solver.

Triplicated diagnostic tests are performed throughout the module, including measurements for current and voltage on each portion of voted input or output channels. Tests are also performed for stuck on and stuck off failures. All inputs are treated as analogue and are fully tested. Fault tolerance is achieved through a Triple Modular Redundant (TMR) architecture within the module for each of the 40 channels.

Features

• 40 Triple Modular Redundant selectable input/output points per module.

• Inputs interface to 4-20mA gas detectors, Fire and Heat detectors, Break Glass units etc.

• Programmable Field Device Reset signals (up to 5 individual resets)

• Two or Three Wire Field devices through 8842

• Fuse Protection of Inputs and Outputs through 8842

• High Power Digital Outputs to interface to Dampers, Extinguishant Release, Fire pumps

etc.

• 5 Isolated Power Groups to allow flexible and efficient field configurations.

• Comprehensive automatic diagnostics and self-test.

• Automatic line monitoring per point to detect faults in field wiring and loads.

• 2500V dc optical isolation barrier.

• Automatic over-current protection (per channel), no module fuses required

• On-board Sequence of Events (SOE) reporting with 1ms resolution.

• Module can be hot-replaced on-line using dedicated Companion (adjacent) Slot or

SmartSlot (one spare slot for many modules) configurations.

• TÜV Certified IEC 61508 SIL 3

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Issue Record

Issue Number Date Revised by Technical CheckAuthorised by Modification

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8 Feb 06 Pete Stock Format correction

9 Aug 06 N Owens I Vince P Stock Input power

10 Dec 06 V Middleton N Owens P Stock Weights & Dims

11 Mar 07 N Owens I Vince P Stock Accuracy

12 Nov 07 N Owens A Holgate P Stock STATE descriptions

13 Aug 08 I Vince N Owens P Stock Accuracy

14 Apr 10 S Blackett A Holgate N Owens Rack 7 changes

July 05 J W Clark Reformat

Sect 3 Application Resistor

Sect 1.5 Default Thresholds added.

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Table of Contents

1. Description...................................................................................................................................9

1.1. Field Termination Unit (FTU) .....................................................................................................10

1.2. Field Interface Unit (FIU) ...........................................................................................................10

1.3. Host Interface Unit (HIU) ...........................................................................................................11

1.4. Front Panel Unit (FPU) ..............................................................................................................11

1.5. Input Line Monitoring Thresholds...............................................................................................11

1.6. Housekeeping............................................................................................................................12

1.7. Fault Detection and Testing.......................................................................................................12

1.8. Sequence of Events Characteristics..........................................................................................12

1.9. Output Switch Structure .............................................................................................................13

1.9.1. Switch Diagnostics.....................................................................................................................14

1.9.2. Short Circuit Protection Issues ..................................................................................................14

1.9.3. Group Fail Safe Switches ..........................................................................................................15

1.10. Output Line Monitoring States ...................................................................................................15

1.11. Input Interfaces ..........................................................................................................................16

1.12. Field Interface Selection ............................................................................................................16

2. Installation..................................................................................................................................17

2.1. Module Insertion and Removal ..................................................................................................17

2.2. Field Cable Selection .................................................................................................................17

2.3. Termination................................................................................................................................17

2.4. Module Pinout Connections .......................................................................................................18

2.5. TrustedTM Module Polarisation/Keying.......................................................................................19

3. Application .................................................................................................................................20

3.1. Module Configuration.................................................................................................................21

3.2. T8448 Complex Equipment Definition .......................................................................................22

3.2.1. Rack 1: DO ................................................................................................................................23

3.2.2. Rack 2: STATE ..........................................................................................................................23

3.2.3. Rack 3: AI ..................................................................................................................................25

3.2.4. Rack 4: CI ..................................................................................................................................25

3.2.5. Rack 5: LINE_FLT .....................................................................................................................26

3.2.6. Rack 6: DISCREP......................................................................................................................26

3.2.7. Rack 7: HKEEPING ...................................................................................................................27

3.2.8. Rack 8: INFO .............................................................................................................................28

3.2.9. Rack 9: THRSHIN......................................................................................................................30

3.2.10. Rack 10:THRSHOUT.................................................................................................................30

3.3. Sequence of Events Configuration ............................................................................................31

3.4. SYSTEM.INI File Configuration .................................................................................................31

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. Operation ...................................................................................................................................32

4.1. Front Panel ................................................................................................................................32

4.2. Module Status LEDs ..................................................................................................................33

4.3. I/O Status Indicators ..................................................................................................................34

5. Fault Finding and Maintenance..................................................................................................35

5.1. Fault Reporting ..........................................................................................................................35

5.2. Field Wiring Faults.....................................................................................................................35

5.3. Module Faults ............................................................................................................................35

5.4. Companion Slot .........................................................................................................................36

5.5. SmartSlot ...................................................................................................................................36

5.6. Cold Start...................................................................................................................................36

5.7. Transfer between Active and Standby Modules ........................................................................37

6. Specifications.............................................................................................................................38

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Figures

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igure 1 Module Architecture....................................................................................................................9

Figure 2 Function Block Diagram ...........................................................................................................10

Figure 3 Output Switch Structure............................................................................................................13

Figure 4 Simplified Switch Circuit Diagram ............................................................................................14

Figure 5 Module polarisation ..................................................................................................................19

Figure 6 Module Front Panel ..................................................................................................................32

Tabl es

Table 1 Line Monitoring Fault Status......................................................................................................15

Table 2 Field Connector Pinout ..............................................................................................................18

Table 3 Complex Equipment Definition ..................................................................................................22

Table 4 OEM Parameters.......................................................................................................................22

Table 5 Rack 1: DO descriptions............................................................................................................23

Table 6 Rack 2: STATE descriptions......................................................................................................23

Table 7 Rack 2: STATE Output bit descriptions.....................................................................................24

Table 8 Rack 2: STATE Input bit descriptions........................................................................................24

Table 9 Rack 3: AI bit descriptions .........................................................................................................25

Table 10 Rack 4: CI bit descriptions.......................................................................................................25

Table 11 Rack 5: LINE_FLT bit descriptions ..........................................................................................26

Table 12 Rack 6: DISCREP bit descriptions ..........................................................................................26

Table 13 Rack 7: Housekeeping descriptions ........................................................................................27

Table 14 Rack 8: INFO descriptions.......................................................................................................28

Table 15 Rack 8: INFO bit descriptions..................................................................................................29

Table 16 Rack 8: FCR bit descriptions ...................................................................................................29

Table 17 Rack 9: THRSHIN descriptions ...............................................................................................30

Table 18 Rack 10: THRSHOUT descriptions .........................................................................................30

Table 19 Module Status LEDs................................................................................................................33

Table 20 I/O Status LEDs.......................................................................................................................34

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Notice

The content of this document is confidential to ICS Triplex Technology Ltd. companies and their partners. It may not be given away, lent, resold, hired out or made available to a third party for any purpose without the written consent of ICS Triplex Technology Ltd.

This document contains proprietary information that is protected by copyright. All rights are reserved.

Microsoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered trademarks of Microsoft Corporation.

The information contained in this document is subject to change without notice. The reader should, in all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been made. From time to time, amendments to this document will be made as necessary and will be distributed by ICS Triplex Technology Ltd.

Information in this documentation set may be subject to change without notice and does not represent a commitment on the part of ICS Triplex Technology Ltd.

The contents of this document, which may also include the loan of software tools, are subject to the confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.

No part of this documentation may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of ICS Triplex Technology Ltd.

Disclaimer

The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the text of this manual.

The user of, and those responsible for applying this equipment, must satisfy themselves as to the acceptability of each application and use of this equipment.

This document is based on information available at the time of its publication. While efforts have been made to be accurate, the information contained herein does not purport to cover all details or variations in hardware or software, nor to provide for every possible contingency in connection with installation, operation, or maintenance. Features may be described herein which are present in all hardware or software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this document with respect to changes subsequently made.

ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of the information contained herein. No warranties of merchantability or fitness for purpose shall apply.

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Revision and Updating Policy

All new and revised information pertinent to this document shall be issued by ICS Triplex Technology Ltd. and shall be incorporated into this document in accordance with the enclosed instructions. The change is to be recorded on the Amendment Record of this document.

Precautionary Information

WARNING

Warning notices call attention to the use of materials, processes, methods, procedures or limits which must be followed precisely to avoid personal injury or death.

CAUTION

Caution notices call attention to methods and procedures which must be followed to avoid damage to the equipment.

Notes:

Notes highlight procedures and contain information to assist the user in the understanding of the information contained in this document

Warning

RADIO FREQUENCY INTERFERENCE

Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be exercised with regard to the use of portable communications equipment around such equipment. Signs should be posted in the vicinity of the equipment cautioning against the use of portable communications equipment.

MAINTENANCE

Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or damage to the system may be caused.

Caution

HANDLING

Under no circumstances should the module housing be removed.

Associated Documents

Product Descriptions (PD) provide product specific information.

The Safety Manual contains the recommended safety requirements for the safety system design.

The PD8082B – Toolset Suite provides specific guidance on system configuration and application generation.

The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic procedures.

For technical support email: support@icstriplex.com

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1. Description

The TMR Zone Interface module is a member of the Trusted All Trusted

I/O modules share common functionality and form. At the most general level, all I/O

modules interface to the Inter-Module Bus (IMB) which provides power and allows communication with

he TMR Processor. In addition, all modules have a field interface that is used to connect to module

t specific signals in the field. All modules are Triple Modular Redundant (TMR).

range of Input/Output (I/O) modules.

Figure 1 Module Architecture

All High Integrity I/O modules are made up of 4 sections: Host Interface Unit (HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU), and the Front Panel Unit (or FPU).

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Figure 2 shows a simplified block diagram of the TrustedTM Zone Interface Module.

Internal Voting Bus

TMR Intermodule Bus

Housekeeping Module Temp

Back Plane

ack Plane Power Bus 1

ower Bus

Back Plane Power Bus 2

Interface

Bus

nterface

Bus

nterface

upply Diag

SP reference

Redundant Supply

Slice

Control

ime Stamp

Slice

Control

ime Stamp

Slice

Control

ime Stamp

Failsafe Bia s Control

lice Power

upply

Field Logic

Control

ailsafe Bias Control

Slice Power

Supply

Field Logic

Control

ailsafe Bias Control

lice Power

Supply

Field Logic

Control

Opto Isolat ion Boundary

Front Panel

oting Logic

Indicators

Health

Voted Status Display LEDs

Serial Dis play Latches

Front Pane l

OFIUHIU

Housekeeping

iagnostic

onitor

ousekeeping

iagnostic Monitor

N.O.

FPIU

FPDU

Slice A

lice B

N.C.

Slice C

N.C.

OFTU

.C.

ield Interfa ce

rotection C ircuit

roup

Fail-Safe

witch

A B C

Figure 2 Function Block Diagram

1.1. Field Termination Unit (FTU)

The Field Termination Unit (FTU) is the section of the I/O module that connects all three FIUs to a single field interface. The FTU provides the Group Fail-safe switches and passive components necessary for signal conditioning, over-voltage protection, and EMI/RFI filtering. When installed in a Trusted

Controller or Expander Chassis, the FTU field connector interconnects to the Field I/O Cable

Assembly attached at the rear of the chassis.

The SmartSlot link is passed from the HIU to the field connections via the FTU. These signals go directly to the field connector and maintain isolation from the I/O signals on the FTU. The SmartSlot link is the intelligent connection between active and standby modules for co-ordination during module replacement.

1.2. Field Interface Unit (FIU)

The Field Interface Unit (FIU) is the section of the module that contains the specific circuits necessary to interface to the particular types of field I/O signals. Each module has three FIUs, one per slice. For the TMR Zone Interface Module, the FIU contains one stage of the output switch structure, and A/D monitoring circuits for each of the channels Two additional A/D circuits provide optional monitoring of the external field I/O supply voltage.

The FIU receives isolated power from the HIU for logic. The FIU provides additional power conditioning for the operational voltages required by the FIU circuitry. An isolated 6.25Mbit/sec serial link connects each FIU to one of the HIU slices.

The FIU also measures a range of on-board “house-keeping” signals that assist in monitoring the performance and operating conditions of the module. These signals include power supply voltages, current consumption, on-board reference voltages, board temperature, and condensation.

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FCR Interconnect Bus between slices to vote incoming IMB data and distribute outgoing I/O

Redundant power sharing of dual 24V dc chassis supply voltage and power regulation for logic

ordination during module

board housekeeping, which monitors reference voltages, current consumption and board

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1.3. Host Interface Unit (HIU)

The HIU is the point of access to the Inter-Module Bus (IMB) for the module. It also provides power distribution and local programmable processing power. The HIU is the only section of the I/O module to directly connect to the IMB backplane. The HIU is common to most high integrity I/O types and has type dependent and product range common functions. Each HIU contains three independent slices, commonly referred to as A, B, and C.

ll interconnections between the three slices incorporate isolation to prevent any fault interaction

A between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one slice has no effect on the operation of the other slices.

The HIU provides the following services common to the modules in the family:

• High Speed Fault-Tolerant Communications with the TMR Processor via the IMB interface.

•

module data to the IMB.

• Optically isolated serial data interface to the FIU slices.

•

power to HIU circuitry.

• Magnetically isolated power to the FIU slices.

• Serial data interface to the FPU for module status LEDs.

• SmartSlot link between active and standby modules for co-

replacement.

• Digital Signal Processing to perform local data reduction and self-diagnostics.

• Local memory resources for storing module operation, configuration, and field I/O data.

• On-

temperature.

1.4. Front Panel Unit (FPU)

The Front Panel Unit (FPU) contains the necessary connectors, switches, logic, and LED indicators for the front panel. For every module, the FPU contains the Slice Healthy, Active/Standby, the Educated indicators (LEDs), and the module removal switches. Additional bi-colour LEDs provide status indication for the individual I/O signals. Serial data interfaces connect the FPU to each of the HIU slices to control the LED status indicators and monitor the module removal switches.

1.5. Input Line Monitoring Thresholds

Whether selected as a digital or an analogue input, the module measures the voltage applied to each input and compares this with four user programmed thresholds and two fixed (minimum and maximum) thresholds. These may be used within the application to signal a field device state. Hysteresis is provided on the thresholds by upscale and downscale values, corresponding to the thresholds for increasing and decreasing values respectively. The analogue voltage reading is also provided to the application for conversion to engineering units and/or direct trip derivation.

Default threshold values used for non line monitored inputs are as follows (in raw units)

Default = -5000, -5000, 5000, 5000, 7500, 7500, 11750, 11750

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1.6. Housekeeping

The Zone Interface Module automatically performs local measurements of several on-board signals that can be used for detailed troubleshooting and verification of module operating characteristics. Measurements are made within each slice’s HIU and FIU.

1.7. Fault Detection and Testing

From the IMB to the field connector, the I/O module contains extensive fault detection and integrity testing. Most testing is performed in a non-interfering mode. Data input from the IMB is stored in redundant error-correcting RAM on each slice portion of the HIU. Received data is voted on by each slice. All data transmissions include a confirmation response from the receiver.

Periodically, the TMR Processor commands the onboard Digital Signal Processors (DSPs) to perform a Safety Layer Test. The SLT results in the DSP verifying with the TMR Processor its ability to process data with integrity. In addition, the DSP uses Cyclical Redundancy Checks (CRC) to verify the variables and configuration stored in Flash memory.

Between the HIU and FIU are a series of optically isolated links for data and power. The data link is synchronized and monitored for variance. Both FIU and HIU have onboard temperature sensors to characterize temperature-related problems. Each FIU is also fitted with a condensation sensor.

The power supplies for both the HIU and FIU boards are redundant, fully instrumented and testable. Together these assemblies form a Power Integrity Sub System.

1.8. Sequence of Events Characteristics

The module automatically measures the field voltage and current to determine the state of each channel. An event occurs when the channel transitions from one state to another. When a channel changes state, the on-board timer value is recorded. When the TMR Processor next reads data from the module, the channel state and real-time clock value are retrieved. The TMR Processor uses this data to log the state change into the system Sequence of Events (SOE) log. The user may configure each channel to be included in the system SOE log. Full details of SOE are contained in PD-8013 Trusted

SOE and Process Historian.

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1.9. Output Switch Structure

The Zone Interface Module provides a TMR switch topology where the load is driven by a total of three fully monitored, fail-safe (6 element) switch channels, one physically resident on each OFIU in the module. Any single switch or entire slice failure is designed to leave two of the three fail-safe switch channels operational to power the load.

Figure 3 Output Switch Structure

The upper switches as shown in Figure 3 are denoted as N.O. (Normally Open), and are controlled by the FIU on which they are physically resident. Closed), and are controlled by the “upstream” neighbouring FIU.

The lower switches are depicted as N.C. (Normally

Note:

In this context, N.O. is defined as being in the off state in the absence of control signal power, and similarly, N.C. is the on state in the absence of control signal power. These switches are constructed from enhancement mode MOSFETs and are both guaranteed to be off in the

absence of module power to create gate voltage signals to bias them on

(unlike

electromechanical relays for example).

The reason that the lower switches are specified to be on in the absence of control signal power is to allow two channels to power the load should an entire slice fail. Even if an entire slice fails, the surviving output circuits will carry the necessary control. The structure of each OFIU output is shown below:

Their “home” FIU.

The home FIU, supplies an independent control signal for the “downstream” FIU FSS.

For an un-faulted transistor.

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Figure 4 Simplified Switch Circuit Diagram

A resistor provides a means of continuously monitoring the switch current. A signal transistor is used to drive the gate of Switch 2. It provides Switch 2 with a negative gate voltage, to minimize it’s on resistance, and serves to hold Switch 2 on in the event that the secondary gate control loses power.

The zener diode between the gate of Switch 2 and source is only required to protect the gate from large voltage spikes on the drain that might capacitively couple through when Switch 1 and Switch 2 are in the off state.

The resistors in series with the gate of Switch 1 and the signal transistor serve to protect the drive logic in the event of a malicious switch failure. The pull-up resistors define the gate voltages in the absence of power.

1.9.1. Switch Diagnostics

During normal operation, Switch 1 and Switch 2 are maintained on. In this state, Switch 1 and Switch 2 exhibit a low resistance.

To determine the ability of the system to control the load via Switch 1 and Switch 2, their gate voltages are modulated, one at a time. As the gate voltages are modulated, the monitoring signals synchronously change in a predictable fashion. The local DSP analyses the relative amplitude and phase of these small AC signals, to determine the on resistance and threshold voltages of each switch.

The current to the load does not need to be completely interrupted in order to obtain a level of confidence in the ability of the transistors to turn off. For the TMR switch configuration in the on state, only one fail-safe switch at a time needs to be modulated, while the other two bear the load current.

1.9.2. Short Circuit Protection Issues

In a fuse-free design such as in the Trusted event of an over-current or over-power situation. In fact, this protection scheme offers advantages to fuses in both automatic recovery and speed of action.

System, the module is required to respond rapidly in the

The topology of the channel provides a natural limit to the instantaneous current flow, giving the module time to respond. Furthermore, the over-current protection circuitry is inherently self-testable, since the threshold can be a programmable value.

The P-channel architecture of Switch 1 and Switch 2 has an open-drain output structure. Under shortcircuit conditions the maximum instantaneous current with a 24V field voltage is naturally limited to less than 5A per channel. This is because high output currents cause the gate-source voltages of the two transistors to be reduced, tending to turn them off.

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he output current is monitored by the DSP. Sustained over current conditions cause the DSP to de-

T energise the associated output. Once the fault has been corrected, the latched de-energised state can be reset by turning off the logical output signal to the module and pressing the system fault reset button. The output also includes a non-replaceable fusible link for absolute protection.

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1.9.3. Group Fail Safe Switches

To ensure safe operation, the Zone Interface Module is equipped with a series of switches that provide source power to a group of 8 channels. The module Group Fail Safe Switch (GFSS) is intended as a final control switch which can de-energise any outputs that cannot be de-energised in the normal way. For safety, the presence of two or more faults within the module will cause the Group Fail Safe Switches to de-energise. This de-energises all of the outputs in its group.

The GFSS has three switches in parallel, each controlled by one 'slice' of the group. This means that if one slice determines from the states that an output is not de-energised when it should be, then it can command its own GFSS and those of the other slices’ GFSS to de-energise. This results in two of the three elements of the GFSS structure to de-energise, leaving only one GFSS element energised. If two slices do the same thing then the last GFSS will de-energise. For example, this would occur if two or more switch elements fail in a 'stuck-on' state such that the output cannot de-energise.

The GFSS control signal is generated by a charge pump driven from the comms clock to the slice power group. If the clock fails then the GFSS bias collapses. This means that even if the ability of the slice to communicate with a power group is lost, the GFSS can still be de-energised by stopping the comms clock. If a slice fails, the watchdog on the HIU will time out and reset the slice. This will shutdown the OFIU power supply and the associated GFSS control signal will also de-energise.

1.10. Output Line Monitoring States

When a channel is selected as an output, the module automatically monitors channel current and voltage to determine the state. The numerical output state and line fault status are reported back to the application and are represented below.

Description

Field Short Circuit 5 1 Output Energised (On) 4 0 No Load, Field Open Circuit 3 1 Output De-energised (Off) 2 0 No Field Supply Voltage 1 1

Table 1 Line Monitoring Fault Status

Numerical Output State

Line Fault Status

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1.11. Input Interfaces

Each channel selected as an input is provided with three A/D converters which monitor the voltage at the input connection. These are the same A/D converters which are used to determine channel state in the output configuration. Each input is a high impedance channel and measures from 0 to 30 V. If current is to be measured, the input must be conditioned with an external resistor. This resistor is mounted on the 8842 Versatile Field Termination Assembly. The module uses its TMR architecture to provide fault tolerance in the event of a hardware failure. Dynamic testing of the input path is provided to ensure safe operation within the TMR structure.

Note that 24V field power is required for a Zone Interface Module even if all channels are configured as volt-free inputs. This may be connected via the plug at the chassis end of the cable to a T8290 or T8297 distribution unit (for cables without power wires) or at the VFTA (for integral power cables).

1.12. Field Interface Selection

For details of the recommended field interface circuit configurations, please refer to the product description for the 8842 Versatile Termination Assembly.

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2. Installation

2.1. Module Insertion and Removal

CAUTION:

The module contains static sensitive parts. static handling precautions must be observed. Specifically ensure that exposed connector pins ARE NOT TOUCHED. Under no circumstances should the module housing BE REMOVED.

Before installation, visually inspect the module for damage. Ensure that the module housing appears undamaged and inspect the I/O connector at the back of the module for bent pins. If the module appears damaged or any pins are bent, do not install the module. Do not try to straighten bent pins. Return the module for replacement.

Ensure that the module is of the correct type.

Record the module type, revision and serial number of the module before installation.

To install the module:

1. Ensure that the field cable assembly is installed and correctly located.

2. If I/O module keys are used, verify that all keys are installed in the correct positions and properly seated in their slots.

3. Release the ejector tabs on the module using the release key. Ensure that the ejector tabs are fully open.

4. Holding the ejectors, carefully insert the module into the intended slot.

5. Push the module fully home by pressing on the top and bottom of the module fascia.

Close the module ejectors, ensuring that they click into their locked position.

The module should mount into the chassis with a minimum of resistance. If the module does not mount easily, do not force it. Remove the module and check it for bent or damaged pins. If the pins have not been damaged, try reinstalling the module.

2.2. Field Cable Selection

I/O Cables suitable for use with the TrustedTM TMR Zone Interface module are detailed in the following product descriptions:

1. PD-TC200 – Trusted

2. PD-TC500 – Trusted

3. The Product Descriptions detailed above also detail the types of Field Termination Assembly (FTA) or Versatile Field Termination Assembly (VFTA) which may be used with each type of module.

I/O Companion Slot Cables

I/O SmartSlot Slot Cables

2.3. Termination

Unused outputs should be commanded off in the application and wired through a 4K7 0.5W resistor to zero volts.

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2.4. Module Pinout Connections

C B A

1 Smart Slot Link C Smart Slot Link B Smart Slot Link A

3 Chan 5 (+) Pwr Group 1 (+) Chan 1 (+)

4 Chan 6 (+) Pwr Group 1 (+) Chan 2 (+)

5 Pwr Group 1 Rtn Pwr Group 1 (+) Pwr Group 1 Rtn

6 Chan 7 (+) Pwr Group 1 (+) Chan 3 (+)

7 Chan 8 (+) Pwr Group 1 (+) Chan 4 (+)

9 Chan 13 (+) Pwr Group 2 (+) Chan 9 (+)

10 Chan 14 (+) Pwr Group 2 (+) Chan 10 (+)

11 Pwr Group 2 Rtn Pwr Group 2 (+) Pwr Group 2 Rtn

12 Chan 15 (+) Pwr group 2 (+) Chan 11 (+)

13 Chan 16 (+) Pwr Group 2 (+) Chan 12 (+)

15 Chan 21 (+) Pwr Group 3 (+) Chan 17 (+)

16 Chan 22 (+) Pwr Group 3 (+) Chan 18 (+)

17 Pwr Group 3 Rtn Pwr Group 3 (+) Pwr Group 3 Rtn

18 Chan 23 (+) Pwr Group 3 (+) Chan 19 (+)

19 Chan 24 (+) Pwr Group 3 (+) Chan 20 (+)

21 Chan 29 (+) Pwr Group 4 (+) Chan 25 (+)

22 Chan 30 (+) Pwr Group 4 (+) Chan 26 (+)

23 Pwr Group 4 Rtn Pwr Group 4 (+) Pwr Group 4 Rtn

24 Chan 31 (+) Pwr Group 4 (+) Chan 27 (+)

25 Chan 32 (+) Pwr Group 4 (+) Chan 28 (+)

27 Chan 37 (+) Pwr Group 5 (+) Chan 33 (+)

28 Chan 38 (+) Pwr Group 5 (+) Chan 34 (+)

29 Pwr Group 5 Rtn Pwr Group 5 (+) Pwr Group 5 Rtn

30 Chan 39 (+) Pwr Group 5 (+) Chan 35 (+)

31 Chan 40 (+) Pwr Group 5 (+) Chan 36 (+)

Table 2 Field Connector Pinout

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identified below)

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2.5. TrustedTM Module Polarisation/Keying.

All TrustedTM Modules have been Keyed to prevent insertion into the wrong position within a chassis. The polarisation comprises two parts. The module and the associated field cable.

Each module type has been keyed during manufacture. The organisation responsible for the integration of the Trusted

o that they correspond with the bungs fitted to the associated module prior to fitting.

Polarising/Keying Pins. (Remove using side cutters where

system must key the cable by removing the keying pieces from the cable

Cable Exit

Trusted Cable hood

Release button

Smart Swap Connector if Fitted

For Cables with Companion slot installations both keying strips must be polarised.

For This Module (T8448) remove keying pins 1,7,9

Figure 5 Module polarisation

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Module T8448

3. Application

The Zone Interface Module has been designed to provide a cost effective and high integrity interface with a Fire and Gas Zone. Each Zone within an application will have a unique combination of signals. In order to reduce the amount of hardware required, the Zone Interface has been made configurable

sing a simple software configuration package. The Zone Interface Module operates in conjunction

u with the Trusted

The Termination assembly uses plug-in fuses and links to allow selection of different field loop conditioning combinations.

Under software control, the Zone Interface Module can select any channel to be input or output. When a channel is selected as output the module provides a full TMR high integrity fault tolerant switch. In the input mode the channel becomes a voltage input analogue interface. Each field input is triplicated and the input voltage is measured using an analogue to digital converter. In the Input mode, different resistor combinations on the Versatile Field Termination Assembly (VFTA) are used to condition the field loop and provide the voltage input to the module.

For volt-free or zener-limited inputs, the internal input energise test will fail. To avoid fault indications due to inputs that cannot be lifted in voltage by the module due to intrinsic shorting, a 1K 1W resistor is required on the channel wiring between the module and the FTA. Note that this will change the voltages seen by the module, and will require different monitoring thresholds. This resistor may also be placed in series with the field contacts as a line monitoring component. The energise tests are required by TUV for AK6 operation to verify the input circuitry.

Versatile Field Termination Assembly 8842.

One Channel in each power group can be selected on the Versatile Field Termination Assembly to be a fire detector power output. The power is distributed to the 7 remaining channels of that group and is controlled by the Trusted field devices. It is usual to configure the module as groups of 7 fire inputs. However, the linking of the VFTA can allow the Reset group to be any combination from 1 to 39 channels, evenly or randomly distributed throughout the module, given that the total load on the output channel does not exceed 2A.

Gas inputs are interfaced by converting a 4-20mA current loop into a 1-5V signal on the VFTA, but the inputs operate across a wider range in order to allow for poor field calibration and the calibration/fault modes of field devices.

Each digital input voltage can be compared to user adjustable thresholds so as to generate up to 5 distinct states (for example Open circuit loop, Normal, Alarm, Short Circuit loop). Each of these thresholds has adjustable hysteresis and can be positioned anywhere within the operating range of the input. This allows for detection of field loop faults as well as alarm states.

application logic. Removing power from the field loop resets fire detecting

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Module T8448

3.1. Module Configuration

There is no configuration required to the physical module. All configurable characteristics of the module are performed using tools on the EWS and become part of the application or system.ini file that is loaded into the TMR Processor. The TMR Processor automatically configures the module after applications are downloaded and during Active/Standby changeover.

The IEC1131 TOOLSET provides the main interface to configure the Zone Interface module. Details of the configuration tools and configuration sequence are provided in PD-8082B Trusted

Toolset

Suite. There are three procedures necessary to configure the module. These are:

1. Define the necessary I/O variables for the field data and module status data using the Dictionary Editor of the IEC1131 TOOLSET.

2. Create an I/O module definition in the I/O Connection Editor for each I/O module. The I/O module definition defines physical information, e.g. Chassis and Slot location, and allows variables to be connected to the I/O channels of the module.

3. Using the Trusted

System Configuration Manager, define custom LED indicator modes,

per-channel default or fail-safe states, and other module settings.

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Module T8448

3.2. T8448 Complex Equipment Definition

The 8448 I/O Complex Equipment Definition includes 10 I/O boards, referenced numerically by rack number.

Rack I/O Board Description Data Type Direction No. of

Channels

1 DO

2 STATE Field Output State Integer In 40 3 AI Measured voltage Integer In 40 4 CI Measured current Integer In 40 5 LINE_FLT Line Fault Status Boolean In 40 6 DISCREP Channel Discrepancy Integer In 3 7 HKEEPING Housekeeping Registers Integer In 57 8 INFO I/O Module Information Integer In 11 9 THRSHIN Threshold Setting Feedback Integer In 9

10 THRSHOUT Threshold Setting Command Integer Out 11

OEM Parameters - - Field Output Status Boolean Out 40

Table 3 Complex Equipment Definition

There are two OEM parameters included in the first rack (DO Board). These OEM parameters define the primary module position, declaring the module’s chassis and slot location. There is no need to define the secondary module position within the IEC1131 TOOLSET if the system will always be started with a module in the primary position. Where systems may be required to start-up with modules in the secondary position as the active module, e.g. primary module is not installed when application is started, the secondary module’s position should be declared in the module definition of the System Configuration Manager.

OEM Parameter

TICS_CHASSIS The number of the

Description Notes

Controller Chassis is 1, and

Expander Chassis are 2 to 15

Trusted

Chassis

The Trusted

Trusted where the Primary I/O module is installed

TICS_SLOT The slot number in the

chassis where the Primary I/O module is installed

The I/O module slots in the Trusted

chassis are numbered from 1 to 8. The I/O Module

slots in the Trusted

Expander Chassis are

numbered from 1 to 12.

Controller

Table 4 OEM Parameters

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Module T8448

3.2.1. Rack 1: DO

his board provides the connection to the logical output control signal for each of the field outputs.

Channel Description

1 Field output channel 1 logical state 2 Field output channel 2 logical state

40 Field output channel 40 logical state

Table 5 Rack 1: DO descriptions

The user application should set the output control signal to true (logic ‘1’) to turn ON or energise an output, and false (logic ‘0’) to turn OFF or de-energise an output.

3.2.2. Rack 2: STATE

This board provides the majority voted numerical state. This indicates the operational status of the channel and associated field connection.

Channel Description

1 Field channel 1 state 2 Field channel 2 state

40 Field channel 40 state

Table 6 Rack 2: STATE descriptions

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The least significant 3-bits indicate the operational state of the channel. When configured as an output, the states have the following meaning.

Module T8448

alue

7 Channel Fault 6 Field fault (e.g. field leakage to 0V or 24V) 5 Short circuit in field wiring or load 4 Output energised (ON) 3 Open circuit in field wiring or load 2 Output de-energised (OFF) 1 No field supply voltage 0 Unused

Table 7 Rack 2: STATE Output bit descriptions

When configured as an input channel, the states are allocated to voltage ranges. The usual definition for a digital input is as follows.

Value Description

7 Channel Fault 6 Over Range 5 Short circuit 4 Contact Closed 3 Contact Indeterminate 2 Contact Open 1 Open Circuit 0 Under Range

escription

Table 8 Rack 2: STATE Input bit descriptions

Note that channels configured as inputs do not have a direct Boolean indication of the input status. The Toolset application must be programmed to recognise states 2 and 4 above as open and closed contact input respectively. All other states are treated as fault conditions; the input status determination in these states is application specific.

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Module T8448

3.2.3. Rack 3: AI

he AI board returns the field loop voltage measured by the module. This is used for analogue and

T digital inputs, and also for monitoring outputs.

Channel Description

1 Field channel 1 voltage 2 Field channel 2 voltage

40 Field channel 40 voltage

Table 9 Rack 3: AI bit descriptions

The voltage is the median value taken from the triplicated module. The voltage level is reported as an integer, with the units being

V. This may be used directly, scaled arithmetically or scaled using the

500

IEC1131 TOOLSET conversion tables.

To scale the value arithmetically simply divide the returned ‘integer’ by 500 to return the voltage as either a REAL or INTEGER as required.

The IEC1131 TOOLSET conversion tables may be used to convert the value to engineering units, in this case voltage. The full-scale range for this number format is decimal ±64, corresponding to physical range –32000 to +32000.

3.2.4. Rack 4: CI

The CI board returns the field loop current measured by the module. Note that current inputs sink current into the 250 ohm resistor on the VFTA, and not into the module.

Channel Description

1 Field channel 1 current 2 Field channel 2 current

40 Field channel 40 current

Table 10 Rack 4: CI bit descriptions

The current is the sum value taken from the triplicated module. The current level is reported as an integer, with the units being

A. This may be used directly, scaled arithmetically or scaled using the

1000

IEC1131 TOOLSET conversion tables.

To scale the value arithmetically simply divide the returned ‘integer’ by 1000 to return the current as either a REAL or INTEGER as required.

The IEC1131 TOOLSET conversion tables may be used to convert the value to engineering units, in this case current. The full-scale range for this number format is decimal ±32, corresponding to physical range –32000 to +32000.

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Module T8448

3.2.5. Rack 5: LINE_FLT

hannel

1 Field channel 1 line fault 2 Field channel 2 line fault

40 Field channel 40 line fault

Table 11 Rack 5: LINE_FLT bit descriptions

The line fault input state is reported as true (logic ‘1’) for a line fault condition (open circuit, short circuit, and no field supply voltage). The logic state is the majority voted value.

escription

3.2.6. Rack 6: DISCREP

Channel Description

1 Discrepancy status channels 1 to 16

(Channel 1 is LSB)

2 Discrepancy status channels 17 to 32

(channel 17 is LSB)

3 Discrepancy status channels 33 to 40

(channel 33 is LSB)

Table 12 Rack 6: DISCREP bit descriptions

Each of the words reports the discrepancy status of 16 channels. The corresponding bit within the word is set to ‘1’ when a discrepancy condition is detected on that channel’s state (rack 2).

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1A2

4A5B6

7A8B9

10A11B12

13A14B15

16A17B18

19A20B21

22A23B24

25A26B27

28A29B30

31A32B33

34A35B36

37A38B39

40A41B42

43A44B45

46A47B48

49A50B51

52A53B54

55A56B57

Module T8448

3.2.7. Rack 7: HKEEPING

Channel

Description

FCR Units (Full Scale Range)

Internal supply voltage (post regulator) -32768 32767 mV

Internal supply current (post regulator) -32768 32767 mA

24V2 Field Voltage -32768 32767 mV

Output voltage (post isolation) -32768 32767 mV

24V1 Field Voltage -32768 32767 mV

HIU Board Temperature