Rockwell Automation T8448 User Manual

Trusted

PD-T8448

Trusted

TMR Zone Interface

Module – 40 Channel

Introduction

The TrustedTM TMR Zone Interface module has been designed to provide a configurable interface specifically for use in Fire and Gas protection systems. The module interfaces to up to 40 Fire and Gas field device inputs or actuators. Each of the 40 I/O Channels can be individually configured as Analogue Input, Digital Input or Digital Output to provide all of the interfaces needed to protect one or more Fire and Gas Zones. Interfacing to the field devices is through a Versatile Field Termination Assembly type 8842, which provides the field loop conditioning for each of the types of signal, and enables the connection of reset signals for latching type detectors without the need for external hardware. The module is separated into 5 power groups each with 8 channels. Power groups can be combined together to provide a configurable number of channels for each Fire/Gas Zone. All of these functions provide data to the Trusted

TMR system which acts as the logic solver.

Triplicated diagnostic tests are performed throughout the module, including measurements for current and voltage on each portion of voted input or output channels. Tests are also performed for stuck on and stuck off failures. All inputs are treated as analogue and are fully tested. Fault tolerance is achieved through a Triple Modular Redundant (TMR) architecture within the module for each of the 40 channels.

Features

• 40 Triple Modular Redundant selectable input/output points per module.

• Inputs interface to 4-20mA gas detectors, Fire and Heat detectors, Break Glass units etc.

• Programmable Field Device Reset signals (up to 5 individual resets)

• Two or Three Wire Field devices through 8842

• Fuse Protection of Inputs and Outputs through 8842

• High Power Digital Outputs to interface to Dampers, Extinguishant Release, Fire pumps

etc.

• 5 Isolated Power Groups to allow flexible and efficient field configurations.

• Comprehensive automatic diagnostics and self-test.

• Automatic line monitoring per point to detect faults in field wiring and loads.

• 2500V dc optical isolation barrier.

• Automatic over-current protection (per channel), no module fuses required

• On-board Sequence of Events (SOE) reporting with 1ms resolution.

• Module can be hot-replaced on-line using dedicated Companion (adjacent) Slot or

SmartSlot (one spare slot for many modules) configurations.

• TÜV Certified IEC 61508 SIL 3

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Issue Record

Issue Number Date Revised by Technical CheckAuthorised by Modification

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8 Feb 06 Pete Stock Format correction

9 Aug 06 N Owens I Vince P Stock Input power

10 Dec 06 V Middleton N Owens P Stock Weights & Dims

11 Mar 07 N Owens I Vince P Stock Accuracy

12 Nov 07 N Owens A Holgate P Stock STATE descriptions

13 Aug 08 I Vince N Owens P Stock Accuracy

14 Apr 10 S Blackett A Holgate N Owens Rack 7 changes

July 05 J W Clark Reformat

Sect 3 Application Resistor

Sect 1.5 Default Thresholds added.

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Table of Contents

1. Description...................................................................................................................................9

1.1. Field Termination Unit (FTU) .....................................................................................................10

1.2. Field Interface Unit (FIU) ...........................................................................................................10

1.3. Host Interface Unit (HIU) ...........................................................................................................11

1.4. Front Panel Unit (FPU) ..............................................................................................................11

1.5. Input Line Monitoring Thresholds...............................................................................................11

1.6. Housekeeping............................................................................................................................12

1.7. Fault Detection and Testing.......................................................................................................12

1.8. Sequence of Events Characteristics..........................................................................................12

1.9. Output Switch Structure .............................................................................................................13

1.9.1. Switch Diagnostics.....................................................................................................................14

1.9.2. Short Circuit Protection Issues ..................................................................................................14

1.9.3. Group Fail Safe Switches ..........................................................................................................15

1.10. Output Line Monitoring States ...................................................................................................15

1.11. Input Interfaces ..........................................................................................................................16

1.12. Field Interface Selection ............................................................................................................16

2. Installation..................................................................................................................................17

2.1. Module Insertion and Removal ..................................................................................................17

2.2. Field Cable Selection .................................................................................................................17

2.3. Termination................................................................................................................................17

2.4. Module Pinout Connections .......................................................................................................18

2.5. TrustedTM Module Polarisation/Keying.......................................................................................19

3. Application .................................................................................................................................20

3.1. Module Configuration.................................................................................................................21

3.2. T8448 Complex Equipment Definition .......................................................................................22

3.2.1. Rack 1: DO ................................................................................................................................23

3.2.2. Rack 2: STATE ..........................................................................................................................23

3.2.3. Rack 3: AI ..................................................................................................................................25

3.2.4. Rack 4: CI ..................................................................................................................................25

3.2.5. Rack 5: LINE_FLT .....................................................................................................................26

3.2.6. Rack 6: DISCREP......................................................................................................................26

3.2.7. Rack 7: HKEEPING ...................................................................................................................27

3.2.8. Rack 8: INFO .............................................................................................................................28

3.2.9. Rack 9: THRSHIN......................................................................................................................30

3.2.10. Rack 10:THRSHOUT.................................................................................................................30

3.3. Sequence of Events Configuration ............................................................................................31

3.4. SYSTEM.INI File Configuration .................................................................................................31

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. Operation ...................................................................................................................................32

4.1. Front Panel ................................................................................................................................32

4.2. Module Status LEDs ..................................................................................................................33

4.3. I/O Status Indicators ..................................................................................................................34

5. Fault Finding and Maintenance..................................................................................................35

5.1. Fault Reporting ..........................................................................................................................35

5.2. Field Wiring Faults.....................................................................................................................35

5.3. Module Faults ............................................................................................................................35

5.4. Companion Slot .........................................................................................................................36

5.5. SmartSlot ...................................................................................................................................36

5.6. Cold Start...................................................................................................................................36

5.7. Transfer between Active and Standby Modules ........................................................................37

6. Specifications.............................................................................................................................38

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Figures

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igure 1 Module Architecture....................................................................................................................9

Figure 2 Function Block Diagram ...........................................................................................................10

Figure 3 Output Switch Structure............................................................................................................13

Figure 4 Simplified Switch Circuit Diagram ............................................................................................14

Figure 5 Module polarisation ..................................................................................................................19

Figure 6 Module Front Panel ..................................................................................................................32

Tabl es

Table 1 Line Monitoring Fault Status......................................................................................................15

Table 2 Field Connector Pinout ..............................................................................................................18

Table 3 Complex Equipment Definition ..................................................................................................22

Table 4 OEM Parameters.......................................................................................................................22

Table 5 Rack 1: DO descriptions............................................................................................................23

Table 6 Rack 2: STATE descriptions......................................................................................................23

Table 7 Rack 2: STATE Output bit descriptions.....................................................................................24

Table 8 Rack 2: STATE Input bit descriptions........................................................................................24

Table 9 Rack 3: AI bit descriptions .........................................................................................................25

Table 10 Rack 4: CI bit descriptions.......................................................................................................25

Table 11 Rack 5: LINE_FLT bit descriptions ..........................................................................................26

Table 12 Rack 6: DISCREP bit descriptions ..........................................................................................26

Table 13 Rack 7: Housekeeping descriptions ........................................................................................27

Table 14 Rack 8: INFO descriptions.......................................................................................................28

Table 15 Rack 8: INFO bit descriptions..................................................................................................29

Table 16 Rack 8: FCR bit descriptions ...................................................................................................29

Table 17 Rack 9: THRSHIN descriptions ...............................................................................................30

Table 18 Rack 10: THRSHOUT descriptions .........................................................................................30

Table 19 Module Status LEDs................................................................................................................33

Table 20 I/O Status LEDs.......................................................................................................................34

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Notice

The content of this document is confidential to ICS Triplex Technology Ltd. companies and their partners. It may not be given away, lent, resold, hired out or made available to a third party for any purpose without the written consent of ICS Triplex Technology Ltd.

This document contains proprietary information that is protected by copyright. All rights are reserved.

Microsoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered trademarks of Microsoft Corporation.

The information contained in this document is subject to change without notice. The reader should, in all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been made. From time to time, amendments to this document will be made as necessary and will be distributed by ICS Triplex Technology Ltd.

Information in this documentation set may be subject to change without notice and does not represent a commitment on the part of ICS Triplex Technology Ltd.

The contents of this document, which may also include the loan of software tools, are subject to the confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.

No part of this documentation may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of ICS Triplex Technology Ltd.

Disclaimer

The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the text of this manual.

The user of, and those responsible for applying this equipment, must satisfy themselves as to the acceptability of each application and use of this equipment.

This document is based on information available at the time of its publication. While efforts have been made to be accurate, the information contained herein does not purport to cover all details or variations in hardware or software, nor to provide for every possible contingency in connection with installation, operation, or maintenance. Features may be described herein which are present in all hardware or software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this document with respect to changes subsequently made.

ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of the information contained herein. No warranties of merchantability or fitness for purpose shall apply.

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Revision and Updating Policy

All new and revised information pertinent to this document shall be issued by ICS Triplex Technology Ltd. and shall be incorporated into this document in accordance with the enclosed instructions. The change is to be recorded on the Amendment Record of this document.

Precautionary Information

WARNING

Warning notices call attention to the use of materials, processes, methods, procedures or limits which must be followed precisely to avoid personal injury or death.

CAUTION

Caution notices call attention to methods and procedures which must be followed to avoid damage to the equipment.

Notes:

Notes highlight procedures and contain information to assist the user in the understanding of the information contained in this document

Warning

RADIO FREQUENCY INTERFERENCE

Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be exercised with regard to the use of portable communications equipment around such equipment. Signs should be posted in the vicinity of the equipment cautioning against the use of portable communications equipment.

MAINTENANCE

Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or damage to the system may be caused.

Caution

HANDLING

Under no circumstances should the module housing be removed.

Associated Documents

Product Descriptions (PD) provide product specific information.

The Safety Manual contains the recommended safety requirements for the safety system design.

The PD8082B – Toolset Suite provides specific guidance on system configuration and application generation.

The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic procedures.

For technical support email: support@icstriplex.com

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1. Description

The TMR Zone Interface module is a member of the Trusted All Trusted

I/O modules share common functionality and form. At the most general level, all I/O

modules interface to the Inter-Module Bus (IMB) which provides power and allows communication with

he TMR Processor. In addition, all modules have a field interface that is used to connect to module

t specific signals in the field. All modules are Triple Modular Redundant (TMR).

range of Input/Output (I/O) modules.

Figure 1 Module Architecture

All High Integrity I/O modules are made up of 4 sections: Host Interface Unit (HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU), and the Front Panel Unit (or FPU).

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Figure 2 shows a simplified block diagram of the TrustedTM Zone Interface Module.

Internal Voting Bus

TMR Intermodule Bus

Housekeeping Module Temp

Back Plane

ack Plane Power Bus 1

ower Bus

Back Plane Power Bus 2

Interface

Bus

nterface

Bus

nterface

upply Diag

SP reference

Redundant Supply

Slice

Control

ime Stamp

Slice

Control

ime Stamp

Slice

Control

ime Stamp

Failsafe Bia s Control

lice Power

upply

Field Logic

Control

ailsafe Bias Control

Slice Power

Supply

Field Logic

Control

ailsafe Bias Control

lice Power

Supply

Field Logic

Control

Opto Isolat ion Boundary

Front Panel

oting Logic

Indicators

Health

Voted Status Display LEDs

Serial Dis play Latches

Front Pane l

OFIUHIU

Housekeeping

iagnostic

onitor

ousekeeping

iagnostic Monitor

N.O.

FPIU

FPDU

Slice A

lice B

N.C.

Slice C

N.C.

OFTU

.C.

ield Interfa ce

rotection C ircuit

roup

Fail-Safe

witch

A B C

Figure 2 Function Block Diagram

1.1. Field Termination Unit (FTU)

The Field Termination Unit (FTU) is the section of the I/O module that connects all three FIUs to a single field interface. The FTU provides the Group Fail-safe switches and passive components necessary for signal conditioning, over-voltage protection, and EMI/RFI filtering. When installed in a Trusted

Controller or Expander Chassis, the FTU field connector interconnects to the Field I/O Cable

Assembly attached at the rear of the chassis.

The SmartSlot link is passed from the HIU to the field connections via the FTU. These signals go directly to the field connector and maintain isolation from the I/O signals on the FTU. The SmartSlot link is the intelligent connection between active and standby modules for co-ordination during module replacement.

1.2. Field Interface Unit (FIU)

The Field Interface Unit (FIU) is the section of the module that contains the specific circuits necessary to interface to the particular types of field I/O signals. Each module has three FIUs, one per slice. For the TMR Zone Interface Module, the FIU contains one stage of the output switch structure, and A/D monitoring circuits for each of the channels Two additional A/D circuits provide optional monitoring of the external field I/O supply voltage.

The FIU receives isolated power from the HIU for logic. The FIU provides additional power conditioning for the operational voltages required by the FIU circuitry. An isolated 6.25Mbit/sec serial link connects each FIU to one of the HIU slices.

The FIU also measures a range of on-board “house-keeping” signals that assist in monitoring the performance and operating conditions of the module. These signals include power supply voltages, current consumption, on-board reference voltages, board temperature, and condensation.

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FCR Interconnect Bus between slices to vote incoming IMB data and distribute outgoing I/O

Redundant power sharing of dual 24V dc chassis supply voltage and power regulation for logic

ordination during module

board housekeeping, which monitors reference voltages, current consumption and board

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1.3. Host Interface Unit (HIU)

The HIU is the point of access to the Inter-Module Bus (IMB) for the module. It also provides power distribution and local programmable processing power. The HIU is the only section of the I/O module to directly connect to the IMB backplane. The HIU is common to most high integrity I/O types and has type dependent and product range common functions. Each HIU contains three independent slices, commonly referred to as A, B, and C.

ll interconnections between the three slices incorporate isolation to prevent any fault interaction

A between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one slice has no effect on the operation of the other slices.

The HIU provides the following services common to the modules in the family:

• High Speed Fault-Tolerant Communications with the TMR Processor via the IMB interface.

•

module data to the IMB.

• Optically isolated serial data interface to the FIU slices.

•

power to HIU circuitry.

• Magnetically isolated power to the FIU slices.

• Serial data interface to the FPU for module status LEDs.

• SmartSlot link between active and standby modules for co-

replacement.

• Digital Signal Processing to perform local data reduction and self-diagnostics.

• Local memory resources for storing module operation, configuration, and field I/O data.

• On-

temperature.

1.4. Front Panel Unit (FPU)

The Front Panel Unit (FPU) contains the necessary connectors, switches, logic, and LED indicators for the front panel. For every module, the FPU contains the Slice Healthy, Active/Standby, the Educated indicators (LEDs), and the module removal switches. Additional bi-colour LEDs provide status indication for the individual I/O signals. Serial data interfaces connect the FPU to each of the HIU slices to control the LED status indicators and monitor the module removal switches.

1.5. Input Line Monitoring Thresholds

Whether selected as a digital or an analogue input, the module measures the voltage applied to each input and compares this with four user programmed thresholds and two fixed (minimum and maximum) thresholds. These may be used within the application to signal a field device state. Hysteresis is provided on the thresholds by upscale and downscale values, corresponding to the thresholds for increasing and decreasing values respectively. The analogue voltage reading is also provided to the application for conversion to engineering units and/or direct trip derivation.

Default threshold values used for non line monitored inputs are as follows (in raw units)

Default = -5000, -5000, 5000, 5000, 7500, 7500, 11750, 11750

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1.6. Housekeeping

The Zone Interface Module automatically performs local measurements of several on-board signals that can be used for detailed troubleshooting and verification of module operating characteristics. Measurements are made within each slice’s HIU and FIU.

1.7. Fault Detection and Testing

From the IMB to the field connector, the I/O module contains extensive fault detection and integrity testing. Most testing is performed in a non-interfering mode. Data input from the IMB is stored in redundant error-correcting RAM on each slice portion of the HIU. Received data is voted on by each slice. All data transmissions include a confirmation response from the receiver.

Periodically, the TMR Processor commands the onboard Digital Signal Processors (DSPs) to perform a Safety Layer Test. The SLT results in the DSP verifying with the TMR Processor its ability to process data with integrity. In addition, the DSP uses Cyclical Redundancy Checks (CRC) to verify the variables and configuration stored in Flash memory.

Between the HIU and FIU are a series of optically isolated links for data and power. The data link is synchronized and monitored for variance. Both FIU and HIU have onboard temperature sensors to characterize temperature-related problems. Each FIU is also fitted with a condensation sensor.

The power supplies for both the HIU and FIU boards are redundant, fully instrumented and testable. Together these assemblies form a Power Integrity Sub System.

1.8. Sequence of Events Characteristics

The module automatically measures the field voltage and current to determine the state of each channel. An event occurs when the channel transitions from one state to another. When a channel changes state, the on-board timer value is recorded. When the TMR Processor next reads data from the module, the channel state and real-time clock value are retrieved. The TMR Processor uses this data to log the state change into the system Sequence of Events (SOE) log. The user may configure each channel to be included in the system SOE log. Full details of SOE are contained in PD-8013 Trusted

SOE and Process Historian.

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