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TrustedTM
PD-T8433
TM
Trusted
TMR Isolated 4-20 mA
Analogue Input Module – 20 Channel
Introduction
M
The Trusted
transmitters. Each channel provides independent high voltage galvanic isolation from system ground,
as well as with respect to the other channels on the module. When used in conjunction with the T8833
Field Termination Assembly (FTA), the isolation barrier is powered from the current loop signal itself.
Comprehensive diagnostic tests are performed on each input channel. Fault tolerance is achieved
through a Triple Modular Redundant (TMR) architecture within the module for each of the 20 input
channels.
The module provides on-board Sequence of Events (SOE) reporting with a resolution of 1ms. A
change of state triggers an SOE entry. States are determined by voltage thresholds that can be
configured on a per channel basis.
T
TMR Isolated 4-20 mA Analogue Input module interfaces to 20 current loop
Features
• 20 Triple Modular Redundant (TMR) isolated input channels per module.
• Comprehensive, automatic diagnostics and self-test.
• 2500Vdc optical/magnetic 2 stage galvanic isolation barrier.
• On-board Sequence of Events (SOE) reporting with 1ms resolution.
• Module can be hot-replaced on-line using dedicated Companion (adjacent) Slot or
SmartSlot (one spare slot for many modules) configurations.
• Front panel input status LEDs for each channel indicate input status and field wiring faults.
• Front panel module status LEDs indicate module health and operational mode (Active,
Standby, Educated)
6V Certified IEC 61508 SIL 3
• T
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Issue Record
Issue
Number Date Revised by Technical CheckAuthorised by Modification
5 June 05 J W Clark G Creech R Cockman Reformat
6 Aug 06 N Owens I Vince P Stock Corrections
7 Dec 06 V Middleton N Owens P Stock Weights & Dims
8 Sep 07 N Owens I Vince P Stock Threshold boards
9 Dec 08 N Owens A Holgate P Stock Channel LEDs
10 Nov 09 S Blackett A Holgate N Owens Calibration check
TM
Module T8433
ect 3.2.6 PD-T8110B
S
changed to PD-T8082B
information
11 Apr 10 S Blackett A Holgate N Owens Rack 7 minor change
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Module T8433
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Module T8433
Table of Contents
1. Description...................................................................................................................................8
1.1. Isolated Input Field Termination Unit (IIFTU).............................................................................10
1.2. Input Field Interface Unit (IFIU) .................................................................................................10
1.3. Host Interface Unit (HIU) ...........................................................................................................11
1.4. Front Panel Unit (FPU) ..............................................................................................................11
1.5. Line Monitoring Thresholds........................................................................................................12
1.6. Housekeeping ............................................................................................................................13
1.7. Fault Detection and Testing.......................................................................................................13
1.8. Sequence of Events Characteristics..........................................................................................13
2. Installation..................................................................................................................................14
2.1. Module Insertion/Removal .........................................................................................................14
2.2. Cable Selection..........................................................................................................................14
2.3. Module Pinout Connections .......................................................................................................15
2.4. TrustedTM Module Polarisation/Keying.......................................................................................16
3. Application .................................................................................................................................17
3.1. Module Configuration.................................................................................................................17
3.2. T8433 Complex Equipment Definition .......................................................................................17
3.2.1. Rack 1: THRSHIN......................................................................................................................18
3.2.2. Rack 2: STATE ..........................................................................................................................19
3.2.3. Rack 3: AI ..................................................................................................................................20
3.2.4. Rack 4: THRSHOUT..................................................................................................................21
3.2.5. Rack 5: LINE_FLT .....................................................................................................................21
3.2.6. Rack 6: DISCREP......................................................................................................................22
3.2.7. Rack 7: HKEEPING ...................................................................................................................23
3.2.8. Rack 8: Information....................................................................................................................24
3.3. Sequence of Events Configuration ............................................................................................25
3.4. SYSTEM.INI File Configuration .................................................................................................25
4. Operation ...................................................................................................................................26
4.1. Front Panel ................................................................................................................................26
4.2. Module Status LEDs ..................................................................................................................27
4.3. I/O Status LEDs .........................................................................................................................28
5. Fault Finding and Maintenance..................................................................................................29
5.1. Fault Reporting ..........................................................................................................................29
5.2. Field Wiring Faults .....................................................................................................................29
5.3. Module Faults ............................................................................................................................29
5.4. Companion Slot .........................................................................................................................30
5.5. SmartSlot ...................................................................................................................................30
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5.6. Cold Start ...................................................................................................................................30
5.7. Input Channel Calibration Check ...............................................................................................31
5.8. Transfer between Active and Standby Modules ........................................................................31
6. Specifications.............................................................................................................................33
TM
Module T8433
Figures
Figure 1 Module Architecture...................................................................................................................8
Figure 2 Functional Block Diagram .........................................................................................................9
Figure 3 Module polarisation ..................................................................................................................16
Figure 4 Module Front Panel .................................................................................................................26
Tab le s
Table 1 Example Threshold data (4-20mA) ...........................................................................................12
Table 2 Field Connector Pinout ..............................................................................................................15
Table 3 Complex Equipment Definition ..................................................................................................17
Table 4 OEM Parameters .......................................................................................................................18
Table 5 Rack 1: THRSHIN descriptions .................................................................................................18
Table 6 Rack 2: STATE descriptions......................................................................................................19
Table 7 Rack 2: STATE bit descriptions.................................................................................................19
Table 8 Rack 3: AI descriptions ..............................................................................................................20
Table 9 Rack 3: Presentation Units ........................................................................................................20
Table 10 Rack 4: THRSOUT descriptions..............................................................................................21
Table 11 Rack 5; LINE_FLT ...................................................................................................................21
Table 12 Rack 6: DISCREP bit descriptions ..........................................................................................22
Table 13 Rack 7: Housekeeping descriptions ........................................................................................23
Table 14 Rack 8: INFO descriptions.......................................................................................................24
Table 15 Rack 8 INFO bit descriptions ...................................................................................................24
Table 16 Rack 8: FCR bit descriptions ...................................................................................................25
Table 17 Module Status Indicators .........................................................................................................27
Table 18 Default I/O Status Indicators....................................................................................................28
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Module T8433
Notice
The content of this document is confidential to ICS Triplex Technology Ltd. companies and their
partners. It may not be given away, lent, resold, hired out or made available to a third party for any
purpose without the written consent of ICS Triplex Technology Ltd.
This document contains proprietary information that is protected by copyright. All rights are reserved.
icrosoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered
M
trademarks of Microsoft Corporation.
The information contained in this document is subject to change without notice. The reader should, in
all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been
made. From time to time, amendments to this document will be made as necessary and will be
distributed by ICS Triplex Technology Ltd.
Information in this documentation set may be subject to change without notice and does not represent
a commitment on the part of ICS Triplex Technology Ltd.
The contents of this document, which may also include the loan of software tools, are subject to the
confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.
No part of this documentation may be reproduced or transmitted in any form or by any means,
electronic or mechanical, including photocopying and recording, for any purpose, without the express
written permission of ICS Triplex Technology Ltd.
Disclaimer
The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the
text of this manual.
The user of, and those responsible for applying this equipment, must satisfy themselves as to the
acceptability of each application and use of this equipment.
This document is based on information available at the time of its publication. While efforts have been
made to be accurate, the information contained herein does not purport to cover all details or variations
in hardware or software, nor to provide for every possible contingency in connection with installation,
operation, or maintenance. Features may be described herein which are present in all hardware or
software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this
document with respect to changes subsequently made.
ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with
respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of
the information contained herein. No warranties of merchantability or fitness for purpose shall apply.
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Revision and Updating Policy
All new and revised information pertinent to this document shall be issued by ICS Triplex Technology
Ltd. and shall be incorporated into this document in accordance with the enclosed instructions. The
change is to be recorded on the Amendment Record of this document.
Precautionary Information
WARNING
Warning notices call attention to the use of materials, processes, methods, procedures or limits which
must be followed precisely to avoid personal injury or death.
CAUTION
Caution notices call attention to methods and procedures which must be followed to avoid damage to
the equipment.
Notes:
Notes highlight procedures and contain information to assist the user in the understanding of the
information contained in this document
Warning
RADIO FREQUENCY INTERFERENCE
Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be
exercised with regard to the use of portable communications equipment around such equipment.
Signs should be posted in the vicinity of the equipment cautioning against the use of portable
communications equipment.
MAINTENANCE
Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or
damage to the system may be caused.
Caution
HANDLING
Under no circumstances should the module housing be removed.
Associated Documents
Product Descriptions (PD) provide product specific information.
The Safety Manual contains the recommended safety requirements for the safety system design.
The PD8082B – Toolset Suite provides specific guidance on system configuration and application
generation.
The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic
procedures.
For technical support email: support@icstriplex.com
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Module T8433
1. Description
The TMR Isolated 4-20 mA Analogue Input module is a member of the TrustedTM range of Input/Output
I/O) modules. All Trusted
(
level, all I/O modules interface to the Inter-Module Bus (IMB) which provides power and allows
communication with the Trusted
M
T
/O modules share common functionality and form. At the most general
I
TM
TMR Processor. In addition, all modules have a field interface that
is used to connect to module specific signals in the field. All modules are Triple Modular Redundant
(TMR).
FIELD
TERMINATION
UNIT
(FTU)
CH ASSIS POW ER ISOLATION
FCR A
FIU POWER
SUPPLY
FIELD
INT ERFAC E
U
NIT
(
FIU)
Smart Slot Link
FCR B
FIU POWER
SUPPLY
FIELD
INT ERFAC E
UNIT
(FIU)
I
SOLATO R
ISOLATOR
V
1V2
HIU POWER
SUPPLY
HOST
ISOLATION
ISOLATION
INT ERFAC E
U
NIT
(
HIU)
HIU POWER
SUPPLY
HOST
INT ERFAC E
UNIT
(HIU)
V1
V
2
FCR INTERCON NECT BUS
V1
V
2
24V1
24V2
I
MB A
IMB B
Smart Slot Link
FCR C
FIU POWER
INT ERFAC E
Smart Slot Link
FCR D
SUPPLY
FIELD
UNIT
(FIU)
LED' s
ISOLATION
FRONT
PANEL
UNIT
HIU POWER
SUPPLY
HOST
INT ERFAC E
UNIT
(HIU)
V1
V2
IMB C
Figure 1 Module Architecture
All High Integrity I/O modules comprise four sections: Host Interface Unit (HIU), the Field Interface Unit
(FIU), the Field Termination Unit (FTU) and the Front Panel Unit (or FPU).
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Module T8433
Figure 2 shows a simplified functional block diagram of the Trusted
module in a typical installation.
V
1+
DISTANT
F
IELD
D
EVICE
V
1-
F
IELD CABLE
4-20 m A
M
T
4-20 mA Isolated Analogue Input
FT A
VPOWER [1]
COMMON[1]
VSENSE[ 1]
V20+
D
ISTA NT
FIELD
DEVICE
V20-
TRU STED I/O CA BLE ASSEM BLY
F
IELD CABLE
IIFTU IFIU
A
T
MR
ISOLATI ON
AMPLIFIER
ISOLATI ON
AMPLIFIER
ISOLATED INPUT FIELD
B
C
1
A
TMR
B
C
20
TERM INATION UNIT
A
T M R B UF FER AR RAY
B
C
A/D
CONVERTER
ARRAY
DIAGNOSTIC
D/A ARR AY
IFIU A
INP UT F IELD IN TERF ACE UNI T - SLIC E A
IFIU B
IFIU C
FRONT PANEL INTERFA CE UNIT
FPIU
SERIAL DISPLAY LATC HES
VOTED ST ATUS DISPLAY LEDS
FPDU
FRON T PANEL DISPLAY UN IT
250 VRMS
WORKING
VOLTAGE
TRANSIENT
F
IELD LOGIC
CONTROL
HOUSEKEEPING
SLIC E POW ER
SUPPLY
FRONT PANEL VOTING
HEALTH INDIC ATORS
4-20 m A
2.5 KV
LOGI C
BCA
VPOWER [20]
COMMON[20]
VSENSE[ 20]
T8833
FIELD
T
ERM INAT ION
A
SSEMB LY
IMB
HIU
BACKPLANE
ISO LATI ON
BA RR IER
SLICE A
CONTROL
TIM E STAMP
B
C
FIU P OWER
HOST I NTERFA CE UNIT
HOUSEKEEPING
DSP REFERENCE
B
C
BUS
INTER FACE
MOD ULE TEMP
SUPPLY DIAGS
HIU POW ER
BC
A
REDUNDANT
SUPPLY
ISOLATION
24V1
24V2
IMB A
IMB B
IMB C
T8433 TMR ISOLATED 4-20 mA ANALOG INPUT MODULE
Figure 2 Functional Block Diagram
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Module T8433
1.1. Isolated Input Field Termination Unit (IIFTU)
The Isolated Input Field Termination Unit (IIFTU) is the I/O module sub-assembly containing the field
connector and the TMR isolation amplifiers. The IIFTU connects the isolated field signals into the TMR
isolation amplifier array and onto the three IFIU slices.
Each isolation amplifier slice in the array obtains its operating power from the 4-20 mA current loop
input signal itself. The T8433 module will normally be used in conjunction with a T8833 or T8834 Field
Termination Assembly (FTA). The FTA converts the 4-20 mA current loop signal into a voltage
through the use of rugged under-stressed high-reliability passive components. This voltage is split into
a raw isolated 7.5V DC low current power supply signal, and a precision 0-2V current sense signal by
the FTA.
When two modules are installed in an active/standby pair, their IIFTUs are connected directly in
parallel, and share the same signals.
M
T
When installed in a Trusted
Field I/O Cable Assembly attached at the rear of the chassis. The cable serves to connect the module
to it’s associated FTA, and is an important component of the system.
The SmartSlot link is passed from the HIU to the field connections via the IIFTU. These signals go
directly to the I/O cable assembly and maintain isolation from the I/O signals on the IIFTU. The
SmartSlot link is the intelligent connection between active and standby modules for co-ordination
during module replacement.
Controller or Expander Chassis, the IIFTU field connector mates to the
1.2. Input Field Interface Unit (IFIU)
The Input Field Interface Unit (IFIU) is the standard 42 channel sub-assembly that is used in a variety
of other input modules in the Trusted
TMR Isolated 4-20 mA Analogue Input module, the FIU contains two analogue to digital (A/D)
converters for each of the 20 field inputs. The redundant A/D values are provided to the application for
an optional layer of information.
The IFIU receives power from the HIU and isolates it for use on IFIU, and it is also used to power the
IIFTU buffer array. The IFIU provides additional power conditioning for the precision reference
voltages required by the IFIU A/D and diagnostic D/A circuitry. An isolated 6.25Mbit/sec serial link
connects each FIU to one of the HIU slices.
The FIU also measures a range of on-board “house-keeping” signals that assist in monitoring the
performance and operating conditions of the module. These signals include power supply voltages,
current consumption, on-board reference voltages, board temperature, and condensation.
TM
I/O family. Each module has three FIUs, one per slice. For the
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FCR Interconnect Bus between slices to vote coming IMB data and distribute outgoing I/O
Redundant power sharing of dual 24V dc chassis supply voltage and power regulation for
ordination during module
board housekeeping, which monitors reference voltages, current consumption and
TM
Module T8433
1.3. Host Interface Unit (HIU)
The HIU is the point of access to the Inter-Module Bus (IMB) for the module. It also provides power
distribution and local programmable processing power. The HIU is the only section of the I/O module
to directly connect to the IMB backplane. The HIU is common to most Trusted
has type dependent and product range common functions. Each HIU contains three independent
slices, referred to as A, B, and C.
All interconnections between the three slices incorporate isolation to prevent any fault interaction
between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one
slice has no effect on the operation of the other slices.
The HIU provides the following services common to the modules in the family:
• High Speed Fault Tolerant Communications with the TMR Processor via the IMB interface.
•
module data to the IMB.
• Optically isolated serial data interface to the FIU slices.
•
logic power to HIU circuitry.
M
T
I/O module types and
• Magnetically Isolated power to the FIU slices.
• Serial data interface to the FPU for module status LEDs.
• SmartSlot link between active and standby modules for co-
replacement.
• Digital Signal Processing to perform local data reduction and self-diagnostics.
• Local memory resources for storing module operation, configuration, and field I/O data.
• On-
board temperature.
1.4. Front Panel Unit (FPU)
The Front Panel Unit (FPU) comprises a Front Panel Interface Unit (FPIU) and a Front Panel Display
Unit (FPDU). The overall FPU contains the necessary connectors, switches, logic, and LED indicators
for the front panel. For every type of Trusted
Active/Standby and Educated indicators (LEDs), and the module removal switches. Additional bicolour
LEDs provide status indication for the individual I/O signals. Serial data interfaces connect the FPU to
each of the HIU slices to control the LED status indicators and monitor the module removal switches.
TM
I/O module, the FPU contains the Slice Healthy,
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Module T8433
1.5. Line Monitoring Thresholds
The module determines the contact state and line fault status by comparing the input current level to
four user programmed thresholds and two fixed (minimum and maximum) thresholds. Hysteresis is
provided on the thresholds by up-scale and downscale values, corresponding to the thresholds for
increasing and decreasing values respectively.
Default
threshold values
(mA)
Input
Channel
State
Over-range 6 1
Line Fault
Status
Tmax 24.0
T8 18.25
T7 17.75
T6 13.25
T5 12.75
T4 9.75
T3 9.25
T2 6.25
T1 5.75
High-High 5
High 4 0
Normal 3 0
Low 2
Low-Low 1 1
1
4 or 5
3 or 4 0
2 or 3
1 or 2
0
0
Tmin -2.0
Under-range 0
1
Table 1 Example Threshold data (4-20mA)
Default threshold values used for non line monitored inputs are as follows (in raw units)
Default = 448,576,1344,1472,2240,2368,3520,3648.
1
The channel state value returned is dependent on the previous state value. If the input level is
increasing then the lower state value will be returned. If the input level is decreasing the higher state
value will be returned.
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Module T8433
1.6. Housekeeping
The input module automatically performs local measurements of several on-board signals that can be
used for detailed troubleshooting and verification of module operating characteristics. Measurements
are made within each slice’s HIU and FIU.
1.7. Fault Detection and Testing
From the IMB to the field connector, the input module contains extensive fault detection and integrity
testing. As an input device, all testing is performed in a non-interfering mode. Data received from the
Main Processor via the IMB is stored in redundant error-detecting RAM on each slice of the HIU.
Received data is voted on by each slice. All data transmissions include a confirmation response from
the receiver.
Between each slice of the HIU and the corresponding FIU, there is a bidirectional optically isolated data
link. The data link is synchronised and monitored for variance. Both the FIU and HIU have onboard
temperature sensors to characterise temperature-related problems. Each FIU is also fitted with a
condensation sensor.
The power supplies for both the HIU and FIU boards are redundant, fully instrumented and testable.
Together, these assemblies form a Power Integrity Sub System.
The module field input is redundantly isolated on the FTU and processed by a modulator which
serves as a precision A/D converter. These circuits, two per channel on each slice, produce a digital
output which naturally transitions between on and off. Any failure in the circuit causes the output to
saturate to stuck-on or stuck-off which is automatically detected. As the conversion process is
dynamic and not gated like traditional ADCs, most failures are rapidly diagnosed and located. Each
channel is partnered with an individual D/A converter which non-intrusively injects a unique test signal
into the front end. The test signal is extracted and analyzed for the correct signature downstream
by the HIU before the signal is presented to the Main Processor.
By using the circuit, the analogue path in the module is short, completely testable, and involves very
few components. This results in most analogue failures being contained to a single channel on a
single slice instead of causing a group of eight or more inputs to fail.
1.8. Sequence of Events Characteristics
The input module automatically measures the field-input voltage, compares the value to the
configurable thresholds, and determines the state of the field input. An event occurs when the input
transitions from one state to another. When an input changes state, the on-board real-time clock value
is recorded. When the TMR Processor next reads data from the input module, the input state and realtime clock values are retrieved. The TMR Processor uses this data to log the input state change into
the system Sequence of Events (SOE) log. The user may configure each input to be included in the
system SOE log. Full details of SOE are contained in PD-8013 – Trusted
Historian.
TM
SOE And Process
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Module T8433
2. Installation
2.1. Module Insertion/Removal
CAUTION:
The module contains static sensitive parts. static handling precautions must be observed. Specifically
ensure that exposed connector pins ARE NOT TOUCHED. Under no circumstances should the
module housing BE REMOVED.
Before installation, visually inspect the module for damage. Ensure that the module housing appears
undamaged and inspect the I/O connector at the back of the module for bent pins. If the module
appears damaged or any pins are bent, do not install the module. Do not try to straighten bent pins.
Return the module for replacement.
Ensure that the module is of the correct type.
Record the module type, revision and serial number of the module before installation.
To install the module:
1. Ensure that the field cable assembly is installed and correctly located.
2. If I/O module keys are used, verify that all keys are installed in the correct positions and
properly seated in their slots.
3. Release the ejector tabs on the module using the release key. Ensure that the ejector tabs
are fully open.
4. Holding the ejectors, carefully insert the module into the intended slot.
5. Push the module fully home by pressing on the top and bottom of the module fascia.
Close the module ejectors, ensuring that they click into their locked position.
The module should mount into the chassis with a minimum of resistance. If the module does not
mount easily, do not force it. Remove the module and check it for bent or damaged pins. If the pins
have not been damaged, try reinstalling the module.
2.2. Cable Selection
I/O cables suitable for use with the TrustedTM TMR Isolated 4-20 mA Analogue Input Module are
detailed in the following Product Descriptions.
TM
1. PD-TC700 – Trusted
2. PD-TC600 – Trusted
The Product Descriptions detailed above also detail the types of Field Termination Assembly (FTA) or
Versatile Field termination Assembly (VFTA) which may be used with type of module.
I/O Companion Slot Cables
TM
I/O SmartSlot Cables
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2.3. Module Pinout Connections
C B A
1 Smart Slot Link C Smart Slot Link B Smart Slot Link A
2
3 VSENSE[1] COMMON[1] VPOWER[1]
4 VSENSE[2] COMMON[2] VPOWER[2]
5 VSENSE[3] COMMON[3] VPOWER[3]
6 VSENSE[4] COMMON[4] VPOWER[4]
7 VSENSE[5] COMMON[5] VPOWER[5]
8 VSENSE[6] COMMON[6] VPOWER[6]
9 VSENSE[7] COMMON[7] VPOWER[7]
10 VSENSE[8] COMMON[8] VPOWER[8]
11 VSENSE[9] COMMON[9] VPOWER[9]
12 VSENSE[10] COMMON[10] VPOWER[10]
13 VSENSE[11] COMMON[11] VPOWER[11]
14 VSENSE[12] COMMON[12] VPOWER[12]
15 VSENSE[13] COMMON[13] VPOWER[13]
16 VSENSE[14] COMMON[14] VPOWER[14]
17 VSENSE[15] COMMON[15] VPOWER[15]
18 VSENSE[16] COMMON[16] VPOWER[16]
19 VSENSE[17] COMMON[17] VPOWER[17]
20 VSENSE[18] COMMON[18] VPOWER[18]
21 VSENSE[19] COMMON[19] VPOWER[19]
22 VSENSE[20] COMMON[20] VPOWER[20]
23
24
25
26
27
28
29
30
31 CHAN0[C] CHAN0[B] CHAN0[A]
32 FIU_0V FIU_0V FIU_0V
Table 2 Field Connector Pinout
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identified below)
TM
Module T8433
2.4. TrustedTM Module Polarisation/Keying.
M
All Trusted
The polarisation comprises two parts. The module and the associated field cable.
ach module type has been keyed during manufacture. The organisation responsible for the
E
integration of the Trusted
so that they correspond with the bungs fitted to the associated module prior to fitting.
T
Modules have been Keyed to prevent insertion into the wrong position within a chassis.
TM
system must key the cable by removing the keying pieces from the cable
Cable Exit
1
Polarising/Keying
Pins.
(Remove using
side cutters where
Trusted Cable
hood
12
Release button
Smart
Swap
Connector
if Fitted
Figure 3 Module polarisation
For Cables with Companion slot installations both keying strips must be polarised.
For This Module (T8433) remove keying pins 1,4,7.
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Module T8433
3. Application
3.1. Module Configuration
There is no configuration required to the physical input module. All configurable characteristics of the
module are performed using tools on the EWS and become part of the application or system.ini file
that is loaded into the TMR Processor. The TMR Processor automatically configures the input module
after applications are downloaded and during Active/Standby changeover.
The IEC1131 TOOLSET provides the main interface to configure the input module. Details of the
configuration tools and configuration sequence are provided in PD-8082B Trusted
There are three procedures necessary to configure the input module. These are:
1. Define the necessary I/O variables for the field input data and module status data using the
Dictionary Editor of the IEC1131 TOOLSET.
2. Create an I/O module definition in the I/O Connection Editor for each I/O module. The I/O
module definition defines physical information, e.g. Chassis and Slot location, and allows
variables to be connected to the I/O channels of the module.
TM
3. Using the Trusted
per-channel threshold levels and noise filtering, and other module settings.
System Configuration Manager, define custom LED indicator modes,
TM
Toolset Suite.
3.2. T8433 Complex Equipment Definition
The T8433 I/O Complex Equipment Definition includes 8 I/O boards, referenced numerically by Rack
number:
Rack I/O Board Description Data Type Direction No. of
Channels
1 THRSHIN
2 STATE Field Input State Integer In 40
3 AI Input voltage Integer In 40
4 THRSHOUT Threshold data Integer Out 11
5 LINE_FLT Line Fault Status Boolean In 40
6 DISCREP Channel Discrepancy Integer In 3
7 HKEEPING Housekeeping Registers Integer In 51
8 INFO I/O Module Information Integer In 11
OEM Parameters - - -
Field Input Status Integer In 9
Table 3 Complex Equipment Definition
There are two OEM parameters included in the first rack (THRSHIN Board). These OEM parameters
define the primary module position; declaring the module’s chassis and slot location. There is no need
to define the secondary module position within the IEC1131 TOOLSET. Where systems may be
required to start-up with a module in the secondary position as the active module, e.g. primary module
is not installed when application is started, the secondary module’s position should be declared in the
module definition of the System Configuration Manager.
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O
TICS_CHASSIS The number of the
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Module T8433
EM Parameter Description Notes
TM
Trusted
Chassis where
the primary I/O module is
The Trusted
and Trusted
to 15
M
T
Controller Chassis is 1,
TM
Expander Chassis are 2
installed
TICS_SLOT The slot number in the
hassis where the primary
c
I/O module is installed
The I/O module slots in the Trusted
ontroller chassis are numbered from 1
C
to 8. The I/O Module slots in the
Trusted
TM
Expander Chassis are
TM
numbered from 1 to 12
Table 4 OEM Parameters
3.2.1. Rack 1: THRSHIN
This board allows the current thresholds for an analogue input channel to be read by the application,
under control of the THRSHOUT board (see section 3.2.4.
Channel Description
1 Channel number being read. Range 1 to
20.
2 States 2 > 1 falling threshold
3 States 1 > 2 rising threshold
4 States 3 > 2 falling threshold
5 States 2 > 3 rising threshold
6 States 4 > 3 falling threshold
7 States 3 > 4 rising threshold
8 States 5 > 4 falling threshold
9 States 4 > 5 rising threshold
Table 5 Rack 1: THRSHIN descriptions
THRSHIN reads in the module threshold values controlled by THRSHOUT in Rack 4. See Table 1 for a
graphical representation of the states and thresholds.
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Module T8433
3.2.2. Rack 2: STATE
This board provides the majority voted numerical input state. This indicates within which threshold
band the field input is in and module channel fault status.
Channel Description
1
2 Field input channel 2 state
20 Field input channel 20 state
21 Field input channel 1 redundant state
40 Field input channel 20 redundant state
The numerical input state is returned as an integer value; with the least significant 4-bits indicating the
state. The most significant of these 4-bits indicates the channel fault condition; 1 indicating that a fault
has been detected within the internal operation for that channel.
Field input channel 1 state
Table 6 Rack 2: STATE descriptions
The least significant 3-bits indicate the threshold band within which the input lies.
Value Description
7 Unknown
6 Over-range
5 High-High
4 High
3 Normal
2 Low
1 Low-Low
0 Underrange
Table 7 Rack 2: STATE bit descriptions
The input channel has a value 7 (Unknown) when:
1. The input channel cannot be correctly measured by two or more slices of the TMR input
module.
2. The TMR Processor detects a 2-oo-3 channel discrepancy between the three slices of the
TMR input module.
3. The module is simulated (not installed or the TMR Processor cannot communicate with 2-oo3 slices of the module).
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3.2.3. Rack 3: AI
The AI board returns the field loop current at the input.
Channel Description
1 Field input channel 1 current
2 Field input channel 2 current
20 Field input channel 20 current
21 Field input channel 1 redundant current
40 Field input channel 20 redundant current
Table 8 Rack 3: AI descriptions
The current is the median value taken from the triplicated module. The current level is reported as an
integer, scaled in 12 bit equivalent "presentation units" as shown in the table below. This may be used
directly, scaled arithmetically to 0-20mA or scaled using the IEC1131 TOOLSET conversion tables.
Presentation Units Current (mA)
-2048 Open Circuit
-1024 0 mA
0 4 mA
4096 20 mA
Table 9 Rack 3: Presentation Units
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Module T8433
3.2.4. Rack 4: THRSHOUT
This board allows the current thresholds for an analogue input channel to be read or written by the
application. The application can write new thresholds in the THRSHOUT board for a particular channel,
and it can read the current thresholds from the THRSHIN board, under control of a channel in the
THRSHOUT board.
Channel Description
1 Write the threshold data for a particular
input channel on channels 3 to 11 to the
module. The data is written on a rising
edge 0 to 1.
2 Read the threshold data for a particular
channel from the module to the THRSHIN
board. The data is read on a rising edge 0
to 1.
3 Channel number to write/read threshold
data. Range 1 to 20.
4 States 2 > 1 falling threshold
5 States 1 > 2 rising threshold
6 States 3 > 2 falling threshold
7 States 2 > 3 rising threshold
8 States 4 > 3 falling threshold
9 States 3 > 4 rising threshold
10 States 5 > 4 falling threshold
11 States 4 > 5 rising threshold
Table 10 Rack 4: THRSOUT descriptions
3.2.5. Rack 5: LINE_FLT
Channel Description
1 Field input channel 1 line fault
2 Field input channel 2 line fault
20 Field input channel 20 line fault
21 Field input channel 1 redundant line fault
40 Field input channel 20 redundant line fault
Table 11 Rack 5; LINE_FLT
The line fault input state is reported as true (logic ‘1’) for a line fault condition (open circuit,
indeterminate, or short circuit condition). The logic state is the majority voted value.
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Module T8433
3.2.6. Rack 6: DISCREP
Channel Description
1 Discrepancy status inputs 1 to 16
2 Discrepancy status inputs 17 to 32
3 Discrepancy status inputs 33 to 40
Table 12 Rack 6: DISCREP bit descriptions
Each of the words reports the discrepancy status of 16 input channels. The corresponding bit within
the word is set to ‘1’ when a discrepancy condition is detected on that input channel’s input state (rack
2). Note that as with the other channel status arrays, channels 21 through 40 are a redundant image
of 1 through 20.
NOTE: The maximum allowable discrepancy time, established by the TrustedTM TMR Processor, is set to 2000
ms by default. The T8433 slices may sometimes be discrepant for longer than this in detecting the open input
condition when field devices are disconnected, or when powering up with open inputs. This can lead to
erroneous discrepancy indications. Therefore, it is recommended to use a ‘discrepancy_val’ setting of 4000 ms
or greater in the ‘system.ini’ configuration for the TMR Processor. Refer to the Product Description for the TMR
Processor, PD-8082B, for more information on how to change this value.
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1A2
B
3
C
4A5B6
C
7A8B9
C
10A11B12
C
13A14B15
C
16A17B18
C
19A20B21
C
22A23B24
C
25A26B27
C
28A29B30
C
31A32B33
C
34A35B36
C
37A38B39
C
40A41B42
C
43A44B45
C
46A47B48
C
49A50B51
C
TM
Module T8433
3.2.7. Rack 7: HKEEPING
Channel
Description
FCR Units (Full Scale Range)
Internal supply voltage (post regulator) -32768 32767 mV
Internal supply current (post regulator) -32768 32767 mA
24V2 Input Voltage -32768 32767 mV
Input voltage (post isolation) -32768 32767 mV
24V1 Input Voltage -32768 32767 mV
HIU Board Temperature
( Note: Temperature, ºC = input value / 256 )
Front Panel Load Current -32768 32767 mA
SmartSlot Link Voltage -32768 32767 mV
Reserved for FIU condensation sensor 0 0 -
FIU Internal Supply Voltage -32768 32767 mV
FIU Internal Supply Current -32768 32767 mA
FIU Unregulated input voltage -32768 32767 mV
FIU Board Temperature
( Note: Temperature, ºC = input value / 256 )
FIU Reference Voltage, DAC_X1 -32768 32767 mV
-32768 32767 -
-32768 32767 -
FIU Reference Voltage, DAC_X2 -32768 32767 mV
FIU Reference Voltage, DAC_X3 -32768 32767 mV
Diagnostic error code
Table 13 Rack 7: Housekeeping descriptions
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Each input within the housekeeping rack is reported as an integer. In general, the application engineer
will not normally require these inputs. They are provided to aid fault finding and diagnosis and may be
used for reporting and display purposes. If a slice is Fatal, then all reported housekeeping inputs are
set to zero.
TM
Module T8433
3.2.8. Rack 8: Information
Channel Description
1 Active Module chassis number
2 Active Module slot number
3 Active Module Healthy
4 Active Module Mode
5 Standby Module Chassis Number
6 Standby Module Slot Number
7 Standby Module Healthy
8 Standby Module Mode
9 FCR Status
10 Primary module is active
11 Active module is simulated
Table 14 Rack 8: INFO descriptions
The active module chassis and slot numbers indicate the position of the currently active module.
These values will change to match the primary or secondary module position, depending on their active
status, i.e. active/standby changeover will “swap” the values for the active module chassis and slot
number channels with those in the standby module chassis and slot number channels. The chassis
and slot numbers are set to zero if the module is not present.
The active and standby module healthy channel is returned as an integer, however only the least
significant bit is used. A value of 0 indicates that a fault has been detected, a non-zero value indicates
that the module is healthy.
The active and standby module mode is an integer indicating the current operating mode of the
associated module. The value indicates the current internal operating mode of the module.
Value Module Mode
5 Shutdown
4 Maintain
3 Active
2 Standby
1 Configuration
0 Unknown, no module present
Table 15 Rack 8 INFO bit descriptions
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The FCR Status channel reports the fault status of the active and standby modules. The value is bitpacked as shown below, the least significant byte is used with the most significant 8-bits set to zero:
Bit Number
7 6 5 4 3 2 1 0
Standby Module Active Module
Ejector
open
The ‘Primary Module is active’ channel is set to non-zero if the primary module is the current active
module, i.e. the active module is in the chassis and slot numbers defined within the OEM parameters.
The ‘Active Module is simulated’ channel is set to non-zero if the active module is being simulated, this
will only be set if the module is not present and the simulation enable has been set within the module’s
configuration in the system.ini file.
TM
Module T8433
FCR C
Healthy
FCR B
Healthy
FCR A
Healthy
Table 16 Rack 8: FCR bit descriptions
Ejectors
open
FCR C
Healthy
FCR B
Healthy
FCR A
Healthy
3.3. Sequence of Events Configuration
Each Boolean Input Variable can be configured for automatic Sequence of Events (SOE) logging. This
applies to the Input Status and Line Fault Status variables. A Boolean variable is configured for SOE
during the variable definition in the Data Dictionary Editor. To select SOE, press the Extended Button
in the Boolean Variable Definition Dialog Box to open the Extended Definition Dialog. Then check the
box for Sequence of Events to enable the variable for automatic SOE logging.
During operation, the input module automatically reports time-stamped change of state information for
the input data. The TMR Processor automatically logs change of state for configured SOE variables
into the system SOE Log. The SOE Log can be monitored and retrieved using the SOE and Process
Historian Package running on the EWS. This software package is described in PD-8013.
3.4. SYSTEM.INI File Configuration
There are many operating characteristics of the input module that can be customised for a particular
application. The System Configuration Manager is a tool that allows the user to configure the specific
operating characteristics for each module. Descriptions of the items that may be configured for the
Trusted
Certain characteristics apply to the entire module and are considered Module Configurable Items.
Other characteristics apply to individual input channels and are considered Channel Configurable
Items. There are specific default settings for each of the configurable items. If the default settings are
appropriate for a given application, then customization of the module definition in the System
Configuration Manager is not required.
TM
4-20 mA Isolated Analogue Input Module T8433 are contained in PD-8082B.
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T8433 Trusted TMR Isolated Analog Input
M d l
TM
Module T8433
4. Operation
4.1. Front Panel
Status LEDs on the front of the module provide visual indications of the module’s operational status
and field input status. Each LED is a tri-colour LED of which for normal operation, only two colours are
used; red and green. Located at the top and bottom of each module is an ejector lever that is used to
remove the module from the chassis. Limit switches detect the open/closed position of the ejector
levers. The ejector levers are normally latched closed when the module is firmly seated into the
Controller or Expander Chassis.
Module
Latch
Module
Status
Indicators
Input
Status
Indicators
Module
Latch
Figure 4 Module Front Panel
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Module T8433
4.2. Module Status LEDs
There are six module status LEDs on the module front panel; three Healthy, one Active, one Standby,
and one Educated. The Healthy indicators are controlled directly by each module slice. The Active,
Standby, and Educated indicators are controlled by the FPU. The FPU receives data from each of the
module slices. The FPU performs a 2-oo-3 vote on each data bit from the slices and sets the
indicators accordingly.
The module status LED states and their meanings are described as follows:
LED STATE DESCRIPTION
Healthy Off No power applied to the module.
Amber Slice is in the start-up state (momentary after
installation or power-up).
Green Slice is healthy.
Red – flashing Fault present on the associated slice but the
slice is still operational, or one 24V feed to
the chassis has failed.
Red (momentary) On installation – power applied to the
associated slice.
Red The associated slice is in the fatal state. A
critical fault has been detected and the slice
disabled.
Active Off Module is not in the Active state.
Green Module is in the Active (or Maintain) state.
Red – flashing Module is in the shutdown state if the
Standby LED is off.
Red – flashing Module is in the fatal state if the Standby
LED is also flashing.
Standby Off Module is not in the Standby state.
Green Module is in the Standby state.
Red – flashing Module is in the fatal state. The Active LED
will also be flashing red.
Educated Off Module is not educated.
Green Module is educated.
Green – flashing
Amber - Flashing Active/standby changeover in progress
Module is recognised by the Processor but
education is not complete.
Table 17 Module Status Indicators
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Module T8433
4.3. I/O Status LEDs
There are 20 input channel status LEDs on the module front panel, one for each field input. These
indicators are controlled by the FPU. The FPU receives data from each of the module slices. The
FPU performs a 2-oo-3 vote on each data bit from the slices and sets the indicators accordingly.
The input status LED mode is dependent upon the voltage level of the field I/O signal. Each field input
voltage is measured and compared to six threshold levels (four configurable and two fixed) which
produce seven threshold bands. Each threshold band can be defined to have a particular indicator
mode: off, green, red, flashing green, or flashing red.
The configurable voltage thresholds and LED modes allow users to customise the input measurement
and status indications to suit individual application requirements. Without customisation, the default
indicator modes are suitable for analogue inputs as described below:
INDICATOR STATE DESCRIPTION
Off ’Normal’ (states 1,2,3)
Green - steady ‘High alarm’ (states 4,5)
Green – flashing Overrange (state 6)
Red – flashing Underrange (state 0) or Channel Fault (8 to 15)
Table 18 Default I/O Status Indicators
Note: The LEDs indicating channel status may be configured to suit user requirements by
implementing the procedure for configuring the System.INI file detailed in PD-8082B.
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Module T8433
5. Fault Finding and Maintenance
5.1. Fault Reporting
Input module faults are reported to the user through visual indicators (LEDs) on the front
panel of the module. Faults are also reported via status variables which may be
automatically monitored in the application programs, and external system communications
interfaces. There are generally two types of faults that must be remedied by the user;
external wiring and module faults. External wiring faults require corrective action in the field
to repair the fault condition. Module faults require replacement of the input module.
5.2. Field Wiring Faults
By comparing the input signal from the field with pre-configured alarm thresholds, the module can
automatically detect field-wiring faults. When a field loop develops a line fault, the input channel status
LED will adopt the steady red state (default setting). The corresponding input state will be reported
and the line fault status for that channel will be set to ‘1’. All other input channels will be unaffected,
except in the case of common cause wiring faults in the field.
Once the field-wiring fault has been identified and corrected, the input status and the input status LED
will display the normal status of the field device and field wiring.
5.3. Module Faults
Extensive diagnostics provide the automatic detection of module faults. The TMR architecture of the
input module and the diagnostics performed ensure the validity of all critical circuits. Using the TMR
architecture provides a Fault Tolerant method to withstand the first fault occurrence on the module and
continue normal input measurements without interruption in the system or process. Faults are
reported to the user through the Healthy status indicators on the front panel of the module and through
the INFO and HKEEPING variables. Under normal operations all three Healthy Indicators are green.
When a fault occurs, one of the Healthy Indicators will be flashing red. It is recommended that this
condition is investigated and if the cause is within the module, it should be replaced.
Module replacement activities depend on the type of spare module configuration chosen when the
system was configured and installed. The module may be configured with a dedicated Companion Slot
or with a SmartSlot for a spare replacement module.
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Module T8433
5.4. Companion Slot
M
For a Companion Slot configuration, two adjacent slots in a Trusted
same input module function. One slot is the primary slot and the other a unique secondary (or spare)
slot. The two slots are joined at the rear of the Trusted
M
T
Chassis with a double-wide I/O Interface
T
Chassis are configured for the
Cable that connects both slots to common field wiring terminations. During normal operations, the
primary slot contains the active module as indicated by the Active indicator on the front panel of the
module. The secondary slot is available for a spare module that will normally be the standby module
as indicated by the Standby indicator on the front panel of the module.
Depending on the installation, a hot-spare module may already be installed, or a module blank will be
installed in the standby slot. If a hot-spare module is already installed, transfer to the standby module
occurs automatically when a module fault is detected in the active module. If a hot spare is not
installed, the system continues operating from the active module until a spare module is installed.
5.5. SmartSlot
For a SmartSlot configuration, the secondary slot is not unique to each primary slot. Instead, a single
secondary slot is shared among many primary slots. This technique provides the highest density of
modules to be fitted in a given physical space. At the rear of the Trusted
Cable connects the secondary slot directly to the I/O Cable connected to the failed primary module.
With a spare module installed in the SmartSlot and the SmartSlot I/O Cable connected to the failed
primary module, the SmartSlot can be used to replace the failed primary module.
TM
Chassis, a single-wide I/O
Input module Smart Slot jumper cable TC-306-02
Smart Slot between chassis can be performed if the chassis are version 2 (or higher). These have the
connector fitted to enable connection of a TC-006 that ensures the 0 Volt of each chassis is at the
same potential.
5.6. Cold Start
If an I/O module has shut down (due, for example, to two existing faults), the three Healthy LEDs will
be red, the Active and Standby LEDs will be flashing red and the Educated LED will be flashing amber.
The I/O functions provided by this module will have been lost if a hot swap partner has not taken over
control. The module can only be restarted by removing it from its slot and re-inserting it.
If an I/O module is inserted into a functional system slot which previously had no active module (e.g.
removing and reinserting as above), then the processor will educate the module once it has booted.
Once educated, the Educated LED will be steady green and the Active LED will be red flashing.
Input modules will now be reading and reporting their inputs. Output modules have not yet energised
their outputs. To activate outputs and to set the module’s Active LED and the processor’s System
Healthy LED steady green, press the processor Reset pushbutton.
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The user must define the primary, and optionally the secondary, I/O module location for each
I/O module pair. Each primary module location must be unique and is defined as part of the
. Secondary module locations
can be unique or shared between multiple secondary modules and are defined within the
module’s section within the System.INI file. The system will automatically determine the
up, if the primary module is installed, it will become the active module by default.
If the secondary module has been defined within the System.INI file and no primary module is
present, and if the secondary module location is unique, the secondary module will become
the active module by default. If the secondary module is installed with no primary module
configuration),
In order for a module to become the active module, the TMR Processor will verify that the
module is the correct I/O module type and that both Module Removal switches are closed. At
When a fault occurs on the active module, the TMR Processor will be informed. Once it
An active/standby changeover starts with the TMR Processor checking to see if a standby I/O
module is installed. If no standby I/O module is available, the TMR Processor will continue to
ctive module and will continue to check for an available standby I/O module. Once
a standby module is found, the TMR Processor will verify that the I/O module is of the correct
a part of the
correct module pair by using the SmartSlot link. At this point, the TMR Processor will
configure the standby I/O module with the same configuration information as the currently
ndby state. The active module
is then placed in the maintain state (which suspends field loop testing), and any module
specific changeover data is transferred. The educated light flashes amber before the
transfer of dynamic change over data
(COD). The previous standby module then becomes the active module and the original
module becomes standby. If the currently active module does not successfully complete the
t to the standby state, and the module in the maintain
When both Module Removal switches are opened on an active module, regardless of the
orm an active/standby
TM
Module T8433
5.7. Input Channel Calibration Check
It is recommended that you carry out a check on the input channel calibration. This check will detect
long term drift and any inaccuracy as a result. It requires a three point check as follows:
nject a signal to each input channel in turn using the following values and check through the
I
workbench that the reading is as shown below:
• 4 mA signal should give a 0% of full scale reading
• 12 mA signal should give a 50% of full scale reading
• 20 mA signal should give a 100% of full scale reading
5.8. Transfer between Active and Standby Modules
The TMR Processor is responsible for managing a pair of I/O modules through an active/standby
changeover. The following rules apply to active/standby changeovers, though the TMR Processor and
not the I/O module enforce them:
•
complex equipment definition within the IEC1131 TOOLSET
secondary module position if the primary module is installed and is operable.
• On initial start-
present, and the secondary module location is not unique (as in a SmartSlot
then NO module for that module pair will become active.
•
this point the I/O module is configured and eventually placed in the active state.
• A module in the active state should never be removed.
•
becomes aware of the fault, the TMR Processor will attempt an active/standby changeover
•
utilise the a
type, that both Module Removal switches are closed, and that the I/O module is
active I/O module and place the standby I/O module into the sta
active/standby changeover takes place, to indicate
self-tests, the TMR Processor will revert i
state will revert back to the active state.
•
module fault status, the TMR Processor will treat it as a request to perf
changeover.
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Under normal conditions, an active/standby changeover will only occur if the new active module is
fault-free. Under some circumstances, it is desirable to be able to force a changeover to a known
aulted module. This can be accomplished by opening the Module Removal switches on the currently
f
active module and pressing the push-button reset on the TMR Processor. This will force the
changeover to proceed even if the new active module is not fault free.
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Module T8433
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Module T8433
6. Specifications
System Supply Voltage Range 20 to 32Vdc
Number of Inputs 20 Channels
nput Signal Current Range (with T8833 FTA) 2 to 22 mA minimum useable
I
range
Safety Accuracy +/- 1% of full scale
(default threshold above which 0x70nn series slice discrepancy faults are raised)
Calibration Accuracy 0.08%
Recommended input channel calibration check interval 2 years
Channel to Channel Crosstalk -60 dB minimum
Resolution 3.9uA (1/256 mA)
Channel to Chassis Isolation
Sustained Working
Maximum Withstanding
Channel to Channel Isolation
Sustained Working
Maximum Withstanding
Insertion Voltage (with T8833 FTA) 10V dc maximum at 20 mA
Isolated Channel Signal Voltages (at field connector)
Power Input Voltage Range
Signal Input Voltage Range (for 0-25 mA)
Settling Time for 4-20 mA Step 90 ms to within 0.1% (see Note 2)
Frequency Response (3 dB attenuation) 7 Hz (see Note 2)
Sample Update Time 1.0 ms
User Defined Thresholds 4
Circuit Type Fault tolerant, fully triplicated
Fusing None, external if required
Intrinsic Safety External barrier
Sequence of Events
Event Resolution
Time-stamp Accuracy
Power Consumption 15 – 18W
±250V dc minimum
±2.5kV dc
±250V dc minimum
±2.5kV dc
4.5 to 8V dc
0 to -2.5V dc
1ms
±0.5 ms
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Note 1.) FTA sense resistor errors may add up to an additional +/- 0.5% initial error, depending on FTA
revision.
Note 2.) AC performance is equivalent to T8431 and T8432.
TM
Module T8433
Self-Test Interval 2 minutes
perating Temperature
O
Non-operating Temperature
Temperature change 0.5ºC/min
Operating Humidity 5 – 95% RH non-condensing
Environmental Specifications Refer to Document 552517
Dimensions
Height
Width
Depth
Weight 1.221kg (2.7lbs)
Real Time Clock Resolution
-5°C to 60°C (23°F to 140°F)
-25°C to 70°C (-13°F to 158°F)
266mm (10.5ins)
31mm (1.2ins)
303mm (12ins)
100µSec
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