Rockwell Automation T8433 User Manual

TrustedTM

PD-T8433

Trusted

TMR Isolated 4-20 mA

Analogue Input Module – 20 Channel

Introduction

The Trusted transmitters. Each channel provides independent high voltage galvanic isolation from system ground, as well as with respect to the other channels on the module. When used in conjunction with the T8833 Field Termination Assembly (FTA), the isolation barrier is powered from the current loop signal itself. Comprehensive diagnostic tests are performed on each input channel. Fault tolerance is achieved through a Triple Modular Redundant (TMR) architecture within the module for each of the 20 input channels.

The module provides on-board Sequence of Events (SOE) reporting with a resolution of 1ms. A change of state triggers an SOE entry. States are determined by voltage thresholds that can be configured on a per channel basis.

TMR Isolated 4-20 mA Analogue Input module interfaces to 20 current loop

Features

• 20 Triple Modular Redundant (TMR) isolated input channels per module.

• Comprehensive, automatic diagnostics and self-test.

• 2500Vdc optical/magnetic 2 stage galvanic isolation barrier.

• On-board Sequence of Events (SOE) reporting with 1ms resolution.

• Module can be hot-replaced on-line using dedicated Companion (adjacent) Slot or

SmartSlot (one spare slot for many modules) configurations.

• Front panel input status LEDs for each channel indicate input status and field wiring faults.

• Front panel module status LEDs indicate module health and operational mode (Active,

Standby, Educated)

6V Certified IEC 61508 SIL 3

• T

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Issue Record

Issue

Number Date Revised by Technical CheckAuthorised by Modification

5 June 05 J W Clark G Creech R Cockman Reformat

6 Aug 06 N Owens I Vince P Stock Corrections

7 Dec 06 V Middleton N Owens P Stock Weights & Dims

8 Sep 07 N Owens I Vince P Stock Threshold boards

9 Dec 08 N Owens A Holgate P Stock Channel LEDs

10 Nov 09 S Blackett A Holgate N Owens Calibration check

Module T8433

ect 3.2.6 PD-T8110B

S changed to PD-T8082B

information

11 Apr 10 S Blackett A Holgate N Owens Rack 7 minor change

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Table of Contents

1. Description...................................................................................................................................8

1.1. Isolated Input Field Termination Unit (IIFTU).............................................................................10

1.2. Input Field Interface Unit (IFIU) .................................................................................................10

1.3. Host Interface Unit (HIU) ...........................................................................................................11

1.4. Front Panel Unit (FPU) ..............................................................................................................11

1.5. Line Monitoring Thresholds........................................................................................................12

1.6. Housekeeping ............................................................................................................................13

1.7. Fault Detection and Testing.......................................................................................................13

1.8. Sequence of Events Characteristics..........................................................................................13

2. Installation..................................................................................................................................14

2.1. Module Insertion/Removal .........................................................................................................14

2.2. Cable Selection..........................................................................................................................14

2.3. Module Pinout Connections .......................................................................................................15

2.4. TrustedTM Module Polarisation/Keying.......................................................................................16

3. Application .................................................................................................................................17

3.1. Module Configuration.................................................................................................................17

3.2. T8433 Complex Equipment Definition .......................................................................................17

3.2.1. Rack 1: THRSHIN......................................................................................................................18

3.2.2. Rack 2: STATE ..........................................................................................................................19

3.2.3. Rack 3: AI ..................................................................................................................................20

3.2.4. Rack 4: THRSHOUT..................................................................................................................21

3.2.5. Rack 5: LINE_FLT .....................................................................................................................21

3.2.6. Rack 6: DISCREP......................................................................................................................22

3.2.7. Rack 7: HKEEPING ...................................................................................................................23

3.2.8. Rack 8: Information....................................................................................................................24

3.3. Sequence of Events Configuration ............................................................................................25

3.4. SYSTEM.INI File Configuration .................................................................................................25

4. Operation ...................................................................................................................................26

4.1. Front Panel ................................................................................................................................26

4.2. Module Status LEDs ..................................................................................................................27

4.3. I/O Status LEDs .........................................................................................................................28

5. Fault Finding and Maintenance..................................................................................................29

5.1. Fault Reporting ..........................................................................................................................29

5.2. Field Wiring Faults .....................................................................................................................29

5.3. Module Faults ............................................................................................................................29

5.4. Companion Slot .........................................................................................................................30

5.5. SmartSlot ...................................................................................................................................30

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5.6. Cold Start ...................................................................................................................................30

5.7. Input Channel Calibration Check ...............................................................................................31

5.8. Transfer between Active and Standby Modules ........................................................................31

6. Specifications.............................................................................................................................33

Module T8433

Figures

Figure 1 Module Architecture...................................................................................................................8

Figure 2 Functional Block Diagram .........................................................................................................9

Figure 3 Module polarisation ..................................................................................................................16

Figure 4 Module Front Panel .................................................................................................................26

Tab le s

Table 1 Example Threshold data (4-20mA) ...........................................................................................12

Table 2 Field Connector Pinout ..............................................................................................................15

Table 3 Complex Equipment Definition ..................................................................................................17

Table 4 OEM Parameters .......................................................................................................................18

Table 5 Rack 1: THRSHIN descriptions .................................................................................................18

Table 6 Rack 2: STATE descriptions......................................................................................................19

Table 7 Rack 2: STATE bit descriptions.................................................................................................19

Table 8 Rack 3: AI descriptions ..............................................................................................................20

Table 9 Rack 3: Presentation Units ........................................................................................................20

Table 10 Rack 4: THRSOUT descriptions..............................................................................................21

Table 11 Rack 5; LINE_FLT ...................................................................................................................21

Table 12 Rack 6: DISCREP bit descriptions ..........................................................................................22

Table 13 Rack 7: Housekeeping descriptions ........................................................................................23

Table 14 Rack 8: INFO descriptions.......................................................................................................24

Table 15 Rack 8 INFO bit descriptions ...................................................................................................24

Table 16 Rack 8: FCR bit descriptions ...................................................................................................25

Table 17 Module Status Indicators .........................................................................................................27

Table 18 Default I/O Status Indicators....................................................................................................28

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Notice

The content of this document is confidential to ICS Triplex Technology Ltd. companies and their partners. It may not be given away, lent, resold, hired out or made available to a third party for any purpose without the written consent of ICS Triplex Technology Ltd.

This document contains proprietary information that is protected by copyright. All rights are reserved.

icrosoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered

M trademarks of Microsoft Corporation.

The information contained in this document is subject to change without notice. The reader should, in all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been made. From time to time, amendments to this document will be made as necessary and will be distributed by ICS Triplex Technology Ltd.

Information in this documentation set may be subject to change without notice and does not represent a commitment on the part of ICS Triplex Technology Ltd.

The contents of this document, which may also include the loan of software tools, are subject to the confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.

No part of this documentation may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of ICS Triplex Technology Ltd.

Disclaimer

The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the text of this manual.

The user of, and those responsible for applying this equipment, must satisfy themselves as to the acceptability of each application and use of this equipment.

This document is based on information available at the time of its publication. While efforts have been made to be accurate, the information contained herein does not purport to cover all details or variations in hardware or software, nor to provide for every possible contingency in connection with installation, operation, or maintenance. Features may be described herein which are present in all hardware or software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this document with respect to changes subsequently made.

ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of the information contained herein. No warranties of merchantability or fitness for purpose shall apply.

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Revision and Updating Policy

All new and revised information pertinent to this document shall be issued by ICS Triplex Technology Ltd. and shall be incorporated into this document in accordance with the enclosed instructions. The change is to be recorded on the Amendment Record of this document.

Precautionary Information

WARNING

Warning notices call attention to the use of materials, processes, methods, procedures or limits which must be followed precisely to avoid personal injury or death.

CAUTION

Caution notices call attention to methods and procedures which must be followed to avoid damage to the equipment.

Notes:

Notes highlight procedures and contain information to assist the user in the understanding of the information contained in this document

Warning

RADIO FREQUENCY INTERFERENCE

Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be exercised with regard to the use of portable communications equipment around such equipment. Signs should be posted in the vicinity of the equipment cautioning against the use of portable communications equipment.

MAINTENANCE

Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or damage to the system may be caused.

Caution

HANDLING

Under no circumstances should the module housing be removed.

Associated Documents

Product Descriptions (PD) provide product specific information.

The Safety Manual contains the recommended safety requirements for the safety system design.

The PD8082B – Toolset Suite provides specific guidance on system configuration and application generation.

The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic procedures.

For technical support email: support@icstriplex.com

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1. Description

The TMR Isolated 4-20 mA Analogue Input module is a member of the TrustedTM range of Input/Output

I/O) modules. All Trusted

( level, all I/O modules interface to the Inter-Module Bus (IMB) which provides power and allows communication with the Trusted

/O modules share common functionality and form. At the most general

TMR Processor. In addition, all modules have a field interface that is used to connect to module specific signals in the field. All modules are Triple Modular Redundant (TMR).

FIELD

TERMINATION

UNIT

(FTU)

CH ASSIS POW ER ISOLATION

FCR A

FIU POWER

SUPPLY

FIELD

INT ERFAC E

NIT

(

FIU)

Smart Slot Link

FCR B

FIU POWER

SUPPLY

FIELD

INT ERFAC E

UNIT (FIU)

SOLATO R

ISOLATOR

1V2

HIU POWER

SUPPLY

HOST

ISOLATION

INT ERFAC E

NIT

(

HIU)

HIU POWER

SUPPLY

HOST

INT ERFAC E

UNIT (HIU)

V1 V

FCR INTERCON NECT BUS

V1 V

24V1

24V2

MB A

IMB B

Smart Slot Link

FCR C

FIU POWER

INT ERFAC E

Smart Slot Link

FCR D

SUPPLY

FIELD

UNIT (FIU)

LED' s

ISOLATION

FRONT PANEL

UNIT

HIU POWER

SUPPLY

HOST

INT ERFAC E

UNIT (HIU)

V1 V2

IMB C

Figure 1 Module Architecture

All High Integrity I/O modules comprise four sections: Host Interface Unit (HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU) and the Front Panel Unit (or FPU).

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Module T8433

Figure 2 shows a simplified functional block diagram of the Trusted module in a typical installation.

DISTANT

IELD

EVICE

IELD CABLE

4-20 m A

4-20 mA Isolated Analogue Input

FT A

VPOWER [1]

COMMON[1]

VSENSE[ 1]

V20+

ISTA NT FIELD

DEVICE

V20-

TRU STED I/O CA BLE ASSEM BLY

IELD CABLE

IIFTU IFIU

MR ISOLATI ON AMPLIFIER

ISOLATI ON AMPLIFIER

ISOLATED INPUT FIELD

TMR

TERM INATION UNIT

T M R B UF FER AR RAY

A/D

CONVERTER

ARRAY

DIAGNOSTIC

D/A ARR AY

IFIU A

INP UT F IELD IN TERF ACE UNI T - SLIC E A

IFIU B

IFIU C

FRONT PANEL INTERFA CE UNIT

FPIU

SERIAL DISPLAY LATC HES

VOTED ST ATUS DISPLAY LEDS

FPDU

FRON T PANEL DISPLAY UN IT

250 VRMS WORKING VOLTAGE

TRANSIENT

IELD LOGIC CONTROL

HOUSEKEEPING

SLIC E POW ER

SUPPLY

FRONT PANEL VOTING

HEALTH INDIC ATORS

4-20 m A

2.5 KV

LOGI C

BCA

VPOWER [20]

COMMON[20]

VSENSE[ 20]

T8833 FIELD

ERM INAT ION A

SSEMB LY

IMB

HIU

BACKPLANE

ISO LATI ON

BA RR IER

SLICE A

CONTROL

TIM E STAMP

FIU P OWER

HOST I NTERFA CE UNIT

HOUSEKEEPING

DSP REFERENCE

BUS

INTER FACE

MOD ULE TEMP SUPPLY DIAGS

HIU POW ER

REDUNDANT

SUPPLY

ISOLATION

24V1

24V2

IMB A

IMB B

IMB C

T8433 TMR ISOLATED 4-20 mA ANALOG INPUT MODULE

Figure 2 Functional Block Diagram

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1.1. Isolated Input Field Termination Unit (IIFTU)

The Isolated Input Field Termination Unit (IIFTU) is the I/O module sub-assembly containing the field connector and the TMR isolation amplifiers. The IIFTU connects the isolated field signals into the TMR isolation amplifier array and onto the three IFIU slices.

Each isolation amplifier slice in the array obtains its operating power from the 4-20 mA current loop input signal itself. The T8433 module will normally be used in conjunction with a T8833 or T8834 Field Termination Assembly (FTA). The FTA converts the 4-20 mA current loop signal into a voltage through the use of rugged under-stressed high-reliability passive components. This voltage is split into a raw isolated 7.5V DC low current power supply signal, and a precision 0-2V current sense signal by the FTA.

When two modules are installed in an active/standby pair, their IIFTUs are connected directly in parallel, and share the same signals.

When installed in a Trusted Field I/O Cable Assembly attached at the rear of the chassis. The cable serves to connect the module to it’s associated FTA, and is an important component of the system.

The SmartSlot link is passed from the HIU to the field connections via the IIFTU. These signals go directly to the I/O cable assembly and maintain isolation from the I/O signals on the IIFTU. The SmartSlot link is the intelligent connection between active and standby modules for co-ordination during module replacement.

Controller or Expander Chassis, the IIFTU field connector mates to the

1.2. Input Field Interface Unit (IFIU)

The Input Field Interface Unit (IFIU) is the standard 42 channel sub-assembly that is used in a variety of other input modules in the Trusted TMR Isolated 4-20 mA Analogue Input module, the FIU contains two analogue to digital (A/D) converters for each of the 20 field inputs. The redundant A/D values are provided to the application for an optional layer of information.

The IFIU receives power from the HIU and isolates it for use on IFIU, and it is also used to power the IIFTU buffer array. The IFIU provides additional power conditioning for the precision reference voltages required by the IFIU A/D and diagnostic D/A circuitry. An isolated 6.25Mbit/sec serial link connects each FIU to one of the HIU slices.

The FIU also measures a range of on-board “house-keeping” signals that assist in monitoring the performance and operating conditions of the module. These signals include power supply voltages, current consumption, on-board reference voltages, board temperature, and condensation.

I/O family. Each module has three FIUs, one per slice. For the

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FCR Interconnect Bus between slices to vote coming IMB data and distribute outgoing I/O

Redundant power sharing of dual 24V dc chassis supply voltage and power regulation for

ordination during module

board housekeeping, which monitors reference voltages, current consumption and

Module T8433

1.3. Host Interface Unit (HIU)

The HIU is the point of access to the Inter-Module Bus (IMB) for the module. It also provides power distribution and local programmable processing power. The HIU is the only section of the I/O module to directly connect to the IMB backplane. The HIU is common to most Trusted has type dependent and product range common functions. Each HIU contains three independent slices, referred to as A, B, and C.

All interconnections between the three slices incorporate isolation to prevent any fault interaction between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one slice has no effect on the operation of the other slices.

The HIU provides the following services common to the modules in the family:

• High Speed Fault Tolerant Communications with the TMR Processor via the IMB interface.

•

module data to the IMB.

• Optically isolated serial data interface to the FIU slices.

•

logic power to HIU circuitry.

I/O module types and

• Magnetically Isolated power to the FIU slices.

• Serial data interface to the FPU for module status LEDs.

• SmartSlot link between active and standby modules for co-

replacement.

• Digital Signal Processing to perform local data reduction and self-diagnostics.

• Local memory resources for storing module operation, configuration, and field I/O data.

• On-

board temperature.

1.4. Front Panel Unit (FPU)

The Front Panel Unit (FPU) comprises a Front Panel Interface Unit (FPIU) and a Front Panel Display Unit (FPDU). The overall FPU contains the necessary connectors, switches, logic, and LED indicators for the front panel. For every type of Trusted Active/Standby and Educated indicators (LEDs), and the module removal switches. Additional bicolour LEDs provide status indication for the individual I/O signals. Serial data interfaces connect the FPU to each of the HIU slices to control the LED status indicators and monitor the module removal switches.

I/O module, the FPU contains the Slice Healthy,

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