TrustedTM
PD-T8431
TM
Trusted
TMR 24Vdc Analogue Input
Module – 40 Channel
Introduction
M
The Trusted
as a current sink for all these devices. Comprehensive diagnostic tests are performed on each input
channel. Fault tolerance is achieved through a Triple Modular Redundant (TMR) architecture within the
module for each of the 40 input channels.
Using the built-in line-monitoring feature, the module can detect open and shorted field cables. Line
monitoring functions are independently configured for each input channel.
The module provides on-board Sequence of Events (SOE) reporting with a resolution of 1ms. A
change of state triggers an SOE entry. States are determined by voltage thresholds that can be
configured on a per channel basis. When the field voltage and field return are connected to the
auxiliary input channels of the module, thresholds can be specified as a ratio of the field supply voltage.
T
TMR 24V dc Analogue Input module interfaces to 40 sourcing field input devices, acting
Features
• 40 Triple Modular Redundant (TMR) input channels per module.
• Comprehensive, automatic diagnostics and self-test.
• Selectable line monitoring per channel to detect open circuit and short circuit field wiring
faults.
• 2500Vdc opto/galvanic isolation barrier.
• On-board Sequence of Events (SOE) reporting with 1ms resolution.
• Module can be hot-replaced on-line using dedicated Companion (adjacent) Slot or
SmartSlot (one spare slot for many modules) configurations.
• Front panel input status LEDs for each channel indicate input status and field wiring
faults.
• Front panel module status LEDs indicate module health and operational mode (Active,
Standby, Educated)
:V Certified IEC 61508 SIL 3
• T
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Module T8431
Table of Contents
1. D e s c r i p t i o n . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Field Termination Unit (FTU) ....................................................................................................... 7
1.1.
1.2.
Field Interface Unit (FIU) ............................................................................................................. 8
Host Interface Unit (HIU) ............................................................................................................. 8
1.3.
Front Panel Unit (FPU) ................................................................................................................ 9
1.4.
Line Monitoring Thresholds........................................................................................................ 10
1.5.
1.6. H o u s e k e e p i n g . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.7. Fault Detection and Testing ....................................................................................................... 11
1.8. Sequence of Events Characteristics .......................................................................................... 11
2. I n s t a l l a t i o n . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.1. Module Insertion/Removal ......................................................................................................... 12
2.2. Field Cable Selection ................................................................................................................. 12
2.3. Module Pinout Connections ....................................................................................................... 13
2.4. TrustedTM Module Polarisation/Keying. ...................................................................................... 14
3. Application ................................................................................................................................. 15
3.1. Module Configuration ................................................................................................................. 15
3.2. T8431 Complex Equipment Definition ....................................................................................... 15
3.2.1. Rack 1: THRSHIN ...................................................................................................................... 16
3.2.2. Rack 2: STATE .......................................................................................................................... 17
3.2.3. Rack 3: AI .................................................................................................................................. 18
3.2.4. Rack 4: THRSHOUT.................................................................................................................. 19
3.2.5. Rack 5: LINE_FLT ..................................................................................................................... 20
3.2.6. Rack 6: DISCREP ...................................................................................................................... 20
3.2.7. Rack 7: HKEEPING ................................................................................................................... 21
3.2.8. Rack 8: Information .................................................................................................................... 22
3.3. Sequence of Events Configuration ............................................................................................ 23
3.4. SYSTEM.INI File Configuration ................................................................................................. 23
4. Oper at io n . ........ .. .. .. ........ .. .. .. ......... .. .. .. ........ .. .. .. ........ .. .. .. ........ .. .. .. ......... .. .. .. ........ .. .. .. ........ .. .. .. .. 24
4.1. Front Panel ................................................................................................................................ 24
4.2. Module Status LEDs .................................................................................................................. 25
4.3. I/O Status LEDs ......................................................................................................................... 26
5. Fault Finding and Maintenance .................................................................................................. 27
5.1. Fault Reporting .......................................................................................................................... 27
5.2. Field Wiring Faults ..................................................................................................................... 27
5.3. Module Faults ............................................................................................................................ 27
5.4. Companion Slot ......................................................................................................................... 28
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5.5. S mar tS lo t . . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. . 28
5.6. Cold Start ................................................................................................................................... 28
5.7. Input Channel Calibration Check ............................................................................................... 29
5.8. Transfer between Active and Standby Modules ........................................................................ 29
6. S p e c i f i c a t i o n s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
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Module T8431
Figures
Figure 1 Module Architecture ................................................................................................................... 6
Figure 2 Functional Block Diagram ......................................................................................................... 7
Figure 3 Module polarisation .................................................................................................................. 14
Figure 4 Module Front Panel ................................................................................................................. 24
Tables
Table 1 Example Threshold data (24Vdc) .............................................................................................. 10
Table 2 Field Connector Pinout .............................................................................................................. 13
Table 3 Complex Equipment Definition .................................................................................................. 15
Table 4 OEM Parameters ....................................................................................................................... 16
Table 5 Rack 1: Threshold input descriptions ........................................................................................ 16
Table 6 Rack 2: STATE descriptions...................................................................................................... 17
Table 7 Rack 2: STATE bit descriptions ................................................................................................. 17
Table 8 Rack 3: Channel Field Engineering Units .................................................................................. 18
Table 9 Rack 3: Normal operating values .............................................................................................. 18
Table 10 Rack 4: THRSHOUT ............................................................................................................... 19
Table 11 Rack 5: LINE_FLT ................................................................................................................... 20
Table 12 Rack 6: DISCREP bit descriptions .......................................................................................... 20
Table 13 Rack 7: Housekeeping descriptions ........................................................................................ 21
Table 14 Rack 8: INFO descriptions ....................................................................................................... 22
Table 15 Rack 8: INFO bit descriptions .................................................................................................. 22
Table 16 Rack 8: FCR bit descriptions ................................................................................................... 23
Table 17 Module Status Indicators ......................................................................................................... 25
Table 18 Default I/O Status Indicators .................................................................................................... 26
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Notice
The content of this document is confidential to ICS Triplex Technology Ltd. companies and their
partners. It may not be given away, lent, resold, hired out or made available to a third party for any
purpose without the written consent of ICS Triplex Technology Ltd.
This document contains proprietary information that is protected by copyright. All rights are reserved.
Microsoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered
trademarks of Microsoft Corporation.
The information contained in this document is subject to change without notice. The reader should, in
all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been
made. From time to time, amendments to this document will be made as necessary and will be
distributed by ICS Triplex Technology Ltd.
Information in this documentation set may be subject to change without notice and does not represent
a commitment on the part of ICS Triplex Technology Ltd.
The contents of this document, which may also include the loan of software tools, are subject to the
confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.
No part of this documentation may be reproduced or transmitted in any form or by any means,
electronic or mechanical, including photocopying and recording, for any purpose, without the express
written permission of ICS Triplex Technology Ltd.
Disclaimer
The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the
text of this manual.
The user of, and those responsible for applying this equipment, must satisfy themselves as to the
acceptability of each application and use of this equipment.
This document is based on information available at the time of its publication. While efforts have been
made to be accurate, the information contained herein does not purport to cover all details or variations
in hardware or software, nor to provide for every possible contingency in connection with installation,
operation, or maintenance. Features may be described herein which are present in all hardware or
software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this
document with respect to changes subsequently made.
ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with
respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of
the information contained herein. No warranties of merchantability or fitness for purpose shall apply.
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Module T8431
Revision and Updating Policy
All new and revised information pertinent to this document shall be issued by ICS Triplex Technology
Ltd. and shall be incorporated into this document in accordance with the enclosed instructions.
The change is to be recorded on the Amendment Record of this document.
Precautionary Information
WARNING
Warning notices call attention to the use of materials, processes, methods, procedures or limits which
must be followed precisely to avoid personal injury or death.
CAUTION
Caution notices call attention to methods and procedures which must be followed to avoid damage to
the equipment.
Notes:
Notes highlight procedures and contain information to assist the user in the understanding of the
information contained in this document
Warning
RADIO FREQUENCY INTERFERENCE
Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be
exercised with regard to the use of portable communications equipment around such equipment.
Signs should be posted in the vicinity of the equipment cautioning against the use of portable
communications equipment.
MAINTENANCE
Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or
damage to the system may be caused.
Caution
HANDLING
Under no circumstances should the module housing be removed.
Associated Documents
Product Descriptions (PD) provide product specific information.
The Safety Manual contains the recommended safety requirements for the safety system design.
The PD8082B – Toolset Suite provides specific guidance on system configuration and application
generation.
The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic
procedures.
For technical support email: support@icstriplex.com
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Module T8431
1. Description
The TMR 24V dc Analogue Input module is a member of the TrustedTM range of Input/Output (I/O)
modules. All Trusted
all I/O modules interface to the Inter-Module Bus (IMB) which provides power and allows
communication with the Trusted
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T
I/O modules share common functionality and form. At the most general level,
TM
TMR Processor. In addition, all modules have a field interface that
is used to connect to module specific signals in the field. All modules are Triple Modular Redundant
(TMR).
Figure 1 Module Architecture
All High Integrity I/O modules comprise four sections: Host Interface Unit (HIU), the Field Interface Unit
(FIU), the Field Termination Unit (FTU) and the Front Panel Unit (or FPU).
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igure 2 shows a simplified functional block diagram of the Trusted
F
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Module T8431
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4V dc Analogue Input module.
2
Figure 2 Functional Block Diagram
1.1. Field Termination Unit (FTU)
The Field Termination Unit (FTU) is the I/O module assembly that connects all three FIUs to a field
connector. The FTU primarily contains passive components necessary for front-end signal
conditioning. When installed in a Trusted
mates to the Field I/O Cable Assembly attached at the rear of the chassis.
The SmartSlot link is passed from the HIU to the field connections via the FTU. These signals go
directly to the I/O cable assembly and maintain isolation from the I/O signals on the FTU. The
SmartSlot link is the intelligent connection between active and standby
during module replacement.
TM
Controller or Expander Chassis, the FTU field connector
modules for co-ordination
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High Speed Fault Tolerant Communications with the TMR Processor via the IMB
FCR Interconnect Bus between slices to vote coming IMB data and distribute outgoing I/O
for
ordination during module
board housekeeping, which monitors reference voltages, current consumption and
TM
Module T8431
1.2. Field Interface Unit (FIU)
The Field Interface Unit (FIU) is the section of the module that contains the specific circuits necessary
to interface to the particular types of field I/O signals. Each module has three FIUs, one per slice. For
he TMR 24V dc Analogue Input module, the FIU contains an analogue to digital (A/D) converter for
t
each of the 40 field inputs.
The FIU receives isolated power from the HIU for logic. The FIU provides additional power
conditioning for the operational voltages required by the FIU circuitry. An isolated 6.25Mbit/sec serial
link connects each FIU to one of the HIU slices.
The FIU also measures a range of on-board “house-keeping” signals that assist in monitoring the
performance and operating conditions of the module. These signals include power supply voltages,
current consumption, on-board reference voltages, board temperature, and condensation.
1.3. Host Interface Unit (HIU)
The HIU is the point of access to the Inter-Module Bus (IMB) for the module. It also provides power
distribution and local programmable processing power. The HIU is the only section of the I/O module
to directly connect to the IMB backplane. The HIU is common to most Trusted
has type dependent and product range common functions. Each HIU contains three independent
slices, commonly referred to as A, B, and C.
TM
I/O module types and
All interconnections between the three slices incorporate isolation to prevent any fault interaction
between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one
slice has no effect on the operation of the other slices.
The HIU provides the following services common to the modules in the family:
•
interface.
•
module data to the IMB.
• Optically isolated serial data interface to the FIU slices.
• Redundant power sharing of dual 24V dc chassis supply voltage and power regulation
logic power to HIU circuitry.
• Magnetically Isolated power to the FIU slices.
• Serial data interface to the FPU for module status LEDs.
• SmartSlot link between active and standby modules for co-
replacement.
• Digital Signal Processing to perform local data reduction and self-diagnostics.
• Local memory resources for storing module operation, configuration, and field I/O data.
• On-
board temperature.
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Module T8431
1.4. Front Panel Unit (FPU)
The Front Panel Unit (FPU) comprises a Front Panel Termination Unit (FPTU) and a Front Panel
Display Unit (FPDU). The overall FPU contains the necessary connectors, switches, logic, and LED
ndicators for the front panel. For every type of Trusted
i
Healthy, Active/Standby and Educated indicators (LEDs), and the module removal switches.
Additional bicolour LEDs provide status indication for the individual I/O signals. Serial data interfaces
connect the FPU to each of the HIU slices to control the LED status indicators and monitor the module
removal switches.
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T
/O module, the FPU contains the Slice
I
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1.5. Line Monitoring Thresholds
The module determines the contact state and line fault status by comparing the input voltage level to
four user programmed thresholds and two fixed (minimum and maximum) thresholds. Hysteresis is
provided on the thresholds by up-scale and downscale values, corresponding to the thresholds for
increasing and decreasing values respectively.
Typical
voltage
threshold
values
Tmax 6.0
Input
Over-range 6 1
High-High 5
Channel
State
Line
Fault
Status
0
T8 2.28
T7 2.24
T6 1.82
T5 1.79
T4 1.52
T3 1.47
T2 1.12
T1 1.11
1
4 or 5
High 4 0
3 or 4 0
Normal 3 0
2 or 3
Low 2
1 or 2
Low-Low 1 1
0
Tmin -0.5V
1
increasing then the lower state value will be returned. If the input level is decreasing the higher state
value will be returned.
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The channel state value returned is dependent on the previous state value. If the input level is
1
Under-range 0
Table 1 Example Threshold data (24Vdc)
Trusted
Default threshold values used for non line monitored inputs are as follows (in raw units)
Default = 448, 576, 1344, 1472, 2240, 2368, 3520, 3648, 5120
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Module T8431
1.6. Housekeeping
The input module automatically performs local measurements of several on-board signals that can be
sed for detailed troubleshooting and verification of module operating characteristics. Measurements
u
are made within each slice’s HIU and FIU.
1.7. Fault Detection and Testing
From the IMB to the field connector, the input module contains extensive fault detection and integrity
testing. As an input device, all testing is performed in a non-interfering mode. Data input from the IMB
is stored in redundant error-correcting RAM on each slice portion of the HIU. Received data is voted
on by each slice. All data transmissions include a confirmation response from the receiver.
Between the HIU and FIU, there are a series of optically isolated links for data and power. The data
link is synchronised and monitored for variance. Both the FIU and HIU have onboard temperature
sensors to characterise temperature-related problems. Each FIU is also fitted with a condensation
sensor.
The power supplies for both the HIU and FIU boards are redundant, fully instrumented and testable.
Together, these assemblies form a Power Integrity Sub System.
The module field input is connected to a single bit ADC known as the input circuit. These circuits,
one per channel on each slice, produce a digital output which naturally transitions between on and off.
Any failure in the circuit causes the output to saturate to stuck-on or stuck-off which is automatically
detected. As the conversion process is dynamic and not gated like traditional ADCs, failures are
rapidly diagnosed and located.
By using the circuit, the analogue path in the module is short and does not involve many
components. This results in analogue failures being contained to a single channel on a single slice
instead of causing a group of eight or more inputs to fail.
1.8. Sequence of Events Characteristics
The input module automatically measures the field-input voltage, compares the value to the
configurable thresholds, and determines the state of the field input. An event occurs when the input
transitions from one state to another. When an input changes state, the on-board real-time clock value
is recorded. When the TMR Processor next reads data from the input module, the input state and realtime clock values are retrieved. The TMR Processor uses this data to log the input state change into
the system Sequence of Events (SOE) log. The user may configure each input to be included in the
system SOE log. Full details of SOE are contained in PD-8013 – Trusted
Historian.
TM
SOE And Process
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Module T8431
2. Installation
2.1. Module Insertion/Removal
CAUTION:
The module contains static sensitive parts. static handling precautions must be observed. Specifically
ensure that exposed connector pins ARE NOT TOUCHED. Under no circumstances should the
module housing BE REMOVED.
Before installation, visually inspect the module for damage. Ensure that the module housing appears
undamaged and inspect the I/O connector at the back of the module for bent pins. If the module
appears damaged or any pins are bent, do not install the module. Do not try to straighten bent pins.
Return the module for replacement.
Ensure that the module is of the correct type.
Record the module type, revision and serial number of the module before installation.
To install the module:
1. Ensure that the field cable assembly is installed and correctly located.
2. If I/O module keys are used, verify that all keys are installed in the correct positions and
properly seated in their slots.
3. Release the ejector tabs on the module using the release key. Ensure that the ejector tabs
are fully open.
4. Holding the ejectors, carefully insert the module into the intended slot.
5. Push the module fully home by pressing on the top and bottom of the module fascia.
6. Close the module ejectors, ensuring that they click into their locked position.
The module should mount into the chassis with a minimum of resistance. If the module does not
mount easily, do not force it. Remove the module and check it for bent or damaged pins. If the pins
have not been damaged, try reinstalling the module.
2.2. Field Cable Selection
I/O cables suitable for use with the TrustedTM TMR 24V dc Analogue Input Module are detailed in the
following Product Descriptions.
TM
1. PD-TC200 – Trusted
2. PD-TC500 – Trusted
The Product Descriptions detailed above also detail the types of Field Termination Assembly (FTA) or
Versatile Field termination Assembly (VFTA) which may be used with type of module.
I/O Companion Slot Cables
TM
I/O SmartSlot Cables
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Module T8431
2.3. Module Pinout Connections
C B A
1 Smart Slot Link C Smart Slot Link B Smart Slot Link A
2
3 Chan 28 (+) Chan 14 (+) Chan 0 (+)
4 Chan 28 (+) Chan 14 (+) Chan 0 (+)
5 Chan 29 (+) Chan 15 (+) Chan 1 (+)
6 Chan 29 (+) Chan 15 (+) Chan 1 (+)
7 Chan 30 (+) Chan 16 (+) Chan 2 (+)
8 Chan 30(+) Chan 16 (+) Chan 2 (+)
9 Return Return Return
10 Chan 31 (+) Chan 17 (+) Chan 3 (+)
11 Chan 31 (+) Chan 17 (+) Chan 3 (+)
12 Chan 32 (+) Chan 18 (+) Chan 4 (+)
13 Chan 32 (+) Chan 18 (+) Chan 4 (+)
14 Chan 33 (+) Chan 19 (+) Chan 5 (+)
15 Chan 33 (+) Chan 19 (+) Chan 5 (+)
16 Chan 34 (+) Chan 20 (+) Chan 6 (+)
17 Chan 34 (+) Chan 20 (+) Chan 6 (+)
18 Chan 35 (+) Chan 21 (+) Chan 7 (+)
19 Chan35 (+) Chan 21 (+) Chan 7 (+)
20 Return Return Return
21 Chan 36 (+) Chan 22 (+) Chan 8 (+)
22 Chan 36 (+) Chan 22 (+) Chan 8 (+)
23 Chan 37 (+) Chan 23 (+) Chan 9 (+)
24 Chan 37 (+) Chan 23 (+) Chan 9 (+)
25 Chan 38 (+) Chan 24 (+) Chan 10 (+)
26 Chan 38 (+) Chan 24 (+) Chan 10 (+)
27 Chan 39 (+) Chan 25 (+) Chan 11 (+)
28 Chan 39 (+) Chan 25 (+) Chan 11 (+)
29 Chan 40 (+) Chan 26 (+) Chan 12 (+)
30 Chan 40 (+) Chan 26 (+) Chan 12 (+)
31 Chan 41 (+) Chan 27 (+) Chan 13 (+)
32 Chan 41 (+) Chan 27 (+) Chan 13 (+)
Table 2 Field Connector Pinout
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identified below)
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Module T8431
2.4. TrustedTM Module Polarisation/Keying.
TM
All Trusted
The polarisation comprises two parts. The module and the associated field cable.
Modules have been Keyed to prevent insertion into the wrong position within a chassis.
Each module type has been keyed during manufacture. The organisation responsible for the
integration of the Trusted
TM
system must key the cable by removing the keying pieces from the cable
so that they correspond with the bungs fitted to the associated module prior to fitting.
Cable Exit
1
Polarising/Keying
Pins.
(Remove using
side cutters where
Trusted Cable
hood
12
Release button
Smart
Swap
Connector
if Fitted
Figure 3 Module polarisation
For Cables with Companion slot installations both keying strips must be polarised.
For This Module (T8431) remove keying pins 1,4,5.
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Module T8431
3. Application
3.1. Module Configuration
There is no configuration required to the physical input module. All configurable characteristics of the
module are performed using tools on the EWS and become part of the application or system.ini file
that is loaded into the TMR Processor. The TMR Processor automatically configures the input module
after applications are downloaded and during Active/Standby changeover.
The IEC1131 TOOLSET provides the main interface to configure the input module. Details of the
configuration tools and configuration sequence are provided in PD-8082B Trusted
There are three procedures necessary to configure the input module. These are:
1. Define the necessary I/O variables for the field input data and module status data using the
Dictionary Editor of the IEC1131 TOOLSET.
2. Create an I/O module definition in the I/O Connection Editor for each I/O module. The I/O
module definition defines physical information, e.g. Chassis and Slot location, and allows
variables to be connected to the I/O channels of the module.
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3. Using the Trusted
per-channel threshold levels and noise filtering, and other module settings.
System Configuration Manager, define custom LED indicator modes,
TM
Toolset Suite.
3.2. T8431 Complex Equipment Definition
The T8431 I/O Complex Equipment Definition includes 8 I/O boards, referenced numerically by Rack
number:
Rack I/O Board Description Data Type Direction No. of
Channels
1 THRSHIN
2 STATE Field Input State Integer In 40
3 AI Field Input Engineering Unit Integer In 40
4 THRSHOUT Threshold data Integer Out 11
5 LINE_FLT Line Fault Status Boolean In 40
6 DISCREP Channel Discrepancy Integer In 3
7 HKEEPING Housekeeping Registers Integer In 51
8 INFO I/O Module Information Integer In 11
OEM Parameters - - -
Field Input Status Integer In 9
Table 3 Complex Equipment Definition
There are two OEM parameters included in the first rack (THRSHIN Board). These OEM parameters
define the primary module position; declaring the module’s chassis and slot location. There is no need
to define the secondary module position within the IEC1131 TOOLSET. Where systems may be
required to start-up with a module in the secondary position as the active module, e.g. primary module
is not installed when application is started, the secondary module’s position should be declared in the
module definition of the System Configuration Manager.
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OEM Parameter Description Notes
TICS_CHASSIS The number of the
TICS_SLOT The slot number in the
TM
Module T8431
TrustedTM Chassis
where the primary I/O
module is installed
chassis where the
primary I/O module is
installed
Table 4 OEM Parameters
The TrustedTM Controller Chassis is 1, and
TrustedTM Expander Chassis are 2 to 15
The I/O module slots in the TrustedTM
Controller chassis are numbered from 1 to 8.
The I/O Module slots in the TrustedTM Expander
Chassis are numbered from 1 to 12
3.2.1. Rack 1: THRSHIN
This board allows the current thresholds for an analogue input channel to be read by the application,
under control of the THRSHOUT board (see section 3.2.4).
Channel Description
1 Channel number being read. Range 0 to
41.
2 States 2 > 1 falling threshold
3 States 1 > 2 rising threshold
4 States 3 > 2 falling threshold
5 States 2 > 3 rising threshold
6 States 4 > 3 falling threshold
7 States 3 > 4 rising threshold
8 States 5 > 4 falling threshold
9 States 4 > 5 rising threshold
Table 5 Rack 1: Threshold input descriptions
THRSHIN reads in the module threshold values controlled by THRSHOUT in Rack 4. See Table 1 for a
graphical representation of the states and thresholds.
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Module T8431
3.2.2. Rack 2: STATE
This board provides the majority voted numerical input state. This indicates within which threshold
band the field input is in and module channel fault status.
Channel Description
1 Field input channel 1 state
2 Field input channel 2 state
40 Field input channel 40 state
Table 6 Rack 2: STATE descriptions
The numerical input state is returned as an integer value.
Value Description
8-15 Internal channel fault on module
7 Unknown
6 Over-range
5 High-High
4 High
3 Normal
2 Low
1 line fault
0 Underrange
Table 7 Rack 2: STATE bit descriptions
The input channel has a value 7 (Unknown) when:
1. The input channel cannot be correctly measured by two or more slices of the TMR input
module.
2. The TMR Processor detects a 2-oo-3 channel discrepancy between the three slices of the
TMR input module.
3. The module is simulated (not installed or the TMR Processor cannot communicate with 2-oo3 slices of the module).
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Module T8431
3.2.3. Rack 3: AI
The AI board returns the engineering units for the associated field input.
Channel Description
1 Field input channel 1 voltage
2
40 Field input channel 40 voltage
Table 8 Rack 3: Channel Field Engineering Units
The voltage is the median value taken from the triplicated module. Field input current is converted to
voltage using a 250R resistor on a standard field termination assembly (FTA). This AI value may be
used directly or scaled using the IEC1131 TOOLSET conversion tables. The voltage is reported as
1024 counts per volt. To allow easy scaling for 4-20mA inputs, zero volts reports as -1024, one volt
reports as 0, and 5 volts reports as 4096.
Using a 250R field loop configuration the following table represents normal operating values
Field input channel 2 voltage
Voltage Current Engineering Unit
Open
Circuit
0 0mA -1024
1 4mA 0
2 8mA 1024
3 12mA 2048
4 16mA 3072
5 20mA 4096
-2048
Table 9 Rack 3: Normal operating values
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Module T8431
3.2.4. Rack 4: THRSHOUT
This board allows the current thresholds for an analogue input channel to be read or written by the
application. The application can write new thresholds in the THRSHOUT board for a particular channel,
and it can read the current thresholds from the THRSHIN board, under control of a channel in the
HRSHOUT board.
T
Note that channels 0 and 41 are internal reference channels, and are not connected to the field.
Channels 1 to 40 are field channels.
Channel Description
1 W rite the threshold data for a particular
input channel on channels 3 to 11 to the
module. The data is written on a rising
edge 0 to 1.
2 Read the threshold data for a particular
channel from the module to the THRSHIN
board. The data is read on a rising edge 0
to 1.
3 Channel number to write/read threshold
data. Range 0 to 41.
4 States 2 > 1 falling threshold
5 States 1 > 2 rising threshold
6 States 3 > 2 falling threshold
7 States 2 > 3 rising threshold
8 States 4 > 3 falling threshold
9 States 3 > 4 rising threshold
10 States 5 > 4 falling threshold
11 States 4 > 5 rising threshold
Table 10 Rack 4: THRSHOUT
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3.2.5. Rack 5: LINE_FLT
Channel Description
1 Field input channel 1 line fault
2 Field input channel 2 line fault
40 Field input channel 40 line fault
Table 11 Rack 5: LINE_FLT
The line fault input state is reported as true (logic ‘1’) for a line fault condition (open circuit,
indeterminate, or short circuit condition). The logic state is the majority voted value.
3.2.6. Rack 6: DISCREP
Channel Description
1 Discrepancy status inputs 1 to 16
2 Discrepancy status inputs 17 to 32
3 Discrepancy status inputs 33 to 40
Table 12 Rack 6: DISCREP bit descriptions
Each of the words reports the discrepancy status of 16 input channels. The corresponding bit within
the word is set to ‘1’ when a discrepancy condition is detected on that input channel’s input state
(rack 2).
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1
A
2B3C4
A
5B6C7
A
8B9C10
A
11
B
12C13
A
14B15C16
A
17B18C19
A
20B21C22
A
23B24C25
A
26B27C28
A
29B30C31
A
32B33C34
A
35B36C37
A
38B39C40
A
41B42C43
A
44B45C46A
47B48C49
A
50B51
C
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Module T8431
3.2.7. Rack 7: HKEEPING
Channel
Description
FCR Units (Full Scale Range)
24V2 Input Voltage -32768 32767 mV
Internal supply voltage (post regulator) -32768 32767 mV
Internal supply current (post regulator) -32768 32767 mA
Input voltage (post isolation) -32768 32767 mV
24V1 Input Voltage -32768 32767 mV
HIU Board Temperature
( Note: Temperature, ºC = input value / 256 )
Front Panel Load Current -32768 32767 mA
SmartSlot Link Voltage -32768 32767 mV
Reserved for FIU condensation sensor 0 0 -
FIU Internal Supply Voltage -32768 32767 mV
FIU Internal Supply Current -32768 32767 mA
FIU Unregulated input voltage -32768 32767 mV
FIU Board Temperature
( Note: Temperature, ºC = input value / 256 )
FIU Reference Voltage, DAC_X1 -32768 32767 mV
FIU Reference Voltage, DAC_X2 -32768 32767 mV
-32768 32767 -
-32768 32767 -
FIU Reference Voltage, DAC_X3 -32768 32767 mV
Diagnostic error code
Table 13 Rack 7: Housekeeping descriptions
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ach input within the housekeeping rack is reported as an integer. In general, the application engineer
E
will not normally require these inputs. They are provided to aid fault finding and diagnosis and may be
used for reporting and display purposes. If a slice is Fatal, then all reported housekeeping inputs are
set to zero.
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Module T8431
3.2.8. Rack 8: Information
Channel Description
1 Active Module chassis number
2 Active Module slot number
3 Active Module Healthy
4 Active Module Mode
5 Standby Module Chassis Number
6 Standby Module Slot Number
7 Standby Module Healthy
8 Standby Module Mode
9 FCR Status
10 Primary module is active
11 Active module is simulated
Table 14 Rack 8: INFO descriptions
The active module chassis and slot numbers indicate the position of the currently active module.
These values will change to match the primary or secondary module position, depending on their active
status, i.e. active/standby changeover will “swap” the values for the active module chassis and slot
number channels with those in the standby module chassis and slot number channels. The chassis
and slot numbers are set to zero if the module is not present.
The active and standby module healthy channel is returned as an integer, however only the least
significant bit is used. A value of 0 indicates that a fault has been detected, a non-zero value indicates
that the module is healthy.
The active and standby module mode is an integer indicating the current operating mode of the
associated module. The value indicates the current internal operating mode of the module.
Value Module Mode
5 Shutdown
4 Maintain
3 Active
2 Standby
1 Configuration
0 Unknown, no module present
Table 15 Rack 8: INFO bit descriptions
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he FCR Status channel reports the fault status of the active and standby modules. The value is bit-
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packed as shown below, the least significant byte is used with the most significant 8-bits set to zero:
The ‘Primary Module is active’ channel is set to non-zero if the primary module is the current active
module, i.e. the active module is in the chassis and slot numbers defined within the OEM parameters.
The ‘Active Module is simulated’ channel is set to non-zero if the active module is being simulated, this
will only be set if the module is not present and the simulation enable has been set within the module’s
configuration in the system.ini file.
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Module T8431
Bit Number
7 6 5 4 3 2 1 0
Standby Module Active Module
Ejector
pen
o
FCR C
ealthy
H
FCR B
ealthy
H
Table 16 Rack 8: FCR bit descriptions
FCR A
ealthy
H
Ejectors
pen
o
FCR C
H
ealthy
FCR B
ealthy
H
FCR A
ealthy
H
3.3. Sequence of Events Configuration
Each Boolean Input Variable can be configured for automatic Sequence of Events (SOE) logging. This
applies to the Input Status and Line Fault Status variables. A Boolean variable is configured for SOE
during the variable definition in the Data Dictionary Editor. To select SOE, press the Extended Button
in the Boolean Variable Definition Dialog Box to open the Extended Definition Dialog. Then check the
box for Sequence of Events to enable the variable for automatic SOE logging.
During operation, the input module automatically reports time-stamped change of state information for
the input data. The TMR Processor automatically logs change of state for configured SOE variables
into the system SOE Log. The SOE Log can be monitored and retrieved using the SOE and Process
Historian Package running on the EWS. This software package is described in PD-8013.
3.4. SYSTEM.INI File Configuration
There are many operating characteristics of the input module that can be customised for a particular
application. The System Configuration Manager is a tool that allows the user to configure the specific
operating characteristics for each module. Descriptions of the items that may be configured for the
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Certain characteristics apply to the entire module and are considered Module Configurable Items.
Other characteristics apply to individual input channels and are considered Channel Configurable
Items. There are specific default settings for each of the configurable items. If the default settings are
appropriate for a given application, then customization of the module definition in the System
Configuration Manager is not required
TM
24V dc Analogue Input Module T8431 are contained in PD-8082B.
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T8431
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Module T8431
4. Operation
4.1. Front Panel
Status LEDs on the front of the module provide visual indications of the module’s operational status
and field input status. Each LED is a tri-colour LED of which for normal operation, only two colours are
used; red and green. Located at the top and bottom of each module is an ejector lever that is used to
remove the module from the chassis. Limit switches detect the open/closed position of the ejector
levers. The ejector levers are normally latched closed when the module is firmly seated into the
Controller or Expander Chassis.
Module
Latch
Module
Status
Indicators
Input
Trusted TMR Analogue Input
Latch
Figure 4 Module Front Panel
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Module T8431
4.2. Module Status LEDs
There are six module status LEDs on the module front panel; three Healthy, one Active, one Standby,
and one Educated. The Healthy indicators are controlled directly by each module slice. The Active,
Standby, and Educated indicators are controlled by the FPU. The FPU receives data from each of the
module slices. The FPU performs a 2-oo-3 vote on each data bit from the slices and sets the
indicators accordingly.
The module status LED states and their meanings are described as follows:
LED STATE DESCRIPTION
Healthy Off No power applied to the module.
Amber Slice is in the start-up state (momentary after
installation or power-up).
Green Slice is healthy.
Red – flashing Fault present on the associated slice but the
slice is still operational, or one 24V feed to
the chassis has failed.
Red (momentary) On installation – power applied to the
associated slice.
Red The associated slice is in the fatal state. A
critical fault has been detected and the slice
disabled..
Active Off Module is not in the Active state.
Green Module is in the Active (or Maintain) state.
Red – flashing Module is in the shutdown state if the
Standby LED is off.
Red – flashing Module is in the fatal state if the Standby
LED is also flashing.
Standby Off Module is not in the Standby state.
Green Module is in the Standby state.
Red – flashing Module is in the fatal state. The Active LED
will also be flashing red.
Educated Off
Green
Green – flashing
Module is not educated.
Module is educated.
Module is recognised by the Processor but
education is not complete.
Amber - Flashing Active/standby changeover in progress
Table 17 Module Status Indicators
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4.3. I/O Status LEDs
There are 40 input channel status LEDs on the module front panel, one for each field input. These
indicators are controlled by the FPU. The FPU receives data from each of the module slices. The
PU performs a 2-oo-3 vote on each data bit from the slices and sets the indicators accordingly.
F
The input status LED mode is dependent upon the voltage level of the field I/O signal. Each field input
voltage is measured and compared to six threshold levels (four configurable and two fixed) which
produce seven threshold bands. Each threshold band can be defined to have a particular indicator
mode: off, green, red, flashing green, or flashing red.
The configurable voltage thresholds and LED modes allow users to customise the input measurement
and status indications to suit individual application requirements. Without customisation, the default
indicator modes are suitable for analogue inputs as described below:
INDICATOR STATE DESCRIPTION
Off ’Normal’ (states 1,2,3)
Green - steady ‘High alarm’ (states 4,5)
Green – flashing Overrange (state 6)
Red – flashing Underrange (state 0) or Channel Fault (8 to 15)
Table 18 Default I/O Status Indicators
Note: The LEDs indicating channel status may be configured to suit user requirements by
implementing the procedure for configuring the System.INI file detailed in PD-8082B.
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5. Fault Finding and Maintenance
5.1. Fault Reporting
Input module faults are reported to the user through visual indicators (LEDs) on the front panel of the
module. Faults are also reported via status variables which may be automatically monitored in the
application programs, and external system communications interfaces. There are generally two types
of faults that must be remedied by the user; external wiring and module faults. External wiring faults
require corrective action in the field to repair the fault condition. Module faults require replacement of
the input module.
5.2. Field Wiring Faults
The input circuits of the module may be used to detect field wiring faults in addition to alarm states. To
achieve this, line monitoring components must be fitted to the field device.
By comparing the input signal from the field with pre-configured alarm thresholds, the module can
automatically detect field-wiring faults. When a field loop develops a line fault, the input channel status
LED will adopt the steady red state (default setting). The corresponding input state will be reported
and the line fault status for that channel will be set to ‘1’. All other input channels will be unaffected,
except in the case of common cause wiring faults in the field.
Once the field-wiring fault has been identified and corrected, the input status and the input status LED
will display the normal status of the field device and field wiring.
5.3. Module Faults
Extensive diagnostics provide the automatic detection of module faults. The TMR architecture of the
input module and the diagnostics performed ensure the validity of all critical circuits. Using the TMR
architecture provides a Fault Tolerant method to withstand the first fault occurrence on the module and
continue normal input measurements without interruption in the system or process. Faults are
reported to the user through the Healthy status indicators on the front panel of the module and through
the INFO and HKEEPING variables. Under normal operations all three Healthy Indicators are green.
When a fault occurs, one of the Healthy Indicators will be flashing red. It is recommended that this
condition is investigated and if the cause is within the module, it should be replaced.
Module replacement activities depend on the type of spare module configuration chosen when the
system was configured and installed. The module may be configured with a dedicated Companion Slot
or with a SmartSlot for a spare replacement module.
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Module T8431
5.4. Companion Slot
For a Companion Slot configuration, two adjacent slots in a TrustedTM Chassis are configured for the
same input module function. One slot is the primary slot and the other a unique secondary (or spare)
lot. The two slots are joined at the rear of the Trusted
s
Cable that connects both slots to common field wiring terminations. During normal operations, the
primary slot contains the active module as indicated by the Active indicator on the front panel of the
module. The secondary slot is available for a spare module that will normally be the standby module
as indicated by the Standby indicator on the front panel of the module.
Depending on the installation, a hot-spare module may already be installed, or a module blank will be
installed in the standby slot. If a hot-spare module is already installed, transfer to the standby module
occurs automatically when a module fault is detected in the active module. If a hot spare is not
installed, the system continues operating from the active module until a spare module is installed.
M
T
hassis with a double-wide I/O Interface
C
5.5. SmartSlot
For a SmartSlot configuration, the secondary slot is not unique to each primary slot. Instead, a single
secondary slot is shared among many primary slots. This technique provides the highest density of
modules to be fitted in a given physical space. At the rear of the Trusted
Cable connects the secondary slot directly to the I/O Cable connected to the failed primary module.
With a spare module installed in the SmartSlot and the SmartSlot I/O Cable connected to the failed
primary module, the SmartSlot can be used to replace the failed primary module.
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Chassis, a single-wide I/O
Input module Smart Slot jumper cable TC-306-02
Smart Slot between chassis can be performed if the chassis are version 2 (or higher). These have the
connector fitted to enable connection of a TC-006 that ensures the 0 Volt of each chassis is at the
same potential.
5.6. Cold Start
If an I/O module has shut down (due, for example, to two existing faults), the three Healthy LEDs will
be red, the Active and Standby LEDs will be flashing red and the Educated LED will be flashing amber.
The I/O functions provided by this module will have been lost if a hot swap partner has not taken over
control. The module can only be restarted by removing it from its slot and re-inserting it.
If an I/O module is inserted into a functional system slot which previously had no active module (e.g.
removing and reinserting as above), then the processor will educate the module once it has booted.
Once educated, the Educated LED will be steady green and the Active LED will be red flashing.
Input modules will now be reading and reporting their inputs. Output modules have not yet energised
their outputs. To activate outputs and to set the module’s Active LED and the processor’s System
Healthy LED steady green, press the processor Reset pushbutton.
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The user must define the primary, and optionally the secondary, I/O module location for
each I/O module pair. Each primary module location must be unique and is defined as part
. Secondary module
locations can be unique or shared between multiple secondary modules and are defined
within the module’s section within the System.INI file. The system will automatically
up, if the primary module is installed, it will become the active module by
module location is unique, the secondary module
will become the active module by default. If the secondary module is installed with no
primary module present, and the secondary module location is not unique (as in a
In order for a module to become the active module, the TMR Processor will verify that the
module is the correct I/O module type and that both Module Removal switches are closed.
When a fault occurs on the active module, the TMR Processor will be informed. Once it
An active/standby changeover starts with the TMR Processor checking to see if a standby
I/O module is installed. If no standby I/O module is available, the TMR Processor will
ue to check for an available standby I/O
module. Once a standby module is found, the TMR Processor will verify that the I/O
module is of the correct type, that both Module Removal switches are closed, and that the
e pair by using the SmartSlot link. At this point, the
TMR Processor will configure the standby I/O module with the same configuration
information as the currently active I/O module and place the standby I/O module into the
le is then placed in the maintain state (which suspends field
loop testing), and any module specific changeover data is transferred. The educated light
flashes amber before the active/standby changeover takes place, to indicate transfer of
over data (COD). The previous standby module then becomes the active
module and the original module becomes standby. If the currently active module does not
tests, the TMR Processor will revert it to the standby state,
When both Module Removal switches are opened on an active module, regardless of the
module fault status, the TMR Processor will treat it as a request to perform an
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Module T8431
5.7. Input Channel Calibration Check
It is recommended that you carry out a check at 2 yearly intervals on the input channel calibration. This
check will detect long term drift and any inaccuracy as a result. It requires a three point check as
ollows:
f
Inject a signal to each input channel in turn using the following values and check through the
workbench that the reading is as shown below:
• 4 mA signal should give a 0% of full scale reading
• 12 mA signal should give a 50% of full scale reading
• 20 mA signal should give a 100% of full scale reading
5.8. Transfer between Active and Standby Modules
The TMR Processor is responsible for managing a pair of I/O modules through an active/standby
changeover. The following rules apply to active/standby changeovers, though the TMR Processor and
not the I/O module enforce them:
•
of the complex equipment definition within the IEC1131 TOOLSET
determine the secondary module position if the primary module is installed and is operable.
• On initial startdefault. If the secondary module has been defined within the System.INI file and no primary
module is present, and if the secondary
SmartSlot configuration), then NO module for that module pair will become active.
•
At this point the I/O module is configured and eventually placed in the active state.
• A module in the active state should never be removed.
•
becomes aware of the fault, the TMR Processor will attempt an active/standby changeover.
•
continue to utilise the active module and will contin
I/O module is a part of the correct modul
standby state. The active modu
dynamic change
successfully complete the selfand the module in the maintain state will revert back to the active state.
•
active/standby changeover.
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Under normal conditions, an active/standby changeover will only occur if the new active module is
fault-free. Under some circumstances, it is desirable to be able to force a changeover to a known
faulted module. This can be accomplished by opening the Module Removal switches on the currently
active module and pressing the push-button reset on the TMR Processor. This will force the
changeover to proceed even if the new active module is not fault free.
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Module T8431
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Module T8431
6. Specifications
System Supply Voltage Range 20 to 32V dc
Number of Inputs 40 Channels
User Defined Thresholds 4-off
Input Current Range 0-22mA
Input Voltage Range 0-6 Vdc
Sample Update Time 0.5ms
Resolution 3.9uA (1/256mA)
Safety Accuracy +/- 1% of full scale
(default threshold above which 0x70nn series slice discrepancy faults are raised)
Calibration Accuracy 0.03%
Recommended input channel calibration check
interval
Circuit Type Fault tolerant, fully triplicated with
Fusing None, external if required
Intrinsic Safety External barrier
Sequence of Events
Event Resolution
Time-stamp Accuracy
Field Common Isolation
Sustained Working
Maximum Withstanding
Channel to Channel Crosstalk
Power Consumption
Self-Test Interval 2 minutes
Operating Temperature
Non-operating Temperature
Temperature change 0.5ºC/min
Operating Humidity 10 – 95% RH non-condensing
Environmental Specifications Refer to Document 552517
Dimensions
Height
Width
Depth
Weight 1.149kg (2.5lbs)
Real Time Clock Resolution
2 years
optional line monitoring
1ms
±0.5 ms
±250V dc
±2.5kV dc
-40 to –60 dB
15 – 18W
-5°C to 60°C (23°F to 140°F)
-25°C to 70°C (-13°F to 158°F)
266mm (10.5ins)
31mm (1.2ins)
303mm (12ins)
100µSec
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