Rockwell Automation T8431 User Manual

TrustedTM
PD-T8431
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Trusted
TMR 24Vdc Analogue Input
Introduction
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The Trusted as a current sink for all these devices. Comprehensive diagnostic tests are performed on each input channel. Fault tolerance is achieved through a Triple Modular Redundant (TMR) architecture within the module for each of the 40 input channels.
Using the built-in line-monitoring feature, the module can detect open and shorted field cables. Line monitoring functions are independently configured for each input channel.
The module provides on-board Sequence of Events (SOE) reporting with a resolution of 1ms. A change of state triggers an SOE entry. States are determined by voltage thresholds that can be configured on a per channel basis. When the field voltage and field return are connected to the auxiliary input channels of the module, thresholds can be specified as a ratio of the field supply voltage.
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TMR 24V dc Analogue Input module interfaces to 40 sourcing field input devices, acting
Features
40 Triple Modular Redundant (TMR) input channels per module.
Comprehensive, automatic diagnostics and self-test.
Selectable line monitoring per channel to detect open circuit and short circuit field wiring
faults.
2500Vdc opto/galvanic isolation barrier.
On-board Sequence of Events (SOE) reporting with 1ms resolution.
Module can be hot-replaced on-line using dedicated Companion (adjacent) Slot or
SmartSlot (one spare slot for many modules) configurations.
Front panel input status LEDs for each channel indicate input status and field wiring faults.
Front panel module status LEDs indicate module health and operational mode (Active, Standby, Educated)
:V Certified IEC 61508 SIL 3
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Table of Contents
1. D e s c r i p t i o n . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Field Termination Unit (FTU) ....................................................................................................... 7
1.1.
1.2.
Field Interface Unit (FIU) ............................................................................................................. 8
Host Interface Unit (HIU) ............................................................................................................. 8
1.3.
Front Panel Unit (FPU) ................................................................................................................ 9
1.4.
Line Monitoring Thresholds........................................................................................................ 10
1.5.
1.6. H o u s e k e e p i n g . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.7. Fault Detection and Testing ....................................................................................................... 11
1.8. Sequence of Events Characteristics .......................................................................................... 11
2. I n s t a l l a t i o n . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.1. Module Insertion/Removal ......................................................................................................... 12
2.2. Field Cable Selection ................................................................................................................. 12
2.3. Module Pinout Connections ....................................................................................................... 13
2.4. TrustedTM Module Polarisation/Keying. ...................................................................................... 14
3. Application ................................................................................................................................. 15
3.1. Module Configuration ................................................................................................................. 15
3.2. T8431 Complex Equipment Definition ....................................................................................... 15
3.2.1. Rack 1: THRSHIN ...................................................................................................................... 16
3.2.2. Rack 2: STATE .......................................................................................................................... 17
3.2.3. Rack 3: AI .................................................................................................................................. 18
3.2.4. Rack 4: THRSHOUT.................................................................................................................. 19
3.2.5. Rack 5: LINE_FLT ..................................................................................................................... 20
3.2.6. Rack 6: DISCREP ...................................................................................................................... 20
3.2.7. Rack 7: HKEEPING ................................................................................................................... 21
3.2.8. Rack 8: Information .................................................................................................................... 22
3.3. Sequence of Events Configuration ............................................................................................ 23
3.4. SYSTEM.INI File Configuration ................................................................................................. 23
4. Oper at io n . ........ .. .. .. ........ .. .. .. ......... .. .. .. ........ .. .. .. ........ .. .. .. ........ .. .. .. ......... .. .. .. ........ .. .. .. ........ .. .. .. .. 24
4.1. Front Panel ................................................................................................................................ 24
4.2. Module Status LEDs .................................................................................................................. 25
4.3. I/O Status LEDs ......................................................................................................................... 26
5. Fault Finding and Maintenance .................................................................................................. 27
5.1. Fault Reporting .......................................................................................................................... 27
5.2. Field Wiring Faults ..................................................................................................................... 27
5.3. Module Faults ............................................................................................................................ 27
5.4. Companion Slot ......................................................................................................................... 28
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5.5. S mar tS lo t . . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. .. . .. . 28
5.6. Cold Start ................................................................................................................................... 28
5.7. Input Channel Calibration Check ............................................................................................... 29
5.8. Transfer between Active and Standby Modules ........................................................................ 29
6. S p e c i f i c a t i o n s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
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Figures
Figure 1 Module Architecture ................................................................................................................... 6
Figure 2 Functional Block Diagram ......................................................................................................... 7
Figure 3 Module polarisation .................................................................................................................. 14
Figure 4 Module Front Panel ................................................................................................................. 24
Tables
Table 1 Example Threshold data (24Vdc) .............................................................................................. 10
Table 2 Field Connector Pinout .............................................................................................................. 13
Table 3 Complex Equipment Definition .................................................................................................. 15
Table 4 OEM Parameters ....................................................................................................................... 16
Table 5 Rack 1: Threshold input descriptions ........................................................................................ 16
Table 6 Rack 2: STATE descriptions...................................................................................................... 17
Table 7 Rack 2: STATE bit descriptions ................................................................................................. 17
Table 8 Rack 3: Channel Field Engineering Units .................................................................................. 18
Table 9 Rack 3: Normal operating values .............................................................................................. 18
Table 10 Rack 4: THRSHOUT ............................................................................................................... 19
Table 11 Rack 5: LINE_FLT ................................................................................................................... 20
Table 12 Rack 6: DISCREP bit descriptions .......................................................................................... 20
Table 13 Rack 7: Housekeeping descriptions ........................................................................................ 21
Table 14 Rack 8: INFO descriptions ....................................................................................................... 22
Table 15 Rack 8: INFO bit descriptions .................................................................................................. 22
Table 16 Rack 8: FCR bit descriptions ................................................................................................... 23
Table 17 Module Status Indicators ......................................................................................................... 25
Table 18 Default I/O Status Indicators .................................................................................................... 26
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Notice
The content of this document is confidential to ICS Triplex Technology Ltd. companies and their partners. It may not be given away, lent, resold, hired out or made available to a third party for any purpose without the written consent of ICS Triplex Technology Ltd.
This document contains proprietary information that is protected by copyright. All rights are reserved.
Microsoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered trademarks of Microsoft Corporation.
The information contained in this document is subject to change without notice. The reader should, in all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been made. From time to time, amendments to this document will be made as necessary and will be distributed by ICS Triplex Technology Ltd.
Information in this documentation set may be subject to change without notice and does not represent a commitment on the part of ICS Triplex Technology Ltd.
The contents of this document, which may also include the loan of software tools, are subject to the confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.
No part of this documentation may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of ICS Triplex Technology Ltd.
Disclaimer
The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the text of this manual.
The user of, and those responsible for applying this equipment, must satisfy themselves as to the acceptability of each application and use of this equipment.
This document is based on information available at the time of its publication. While efforts have been made to be accurate, the information contained herein does not purport to cover all details or variations in hardware or software, nor to provide for every possible contingency in connection with installation, operation, or maintenance. Features may be described herein which are present in all hardware or software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this document with respect to changes subsequently made.
ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of the information contained herein. No warranties of merchantability or fitness for purpose shall apply.
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Revision and Updating Policy
All new and revised information pertinent to this document shall be issued by ICS Triplex Technology Ltd. and shall be incorporated into this document in accordance with the enclosed instructions. The change is to be recorded on the Amendment Record of this document.
Precautionary Information
WARNING
Warning notices call attention to the use of materials, processes, methods, procedures or limits which must be followed precisely to avoid personal injury or death.
CAUTION
Caution notices call attention to methods and procedures which must be followed to avoid damage to the equipment.
Notes:
Notes highlight procedures and contain information to assist the user in the understanding of the information contained in this document
Warning
RADIO FREQUENCY INTERFERENCE
Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be exercised with regard to the use of portable communications equipment around such equipment. Signs should be posted in the vicinity of the equipment cautioning against the use of portable communications equipment.
MAINTENANCE
Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or damage to the system may be caused.
Caution
HANDLING
Under no circumstances should the module housing be removed.
Associated Documents
Product Descriptions (PD) provide product specific information.
The Safety Manual contains the recommended safety requirements for the safety system design.
The PD8082B – Toolset Suite provides specific guidance on system configuration and application generation.
The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic procedures.
For technical support email: support@icstriplex.com
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1. Description
The TMR 24V dc Analogue Input module is a member of the TrustedTM range of Input/Output (I/O) modules. All Trusted all I/O modules interface to the Inter-Module Bus (IMB) which provides power and allows communication with the Trusted
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I/O modules share common functionality and form. At the most general level,
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TMR Processor. In addition, all modules have a field interface that is used to connect to module specific signals in the field. All modules are Triple Modular Redundant (TMR).
Figure 1 Module Architecture
All High Integrity I/O modules comprise four sections: Host Interface Unit (HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU) and the Front Panel Unit (or FPU).
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igure 2 shows a simplified functional block diagram of the Trusted
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4V dc Analogue Input module.
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Figure 2 Functional Block Diagram
1.1. Field Termination Unit (FTU)
The Field Termination Unit (FTU) is the I/O module assembly that connects all three FIUs to a field connector. The FTU primarily contains passive components necessary for front-end signal conditioning. When installed in a Trusted mates to the Field I/O Cable Assembly attached at the rear of the chassis.
The SmartSlot link is passed from the HIU to the field connections via the FTU. These signals go directly to the I/O cable assembly and maintain isolation from the I/O signals on the FTU. The SmartSlot link is the intelligent connection between active and standby during module replacement.
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Controller or Expander Chassis, the FTU field connector
modules for co-ordination
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High Speed Fault Tolerant Communications with the TMR Processor via the IMB
FCR Interconnect Bus between slices to vote coming IMB data and distribute outgoing I/O
for
ordination during module
board housekeeping, which monitors reference voltages, current consumption and
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Module T8431
1.2. Field Interface Unit (FIU)
The Field Interface Unit (FIU) is the section of the module that contains the specific circuits necessary to interface to the particular types of field I/O signals. Each module has three FIUs, one per slice. For
he TMR 24V dc Analogue Input module, the FIU contains an analogue to digital (A/D) converter for
t each of the 40 field inputs.
The FIU receives isolated power from the HIU for logic. The FIU provides additional power conditioning for the operational voltages required by the FIU circuitry. An isolated 6.25Mbit/sec serial link connects each FIU to one of the HIU slices.
The FIU also measures a range of on-board “house-keeping” signals that assist in monitoring the performance and operating conditions of the module. These signals include power supply voltages, current consumption, on-board reference voltages, board temperature, and condensation.
1.3. Host Interface Unit (HIU)
The HIU is the point of access to the Inter-Module Bus (IMB) for the module. It also provides power distribution and local programmable processing power. The HIU is the only section of the I/O module to directly connect to the IMB backplane. The HIU is common to most Trusted has type dependent and product range common functions. Each HIU contains three independent slices, commonly referred to as A, B, and C.
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I/O module types and
All interconnections between the three slices incorporate isolation to prevent any fault interaction between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one slice has no effect on the operation of the other slices.
The HIU provides the following services common to the modules in the family:
interface.
module data to the IMB.
Optically isolated serial data interface to the FIU slices.
Redundant power sharing of dual 24V dc chassis supply voltage and power regulation
logic power to HIU circuitry.
Magnetically Isolated power to the FIU slices.
Serial data interface to the FPU for module status LEDs.
SmartSlot link between active and standby modules for co-
replacement.
Digital Signal Processing to perform local data reduction and self-diagnostics.
Local memory resources for storing module operation, configuration, and field I/O data.
On-
board temperature.
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1.4. Front Panel Unit (FPU)
The Front Panel Unit (FPU) comprises a Front Panel Termination Unit (FPTU) and a Front Panel Display Unit (FPDU). The overall FPU contains the necessary connectors, switches, logic, and LED
ndicators for the front panel. For every type of Trusted
i Healthy, Active/Standby and Educated indicators (LEDs), and the module removal switches. Additional bicolour LEDs provide status indication for the individual I/O signals. Serial data interfaces connect the FPU to each of the HIU slices to control the LED status indicators and monitor the module removal switches.
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/O module, the FPU contains the Slice
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1.5. Line Monitoring Thresholds
The module determines the contact state and line fault status by comparing the input voltage level to four user programmed thresholds and two fixed (minimum and maximum) thresholds. Hysteresis is provided on the thresholds by up-scale and downscale values, corresponding to the thresholds for increasing and decreasing values respectively.
Typical voltage threshold values
Tmax 6.0
Input
Over-range 6 1
High-High 5
Channel State
Line Fault Status
0
T8 2.28
T7 2.24
T6 1.82
T5 1.79
T4 1.52
T3 1.47
T2 1.12
T1 1.11
1
4 or 5
High 4 0
3 or 4 0
Normal 3 0
2 or 3
Low 2
1 or 2
Low-Low 1 1
0
Tmin -0.5V
1
increasing then the lower state value will be returned. If the input level is decreasing the higher state value will be returned.
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The channel state value returned is dependent on the previous state value. If the input level is
1
Under-range 0
Table 1 Example Threshold data (24Vdc)
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