Rockwell Automation T8423 User Manual

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PD-T8423

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Trusted

TMR 35 – 120 Vdc Digital Input

Module – 40 Channel

Introduction

The TrustedTM TMR 120V dc Digital Input module interfaces to 40 field input devices. Fault tolerance
is achieved through a Triple Modular Redundant (TMR) architecture within the module for each of the
40 input channels.

Each field input is triplicated and the input voltage is measured using a sigma-delta input circuit. The
resulting field voltage measurement is compared to user configurable threshold voltages to determine
the reported field input state. When a line-monitoring device is installed at the field switch, the module
can detect open and short-circuit field cables. Line monitoring functions are independently configured
for each input channel. The triplicated voltage measurement, coupled with on-board diagnostic testing,
provides comprehensive fault detection and tolerance.

The module provides on-board Sequence of Events (SOE) reporting with a resolution of 1ms. A
change of state triggers an SOE entry. States are determined by voltage thresholds that can be
configured on a per channel basis.

Features

• 40 Triple Modular Redundant (TMR) input channels per module.

• Comprehensive, automatic diagnostics and self-test.

• Selectable line monitoring per channel to detect open circuit and short circuit field wiring

faults.

• 2500V dc optical isolation barrier.

• On-board Sequence of Events (SOE) reporting with 1ms resolution.

• Module can be hot-replaced on-line using dedicated Companion (adjacent) Slot or

SmartSlot (one spare slot for many modules) configurations.

• Front panel input status LEDs for each channel indicate input status and field wiring faults.

• Front panel module status LEDs indicate module health and operational mode (Active,

Standby, Educated)

5V Certified IEC 61508 SIL 3

• T

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Issue Record

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Number Date Revised by Technical CheckAuthorised by Modification

1 J Parry

2 2/4/01 P Barnett

3 22/5/01 P Barnett

4 23/5/01 P Barnett

5 31/8/01 P Barnett

6 21/1/02 P Barnett

7 21/1/03 P Barnett

8 24/7/03 P Barnett

9 Jan 05 J Bourn G Creech R Cockman

10 May 05 J W Clark G Creech R Cockman Reformat

11 June 05 J W Clark Table 11 Rack 3 Bits

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now 0-6 & 7-14.

O/P Smart slot cable
ref removed.

12 Dec 06 V Middleton N Owens P Stock Weights & Dims

13 Nov 07 N Owens A Holgate P Stock STATE descriptions

14 Dec 08 N Owens A Holgate P Stock Channel LEDs

15 Apr 10 S. Blackett A. Holgate P. Stock Rack 7 change

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Table of Contents

1. Description......................................................................................................................................8

1.1. Field Termination Unit (FTU) ..........................................................................................................9

1.2. Field Interface Unit (FIU) ..............................................................................................................10

1.3. Host Interface Unit (HIU) ..............................................................................................................10

1.4. Front Panel Unit (FPU) .................................................................................................................11

1.5. Line Monitoring Thresholds ..........................................................................................................11

1.6. Housekeeping ..............................................................................................................................14

1.7. Fault Detection and Testing .........................................................................................................14

1.8. Sequence of Events Characteristics ............................................................................................15

2. Installation ....................................................................................................................................16

2.1. Module Insertion/Removal............................................................................................................16

2.2. Field Cable Selection....................................................................................................................16

2.3. Module Pinout Connections..........................................................................................................17

2.4. TrustedTM Module Polarisation/Keying. ........................................................................................18

3. Application ....................................................................................................................................19

3.1. Module Configuration ...................................................................................................................19

3.2. T8423 Complex Equipment Definition..........................................................................................19

3.2.1. Rack 1: DI.....................................................................................................................................20

3.2.2. Rack 2: STATE.............................................................................................................................20

3.2.3. Rack 3: AI.....................................................................................................................................21

3.2.4. Rack 4: SPARE ............................................................................................................................22

3.2.5. Rack 5: LINE_FLT........................................................................................................................22

3.2.6. Rack 6: DISCREP ........................................................................................................................22

3.2.7. Rack 7: HKEEPING......................................................................................................................23

3.2.8. Rack 8: Information ......................................................................................................................24

3.3. Sequence of Events Configuration...............................................................................................25

3.4. SYSTEM.INI File Configuration ....................................................................................................25

4. Operation......................................................................................................................................26

4.1. Front Panel ...................................................................................................................................26

4.2. Module Status LEDs.....................................................................................................................27

4.3. I/O Status LEDs............................................................................................................................27

5. Fault Finding and Maintenance ....................................................................................................29

5.1. Fault Reporting .............................................................................................................................29

5.2. Field Wiring Faults........................................................................................................................29

5.3. Module Faults ...............................................................................................................................29

5.4. Companion Slot............................................................................................................................30

5.5. SmartSlot......................................................................................................................................30

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5.6. Cold Start......................................................................................................................................30

5.7. Transfer between Active and Standby Modules...........................................................................31

6. Specifications ...............................................................................................................................32

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Figures

Figure 1 Module Architecture....................................................................................................................8

Figure 2 Functional Block Diagram ..........................................................................................................9

Figure 3 Module polarisation ..................................................................................................................18

Figure 4 Module Front Panel ..................................................................................................................26

Tab l es

Table 1 Example Threshold data (120Vdc) ............................................................................................12

Table 2 Example Threshold data (48Vdc) ..............................................................................................13

Table 3 Field Connector Pinout ..............................................................................................................17

Table 4 Complex Equipment Definition ..................................................................................................19

Table 5 OEM Parameters .......................................................................................................................20

Table 6 Rack 1: DI descriptions..............................................................................................................20

Table 7 Rack 2: STATE descriptions......................................................................................................20

Table 8 Rack 2: STATE Output bit descriptions.....................................................................................21

Table 9 Rack 3: Channel Field Voltage ..................................................................................................21

Table 10 Rack 3: Channel Field Voltage bit definitions ..........................................................................21

Table 11 Rack 5: LINE_FLT ...................................................................................................................22

Table 12 Rack 6: DISCREP bit descriptions ..........................................................................................22

Table 13 Rack 7: Housekeeping descriptions ........................................................................................23

Table 14 Rack 8: INFO Descriptions......................................................................................................24

Table 15 Rack 8: INFO bit Descriptions .................................................................................................24

Table 16 Rack 8: FCR bit Descriptions ..................................................................................................25

Table 17 Module Status Indicators .........................................................................................................27

Table 18 Default I/O status Indicators ....................................................................................................28

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Notice

The content of this document is confidential to ICS Triplex Technology Ltd. companies and their
partners. It may not be given away, lent, resold, hired out or made available to a third party for any
purpose without the written consent of ICS Triplex Technology Ltd.

This document contains proprietary information that is protected by copyright. All rights are reserved.

icrosoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered

M
trademarks of Microsoft Corporation.

The information contained in this document is subject to change without notice. The reader should, in
all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been
made. From time to time, amendments to this document will be made as necessary and will be
distributed by ICS Triplex Technology Ltd.

Information in this documentation set may be subject to change without notice and does not represent
a commitment on the part of ICS Triplex Technology Ltd.

The contents of this document, which may also include the loan of software tools, are subject to the
confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.

No part of this documentation may be reproduced or transmitted in any form or by any means,
electronic or mechanical, including photocopying and recording, for any purpose, without the express
written permission of ICS Triplex Technology Ltd.

Disclaimer

The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the
text of this manual.

The user of, and those responsible for applying this equipment, must satisfy themselves as to the
acceptability of each application and use of this equipment.

This document is based on information available at the time of its publication. While efforts have been
made to be accurate, the information contained herein does not purport to cover all details or variations
in hardware or software, nor to provide for every possible contingency in connection with installation,
operation, or maintenance. Features may be described herein which are present in all hardware or
software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this
document with respect to changes subsequently made.

ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with
respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of
the information contained herein. No warranties of merchantability or fitness for purpose shall apply.

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Revision and Updating Policy

All new and revised information pertinent to this document shall be issued by ICS Triplex Technology
Ltd. and shall be incorporated into this document in accordance with the enclosed instructions. The
change is to be recorded on the Amendment Record of this document.

Precautionary Information

WARNING

Warning notices call attention to the use of materials, processes, methods, procedures or limits which
must be followed precisely to avoid personal injury or death.

CAUTION

Caution notices call attention to methods and procedures which must be followed to avoid damage to
the equipment.

Notes:

Notes highlight procedures and contain information to assist the user in the understanding of the
information contained in this document

Warning

RADIO FREQUENCY INTERFERENCE

Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be
exercised with regard to the use of portable communications equipment around such equipment.
Signs should be posted in the vicinity of the equipment cautioning against the use of portable
communications equipment.

MAINTENANCE

Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or
damage to the system may be caused.

Caution

HANDLING

Under no circumstances should the module housing be removed.

Associated Documents

Product Descriptions (PD) provide product specific information.

The Safety Manual contains the recommended safety requirements for the safety system design.

The PD8082B – Toolset Suite provides specific guidance on system configuration and application
generation.

The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic
procedures.

For technical support email: [e-mail]

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1. Description

The TrustedTM TMR 35-120Vdc Digital Input module is a member of the TrustedTM range of

nput/Output (I/O) modules. All Trusted

I
most general level, all I/O modules interface to the Inter-Module Bus (IMB) which provides power and
allows communication with the Trusted

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T

/O modules share common functionality and form. At the

I

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TMR Processor. In addition, all modules have a field
interface that is used to connect to module specific signals in the field. All modules are Triple Modular
Redundant (TMR).

Figure 1 Module Architecture

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All Trusted

I/O modules comprise four sections: Host Interface Unit (HIU), the Field Interface Unit

(FIU), the Field Termination Unit (FTU) and the Front Panel Unit (or FPU).

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Figure 2 shows a simplified functional block diagram of the TrustedTM 120Vdc Digital input module.

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Figure 2 Functional Block Diagram

1.1. Field Termination Unit (FTU)

The Field Termination Unit (FTU) is the section of the I/O module that connects all three FIUs to a
single field interface. The FTU primarily contains passive components necessary for front-end signal
conditioning, field signal over-voltage protection, and EMI/RFI filtering. When installed in a Trusted
Controller or Expander Chassis, the FTU field connector interconnects to the I/O cable assembly
attached at the rear of the chassis.

The SmartSlot link is passed from the HIU to the field connections via the FTU. These signals go
directly to the I/O cable assembly and maintain isolation from the I/O signals on the FTU. The
SmartSlot link is the intelligent connection between active and standby modules for co-ordination
during module replacement.

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FCR Interconnect Bus between slices to vote incoming IMB data and distribute outgoing I/O

Redundant power sharing of dual 24V dc chassis supply voltage and power regulation for logic

ordination during module

board housekeeping, which monitors reference voltages, current consumption and board

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1.2. Field Interface Unit (FIU)

The Field Interface Unit (FIU) is the section of the module that contains the specific circuits necessary
to interface to the particular types of field I/O signals. Each module has three FIUs, one per slice. For
the TMR 120V dc Digital Input module, the FIU contains an individual analogue to digital (A/D)
converter for each of the 40 field inputs.

The FIU receives isolated power from the HIU for logic. The FIU provides additional power
conditioning for the operational voltages required by the FIU circuitry. An isolated serial link connects
each FIU to one of the HIU slices.

The FIU also measures a range of on-board “house-keeping” signals that assist in monitoring the
performance and operating conditions of the module. These signals include power supply voltages,
current consumption, on-board reference voltages, board temperature, and condensation.

1.3. Host Interface Unit (HIU)

The HIU is the point of access to the Inter-Module Bus (IMB) for the module. It also provides power
distribution and local programmable processing power. The HIU is the only section of the I/O module
to directly connect to the IMB backplane. The HIU is common to most Trusted
type dependent and product range common functions. Each HIU contains three independent slices,
commonly referred to as A, B, and C.

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I/O types and has

All interconnections between the three slices incorporate isolation to prevent any fault interaction
between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one
slice has no effect on the operation of the other slices.

The HIU provides the following services common to the modules in the family:

• High Speed Fault Tolerant Communications with the TMR Processor via the IMB interface.

•

module data to the IMB.

• Optically isolated serial data interface to the FIU slices.

•

power to HIU circuitry.

• Magnetically Isolated power to the FIU slices.

• Serial data interface to the FPU for module status LEDs.

• SmartSlot link between active and standby modules for co-

replacement.

• Digital Signal Processing to perform local data reduction and self-diagnostics.

• Local memory resources for storing module operation, configuration, and field I/O data.

• On-

temperature.

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