Trusted
TM
PD-T8403
TM
Trusted
TMR 24V dc Digital Input
Module – 40 Channel
Introduction
The TrustedTM TMR 24V dc Digital Input module interfaces to 40 field input devices. Fault tolerance is
achieved through a Triple Modular Redundant (TMR) architecture within the module for each of the 40
input channels.
Each field input is triplicated and the input voltage is measured using a sigma-delta input circuit. The
resulting field voltage measurement is compared to user configurable threshold voltages to determine
the reported field input state. When a line-monitoring device is installed at the field switch, the module
can detect open and short-circuit field cables. Line monitoring functions are independently configured
for each input channel. The triplicated voltage measurement, coupled with on-board diagnostic testing,
provides comprehensive fault detection and tolerance.
The module provides on-board Sequence of Events (SOE) reporting with a resolution of 1ms. A
change of state triggers an SOE entry. States are determined by voltage thresholds that can be
configured on a per channel basis.
Features
• 40 Triple Modular Redundant (TMR) input channels per module.
• Comprehensive, automatic diagnostics and self-test.
• Selectable line monitoring per channel to detect open circuit and short circuit field wiring
faults.
• 2500V dc optical isolation barrier.
• On-board Sequence of Events (SOE) reporting with 1ms resolution.
• Configurable 50/60Hz digital filtering to eliminate field induced noise.
• Module can be hot-replaced on-line using dedicated Companion (adjacent) Slot or SmartSlot
(one spare slot for many modules) configurations.
• Front panel input status LEDs for each channel indicate input status and field wiring faults.
• Front panel module status LEDs indicate module health and operational mode (Active,
Standby, Educated)
• TϋV Certified IEC61508 SIL 3
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Issue Record
Issue
Number Date Revised by Technical Check Authorised by Modification
8 Jan 05 J Bourn Gerry Creech Russell
9 May 05 J.W. Clark G Creech R Cockman Reformat
10 June 05 J.W. Clark G Creech R Cockman Reformat
11 Dec 06 V Middleton N Owens P Stock Weights & Dims
12 Nov 07 N Owens A Holgate P Stock STATE descriptions
13 Dec 08 N Owens A Holgate P Stock Channel LEDs
14 Apr 10 S. Blackett A. Holgate P. Stock Table 7 change
15 Jun 13 N Owens S.Blackett P Stock States 0 and 6 removed
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Module T8403
Cockman
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Table of Contents
1. Description ................................................................................................................................... 8
1.1. Field Termination Unit (FTU) ....................................................................................................... 9
1.2. Field Interface Unit (FIU) ............................................................................................................. 9
1.3. Host Interface Unit (HIU) ........................................................................................................... 10
1.4. Front Panel Unit (FPU) .............................................................................................................. 10
1.5. Line Monitoring Thresholds........................................................................................................ 11
1.6. Housekeeping ............................................................................................................................ 12
1.7. Fault Detection and Testing ....................................................................................................... 12
1.8. Sequence of Events Characteristics .......................................................................................... 12
2. Installation .................................................................................................................................. 13
2.1. Module Insertion/Removal ......................................................................................................... 13
2.2. Field Cable Selection ................................................................................................................. 13
2.3. Module Pinout Connections ....................................................................................................... 14
2.4. TrustedTM Module Polarisation/Keying. ...................................................................................... 15
3. Application ................................................................................................................................. 16
3.1. Module Configuration ................................................................................................................. 16
3.2. T8403 Complex Equipment Definition ....................................................................................... 16
3.2.1. Rack 1: DI .................................................................................................................................. 17
3.2.2. Rack 2: STATE .......................................................................................................................... 17
3.2.3. Rack 3: AI .................................................................................................................................. 18
3.2.4. Rack 4: SPARE.......................................................................................................................... 19
3.2.5. Rack 5: LINE_FLT ..................................................................................................................... 19
3.2.6. Rack 6: DISCREP ...................................................................................................................... 19
3.2.7. Rack 7: HKEEPING ................................................................................................................... 20
3.2.8. Rack 8: Information .................................................................................................................... 21
3.3. Sequence of Events Configuration ............................................................................................ 22
3.4. SYSTEM.INI File Configuration ................................................................................................. 22
4. Operation ................................................................................................................................... 23
4.1. Front Panel ................................................................................................................................ 23
4.2. Module Status LEDS .................................................................................................................. 24
4.3. I/O Status LEDs ......................................................................................................................... 25
5. Fault Finding and Maintenance .................................................................................................. 26
5.1. Fault Reporting .......................................................................................................................... 26
5.2. Field Wiring Faults ..................................................................................................................... 26
5.3. Module Faults ............................................................................................................................ 26
5.4. Companion Slot ......................................................................................................................... 27
5.5. SmartSlot ................................................................................................................................... 27
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5.6. Cold Start ................................................................................................................................... 27
5.7. Transfer between Active and Standby Modules ........................................................................ 28
6. Specifications ............................................................................................................................. 29
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Module T8403
Figures
Figure 1 Module Architecture ................................................................................................................... 8
Figure 2 Functional Block Diagram ......................................................................................................... 9
Figure 3 Module polarisation ................................................................................................................. 15
Figure 4 Module Front Panel ................................................................................................................. 23
Tables
Table 1 Example Threshold data ............................................................................................................ 11
Table 2 Field Connector Pinout .............................................................................................................. 14
Table 3 Complex Equipment Definition .................................................................................................. 16
Table 4 OEM Parameters ....................................................................................................................... 17
Table 5 Rack 1: DI descriptions .............................................................................................................. 17
Table 6 Rack 2: STATE descriptions...................................................................................................... 17
Table 7 Rack 2: STATE Output descriptions .......................................................................................... 18
Table 8 Rack 3: Channel Field Voltage .................................................................................................. 18
Table 9 Rack 3: Channel Field Voltage bit definitions ............................................................................ 18
Table 10 Rack 5: LINE_FLT ................................................................................................................... 19
Table 11 Rack 6: DISCREP bit descriptions .......................................................................................... 19
Table 12 Rack 7: Housekeeping ............................................................................................................ 20
Table 13 Rack 8: INFO Descriptions ...................................................................................................... 21
Table 14 Rack 8: INFO bit Descriptions ................................................................................................. 21
Table 15 Rack 8: FCR bit Descriptions .................................................................................................. 22
Table 16 Module Status LEDs ................................................................................................................ 24
Table 17 Default I/O status Indicators .................................................................................................... 25
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Notice
The content of this document is confidential to ICS Triplex Technology Ltd. companies and their
partners. It may not be given away, lent, resold, hired out or made available to a third party for any
purpose without the written consent of ICS Triplex Technology Ltd.
This document contains proprietary information that is protected by copyright. All rights are reserved.
Microsoft, Windows, Windows 95, Windows NT, Windows 2000, and Windows XP are registered
trademarks of Microsoft Corporation.
The information contained in this document is subject to change without notice. The reader should, in
all cases, consult ICS Triplex Technology Ltd. to determine whether any such changes have been
made. From time to time, amendments to this document will be made as necessary and will be
distributed by ICS Triplex Technology Ltd.
Information in this documentation set may be subject to change without notice and does not represent
a commitment on the part of ICS Triplex Technology Ltd.
The contents of this document, which may also include the loan of software tools, are subject to the
confidentiality and other clause(s) within the Integrator Agreement and Software License Agreement.
No part of this documentation may be reproduced or transmitted in any form or by any means,
electronic or mechanical, including photocopying and recording, for any purpose, without the express
written permission of ICS Triplex Technology Ltd.
Disclaimer
The illustrations, figures, charts, and layout examples in this manual are intended solely to illustrate the
text of this manual.
The user of, and those responsible for applying this equipment, must satisfy themselves as to the
acceptability of each application and use of this equipment.
This document is based on information available at the time of its publication. W hile efforts have been
made to be accurate, the information contained herein does not purport to cover all details or variations
in hardware or software, nor to provide for every possible contingency in connection with installation,
operation, or maintenance. Features may be described herein which are present in all hardware or
software systems. ICS Triplex Technology Ltd. assumes no obligation of notice to holders of this
document with respect to changes subsequently made.
ICS Triplex Technology Ltd. makes no representation or warranty, expressed, implied, or statutory with
respect to, and assumes no responsibility for the accuracy, completeness, sufficiency, or usefulness of
the information contained herein. No warranties of merchantability or fitness for purpose shall apply.
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Revision and Updating Policy
All new and revised information pertinent to this document shall be issued by ICS Triplex Technology
Ltd. and shall be incorporated into this document in accordance with the enclosed instructions. The
change is to be recorded on the Amendment Record of this document.
Precautionary Information
WARNING
Warning notices call attention to the use of materials, processes, methods, procedures or limits which
must be followed precisely to avoid personal injury or death.
CAUTION
Caution notices call attention to methods and procedures which must be followed to avoid damage to
the equipment.
Notes:
Notes highlight procedures and contain information to assist the user in the understanding of the
information contained in this document
Warning
RADIO FREQUENCY INTERFERENCE
Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be
exercised with regard to the use of portable communications equipment around such equipment.
Signs should be posted in the vicinity of the equipment cautioning against the use of portable
communications equipment.
MAINTENANCE
Maintenance must be performed only by qualified personnel, otherwise personal injury or death, or
damage to the system may be caused.
Caution
HANDLING
Under no circumstances should the module housing be removed.
Associated Documents
Product Descriptions (PD) provide product specific information.
The Safety Manual contains the recommended safety requirements for the safety system design.
The PD8082B – Toolset Suite provides specific guidance on system configuration and application
generation.
The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic
procedures.
For technical support email: support@icstriplex.com
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1. Description
The TrustedTM TMR 24V dc Digital Input module is a member of the TrustedTM range of Input/Output
(I/O) modules. All TrustedTM I/O modules share common functionality and form. At the most general
level, all I/O modules interface to the Inter-Module Bus (IMB) which provides power and allows
communication with the TrustedTM TMR Processor. In addition, all modules have a field interface that
is used to connect to module specific signals in the field. All modules are Triple Modular Redundant
(TMR).
Figure 1 Module Architecture
All TrustedTM I/O modules comprise four sections: Host Interface Unit (HIU), the Field Interface Unit
(FIU), the Field Termination Unit (FTU) and the Front Panel Unit (or FPU).
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Figure 2 shows a simplified functional block diagram of the TrustedTM 24V dc Digital Input module.
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Module T8403
Figure 2 Functional Block Diagram
1.1. Field Termination Unit (FTU)
The Field Termination Unit (FTU) is the section of the I/O module that connects all three FIUs to a
single field device. The FTU primarily contains passive components necessary for front-end signal
conditioning, field signal over-voltage protection, and EMI/RFI filtering. W hen installed in a TrustedTM
Controller or Expander Chassis, the FTU field connector interconnects to the I/O cable assembly
attached at the rear of the chassis.
The SmartSlot link is passed from the HIU to the field connections via the FTU. These signals go
directly to the I/O cable assembly and maintain isolation from the I/O signals on the FTU. The
SmartSlot link is the intelligent connection between active and standby modules for co-ordination
during module replacement.
1.2. Field Interface Unit (FIU)
The Field Interface Unit (FIU) is the section of the module that contains the specific circuits necessary
to interface to the particular types of field I/O signals. Each module has three FIUs, one per slice. For
the TMR 24V dc Digital Input module, the FIU contains an individual analogue to digital (A/D) converter
for each of the 40 field inputs.
The FIU receives isolated power from the HIU for logic. The FIU provides additional power
conditioning for the operational voltages required by the FIU circuitry. An isolated 6.25Mbit/sec serial
link connects each FIU to one of the HIU slices.
The FIU also measures a range of on-board “house-keeping” signals that assist in monitoring the
performance and operating conditions of the module. These signals include power supply voltages,
current consumption, on-board reference voltages, board temperature, and condensation.
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s between slices to vote incoming IMB data and distribute outgoing I/O
Redundant power sharing of dual 24V dc chassis supply voltage and power regulation for logic
ordination during module
board housekeeping, which monitors reference voltages, current consumption and board
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Module T8403
1.3. Host Interface Unit (HIU)
The HIU is the point of access to the Inter-Module Bus (IMB) for the module. It also provides power
distribution and local programmable processing power. The HIU is the only section of the I/O module
to directly connect to the IMB backplane. The HIU is common to most TrustedTM I/O types and has
type dependent and product range common functions. Each HIU contains three independent slices,
commonly referred to as A, B, and C.
All interconnections between the three slices incorporate isolation to prevent any fault interaction
between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one
slice has no effect on the operation of the other slices.
The HIU provides the following services common to the modules in the family:
• High Speed Fault Tolerant Communications with the TMR Processor via the IMB interface.
• FCR Interconnect Bu
module data to the IMB.
• Optically isolated serial data interface to the FIU slices.
•
power to HIU circuitry.
• Magnetically Isolated power to the FIU slices.
• Serial data interface to the FPU for module status LEDs.
• SmartSlot link between active and standby modules for co-
replacement.
• Digital Signal Processing to perform local data reduction and self-diagnostics.
• Local memory resources for storing module operation, configuration, and field I/O data.
• On-
temperature.
1.4. Front Panel Unit (FPU)
The Front Panel Unit (FPU) comprises a Front Panel Termination Unit (FPTU) and a Front Panel
Display Unit (FPDU). The overall FPU contains the necessary connectors, switches, logic, and LED
indicators for the front panel. For every type of TrustedTM I/O module, the FPU contains the Slice
Healthy, Active/Standby and Educated indicators (LEDs), and the module removal switches.
Additional bicolour LEDs provide status indication for the individual I/O signals. Serial data interfaces
connect the FPU to each of the HIU slices to control the LED status indicators and monitor the module
removal switches.
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1.5. Line Monitoring Thresholds
The module determines the contact state and line fault status by comparing the input voltage level to
four user programmed thresholds and two fixed (minimum and maximum) thresholds. A “Contact
Indeterminate” region is defined between the contact Closed and Open states to account for marginal
faults in the external wiring or in the IFIU. Hysteresis is provided on the thresholds by up-scale and
downscale values, corresponding to the thresholds for increasing and decreasing values respectively.
Typical
voltage
threshold
values
Over-range 7 0 1
Tmax 36.00
T8 22.00
T7 21.00
T6 12.75
T5 12.25
T4 11.75
T3 11.25
T2 3.00
T1 2.00
Tmin -8.00
Short Circuit 5
Contact Closed 4 ‘1’ 0
3 or 4 0/1 0/1
Contact Indeterminate 3 0 1
2 or 3 0
Contact Open 2
1 or 2 0/1
Open Circuit 1 1
Under-range 7
Input
Channel
State
4 or 51
DI
Status
Line
Fault
Status
0/1 0/1
Table 1 Example Threshold data
When a module is inserted into the standby slot in a line-monitored application, then the field
terminations for all the input channels are paralleled, resulting in a drop in the input voltages for the
active module. Therefore the recommended components for line monitoring are zener diodes, one in
parallel with the field switch which is across the supply and signal, the other in series with the signal.
1
The channel state value returned is dependent on the previous state value. If the input level is
increasing then the lower state value will be returned. If the input level is decreasing the higher state
value will be returned.
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The module biases each input channel by means of a 5kΩ (typical for 24V dc digital inputs) termination
resistor to the 0V reference of the module input circuitry. In the absence of any line fault, the zener
diodes used for line monitoring purposes form a voltage divider with this termination resistor in the
module. Typically, the values are chosen so that the open contact voltage at the input terminal is about
1
/3 of the field supply; with the user contact closed the voltage is about 2/3 of the field supply, illustrated
in the previous threshold table, default threshold values used for non line monitored inputs are as
follows (in raw units)
Default = -4096, -2305, -1971, 3046, 3072, 7168, 8192, 14848, 15872, 19456
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1.6. Housekeeping
The input module automatically performs local measurements of several on-board signals that can be
used for detailed fault finding and verification of module operating characteristics. Measurements are
made within each slice’s HIU and FIU.
1.7. Fault Detection and Testing
From the IMB to the field connector, the input module contains extensive fault detection and integrity
testing. As an input device, all testing is performed in a non-interfering mode. Data input from the IMB
is stored in redundant error-correcting RAM on each slice portion of the HIU. Received data is voted
on by each slice. All data transmissions include a confirmation response from the receiver.
Between the HIU and FIU, there are a series of optically isolated links for data and power. The data
link is synchronised and monitored for variance. Both the FIU and HIU have onboard temperature
sensors to characterise temperature-related problems. Each FIU is also fitted with a condensation
sensor.
The power supplies for both the HIU and FIU boards are redundant, fully instrumented and testable.
Together, these assemblies form a Power Integrity Sub System.
The module field input is connected to a single bit ADC known as the Σ∆ input circuit. These circuits,
one per channel on each slice, produce a digital output which naturally transitions between on and off.
Any failure in the circuit causes the output to saturate to stuck-on or stuck-off which is automatically
detected. As the conversion process is dynamic and not gated like traditional ADCs, failures are
rapidly diagnosed and located.
By using the Σ∆ circuit, the analogue path in the module is short and does not involve many
components. This results in analogue failures being contained to a single channel on a single slice
instead of causing a group of eight or more inputs to fail.
1.8. Sequence of Events Characteristics
The input module automatically measures the field-input voltage, compares the value to the
configurable thresholds, and determines the state of the field input. An event occurs when the input
transitions from one state to another. When an input changes state, the on-board real-time clock value
is recorded. When the TMR Processor next reads data from the input module, the input state and realtime clock values are retrieved. The TMR Processor uses this data to log the input state change into
the system Sequence of Events (SOE) log. The user may configure each input to be included in the
system SOE log. Full details of SOE are contained in PD-8013 – TrustedTM SOE And Process
Historian.
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2. Installation
2.1. Module Insertion/Removal
CAUTION:
The module contains static sensitive parts. Static handling precautions must be observed. Specifically
ensure that exposed connector pins are not touched. Under no circumstances should the module
housing be removed.
Before installation, visually inspect the module for damage. Ensure that the module housing appears
undamaged and inspect the I/O connector at the back of the module for bent pins. If the module
appears damaged or any pins are bent, do not install the module. Do not try to straighten bent pins.
Return the module for replacement.
Ensure that the module is of the correct type.
Record the module type, revision and serial number of the module before installation.
To install the module:
1. Ensure that the field cable assembly is installed and correctly located.
2. Release the ejector tabs on the module using the release key. Ensure that the ejector tabs
are fully open.
3. Holding the ejectors, carefully insert the module into the intended slot.
4. Push the module fully home by pressing on the top and bottom of the module fascia.
5. Close the module ejectors, ensuring that they click into their locked position.
The module should mount into the chassis with a minimum of resistance. If the module does not
mount easily, do not force it. Remove the module and check it for bent or damaged pins. If the pins
have not been damaged, try reinstalling the module.
2.2. Field Cable Selection
I/O cables suitable for use with the TrustedTM TMR 24V dc Digital Input Module are detailed in the
following Product Descriptions.
1. PD-TC200 – TrustedTM I/O Companion Slot Cables
2. PD-TC500 – TrustedTM I/O SmartSlot Cables
The Product Descriptions detailed above also detail the types of Field Termination Assembly (FTA) or
Versatile Field termination Assembly (VFTA) which may be used with type of module.
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2.3. Module Pinout Connections
1 Smart Slot Link C Smart Slot Link B Smart Slot Link A
2
3 Chan 28 (+) Chan 14 (+) Chan 0 (+)
4 Chan 28 (+) Chan 14 (+) Chan 0 (+)
5 Chan 29 (+) Chan 15 (+) Chan 1 (+)
6 Chan 29 (+) Chan 15 (+) Chan 1 (+)
7 Chan 30 (+) Chan 16 (+) Chan 2 (+)
8 Chan 30(+) Chan 16 (+) Chan 2 (+)
9 Return Return Return
10 Chan 31 (+) Chan 17 (+) Chan 3 (+)
11 Chan 31 (+) Chan 17 (+) Chan 3 (+)
12 Chan 32 (+) Chan 18 (+) Chan 4 (+)
13 Chan 32 (+) Chan 18 (+) Chan 4 (+)
14 Chan 33 (+) Chan 19 (+) Chan 5 (+)
15 Chan 33 (+) Chan 19 (+) Chan 5 (+)
16 Chan 34 (+) Chan 20 (+) Chan 6 (+)
17 Chan 34 (+) Chan 20 (+) Chan 6 (+)
18 Chan 35 (+) Chan 21 (+) Chan 7 (+)
19 Chan 35 (+) Chan 21 (+) Chan 7 (+)
20 Return Return Return
21 Chan 36 (+) Chan 22 (+) Chan 8 (+)
22 Chan 36 (+) Chan 22 (+) Chan 8 (+)
23 Chan 37 (+) Chan 23 (+) Chan 9 (+)
24 Chan 37 (+) Chan 23 (+) Chan 9 (+)
25 Chan 38 (+) Chan 24 (+) Chan 10 (+)
26 Chan 38 (+) Chan 24 (+) Chan 10 (+)
27 Chan 39 (+) Chan 25 (+) Chan 11 (+)
28 Chan 39 (+) Chan 25 (+) Chan 11 (+)
29 Chan 40 (+) Chan 26 (+) Chan 12 (+)
30 Chan 40 (+) Chan 26 (+) Chan 12 (+)
31 Chan 41 (+) Chan 27 (+) Chan 13 (+)
32 Chan 41 (+) Chan 27 (+) Chan 13 (+)
C B A
Table 2 Field Connector Pinout
Note: The letters appended to the channel numbers indicate the destination slice on the module for
the incoming signal from the field.
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1
12
Cable Exit
Release button
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Module T8403
2.4. TrustedTM Module Polarisation/Keying.
All TrustedTM Modules have been Keyed to prevent insertion into the wrong position within a chassis.
The polarisation comprises two parts. The module and the associated field cable.
Each module type has been keyed during manufacture. The organisation responsible for the
integration of the TrustedTM system must key the cable by removing the keying pieces from the cable
so that they correspond with the bungs fitted to the associated module prior to fitting.
Polarising/Keying
Pins.
(Remove using
side cutters
where identified
below)
Trusted Cable
hood
Smart
Swap
Connect
or if
Fitted
Figure 3 Module polarisation
For Cables with Companion slot installations both keying strips must be polarised.
For This Module (T8403) remove keying pins 1,3,5
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3. Application
3.1. Module Configuration
There is no configuration required to the physical input module. All configurable characteristics of the
module are performed using tools on the EWS and become part of the application or system.ini file
that is loaded into the TMR Processor. The TMR Processor automatically configures the input module
after applications are downloaded and during Active/Standby changeover.
The IEC1131 TOOLSET provides the main interface to configure the input module. Details of the
configuration tools and configuration sequence are provided in PD-8082B. There are three procedures
necessary to configure the input module. These are:
1. Define the necessary I/O variables for the field input data and module status data using the
Dictionary Editor of the IEC1131 TOOLSET.
2. Create an I/O module definition in the I/O Connection Editor for each I/O module. The I/O
module definition defines physical information, e.g. Chassis and Slot location, and allows
variables to be connected to the I/O channels of the module.
3. Using the TrustedTM System Configuration Manager, define custom LED indicator modes,
per-channel threshold levels and noise filtering, and other module settings.
3.2. T8403 Complex Equipment Definition
The T8403 I/O Complex Equipment Definition includes 8 I/O boards, referenced numerically by Rack
number:
Rack I/O Board Description Data Type Direction No. of
Channels
1 DI
2 STATE Field Input State Integer In 40
3 AI Input voltage Integer In 40
4 SPARE Not used Integer - 16
5 LINE_FLT Line Fault Status Boolean In 40
6 DISCREP Channel Discrepancy Integer In 3
7 HKEEPING Housekeeping Registers Integer In 51
8 INFO I/O Module Information Integer In 11
There are two OEM parameters included in the first rack (DI Board). These OEM parameters define
the primary module position; declaring the module’s chassis and slot location. There is no need to
define the secondary module position within the IEC1131 TOOLSET. Where systems may be required
to start-up with a module in the secondary position as the active module, e.g. primary module is not
installed when application is started, the secondary module’s position should be declared in the module
definition of the System Configuration Manager.
OEM Parameters - - -
Field Input Status Boolean In 40
Table 3 Complex Equipment Definition
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OEM Parameter Description Notes
TICS_CHASSIS The number of the
TICS_SLOT The slot number in the
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Module T8403
TrustedTM Chassis where
the primary I/O module is
installed
chassis where the primary
I/O module is installed
The TrustedTM Controller Chassis is 1, and
TrustedTM Expander Chassis are 2 to 15
The I/O module slots in the TrustedTM Controller
chassis are numbered from 1 to 8. The I/O
Module slots in the TrustedTM Expander Chassis
are numbered from 1 to 12
Table 4 OEM Parameters
3.2.1. Rack 1: DI
This board provides the logical input state for each of the field inputs.
Channel Description
1 Field input channel 1 logical state
2 Field input channel 2 logical state
40 Field input channel 40 logical state
Table 5 Rack 1: DI descriptions
The input state is reported as true (logic ‘1’) for a closed contact input, and false (logic ‘0’) for an open
contact input. The logic state is the majority voted value.
3.2.2. Rack 2: STATE
This board provides the majority voted numerical input state. This input channel state indicates the
threshold band within which the input voltage lies.
Channel Description
1 Field input channel 1 state
2 Field input channel 2 state
40 Field input channel 40 state
Table 6 Rack 2: STATE descriptions
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Value Description
7 Unknown
5 Short circuit
4 Closed contact
3 Indeterminate
2 Open contact
1 Open circuit
Table 7 Rack 2: STATE Output descriptions
The input channel has a value 7 (Unknown) when:
1. The input channel cannot be correctly measured by two or more slices of the TMR input
module.
2. The TMR Processor detects a 2oo3 channel discrepancy between the three slices of the
TMR input module.
3. The module is simulated (not installed or the TMR Processor cannot communicate with 2oo3
slices of the module).
3.2.3. Rack 3: AI
The AI board returns the field loop voltage at the input.
Channel Description
1 Field input channel 1 voltage
2 Field input channel 2 voltage
40 Field input channel 40 voltage
Table 8 Rack 3: Channel Field Voltage
The voltage is the median value taken from the triplicated module. The voltage level is reported as an
integer, with the units being 1/
V. This may be used directly, scaled arithmetically or scaled using the
512
IEC1131 TOOLSET conversion tables.
When used directly the value may be considered as a signed, fixed-point binary value, i.e.:
Bit
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Sign Integer Fractional
Table 9 Rack 3: Channel Field Voltage bit definitions
To scale the value arithmetically, simply divide the input value by 512 to return the voltage as either a
REAL or INTEGER as required.
The IEC1131 TOOLSET conversion tables may be used to convert the input value to engineering
units, in this case voltage. The full-scale range for this number format is decimal ±64, corresponding
to physical range –32768 to +32767. Other units may be chosen depending on the numeric resolution
and span of the desired result.
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When the TMR Processor detects a 2oo3 channel fault or discrepancy, or if the input module is
simulated, the input voltage numeric value is reported as –2048.
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Module T8403
3.2.4. Rack 4: SPARE
This rack is reserved for future used and is included to promote consistency with other TrustedTM I/O
modules.
3.2.5. Rack 5: LINE_FLT
Channel Description
1 Field input channel 1 line fault
2 Field input channel 2 line fault
40 Field input channel 40 line fault
Table 10 Rack 5: LINE_FLT
The line fault input is reported as true (logic ‘1’) for a line fault condition (open circuit, indeterminate, or
short circuit condition). The logic state is the majority voted value.
When the TMR Processor detects a 2oo3 channel fault or discrepancy, or if the input module is
simulated, the line fault input is set to True.
3.2.6. Rack 6: DISCREP
Channel Description
1 Discrepancy status inputs 1 to 16 (input 1 is LSB, bit 0)
2 Discrepancy status inputs 17 to 32 (input 17 is LSB, bit 0)
3 Discrepancy status inputs 33 to 40 (input 33 is LSB, bit 0)
Table 11 Rack 6: DISCREP bit descriptions
Each of the integers reports the discrepancy status of 16 input channels. The corresponding bit within
the integer is set to ‘1’ when a discrepancy condition is detected on that input channel’s input state
(rack 2). For example, if slice B of the input module reports the state of channel 4 as state 5, while
slices A and C report channel 4 as state 2, then Slice B has a channel discrepancy for channel 4. In
this case, bit 3 of channel 1 on the Discrepancy board would be set to ‘1’.
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1 A
2 B
3 C
4 A
5 B
6 C
7 A
8 B
9 C
10 A
11 B
12 C
13 A
14 B
15 C
16 A
17 B
18 C
19 A
20 B
21 C
22 A
23 B
24 C
25 A
26 B
27 C
28 A
29 B
30 C
31 A
32 B
33 C
34 A
35 B
36 C
37 A
38 B
39 C
40 A
41 B
42 C
43 A
44 B
45 C
46 A
47 B
48 C
49 A
50 B
51 C
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Module T8403
3.2.7. Rack 7: HKEEPING
Channel
Description
FCR Units (Full Scale Range)
Internal supply voltage (post regulator) -32768 32767 mV
Internal supply current (post regulator) -32768 32767 mA
24V2 Input Voltage -32768 32767 mV
Input voltage (post isolation) -32768 32767 mV
24V1 Input Voltage -32768 32767 mV
(Note: Temperature, ºC = input value / 256)
HIU Board Temperature
Front Panel Load Current -32768 32767 mA
SmartSlot Link Voltage -32768 32767 mV
Reserved for FIU condensation sensor 0 0 -
FIU Internal Supply Voltage -32768 32767 mV
FIU Internal Supply Current -32768 32767 mA
FIU Unregulated input voltage -32768 32767 mV
FIU Board Temperature
(Note: Temperature, ºC = input value / 256)
FIU Reference Voltage, DAC_X1 -32768 32767 mV
-32768 32767 -
-32768 32767 -
FIU Reference Voltage, DAC_X2 -32768 32767 mV
FIU Reference Voltage, DAC_X3 -32768 32767 mV
Diagnostic error code
Table 12 Rack 7: Housekeeping
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Each input within the housekeeping rack is reported as an integer. In general, the application engineer
will not normally require these inputs. They are provided to aid fault finding and diagnosis and are
often used for reporting and display purposes. If a slice is Fatal, then all reported housekeeping inputs
are set to zero.
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Module T8403
3.2.8. Rack 8: Information
Channel Description
1 Active module chassis number
2 Active module slot number
3 Active module healthy
4 Active module state
5 Standby module chassis number
6 Standby module slot number
7 Standby module healthy
8 Standby module state
9 Fault Containment Region (FCR) status
10 Primary module is active
11 Active module is simulated
Table 13 Rack 8: INFO Descriptions
The active module chassis and slot numbers indicate the position of the currently active module.
These values will change to match the primary or secondary module position, depending on their active
status, i.e. active/standby changeover will “swap” the values for the active module chassis and slot
number channels with those in the standby module chassis and slot number channels.
The active and standby module healthy channel is returned as an integer. A value of 0 indicates that a
fault has been detected, a value of ‘1’ indicates that the module is healthy.
The active and standby module state is an integer indicating the current operating mode of the
associated module. The value indicates the current internal operating mode of the module.
Value Module State
5 Shutdown
4 Maintain
3 Active
2 Standby
1 Configuration
0 Unknown, no module present, or module is Fatal
Table 14 Rack 8: INFO bit Descriptions
The FCR status channel reports the fault status of each slice of the active and standby modules. The
value is bit-packed as shown below, the least significant byte is used with the most significant 8-bits set
to zero:
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The ‘Primary Module is active’ channel is set to non-zero if the primary module is the current active
module, i.e. the active module is in the chassis and slot numbers defined within the OEM parameters.
The ‘Active Module is simulated’ channel is set to ‘1’ if the active module is being simulated, this will
only be set if the module is not present or non-operational and the simulation enable has been set
within the module’s configuration in the System.INI file.
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Module T8403
Bit
7 6 5 4 3 2 1 0
Standby Module Active Module
Ejector
open
FCR C
Healthy
FCR B
Healthy
Table 15 Rack 8: FCR bit Descriptions
FCR A
Healthy
Ejectors
open
FCR C
Healthy
FCR B
Healthy
FCR A
Healthy
3.3. Sequence of Events Configuration
Each Boolean Input Variable can be configured for automatic Sequence of Events (SOE) logging. This
applies to the Input Status and Line Fault Status variables. A Boolean variable is configured for SOE
during the variable definition in the Data Dictionary Editor. To select SOE, press the Extended Button
in the Boolean Variable Definition Dialog Box to open the Extended Definition Dialog. Then check the
box for Sequence of Events to enable the variable for automatic SOE logging.
During operation, the input module automatically reports time-stamped change of state information for
the input data. The TMR Processor automatically logs change of state for configured SOE variables
into the system SOE Log. The SOE Log can be monitored and retrieved using the SOE and Process
Historian Package running on the EWS. This software package is described PD-8013.
3.4. SYSTEM.INI File Configuration
There are many operating characteristics of the input module that can be customised for a particular
application. The System Configuration Manager is a tool that allows the user to configure the specific
operating characteristics for each module. Descriptions of the items that may be configured for the
TrustedTM 24V dc Digital Input Module T8403 are contained in PD-8082B.
Certain characteristics apply to the entire module and are considered Module Configurable Items.
Other characteristics apply to individual input channels and are considered Channel Configurable
Items. There are specific default settings for each of the configurable items. If the default settings are
appropriate for a given application, then customization of the module definition in the System
Configuration Manager is not required.
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Module
Status
Module
Latch
Input
Status
Indicators
Module
Latch
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Module T8403
4. Operation
4.1. Front Panel
Status LEDs on the front of the module provide visual indications of the module’s operational status
and field input status. Each LED is a tri-colour LED of which for normal operation, only two colours are
used; red and green. Located at the top and bottom of each module is an ejector lever that is used to
remove the module from the chassis. Limit switches detect the open/closed position of the ejector
levers. The ejector levers are normally latched closed when the module is firmly seated into the
Controller or Expander Chassis.
Indicators
Figure 4 Module Front Panel
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4.2. Module Status LEDS
There are six module status LEDs on the module front panel; three Healthy, one Active, one Standby,
and one Educated. The Healthy indicators are controlled directly by each module slice. The Active,
Standby, and Educated indicators are controlled by the FPU. The FPU receives data from each of the
module slices. The FPU performs a 2-oo-3 vote on each data bit from the slices and sets the
indicators accordingly.
The module status LED states and their meanings are described as follows:
LED STATE DESCRIPTION
Healthy Off No power applied to the module.
Amber Slice is in the start-up state (momentary after
installation or power-up).
Green Slice is healthy.
Red – flashing Fault present on the associated slice but the slice is
still operational, or one 24V feed to the chassis has
failed
Red (momentary) On installation – power applied to the associated
slice.
Red The associated slice is in the fatal state. A critical
fault has been detected and the slice disabled..
Active Off Module is not in the Active state.
Green Module is in the Active (or Maintain) state.
Red – flashing Module is in the shutdown state if the Standby LED is
off.
Red – flashing Module is in the fatal state if the Standby LED is also
flashing.
Standby Off Module is not in the Standby state.
Green Module is in the Standby state.
Red – flashing Module is in the fatal state. The Active LED will also
be flashing red.
Educated Off Module is not educated.
Green Module is educated.
Green – flashing
Amber - Flashing Active/standby changeover in progress
Module is recognised by the Processor but education
is not complete.
Table 16 Module Status LEDs
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4.3. I/O Status LEDs
There are 40 input channel status LEDs on the module front panel, one for each field input. These
indicators are controlled by the FPU. The FPU receives data from each of the module slices. The
FPU performs a 2-oo-3 vote on each data bit from the slices and sets the indicators accordingly.
The input status LED mode is dependent upon the voltage level of the field I/O signal. Each field input
voltage is measured and compared to six threshold levels (four configurable and two fixed) which
produce seven threshold bands. Each threshold band can be defined to have a particular indicator
mode: off, green, red, flashing green, or flashing red.
The configurable voltage thresholds and LED modes allow users to customise the input measurement
and status indications to suit individual application requirements. Without customisation, the default
indicator modes are suitable for digital inputs without line monitoring as described below:
Indicator State Description
Off Open field switch (contact) or open circuit or indeterminate
between open and closed (states 1,2,3).
Green Closed field contact (contact) or short circuit (states 4,5).
Red – flashing Channel Fault (state 7).
Table 17 Default I/O status Indicators
Note: The LEDs indicating channel status may be configured to suit user requirements by
implementing the procedure for configuring the System.INI file detailed in PD-8082B.
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5. Fault Finding and Maintenance
5.1. Fault Reporting
Input module faults are reported to the user through visual indicators (LEDs) on the front panel of the
module. Faults are also reported via status variables which may be automatically monitored in the
application programs, and external system communications interfaces. There are generally two types
of faults that must be remedied by the user; external wiring and module faults. External wiring faults
require corrective action in the field to repair the fault condition. Module faults require replacement of
the input module.
5.2. Field Wiring Faults
The input circuits of the module may be used to detect field wiring faults in addition to alarm states. To
achieve this, line monitoring components must be fitted to the field device.
By comparing the input signal from the field with pre-configured alarm thresholds, the module can
automatically detect field-wiring faults. When a field signal fails open or short-circuit, or to an
intermediate value, the input channel status LED will flash red (default setting). The corresponding
input state will be reported and the line fault status for that channel will be set to ‘1’. All other input
channels will be unaffected, except in the case of common cause wiring faults in the field.
Once the field-wiring fault has been identified and corrected, the input status and the input status LED
will display the normal on/off status of the field device and field wiring.
5.3. Module Faults
Extensive diagnostics provide the automatic detection of module faults. The TMR architecture of the
input module and the diagnostics performed ensure the validity of all critical circuits. Using the TMR
architecture provides a fault tolerant method to withstand the first fault occurrence on the module and
continue normal input measurements without interruption in the system or process. Faults are
reported to the user through the Healthy status LEDs on the front panel of the module and through the
INFO and HKEEPING variables. Under normal operations all three Healthy LEDs are green. When a
fault occurs, one of the Healthy LEDs will flash red. It is recommended that this condition is
investigated and if the fault is within the module, it should be replaced.
Module replacement activities depend on the type of spare module configuration chosen when the
system was configured and installed. The module may be configured with a dedicated Companion Slot
or with a SmartSlot for a spare replacement module.
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Module T8403
5.4. Companion Slot
For a Companion Slot configuration, two adjacent slots in a TrustedTM Chassis are configured for the
same input module function. One slot is the primary slot and the other a unique secondary (or spare)
slot. The two slots are joined at the rear of the TrustedTM Chassis with a double-wide I/O Interface
Cable that connects both slots to common field wiring terminations. During normal operations, the
primary slot contains the active module as indicated by the Active indicator on the front panel of the
module. The secondary slot is available for a spare module that will normally be the standby module
as indicated by the Standby indicator on the front panel of the module.
Depending on the installation, a hot-spare module may already be installed, or a module blank will be
installed in the standby slot. If a hot-spare module is already installed, transfer to the standby module
occurs automatically when a module fault is detected in the active module. If a hot spare is not
installed, the system continues operating from the active module until a spare module is installed.
5.5. SmartSlot
For a SmartSlot configuration, the secondary slot is not unique to each primary slot. Instead, a single
secondary slot is shared among many primary slots. This technique provides the highest density of
modules to be fitted in a given physical space. At the rear of the TrustedTM Chassis, a single-wide input
jumper Cable connects the secondary slot directly to the I/O Cable connected to the failed primary
module. With a spare module installed in the SmartSlot and the SmartSlot I/O Cable connected to the
failed primary module, the SmartSlot can be used to replace the failed primary module.
Input module Smart Slot jumper cable TC-306-02
Smart Slot between chassis can be performed if the chassis are version 2 (or higher). These have the
connector fitted to enable connection of a TC-006 that ensures the 0 Volt of each chassis is at the
same potential.
5.6. Cold Start
If an I/O module has shut down (due, for example, to two existing faults), the three Healthy LEDs will
be red, the Active and Standby LEDs will be flashing red and the Educated LED will be flashing amber.
The I/O functions provided by this module will have been lost if a hot swap partner has not taken over
control. The module can only be restarted by removing it from its slot and re-inserting it.
If an I/O module is inserted into a functional system slot which previously had no active module (e.g.
removing and reinserting as above), then the processor will educate the module once it has booted.
Once educated, the Educated LED will be steady green and the Active LED will be red flashing.
Input modules will now be reading and reporting their inputs. Output modules have not yet energised
their outputs. To activate outputs and to set the module’s Active LED and the processor’s System
Healthy LED steady green, press the processor Reset pushbutton.
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The user must define the primary, and optionally the secondary, I/O module location for each I/O
module pair. Each primary module location must be unique and is defined as part of the
. Secondary module locations can
be unique or shared between multiple secondary modules and are defined within the module’s
section within the System.INI file. The system will automatically determine the secondary
up, if the primary module is installed, it will become the active module by default.
If the secondary module has been defined within the System.INI file and no primary module is
module location is unique, the secondary module will become the
active module by default. If the secondary module is installed with no primary module present,
and the secondary module location is not unique (as in a SmartSlot configuration), then NO
In order for a module to become the active module, the TMR Processor will verify that the
module is the correct I/O module type and that both Module Removal switches are closed. At
When a fault occurs on the active module, the TMR Processor will be informed. Once it
An active/standby changeover starts with the TMR Processor checking to see if a standby I/O
module is installed. If no standby I/O module is available, the TMR Processor will continue to
e to check for an available standby I/O module. Once a
standby module is found, the TMR Processor will verify that the I/O module is of the correct type,
that both Module Removal switches are closed, and that the I/O module is a part of the correct
pair by using the SmartSlot link. At this point, the TMR Processor will configure the
standby I/O module with the same configuration information as the currently active I/O module
e is then placed in
the maintain state (which suspends field loop testing), and any module specific changeover data
is transferred. The educated light flashes amber before the active/standby changeover takes
er data (COD). The previous standby module
then becomes the active module and the original module becomes standby. If the currently
tests, the TMR Processor will revert it to
When both Module Removal switches are opened on an active module, regardless of the
module fault status, the TMR Processor will treat it as a request to perform an active/standby
TM
Module T8403
5.7. Transfer between Active and Standby Modules
The TMR Processor is responsible for managing a pair of I/O modules through an active/standby
changeover. The following rules apply to active/standby changeovers, though the TMR Processor and
not the I/O module enforce them:
•
complex equipment definition within the IEC1131 TOOLSET
module position if the primary module is installed and is operable.
• On initial start-
present, and if the secondary
module for that module pair will become active.
•
this point the I/O module is configured and eventually placed in the active state.
• A module in the active state should never be removed.
•
becomes aware of the fault, the TMR Processor will attempt an active/standby changeover.
•
utilise the active module and will continu
module
and place the standby I/O module into the standby state. The active modul
place, to indicate transfer of dynamic change ov
active module does not successfully complete the selfthe standby state, and the module in the maintain state will revert back to the active state.
•
changeover.
Under normal conditions, an active/standby changeover will only occur if the new active module is
fault-free. Under some circumstances, it is desirable to be able to force a changeover to a known
faulted module. This can be accomplished by opening the Module Removal switches on the currently
active module and pressing the push-button reset on the TMR Processor. This will force the
changeover to proceed even if the new active module is not fault free.
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Module T8403
6. Specifications
System Supply Voltage Range 20 to 32V dc
Number of Inputs 40 Channels
Input Voltage
Measurement Range ±40V dc
Maximum Withstanding ±50V dc
Input voltage monitor absolute accuracy 0.5V dc Full Scale
Sample Update Time 0.5ms
Turn-on/off Voltage Configurable
Circuit Type Fault tolerant, fully triplicated
Fusing None, external if required
Intrinsic Safety External barrier
Sequence of Events
Event Resolution
Time-stamp Accuracy
Field Common Isolation
Sustained Working
Maximum Withstanding
Channel to Channel Crosstalk -40 to –60 dB
Power Consumption 15 – 18W
External Power
Expected current consumption @ 24V dc
Input Impedance 5K ohm
Self-Test Interval 2 minutes
Operating Temperature
Non-operating Temperature
Temperature change 0.5ºC/min
Operating Humidity 5 – 95% RH non-condensing
Environmental Specification Refer to Document 552517
Dimensions
Height
Width
Depth
Weight 1.18kg (2.6lbs)
Real Time Clock Resolution
with optional line monitoring
1ms
±0.5 ms
±250V dc
±2.5kV dc
4.8mA per channel
-5°C to 60°C (23°F to 140°F)
-25°C to 70°C (-13°F to 158°F)
266mm (10.5ins)
31mm (1.2ins)
303mm (12ins)
100µSec
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