Rockwell Automation T8300 User Manual
SDS-8300
TM
Trusted
Industrial Control System
TrustedTM Expander Chassis-T8300
FRONT PANEL
DESCRIPTION
The Trusted
houses the Trusted
Processor(s) and up to twelve I/O
modules from the High Integrity
(T84XX) range.
The chassis consists of a
backplane, power connection
terminals, and the Inter-Module
Bus connectors. The chassis is
6U (10.5ins) high and is either
front mounted in a 483mm (19inch) fixed frame or swingframe,
or can be panel (rear) mounted in
a suitable electrical enclosure.
The two slot positions on the left
(as viewed from the front) are for
installing the Trusted
Processors. The twelve
remaining slots are for installing
I/O modules. Each module plugs
into the chassis backplane,
connecting to the triplicated InterModule Bus. Double and single
connector options are available.
TM
Expander Chassis
TM
Expander
TM
Expander
The backplane is part of the
Trusted
provides electrical interconnection
and other services for the
modules. A triplicated 4-position
DIP switch is provided for user
configuration of the system
identification..
Power connection to the
Trusted
provided via a 4-pole connector
on the chassis backplate. The
Trusted
designed for a nominal dual +24V
dc power supply.
TM
Expander Chassis and
TM
Expander Chassis is
TM
Expander Chassis is
FEATURES
Up to two TrustedTM
Expander Processors
supported per Trusted
Expander Chassis
TM
Up to twelve High Integrity
I/O modules supported per
Trusted
Chassis
TM
Expander
Dual redundant power
supplies from the Trusted
High Integrity Power Supply
Unit
Module slot keying
Triplicated Inter-Module
Bus connections
Front or rear (panel)
mounting on 483mm (19inch) dimensions
32,48,64 and 96-way
DIN41612 I/O port
connector capability
M
T
Issue 5 Jan 2006
SDS-8300
Trusted
TM
Industrial Control System
TrustedTM Expander Chassis-T8300
BACKPLANE BLOCK DIAGRAM
ELECTRICAL SPECIFICATION
Power Requirements
Power Dissipation
Module Interface
20 to 32V dc
None – refer to the Expander Processor and
associated I/O module Data Sheets
Triple redundant Inter-Module Bus
MECHANICAL
SPECIFICATION
Dimensions (HxWxD):
266.7mm x 483mm x
312mm
(10.5ins x 19ins x 12.28ins)
Weight:
5kg
(11lbs)
ENVIRONMENTAL
Operating Temperature:
Forced Cooled
-5°C to 60°C
(23°F to 140°F)
Operating Humidity:
5 to 95%, non-condensing
Vibration:
10 to 57Hz ±0.075mm
57 to 150Hz 1.0g
Shock:
15g, ½ sine wave, 11ms
EMI (IEC 801):
ESD
Air discharge to 15kV
Contact discharge to 8kV
Radiated Fields
10V/m, 27MHz to
500MHz
Transients and Bursts
2kV, 2.5kHz for
t=60 seconds
ICS Triplex
Technical data sheets are intended for
information and guidance. The Company
has a policy of continual product
development and improvement.
Specifications are subject to change
without notice. For latest information, visit
our Websi te:- www.icstri plex.com
Loading...