Rockwell Automation T8100 User Manual
SDS-8100
TM
Trusted
Industrial Control System
TrustedTM Controller Chassis-T8100
FRONT PANEL
DESCRIPTION
The Trusted
is designed to accommodate a
maximum of eight single-width
Trusted
two triple-width Trusted
Processors.
The chassis consists of a
backplane, power connection
terminals, and the Inter-Module
Bus connectors. The chassis is
6U (10.5ins) high and is either
front mounted in a 483mm (19inch) fixed frame or swingframe,
or can be panel (rear) mounted in
a suitable electrical enclosure.
The two slot positions on the left
(as viewed from the front) are for
installing the Trusted
Processors. The eight remaining
slots are for installing the
Trusted
module plugs into the chassis
backplane, connecting to the
triplicated Inter-Module Bus.
Double and single connector
options are available.
TM
Controller Chassis
TM
Interfaces and up to
TM
Interfaces. Each
TM
TMR
TM
TMR
The backplane is part of the
Trusted
provides electrical interconnection
and other services for the
modules. A triplicated 4-position
DIP switch is provided for user
configuration of the system
identification..
Power connection to the
Trusted
provided via a 4-pole connector
on the chassis backplate. The
Trusted
designed for a nominal dual +24V
dc power supply.
TM
Controller Chassis and
TM
Controller Chassis is
TM
Controller Chassis is
FEATURES
2 x 90mm TrustedTM TMR
Processor slots
8 x 30mm TrustedTM
Interface Module slots
No user-serviceable parts
Fast assembly
Minimum tooling/parts
Up to twelve High Integrity
I/O modules supported per
Trusted
Chassis
TM
Expander
Dual redundant power
supplies from the Trusted
High Integrity Power Supply
Unit
Module slot keying
Triplicated Inter-Module
Bus connections
Front or rear (panel)
mounting on 483mm (19inch) dimensions
32,48,64 and 96-way
DIN41612 I/O port
connector capability
TM
Issue 5 Jan 2006
SDS-8100
Trusted
TM
Industrial Control System
TrustedTM Controller Chassis T8100
BACKPLANE BLOCK DIAGRAM
ELECTRICAL SPECIFICATION
Power Requirements
Power Dissipation
Module Interface
20 to 32V dc
None – refer to the TMR Processor and
associated TMR Interface module Data Sheets
Triple redundant Inter-Module Bus
MECHANICAL
SPECIFICATION
Dimensions (HxWxD):
266.7mm x 483mm x
312mm
(10.5ins x 19ins x 12.28ins)
Weight:
5kg
(11lbs.
ENVIROMENTAL
Operating Temperature:
-5°C to 60°C
(23°F to 140°F)
Operating Humidity:
5 to 95%, non-condensing
Vibration:
10 to 57Hz ±0.075mm
57 to 500Hz 1.0g
Shock:
15g, ½ sine wave, 11ms
EMI (IEC 801):
ESD
Air discharge to 15kV
Contact discharge to 8kV
Radiated Fields
10V/m, 27MHz to
500MHz
Transients and Bursts
2kV, 2.5kHz for
t=60 seconds
ICS Triplex
Technical data sheets are intended for
information and guidance. The Company
has a policy of continual product
development and improvement.
Specifications are subject to change
without notice. For latest information, visit
our Websi te:- www.icstripl ex.com
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