RICOH R3200x Technical data

R3200x SERIES

RESET TIMER IC FOR MOBILE EQUIPMENTS

NO.EA-280-120328

OUTLINE

The R3200x Series are reset timer ICs with two input signals for mobile equipments which require long interval for reset sequence. The long interval prevents unexpected resets caused by accidental key operations. Internally, each of these ICs consist of a delay generator circuit and output driver transistors.

The R3200x Series have two active-low input pins (SR0 and SR1) which generate reset signals after output delay time when both input pins are activated at the same time.

R3200x Series has two versions that are different in output delay time settings and output release method.

-R3200x001x : Output delay time selectable (7.5s or 11.25s) by connecting DSR pin to either GND or VDD.

The reset signal will be canceled if either of the input pin becomes “H”. Until either input pin becomes “H”, the reset signal will be continually outputted.

-R3200x002x : Output delay time is fixed at 7.5s. After the reset signal is being output 0.234s, it will be

released automatically or if either of the input pin becomes “H”, the reset signal will be canceled.

While the reset signals are remaining active or being sent out, the ICs provide ultra-low supply current. The R3200x Series are available in DFN(PLP)2020-8B and DFN1216-8 packages.

FEATURES

• Supply Current 1 (at standby) ...............................................		Typ. 0.28μA (VDD=5.5V)
• Supply Current 2 (at active before reset signal output) ........		Typ. 3μA (VDD=5.5V) *
• Supply Current 3 (at active after reset signal output) ...........		Typ. 0.45μA (VDD=5.5V)
•	Operating Voltage Range......................................................	1.65V to 5.5V
•	Operating Temperature Range .............................................	−40 to 85 °C
•	Output Delay Time (R3200x001x) ........................................	Typ. 7.5s or 11.25s Selectable
	(R3200x002x).........................................	Typ. 7.5s
• Output Delay Time Accuracy.................................................		±20%
•	Output Release Time (R3200x002x) ....................................	Typ. 0.234s
• Output Release Time Accuracy (R3200x002x).....................		±20% (Min. 0.187s, Max. 0.282s)
•	Output Types.........................................................................	Nch Open Drain and CMOS
•	Packages ..............................................................................	DFN(PLP)2020-8B,
		DFN1216-8

) Guaranteed by design engineering.

APPLICATIONS

•Mobile phone, Smartphone

•E-book, Tablet devices

•Portable Games

•Personal Navigation Devices

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R3200x

BLOCK DIAGRAMS

R3200xxxxA

R3200xxxxB

SR0 Reset

Logic

SR1

Delay

Logic

DSR				Delay Time
							OSC
				Selector

	VDD	SR0	Reset
			Logic
		SR1		Delay
	RST
				Logic
	GND	DSR	Delay Time	OSC
			Selector

VDD

RST2

RST

GND

) The red block part exists only in R3200x001x.

SELECTION GUIDE

The combination of output delay time settings and output release method, the package type and the output type for the ICs can be selected at the users’ request.

Product Name	Package	Quantity per Reel	Pb Free	Halogen Free
R3200Kxxx -TR	DFN(PLP)2020-8B	5,000 pcs	Yes	Yes
R3200Lxxx -E2	DFN1216-8	5,000 pcs	Yes	Yes

xxx: The combination of output delay time settings and output release method can be designated by serial numbers. (from 001)

(001) The output delay time of the reset signals selectable from 7.5s or 11.25s.

The reset signal will be canceled if either of the input pin becomes “H”. Until either input pin becomes “H”, the reset signal will be continually outputted.

(002) The output delay time of the reset signals is fixed at 7.5s. After reset signal is being output 0.234s, it will be released automatically or if either of the input pin becomes “H”, the reset signal will be canceled.

: Designation of Output Type

(A)Nch Open Drain

(B)Nch Open Drain and CMOS

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R3200x

PIN CONFIGURATIONS

• DFN(PLP)2020-8B

• DFN1216-8

Top View

8 7 6 5

1 2 3 4

Bottom View

5	6	7	8
	1
4	3	2	1

Top View

8 7 6 5

1 2 3 4

Bottom View

5	6	7	8
1
4	3	2	1

) Tab is GND level. (They are connected to the reverse side of this IC.)

The tab is better to be connected to the GND, but leaving it open is also acceptable

PIN DESCRIPTIONS

• DFN(PLP)2020-8B, DFN1216-8

Pin No.	Symbol						Description
1			NC				No Connection (Only for A version)
	RST2						CMOS Output Pin, "H" Active (Only for B version)
2	GND						Ground Pin
							2nd Reset Input Pin, ("L" Active) *1
3
		SR1
							Nch Open Drain Output Pin, ("L" Active) *2
4
		RST
5		DSR					Output Delay Time Selection Pin (R3200x001x) (GND: 7.5s, VDD: 11.25s) *3
	TEST2						Test Pin *4 (R3200x002x)
6	TEST						Test Pin *4
7							1st Reset Input Pin, ("L" Active) *1
			SR0
8			VDD				Power Supply Input Pin

1) In the case of using one "L" active input signal pin, either SR0 or SR1 must be connected to GND.2) In the case of using B version without RST, RST must be connected to GND or left open.

3) DSR pin must be connected to either GND or VDD.4) TEST must be connected to GND.

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R3200x

ABSOLUTE MAXIMUM RATINGS

	Symbol	Item	Rating	Unit
	VDD	Supply Voltage	GND-0.3 to 6	V
	VSR0	Input Voltage (1st Reset input pin)	GND-0.3 to 6	V
	VSR1	Input Voltage (2nd Reset input pin)	GND-0.3 to 6	V
	VRST	Output Voltage (1st Reset output pin)	GND-0.3 to 6	V
	VRST2	Output Voltage (2nd Reset output pin)	GND-0.3 to VDD+0.3	V
	VDSR	Input Voltage (Output Delay Time Selection Pin) (only R3200x001x)	GND-0.3 to 6	V
	IOUT	Output Current	20	mA
	PD	Power Dissipation (DFN(PLP)2020-8B)	880	mW
		Power Dissipation (DFN1216-8)	625
	Topt	Operating Temperature Range	−40 to 85	°C
	Tstg	Storage Temperature Range	−55 to 125	°C

) For Power Dissipation, please refer to PACKAGE INFORMATION.

ABSOLUTE MAXIMUM RATINGS

Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured.

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R3200x

ELECTRICAL CHARACTERISTICS

•R3200x001x

The specification in is checked and guaranteed by design engineering at −40°C ≤ Topt ≤ 85°C.

Topt=25°C

Symbol

Item

Conditions

Min.

Typ.

Max.

Unit

VDD

Operating Voltage

1.65

5.5

V

ISS1

Supply Current1

VDD=5.5V, at standby

0.28

μA

1.35

VDD=5.5V,

ISS2

Supply Current2

3.0

6.5

μA

at active before reset signal output

VDD=5.5V,

ISS3

Supply Current3

0.45

1.7

μA

at active after reset signal output

VDD ≥ 4.5V

IOL=8mA

VOL

"L" Output Voltage

V

VDD ≥ 3.3V

IOL=5mA

0.3

VDD ≥ 1.65V

IOL=3mA

VDD ≥ 4.5V

IOH=5mA

"H" Output Voltage

VOH

VDD ≥ 3.3V

V

IOH=2.5mA

VDD x 0.85

(Only for B version)

VDD ≥ 1.65V

IOH=0.8mA

ILEAKI

VDD = 5.5V

μA

SR0

,

SR1

Input Leakage Current

0.1

ILEAKO

Output Leakage Current

VDD = 5.5V

μA

0.1

DSR=GND

7.5

s

tDELAY

Output Delay Time

6

9

DSR=VDD

11.25

s

9

13.5

VIL

V

SR0

,

SR1

"L" Input Voltaget

0.3

VIH

V

SR0

,

SR1

"H" Input Voltaget

0.85

All of units are tested and specified under load conditions such that Tj≈Topt=25°C except for Supply Current2.

RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)

All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions.

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