RICOH R1183Z User Manual

R1183Z SERIES

150mA LDO REGULATOR

NO.EA-147-111026

OUTLINE

The R1183Z Series are CMOS-based voltage regulator ICs with extremely low supply current, and low dropout voltage realized with the built-in low ON-resistance Tr.

150mA output current is guaranteed, and the supply current of IC itself is Typ. 1μA at no load.

The R1183Z series have almost same characteristics as R1180x Series. Only difference is ultra small chip size package (WLCSP4-P2: 0.79mm×0.79mm) and built-in auto discharge function is available with D version, and output voltage accuracy improved to ±1.2%.

Since the package for these ICs is WLCSP-4-P2, the mount area size is less than 1/4 of R1180D Series (SON1612-6).

FEATURES

• Supply Current .....................................................

Typ. 1μA (Except the current through CE pull-down circuit)

• Standby Mode ......................................................

Typ. 0.1μA

• Dropout Voltage ...................................................

Typ. 0.25V (IOUT=150mA,VOUT=3.0V)

Temperature-Drift Coefficient of Output Voltage ..

Typ. ±100ppm/°C

Line Regulation ....................................................

Typ. 0.05%/V

• Output Voltage Accuracy......................................

±1.2%

Output Voltage Range..........................................

1.2V to 3.6V (0.1V steps)

 

 

(For other voltages, please refer to MARK INFORMATIONS.)

Input Voltage Range ............................................

1.7V to 6.0V

Package ...............................................................

WLCSP-4-P2

Built-in Fold Back Protection Circuit ....................

Typ. 40mA

Built-in Auto Discharge Function..........................

D Version

• Ceramic capacitors are recommended to be used with this IC ······· 0.1μF or more

APPLICATIONS

Stable voltage reference.

Power source for electrical appliances such as cameras, VCRs and camcorders.

Power source for battery-powered equipment.

1

RICOH R1183Z User Manual

R1183Z

BLOCK DIAGRAMS

R1183Zxx1B

 

 

R1183Zxx1C

VDD 1

4 VOUT

VDD 1

4 VOUT

 

Vref

Vref

 

Current Limit

Current Limit

CE 2

3 GND

3 GND

 

 

R1183Zxx1D

 

VDD

1

4

VOUT

 

 

Vref

 

 

 

Current Limit

 

CE

2

3

GND

2

R1183Z

SELECTION GUIDE

The output voltage, auto discharge function, package, etc. for the ICs can be selected at the user’s request.

Product Name

Package

Quantity per Reel

Pb Free

Halogen Free

R1183Zxx1 -TR-F

WLCSP-4-P2

5,000 pcs

Yes

Yes

 

 

 

 

 

xx: The output voltage can be designated in the range from 1.2V(12) to 3.6V(36) in 0.1V steps. (For other voltages, please refer to MARK INFORMATIONS.)

: The auto discharge function at off state are options as follows.

(B) without auto discharge function at off state

(C) without CE pin

(D) with auto discharge function at off state

3

R1183Z

PIN CONFIGURATION

 

WLCSP-4-P2

 

Mark Side

 

 

Bump Side

4

3

3

4

1

2

2

1

PIN DESCRIPTIONS

R1183Zxx1B/D

Pin No

Symbol

Pin Description

 

 

 

1

VDD

Input Pin

 

 

 

2

CE

Chip Enable Pin ("H" Active)

 

 

 

3

GND

Ground Pin

 

 

 

4

VOUT

Output Pin

 

 

 

R1183Zxx1C

Pin No

Symbol

Pin Description

1

VDD

Input Pin

 

 

 

2

NC

No Connection

 

 

 

3

GND

Ground Pin

 

 

 

4

VOUT

Output Pin

 

 

 

4

 

 

 

R1183Z

ABSOLUTE MAXIMUM RATINGS

 

 

 

 

 

 

 

 

Symbol

Item

Rating

Unit

 

VIN

Input Voltage

6.5

V

 

 

 

 

 

 

VCE

Input Voltage(CE Pin)

−0.3 to 6.5

V

 

VOUT

Output Voltage

−0.3 to VIN+0.3

V

 

IOUT

Output Current

200

mA

 

 

 

 

 

 

PD

Power Dissipation (WLCSP-4-P2) *

530

mW

 

 

 

 

 

 

Topt

Operating Temperature Range

−40 to +85

°C

 

 

 

 

 

 

Tstg

Storage Temperature Range

−55 to +125

°C

 

 

 

 

 

 

) For Power Dissipation, please refer to PACKAGE INFORMATION.

ABSOLUTE MAXIMUM RATINGS

Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field.

The functional operation at or over these absolute maximum ratings is not assured.

5

R1183Z

ELECTRICAL CHARACTERISTICS

R1183Zxx1B/D

 

 

 

 

 

 

Topt=25°C

 

 

 

 

 

 

 

 

 

Symbol

Item

Conditions

Min.

Typ.

Max.

 

Unit

VOUT

Output Voltage

VIN−VOUT=1.0V

 

VOUT>1.5V

×0.988

 

×1.012

 

V

IOUT=1mA

 

VOUT =< 1.5V

−18

 

+18

 

mV

 

 

 

 

 

IOUT

Output Current

VIN−VOUT=1.0V (VOUT => 1.5V)

150

 

 

 

mA

If VOUT<1.5V, VIN=2.4V

 

 

 

 

 

 

 

 

 

 

 

Load Regulation

VIN−VOUT=1.0V (VOUT => 1.5V)

 

20

40

 

mV

VOUT/ IOUT

If VOUT<1.5V, VIN=2.4V

 

 

 

 

1μA =< IOUT =< 150mA

 

 

 

 

 

VDIF

Dropout Voltage

Refer to the ELECTRICAL CHARACTERISTICS by OUTPUT

VOLTAGE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ISS

Supply Current*

VIN−VOUT=1.0V, IOUT=0mA

 

1.0

1.5

 

μA

Istandby

Standby Current

VIN−VOUT=1.0V, VCE=GND

 

0.1

1.0

 

μA

 

 

IOUT=30mA

 

 

 

 

 

 

VOUT/ VIN

Line Regulation

VOUT+0.5V =< VIN =< 6.0V

 

0.05

0.20

 

%/V

(VOUT => 1.5V)

 

 

 

 

 

If VOUT<1.5V,

 

 

 

 

 

 

 

 

2.0V =< VIN =< 6.0V

 

 

 

 

 

 

VIN

Input Voltage

 

 

 

1.7

 

6.0

 

V

 

 

 

 

 

 

 

 

 

VOUT/

Output Voltage

IOUT=30mA

 

 

±100

 

 

ppm

Topt

Temperature Coefficient

−40°C =< Topt =< 85°C

 

 

 

/°C

 

 

 

 

ISC

Short Current Limit

VOUT=0V

 

 

40

 

 

mA

IPD

CE Pull-down Constant

 

 

 

 

0.35

0.80

 

μA

Current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCEH

CE Input Voltage "H"

 

 

 

1.2

 

6.0

 

V

 

 

 

 

 

 

 

 

 

 

VCEL

CE Input Voltage "L"

 

 

 

0

 

0.3

 

V

 

 

 

 

 

 

 

 

 

 

RLOW

ON Resistance of Nch.Tr.

 

 

 

 

90

 

 

 

for Auto discharge

VCE=0V

 

 

 

 

Ω

 

(of D version)

 

 

 

 

 

 

 

 

*) Except the pull-down constant current through CE pin.

RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)

All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions.

6

 

 

 

 

 

 

 

 

 

 

 

R1183Z

R1183Zxx1C

 

 

 

 

 

 

Topt=25°C

 

 

 

 

 

 

 

 

 

 

 

 

 

Symbol

 

Item

Conditions

Min.

Typ.

Max.

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOUT

 

Output Voltage

VIN−VOUT=1.0V

 

VOUT>1.5V

×0.988

 

×1.012

 

V

 

 

 

IOUT=1mA

 

VOUT =< 1.5V

−18

 

+18

 

mV

 

 

 

 

 

 

 

 

 

 

IOUT

 

Output Current

VIN−VOUT=1.0V (VOUT => 1.5V)

150

 

 

 

mA

 

 

 

If VOUT<1.5V, VIN=2.4V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOUT/ IOUT

 

Load Regulation

VIN−VOUT=1.0V (VOUT => 1.5V)

 

20

40

 

mV

 

 

 

If VOUT<1.5V, VIN=2.4V

 

 

 

 

 

 

 

1μA =< IOUT =< 150mA

 

 

 

 

 

 

 

VDIF

 

Dropout Voltage

Refer to the ELECTRICAL CHARACTERISTICS by OUTPUT

 

 

 

VOLTAGE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ISS

 

Supply Current

VIN−VOUT=1.0V, IOUT=0mA

 

1.0

1.5

 

μA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IOUT=30mA

 

 

 

 

 

 

 

 

 

VOUT/ VIN

 

Line Regulation

VOUT+0.5V =< VIN =< 6.0V

 

0.05

0.20

 

%/V

 

 

 

(VOUT => 1.5V)

 

 

 

 

 

 

 

 

 

If VOUT<1.5V,

 

 

 

 

 

 

 

 

 

 

 

 

2.0V =< VIN =< 6.0V

 

 

 

 

 

 

 

VIN

 

Input Voltage

 

 

 

1.7

 

6.0

 

V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOUT/

 

Output Voltage

IOUT=30mA

 

 

 

±100

 

 

ppm

 

 

Topt

 

Temperature Coefficient

−40°C =< Topt =< 85°C

 

 

 

/°C

 

 

 

 

 

 

 

 

 

ISC

 

Short Current Limit

VOUT=0V

 

 

 

40

 

 

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RECOMMENDED OPERATING CONDITIONS

(ELECTRICAL CHARACTERISTICS)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions.

ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE

Topt=25°C

 

 

Dropout Voltage VDIF (V)

 

Output Voltage

 

 

VOUT (V)

 

 

 

 

Condition

 

Typ.

Max.

 

 

 

 

 

 

 

1.2 =< VOUT < 1.3

 

 

0.85

1.20

1.3 =< VOUT < 1.4

 

 

0.75

1.10

1.4 =< VOUT < 1.5

 

 

0.65

1.00

1.5 =< VOUT < 1.7

IOUT=150mA

 

0.60

0.90

1.7 =< VOUT < 1.9

 

0.50

0.75

 

 

1.9 =< VOUT < 2.1

 

 

0.40

0.65

2.1 =< VOUT < 2.8

 

 

0.35

0.55

2.8 =< VOUT =< 3.6

 

 

0.25

0.40

7

R1183Z

TYPICAL APPLICATION

IN

1 VDD

VOUT

C1

R1183Z

Series

 

2 CE/NC GND

4

OUT

C2

3

(External Components) Output Capacitor

Ceramic Capacitor 0.1μF murata GRM155B31C104KA87B kyocera CM05X5R104K16AB

TECHNICAL NOTES

When using these ICs, consider the following points:

Phase Compensation

In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a capacitor C2 with good frequency characteristics and ESR (Equivalent Series Resistance). (Note: If additional ceramic capacitors are connected with parallel to the output pin with an output capacitor for phase compensation, the operation might be unstable. Because of this, test these ICs with as same external components as ones to be used on the PCB.)

PCB Layout

Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect a capacitor C1 with a capacitance value as much as 0.1μF or more between VDD and GND pin, and as close as possible to the pins.

Set external components, especially the output capacitor C2, as close as possible to the ICs, and make wiring as short as possible.

8

Loading...
+ 16 hidden pages