Richtek RT9724GB, RT9724GQW Schematic [ru]

®
RT9724
100m
Ω, 2A Slew Rate Controlled Load Switch
General Description
The RT9724 is a cost-effective, low-voltage, single
N-MOSFET high-side Power Switch IC. Low switch-on
resistance (typ. 100mΩ) and low supply current (typ. 50uA)
are realized in this IC. The RT9724 integrates an over-
current protection circuit, a short fold back circuit, a
thermal shutdown circuit and an under-voltage lockout
circuit for overall protection. Besides, a slew rate
controlled function is embedded for turn-on rising time
control. The RT9724 is available in SOT-23-5 and WDFN-
8L 2x2 package.
Ordering Information
RT9724
Package Type B : SOT-23-5
QW : WDFN-8L 2x2 (W-Type)
Lead Plating System G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Features
zz
z
zz
zz
z Operating Range : 2.7V to 5.5V
zz
zz
z Reverse Blocking Current
zz
zz
z Under Voltage Lockout
zz
zz
z Thermal Protection with Foldback
zz
zz
z Over Current Protection
zz
zz
z Short Circuit Protection
zz
zz
z Slew Rate Limited Turn-On Time 3ms (5V)
zz
zz
z RoHS Compliant and Halogen Free
zz
ΩΩ
100m
Ω (typ.) N-MOSFET Switch
ΩΩ
Applications
z Cellular Phones
z Digital still Camera
z Hot swap Supplies
z Notebook Computers
z Personal Communication Devices
z Personal Digital Assistants
Pin Configurations
(TOP VIEW)
VIN
5
VIN
4
23
Marking Information
RT9724GB
1Y= : Product Code
1Y=DNN
DNN : Date Code
RT9724GQW
GV : Product Code
GVW
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
©
W : Date Code
DS9724-02 July 2012 www.richtek.com
EN GND VOUT
SOT-23-5
1
NC
2
VOUT
3
4
GND
WDFN-8L 2x2
GND
9
8
VIN
7
VIN
6
VINEN
5
VIN
1
RT9724
Typical Application Circuit
2.7V to 5.5V
Chip Enable
C
IN
1µF
EN
VOUTVIN
RT9724
GND
Functional Pin Description
Pin No.
SOT-23-5 WDFN-8L 2x2
1 3 EN Chip Enable (Active High).
2
9 (Exposed Pad)
4,
3 2 VOUT Power-Switch Output.
4, 5 5, 6, 7, 8 VIN Power Input Voltage.
-- 1 NC No Internal Connection.
Pi n Na me Pi n Functi o n
GND
Ground. The exposed pad must be soldered to a large PCB and
connected to GND for maximum power dissipation.
Function Block Diagram
C
OUT
0.1µF
Load
EN
Bias
Oscillator
UVLO
Charge
Pump
Thermal
Protection
Gate
Control
Current Limiting
Output Voltage
Detection
Auto Discharge
VIN
VOUT
GND
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©
DS9724-02 July 2012www.richtek.com
2
RT9724
Absolute Maximum Ratings (Note 1)
z Supply Voltage, VIN ------------------------------------------------------------------------------------------------------ 6V
z Enable Input Voltage, EN ------------------------------------------------------------------------------------------------ 0.3V to 6V
z Power Dissipation, P
D
SOT-23-5 -------------------------------------------------------------------------------------------------------------------- 0.458W
WDFN-8L 2x2 -------------------------------------------------------------------------------------------------------------- 0.833W
z Package Thermal Resistance (Note 2)
SOT-23-5, θJA-------------------------------------------------------------------------------------------------------------- 218.1°C/W
WDFN-8L 2x2, θJA-------------------------------------------------------------------------------------------------------- 120°C/W
z Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
z Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C
z ESD Susceptibility (Note 3)
HBM (Human Body Model)---------------------------------------------------------------------------------------------- 4kV
Recommended Operating Conditions (Note 4)
z Supply Voltage, VIN ------------------------------------------------------------------------------------------------------ 2.7V to 5.5V
z Enable Input Voltage, EN ------------------------------------------------------------------------------------------------ 0V to 5.5V
z Junction Temperature Range -------------------------------------------------------------------------------------------- 40°C to 100°C
z Ambient Temperature Range --------------------------------------------------------------------------------------------
@ T
= 25°C
A
40°C to 85°C
Electrical Characteristics
(VIN = 5V, CIN = 1μF, C
Parameter Symbol Test Conditions Min Typ Max Unit
Operation Voltage VIN 2.7 -- 5 V
Under Voltage Lookout V
Under Voltage Lockout Hysteresis
Quiescent Current IQ EN = High -- 50 70 μA
Off Supply Current I
Off Switch Current I
On-Resistance R
Curr ent Limiting I
Short Circuit Current I
Thermal shutdown Threshold TSD
Hysteresis -- 20 -- °C
EN Threshold Voltage
Enable Input Leakage IEN V
= 0.1μF, T
OUT
Logic-Low VIL V
Logic-High V
= 25°C, unless otherwise specified)
A
VIN Falling 1.3 1.7 2.1 V
UVLO
ΔV
SHDN
LEAKA GE
LIM
SC_FB
-- 50 -- mV
UVLO
EN = Low, V
EN = Low, V
VIN = 3.3V, I
DS(ON)
V
V
IH
= 3.3V, V
IN
V
= 0V, Measured Prior to
OUT
Thermal Shutdown V
> 1V -- 130 -- °C
OUT
V
= 0V -- 100 -- °C
OUT
= 2.7V to 5.5V -- -- 0.8 V
IN
= 2.7V to 5.5V 2 -- -- V
IN
= 5.5V -- -- 1 μA
EN
= Open -- -- 1 μA
OUT
= 0 -- -- 1 μA
OUT
= 1.3 A -- 100 120 mΩ
OUT
= 2.3V 1.5 2 2.5 A
OUT
0.4 0.8 1.5 A
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
DS9724-02 July 2012 www.richtek.com
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3
RT9724
Parameter Symbol Test Conditions Min Typ Max Unit
Output Turn-On Delay Time T
Output Turn-On Rise Time TON V
Output Turn-Off Delay Time T Output Pull-Down Resistance
During OFF
Note 1. Stresses beyond those listed Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θ Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions.
is measured at T
JA
= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7.
A
VIN = 5V, R
D_ON
VIN = 5V, R
D_OFF
R
DI SCHA RGE
= 10Ω -- 60 100 μs
LOAD
= 5V, R
IN
= 10Ω 1 3 -- ms
LOAD
= 10Ω -- 4 10 μs
LOAD
EN = Low -- 150 -- Ω
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DS9724-02 July 2012www.richtek.com
Typical Operating Characteristics
)
)
RT9724
On Resistance vs. Input Voltage
115
EN = 5V, I
114
113
112
On Resistance (mΩ)
111
110
2.7 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5
OUT
= 1.5A
Input Voltage (V)
Quiescent Current vs. Input Voltage
30
VEN = 5V, No Load
27
24
On Resistance vs. Temperature
150
VIN = VEN = 5V, I
140
130
120
110
100
On Resistance (mΩ)
90
80
-40 -20 0 20 40 60 80 100
OUT
= 1.5A
Temperature (°C)
Quiescent Current vs. Temperature
30
VIN = VEN = 5.5V, No Load
28
26
21
Quiescent Current (µA
18
15
2.7 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5
Input Voltage (V)
Shutdown Current vs. Input Voltage
0.30
VEN = 0V,No Load
0.25
0.20
0.15
0.10
Shutdown Current (µA) 1
0.05
0.00
2.7 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5
Input Voltage (V)
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©
24
Quiescent Current (µA
22
20
-40 -20 0 20 40 60 80 100
Temperature (°C)
Shutdown Current vs. Tem perature
1
VIN = 5.5V, VEN = 0V, No Load
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Shutdown Current (µA) 1
0.1
0
-40-200 20406080100
Temperature (°C)
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