RT9193T
300mA, Thermal Folded Back CMOS LDO Regulator
General Description
The RT9193T is designed for portable RF and wireless
applications with demanding performance and space
requirements. The RT9193T performance is optimized for
battery-powered systems to deliver ultra low noise and
low quiescent current. A noise bypass pin is available for
further reduction of output noise. Regulator ground current
increases only slightly in dropout, further prolonging the
battery life. The RT9193T also works with low-ESR
ceramic capacitors, reducing the amount of board space
necessary for power applications, critical in hand-held
wireless devices. The RT9193T consumes less than 0.01μA
in shutdown mode and has fast turn-on time less than
50μs. RT9193T is short circuit thermal folded back
protected. RT9193T lowers its OTP trip point from 165°C
to 110°C when output short circuit occurs (V
OUT
< 0.4V)
providing maximum safety to end users. The other features
include ultra low dropout voltage, high output accuracy,
current limiting protection, and high ripple rejection ratio.
Available in the 5-lead of SC-70, SOT-23 and
WDFN-6L 2x2 packages.
Ordering Information
RT9193T-
Package Type
U5 : SC-70-5
B : SOT-23-5
QW : WDFN-6L 2x2 (W-Type)
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Features
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Short Circuit Thermal Folded Back Protection
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z Ultra-Low-Noise for RF Application
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z Ultra-Fast Re spon se in Line/Loa d T ra n sient
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z Quick Start-Up (T ypically 50us)
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z < 0.01uA Standby Current When Shutdown
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z Low Dropout : 220mV @ 300mA
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z Wide Operating Voltage Ranges : 2.5V to 5.5V
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z TTL-Logic-Controlled Shutdown Input
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z Low Temperature Coefficient
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z Current Limiting Protection
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z Thermal Shutdown Protection
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z Only 1uF Output Capa citor Required f or Sta bility
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z High Power Supply Rejection Ratio
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z Custom Voltage Available
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z RoHS Compliant and 100% Lead (Pb)-Free
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Applications
z CDMA/GSM Cellular Handsets
z Battery-Powered Equipment
z Laptop, Palmtops, Notebook Computers
z Hand-Held Instruments
z PCMCIA Cards
z Portable Information Appliances
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
Output Voltage
15 : 1.5V
16 : 1.6V
:
34 : 3.4V
35 : 3.5V
1H : 1.85V
2H : 2.85V
Note :
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Pin Configurations
(TOP VIEW)
1
EN
2
GND
3
WDFN-6L 2x2
VOUT BP
5
VIN GND EN
6
BP
5
NC
7
4
VOUTVIN
4
23
SC-70-5/SOT-23-5
DS9193T-06 April 2011 www.richtek.com
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RT9193T
Typical Application Circuit
V
IN
Chip Enable
Functional Pin Description
Pin Name
VIN
GND
EN
BP
VOUT
Pin Function
Power Input Voltage
Ground
Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100kΩ
resistor connected to GND when the control signal is floating.
Reference Noise Bypass
Output Voltage
C
1uF
+
IN
RT9193T
VIN
GND
EN BP
VOUT
+
C
OUT
1uF
C
BP
22nF
V
OUT
Function Block Diagram
EN
Quick
Start
BP
V
REF
Shutdown
and
Logic Control
+
-
Error
Amplifier
VIN
MOSFET
Driver
VOUT
Current-Limit
and
Thermal
Protection
GND
DS9193T-06 April 2011www.richtek.com
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RT9193T
Absolute Maximum Ratings (Note 1)
z Supply Input Voltage ---------------------------------------------------------------------------------------------------- 6V
z Power Dissipation, P
SC-70-5 -------------------------------------------------------------------------------------------------------------------- 300mW
SOT-23-5------------------------------------------------------------------------------------------------------------------- 400mW
WDFN-6L 2x2 ------------------------------------------------------------------------------------------------------------- 606mW
z Package Thermal Resistance (Note 2)
SOT-70-5, θJA------------------------------------------------------------------------------------------------------------- 333°C/W
SOT-23-5, θJA------------------------------------------------------------------------------------------------------------- 250°C/W
WDFN-6L 2x2, θJA------------------------------------------------------------------------------------------------------- 165°C/W
z Lead Temperature (Soldering, 10 sec.) ----------------------------------------------------------------------------- 260°C
z Storage Temperature Range ------------------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Mode) --------------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ---------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions (Note 4)
z Supply Input Voltage ---------------------------------------------------------------------------------------------------- 2.5V to 5.5V
z Ambient Temperature Range ------------------------------------------------------------------------------------------
z Junction Temperature Range ------------------------------------------------------------------------------------------
@ T
D
= 25°C
A
−40°C to 85°C
−40°C to 125°C
Electrical Characteristics
(VIN = V
+ 1V, CIN = C
OUT
= 1uF, CBP = 22nF, T
OUT
Parameter Symbol Test Conditions Min Typ Max Unit
Output Voltage Accuracy ΔV
Current Limit I
Quiescent Current IQ V
Dropout Voltage (Note 5) V
Line Regulation ΔV
Load Regulation ΔV
Standby Current I
EN Input Bias Current I
Logic-Low Voltage
EN Threshold
Logic-High Voltage
Output Noise Voltage eNO
f = 100Hz -- −70 -- Power Supply
Rejection Rate
f = 10kHz
Thermal Shutdown Temperature TSD -- 165 -- °C
= 25°C, unless otherwise specified)
A
I
OUT
R
LIM
DROP
LINE
LOAD
VEN = GND, Shutdown -- 0.01 1 uA
STBY
VEN = GND or VIN -- 0 100 nA
IBSD
V
V
IL
V
VIN = 3V to 5.5V, Start-Up 1.2 -- --
IH
PSRR C
= 1mA −2 -- +2 %
OU T
= 1Ω 360 400 -- mA
LOAD
≥
1.2V, I
EN
I
= 200mA 170 200
OU T
I
= 300mA -- 220 300
OU T
V
= (V
IN
OUT
I
= 1mA
OU T
1mA < I
OUT
= 3V to 5.5V, Shutdown -- -- 0.4
IN
10Hz to 100kHz, I
= 1uF
C
OUT
= 1uF, I
OUT
= 0mA -- 90 130 μA
OUT
+ 0.3V) to 5.5V,
-- -- 0.3 %
< 300mA -- -- 0.6 %
= 200mA
OUT
OUT
= 10mA
-- 100 -- uV
-- −50 --
mV
V
RMS
dB
DS9193T-06 April 2011 www.richtek.com
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RT9193T
Parameter Symbol Test Conditions Min Typ Max Unit
Thermal Shutdown Temperature
H
steresis
ΔT
-- 30 -- °C
SD
Thermal Folded Back -- 110 -- °C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θ
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The dropout voltage is defined as V
is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board
JA
(Single Layer, 1S) of JEDEC 51-3 thermal measurement standard.
-V
IN
, which is measured when V
OUT
OUT
is V
OUT(NORMAL)
− 100mV.
DS9193T-06 April 2011www.richtek.com
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