Lead Temperature (Soldering, 10 sec.)------------------------------------------------------------------------------- 260°C
Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
Storage Temperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C
MM ---------------------------------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions (Note 4)
Supply Input Voltage ------------------------------------------------------------------------------------------------------ 2.2V to 5.5V
Junction Temperature Range --------------------------------------------------------------------------------------------
Ambient Temperature Range --------------------------------------------------------------------------------------------
@ T
D
= 25°C
A
−40°C to 125°C
−40°C to 85°C
Electrical Characteristics
(V
= V
+ 0.5V, V
OUT
IN
Parameter Symbol Test Conditions Min Typ Max Unit
Input Voltage Range VIN 2.2 -- 5.5 V
Output Noise Voltage VON V
Ou tput V oltage Acc ur acy
(Fixed Output Voltage)
Quiescent Current (Note 5) IQ V
Shutdown Current I
Current Limit I
Dropout Voltage (Note 6) V
Load Regulation (Note 7)
(Fixed Output Voltage)
EN Threshold
Enable Pin Current IEN -- 0.1 1 uA
Power Supply Rejection Rate PSRR I
Line Regulation ΔV
Thermal Shutdown Temperature TSD -- 170 --
Thermal Shutdown Hysteresis ΔTSD -- 30 --
= VIN, C
EN
= C
IN
OUT
Logic-Low Voltage V
Logic-High Voltage V
= 1uF/X7R (Ceramic), T
= 1.5V -- 30 -- uV
OU T
ΔV
I
OUT
VEN = 0V -- 0.7 1.5 uA
SHDN
R
LIM
I
DROP
= 10mA −2 0 +2 %
OUT
= 5V, I
EN
LOAD
= 300mA -- 125 240 mV
OUT
1mA < I
ΔV
LOA D
2.2V ≤ V
1mA < I
2.7V ≤ V
0 -- 0.6
IL
1.6 -- 5.5
IH
= 100mA, f = 10kHz -- −50 -- dB
OUT
V
= (V
IN
LINE
I
OUT
= 1mA
= 25°C, unless otherwise specified)
A
= 0mA -- 25 50 uA
OUT
= 0Ω, 2.2V ≤ VIN < 5.5V 300 400 600 mA
< 300mA
OUT
< 2.7V
IN
< 300mA
OUT
≤ 5.5V
IN
+ 0.5) to 5.5V,
OU T
-- -- 0.6
-- -- 1
-- 0.01 0.2 %/V
RMS
%
V
°C
DS9013B-02 April 2011www.richtek.com
3
RT9013B
Note 1. Stresses listed as the above“Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
remain possibility to affect device reliability.
Note 2. θ
is measured in the natural convection at T
JA
JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by I
load condition (I
= 0mA). The total current drawn from the supply is the sum of the load current plus the ground pin
OUT
current.
Note 6. The dropout voltage is defined as V
-V
IN
Note 7. Regulation is measured at constant junction temperature by using a 2ms current pulse. Devices are tested for load
regulation in the load range from 10mA to 300mA.
= 25°C on a low effective thermal conductivity single layer test board of
A
= IIN - I
Q
, which is measured when V
OUT
OUT
is V
OUT(NORMAL)
- 100mV.
under no
OUT
DS9013B-02 April 2011www.richtek.com
4
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