1 BOOT1 Bootstrap Su pply for PWM 1. T his pin powers the hi gh- sid e MOSFET d river.
2 UGATE1
High-side Gat e Driver of PWM 1. This pin provide s t he gate drive for the converter's
high-side MOSFET. Con nect this pin to the Gate of high-side MOSFET.
3 EN Enable Contro l I nput. Active hig h input.
Power Saving Interface. When the voltage is pulled below 0.8V, the device will operate
4 PSI
into 1 phase DEM. When the voltage is bet ween 1.2V to 1.8V, the dev ice will opera te
into 1 phase f orce CCM. W hen t he voltage is between 2.4V to 5 .5V, the device will
operate into active phase force CCM (only for 2 or 3 phase).
5 VID
Programming Output Voltage Contr ol Input. Ref er to PWM-VID Dynamic Voltage
Control .
6 REFADJ Refere nce Ad justment Output. Refer t o PWM-VID Dynamic Voltage Contro l.
7 REF IN External Reference Input.
8 VREF
9 TON
Refere nce Voltage Output. This is a high precision voltage refere nce (2V ) from VREF
pin to RGND pi n.
On-Time/ Switching Freq uency Adjustment Input. Connect a 100pF capacito r between
C
and gr ound is optional for noise imm unity enhancem ent.
TON
10 RGND Negative Remote Sense Input. Connect this pin to the ground of ou tput lo ad.
11 VSNS Positive Remote Sense Input. Connect t his pin to the positive terminal of output load.
12 SS
Soft-Start Time Sett in g. Connect an externa l capacitor to adjust soft -start time.
When the ex ternal capacitor is remove d, t he i nt ernal soft-start function will be ch ose.
TSNS Temperature Sensing Input f or 2/1 Phase Operation.
13
ISEN3 Phase 3 Current Sense Inp ut f or 3-Phase Operation.
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
16 PGOOD Power Good Indicator Output. Active high open-drain output.
17 UGATE2
18 BOOT2 Bootstrap Supply for of PWM 2. This pin p owers the high-side MOSFET driver.
19 PHASE2
20 LGATE2
21 PVCC
22 PWM3
23 LGATE1
24 PHASE1
25 (Exposed Pad) GND
TALE R T
ISEN2 Phase 2 Curren t Sense Inp ut f or 3-Phase Operation.
VCC Supply Voltage Input for 2/1 Phase Operation. (Connect to PVCC)
ISEN1 Phase 1 Curren t Sense Inp ut f or 3-Phase Operation. (Connect to PHASE1)
Thermal Alert. Active l ow open drain ou tpu t for 2/1 Phase Operat ion .
High-side Gate Driver of PWM 2. This pin provides the gate drive for the
con vert er's high-side MOSFET. Connec t thi s pin to the Gate of high-side
MOSFET.
Switch Node for PWM2. This pin is return node of the high-side driver of PWM
2. Connect this p in to the Sourc e of high-side MOSFET together with the Drain
of low-side MOSFET an d th e inductor.
Low-Side Gate Driver of PW M 2. Th is pin provides the gate drive for the
con vert er's low-side MOSFET. Connect this pin to the Gate of low-side
MOSFET.
Supply Voltage Input. Connect this pin to a 5V bias supply. Place a high quality
bypass capac ito r from this pin to GND.
Third Phase PWM Control Signal Output to Driver for 3-Phas e Operation. In 2 /1
Phase Oper atio n, t his pin is high impedance.
Low-Side Gate Driver of PW M 1. Th is pin provides the gate drive for the
con vert er's low-side MOSFET. Connect this pin to the Gate of low-side
MOSFET.
Switch Node for PWM1. This pin is return node of the high-side driver of PWM
1. Connect this p in to the Source of high-side MOSFET together with the Drain
of low-side MOSFET an d th e inductor.
Ground. The Expos ed pad should be solde red to a lar ge PCB and connected to
GND for maximum thermal dissipation.
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θ
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Not production tested. Test condition is V
is measured at T
JA
measured at the exposed pad of the package.
R
PVCC to BOOTx, I
BOOT
= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
A
= 8V, V
IN
OUT
= 1V, I
= 10mA -- 40 80
BOOT
= 20A using application circuit.
OUT
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.