The RT8061A is a high efficiency synchronous, step-down
DC/DC converter. Its input voltage ra nge from 2.7V to 5.5V
that provides an adjustable regulated output voltage from
0.6V to V
while delivering up to 3A of output current.
IN
The internal synchronous low on resistance power
switches increase efficiency and eliminate the need for
an external Schottky diode. The switching frequency is
fixed internally at 1MHz. The 100% duty cycle provides
low dropout operation, hence extending battery life in
portable systems. Current mode operation with internal
compensation allows the transient response to be
optimized over a wide range of loa ds and output ca pacitors.
The RT8061A is operated in PWM/PSM mode to a chieve
high efficiency for a wide load range. The RT8061A is
available in a W DFN-10L 3x3 pack age.
Ordering Information
RT8061A
Package Type
QW : WDFN-10L 3x3 (W-Type)
Lead Plating System
Z : ECO (Ecological Element with
Halogen Free and Pb free)
Note :
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Features
zz
High Efficiency : Up to 95%
z
zz
zz
z Low R
zz
Internal Switches : 69m
DS(ON)
ΩΩ
Ω/49m
ΩΩ
= 5V
zz
z Fixed Frequency : 1MHz
zz
zz
z No Schottky Diode Required
zz
zz
z 0.6V Reference Allows Low Output Voltage
zz
zz
z PWM/PSM Mode Operation
zz
zz
z Low Dropout Operation : 100% Duty Cycle
zz
zz
z OCP, UVP, OVP, OTP
zz
z RoHS Compliant and Halogen Free
Applications
z Portable Instruments
z Battery-Powered Equipment
z Notebook Computers
z Distributed Power Systems
z IP Phones
z Digital Camera s
Pin Configurations
(TOP VIEW)
GND
11
10
PVIN
9
PVIN
8
SVIN
7
NC
6
FB
NC
LX
LX
PGOOD
EN
WDFN-10L 3x3
1
2
3
4
5
ΩΩ
Ω at V
ΩΩ
IN
Marking Information
11 : Product Code
11 YM
DNN
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
1, 7 NC No Internal Connection.
2, 3 LX Switch Node. Connection this pin to the inductor.
2, 3
6
L
OUT
R
R
FB1
FB2
V
OUT
C
C
FF
OUT
4 PGOOD
Power Good Indicator. This pin is an open drain logic output that is pulled to
ground when the output voltage is less than 90% of the target output voltage.
5 EN Enable Control. Pull high to turn on. Do not float.
6 FB
Feed back . Th is pin rec eiv es the fe edb ac k vol tag e fro m a resi stiv e vo lta ge div id er
connected across the output.
8 SVIN Signal Input. Decouple this pin to GND with at least 1μF ceramic cap.
9, 10 PVIN Power Input. Decouple this pin to GND with at least 4.7μF ceramic cap.
11 (Exposed Pad) GND
The exposed pad must be soldered to a large PCB and connected to GND for
maximum power dissipation.
Function Block Diagram
0.6V
PGOOD
EN
PGOOD
FB
EN
Output
Clamp
EN
OSC
Slope
Com
ISEN
OC
Limit
PVIN
Int-SS
0.72V
OV
0.54V
POR
SVIN
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
z Supply Input V oltage, PVIN, SVIN-------------------------------------------------------------------------------- −0.3V to 6.5V
z LX Pin V oltage--------------------------------------------------------------------------------------------------------- (V
z Other I/O Pin Voltage------------------------------------------------------------------------------------------------ −0.3V to 6.5V
z Power Dissipation, P
W DFN-10L 3x3, θJA-------------------------------------------------------------------------------------------------- 70°C/W
WDFN-10L 3x3
z Junction T emperature------------------------------------------------------------------------------------------------ 150°C
z Lead Temperature (Soldering, 10 sec.)-------------------------------------------------------------------------- 260°C
z Storage T emperature Range --------------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Model)----------------------------------------------------------------------------------------- 2kV
Recommended Operating Conditions(Note 4)
0.3V) to 6.8V
IN +
z Supply Input V oltage, PVIN, SVIN--------------------------------------------------------------------------------
z Junction T emperature Range---------------------------------------------------------------------------------------
z Ambient T emperature Range---------------------------------------------------------------------------------------
2.7V to 5.5V
−40°C to 125°C
−40°C to 85°C
Electrical Characteristics
(VIN = 3.3V, T
Feedback Reference Voltage V
Feedback Leakage Current IFB -- 0.1 0.4 μA
DC Bias Current
Output Voltage Line Regulation V
Output Voltage Load Regulation I
Switch Leakage Current VEN = 0A -- -- 1 μA
Switching Frequency 0.8 1 1.2 MHz
Switch On Resistance, High R
Switch On Resistance, Low R
PMOS Current Lim it (latch-off) I
Under Voltage Lock out
Threshold
= 25°C, unless otherwise specified)
A
Parameter Symbol Test Conditions Min Typ Max Unit
0.594 0.6 0.606 V
REF
Active , V
0.7V, Not Switching -- 110 140
FB =
μA
Shutdown -- -- 1
2.7V to 5.5V I
IN =
= 0A to 3A −1 -- 1 %
OUT
DS(ON)_P
DS(ON)_N
LIM
V
V
4 -- -- A
5V -- 69 -- mΩ
IN =
5V -- 49 -- mΩ
IN =
= 0A -- 0.3 -- %/V
OUT
VIN Rising 2.2 2.4 2.6
V
UVLO
V
IN Falling 2 2.2 2.4
V
EN Threshold
Voltage
Logic-High VIH 1.6 -- -Logic-Low V
IL
-- -- 0.4
V
EN Pull Low Resistance -- 500 -- kΩ
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Power Good Measured FB, With Respect to V
Power Good Hysteresis -- 5 -- %
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θ
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
is measured at T
JA
measured at the exposed pad of the package.
= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
A
-- 150 -- °C
T
SD
115 120 130 %
57 66 75 %
85 90 -- %
REF
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.