Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Functional Pin Description
Pin No. Pin Name Pin Function
1 EN
2 FB
3 PVCC
4 SS
5, 9
(Exposed Pad)
GND
Enable Input. A logic-high enables the converter; a logic-low forces the IC into
shutdown mode reducing the supply current to less than 10μA.
Feedback Input. It is used to regulate the output of the converter to a set value via
an external resistive voltage divider. The feedback threshold voltage is 0.765V
typically.
Internal Regulator Output. Connect a 1μF capacitor to GND to stabilize output
voltage.
Soft-Start Control Input. SS controls the soft-start period. Connect a capacitor from
SS to GND to set the soft-start period. A 3.9nF capacitor sets the soft-start period of
to 2.6ms.
V
OUT
Ground. The Exposed pad should be soldered to a large PCB and connected to
GND for maximum thermal dissipation.
(TOP VIEW)
EN
FB
PVCC
SS
2
GND
3
4
SOP-8 (Exposed Pad)
8
VIN
7
BOOT
6
9
SW
5
GND
6 SW Switch Node. Connect this pin to an external L-C filter.
7 BOOT
8 VIN
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Thermal Shutdown Threshold TSD -- 150 -- °C
Thermal Shutdown Hysteresis ΔTSD -- 20 -- °C
On-Time Timer Control
On-Time tON V
Minimum On-Time t
Minimum Off-Time t
ON(MIN)
OFF(MIN)
-- 60 -- ns
= 12V, V
IN
= 1.05V -- 145 -- ns
OUT
-- 230 -- ns
Soft-Start
SS Charge Current VSS = 0V 1.4 2 2.6 μA
SS Discharge Current VSS = 0.5V 0.05 0.1 -- mA
UVLO
UVLO Threshold VIN Rising to Wake up V
3.55 3.85 4.15
PVCC
V
Hysteresis -- 0.3 --
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θ
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
is measured at T
JA
measured at the exposed pad of the package. The PCB copper area of exposed pad is 70mm
= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
A
2
.
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.