RFCOM TECHNOLOGIES RTBTM01 User Manual

RFCOM TECHNOLOGIES
Confidential &Proprietary
RFCOM Technologies 2016
RTBTM01 Bluetooth Module
This document contains proprietary information belonging to RFCOM Technologies. Passing on and copying of this document, use and communication of its contents is not permitted without prior written authorization
User Manual
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RTBTM01 BLE Module Page 2 of 30
Table of Contents
1. INTRODUCTION 6
1.1 DEFINITIONS, ACRONYMS, AND ABBREVIATIONS 6
1.2 REFERENCES 6
1.3 NAMING RULE 6
2. INTRODUCTION OF RTBTM01 BLE MODULE BOARD 7
2.1 KEY FEATURES 7
2.2 APPLICATIONS 7
2.3 BUILD-IN RICH SOFTWARE PROFILES FOR RICH APPLICATIONS 8
2.4 BLUETOOTH CORE SPECIFICATION 8
2.5 PHYSICAL OUTLOOK 9
3. BLOCK DIAGRAM 10
4. RTBTM01 PIN ASSIGNMENT 11
4.1 PIN ASSIGNMENT 11
4.2 PIN DEFINITION 11
5. APPLICATION SCHEMATIC 13
5.1 ADAPTOR BOARD SCHEMATIC 13
5.2 RF CONFIGURATION 13
5.3 APPLICATION INTERFACE 14
5.3.1 Communication at same potential (VDD) 14
5.3.2 Communication at different potential (1.8 V, 2.5 V) 15
6. ELECTRICAL CHARACTERISTICS 16
6.1 ABSOLUTE MAXIMUM RATINGS 16
6.2 INPUT & OUTPUT CHARACTERISTICS 16
6.3 CURRENT CONSUMPTION 17
7. RF CHARACTERISTICS 20
7.1 RF TRANSMISSION CHARACTERISTICS 20
7.2 RF RECEIVER CHARACTERISTICS 21
7.3 ANTENNA CHARACTERISTICS 23
8. DESIGN GUIDELINE 24
8.1 BLE FIRMWARE BRIEF 24
8.2 SERIAL COMMUNICATION WITH RTBTM01 25
9. MOUNTING REQUIREMENTS & PARAMETERS 26
9.1 MOUNTING REQUIREMENT 26
9.2 RTBTM01 PHYSICAL DIMENSION 27
9.3 RECOMMENDED LAND PATTERN 28
9.4 SOLDERING PROFILE 29
10. TAPE AND REEL PACKAGING 30
11. CERTIFICATION 31
11.1 FCC 31
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RTBTM01 BLE Module Page 3 of 30
12. ORDERING INFORMATION 32
13. CONTACT INFORMATION 32
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1. Introduction
1.1 Definitions, Acronyms, and Abbreviations
1.2 References
A reference is a document to which RFCOM Technologies refers. It could be a customer requirement document; it could be an internal RFCOM document.
RFCOM Technologies commit that the end product will behave as in any of the reference documents or it should explicit be mentioned. The following main documents are used in design:
1. RTBTM01 Bluetooth module software user manual
2.
3.
4. R5F11AG Preliminary User's Manual Evaluation Board
5.
6. Renesas rBLE Command Specification
1.3 Naming Rule
RT
BTM
01 - X
X - X
X
RT - Product Prefix of RFCOM Technologies BTM – BLE Module Board 01 – Hardware PCB Version Number XX – Hardware Revision Alphabet (A1 – internal antenna) XX – Firmware Revision Number (10 – default on-chip firmware)
BLE
Bluetooth Low Energy
DC
Direct Current
MCU
Micro-Controller Unit
UART
Universal asynchronous receiver/transmitter
ESD
Electrostatic discharge
RF
UART I2C
Radio Frequency Universal Asynchronous Receiver/Transmitter Inter-integrated Circuit
R5F11AG_BLE_Mannual R5F11AG_Datasheet
R5F11AG Bluetooth Low Energy Protocol Stack User’s Manual
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RTBTM01 BLE Module Page 5 of 30
2. Introduction of RTBTM01 BLE Module Board
RTBTM01 is a Bluetooth low energy module based on Renesas MCU R5F11AG Bluetooth Low Energy consumption RF transceiver supporting the Bluetooth ver.4.1 (Low Energy Single mode) specifications. This module has integrated RF Antenna, 32MHz Crystal, DC/DC inductor to make it easy to use in the
application product without requesting know-how of sensitive circuitry and RF design technics. Customer can optionally use RF connector, RF pin or RF chip Antenna on module for end-product development.
RTBTM01 is capable to operate either modem (as default) or embedded mode for the sake of cost saving and product size reduction. Embedded firmware is optionally available and in this case, customer may contact RFCOM Technologies for further information.
RTBTM01 BLE module is ROHS, CE, FCC Part 15 and RCM pre-approved module. Customers can directly adopt this module so as to delivery their products to market more efficiently.
2.1 Key features
2.4 GHz ISM band, Bluetooth v4.1 compliance
o Low Energy Single mode Mast & Slave
Ultra-low power consumption  Radio capabilities
o Transmit power: 3.2dBm o Receiver sensitivity: -89dBm o Line-of-sight range: 10 meters o Integrated chip antenna o RF connector is optionally available
Baseband capabilities
o 10-bit resolution A/D converter o Software programmable GPIO: 13 o Rich and flexible interfaces – CSI/ UART/I2C o Communication at different potential 1.8 V/2.5 V
Operation voltage: 1.6V to 3.6V  Operation temperature: -30°C to +85°C
Ultra-form factor: 10.0mm x 14.0mm x 1.9mm  ROHS, CE, FCC and RCM
2.2 Applications
Health and fitness gateways  M2M connectivity  Personal navigation devices
Consumer electronics
Industrial and home automation
Protocol Stack. The R5F11AG is a microcomputer incorporating the R5F11AG core and low power
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RTBTM01 BLE Module Page 6 of 30
2.3 Build-in rich software profiles for rich applications
Come together with RTBTM01-X-XX-X Module, the software package includes the following profiles for rich application:
HID device profiles
HOGP - HID over GATT profile
Proximity sensing
FMP - Find me Profile  PXP - Proximity Profile
Alerts and time profiles
PASP - Phone alert status Profile  TIP -Time profile  ANP - Alert Notification Profile
Health care profiles
HTP - Heart Thermometer Profile  GLP - Glucose Profile  BLP - Blood Pressure Profile
Sports and fitness profiles
HRP - Heart Rate Profile  CSCP - Cycling Speed and Cadence Profile  CPP - Cycling Power Profile  RSCP - Running Speed and Cadence Profile  LNP - Location and Navigation Profile
Other profiles
ScPP - Scan Parameters Profile  Sample and API for Custom profile
2.4 Bluetooth Core Specification
RTBTM01 Module supports the additional (optional) specification below.
Feature
Version
Support
Limited Discovery Time Changes
v4.0 Addendum
Yes
GAP Connection Parameters Changes
v4.0 Addendum
Yes
GAP Authentication and Lost Bond
v4.0 Addendum
Yes
Fast Advertising Interval
v4.0 Addendum
Yes
32 Bit UUIDs for LE
v4.1
Yes
LE Low Duty Cycle Directed Advertising
v4.1
Yes
LE Privacy (1.1)
v4.1
Yes
Table 2-1 Additional features in RTBTM01 BLE profiles
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RTBTM01 BLE Module Page 7 of 30
2.5 Physical Outlook
Figure 2-1 RTBTM01 BLE module
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RTBTM01 BLE Module Page 8 of 30
3. Block Diagram
Figure 3-1 Block Diagram of RTBTM01 BLE module shows the overall block diagram of RTBTM01 BLE Module.
32MHz Xtal
RF
RAM
Code Flash
Data Flash
MCU
I/O
1.8 ~ 3.6V
Antenna
I/O Ports
Serial Interface
Peripherals
RTBTM01
Figure 3-1 Block Diagram of RTBTM01 BLE module
MCU
complaint Bluetooth
radio V4.1.
Antenna
Antenna is a ceramic monopole chip antenna as well as optionally configurable RF connectors
32MHz Crystal
DC-DC converter
The build-in DC-DC convertor enable LV (low-voltage main) mode for ultra-low power current consumption operation
RTBTM01 is based on R5F CPU core. The chip includes all the functions required for a
The embedded 32MHz crystal is used for generating the internal digital clocks.
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RTBTM01 BLE Module Page 9 of 30
4. RTBTM01 Pin Assignment
4.1 PIN Assignment
Pin 1
Pin 2 Pin 3 Pin 4 Pin 5
Pin 6
Pin 7 Pin 8 Pin 9
Pin 22 Pin 21 Pin 20 Pin 19 Pin 18 Pin 17 Pin 16
Pin 15
Pin 14
Pin 13
Pin 12
Pin 11
Pin 10
Pin 25
Pin 24
Pin 23
Figure 4-1 RTBTM01 Bottom view
4.2 PIN definition
Pin Number
Pin Signal Name
Default Setting
Alternative Function 1
VSS
GND
GND
2
VSS
GND
GND
3
P1
I/O
External interrupt input /RTC correction clock (1 Hz) output
4
P2
I/O
Serial clock output, Timer Input/output
5
P3
I/O
I/O, Serial data input CSI20
6
P4
I/O
I/O, Serial data output CSI21
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RTBTM01 BLE Module Page 10 of 30
7
TxD0
UART Tx Pin
UART0 Transmit Data
8
RxD0
UART Rx Pin
UART0 Receive Data
9
P5
I/O
Serial Clock Output
10
P6
I/O
Analog Input
11
VSS
GND
GND
12
P7
I/O
UART1 Receive Data
13
P8
I/O
UART1 Transmit Data
14
P9
I/O
Analog Input
15
TOOL0
Flash programmer
Data Input/Output for programming
16
nRST
Reset
Reset
17
XT1
N.C.
32.768KH Crystal oscillator (Subsystem)
18
XT2
N.C.
32.768KH Crystal oscillator (Subsystem)
19
SCL0
I2C Clock Signal
Serial Clock Input/Output
20
SDA0
I2C Data Signal
Serial Data Bus line
21
VDD
Power supply (1.6V to 3.6V)
Power supply
22
VSS
GND
GND
23
VSS
GND
GND
24
RF_PAD
RF Output (optional)
RF Output (optional)
25
VSS
GND
GND
Table 4-1 RTBTM01 BLE Module PIN definition
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RTBTM01 BLE Module Page 11 of 30
5. Application Schematic
5.1 Adaptor Board Schematic
Figure 5-1 RTBTM01 Adaptor Board Schematic
5.2 RF Configuration
RF Configuration
R3
R4
C9
L2
C8
On-module Chip Antenna
(Default)
Not
Mounted
Not
Mounted
2.7nH
0
3.9nH RF Connector
0
Not Mounted
RF Pad
Not
Mounted
0
Not Mounted
Table 5-1 RF configuration (optional)
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RTBTM01 BLE Module Page 12 of 30
5.3 Application Interface
5.3.1 Communication at same potential (VDD)
5.3.1.1 UART interfaces
RTBTM01
User
MCU/Host
RxD
TxD
TxD0
RxD0
Pin7
Pin8
Figure 5-2 UART mode connection diagram at same potential
5.3.1.2 Simplified I2C interface
RTBTM01
User
MCU/Host
SCL
SDA
SCL0
SDA0
Pin19
Pin20
4K7*
VDD
4K7*
Figure 5-3 Typical pull-up resistor for I2C mode connection at same potential
The recommended typical pull-up resistor value 4.7K varies subject to designed communication line (SDA0, SCL0) load capacitance and operation clock frequency at different speed mode.
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RTBTM01 BLE Module Page 13 of 30
5.3.2 Communication at different potential (1.8 V, 2.5 V)
5.3.2.1 UART interfaces
RTBTM01
User
MCU/Host
RxD
TxD
TxD0
RxD0
Pin7
Pin8
4K7*
Vb
VDD
Pin21
VDD
Figure 5-4 UART mode connection diagram at different potential
In this case, VDD ≥ Vb and Vb is either 2.5V (2.3V ~ 2.7V) or 1.8V (1.6V ~ 2.0V). The recommended typical pull-up resistor value 4.7KΩ varies subject to designed communication line (TxD0) load capacitance and operation clock frequency at different speed mode. TTL mode is to be used, please contact RFCOM Technologies for more technical information.
5.3.2.2 Simplified I2C interface
RTBTM01
User
MCU/Host
SCL
SDA
SCL0
SDA0
Pin19
Pin20
4K7*
Vb
Pin21
VDD
VDD
4K7*
Figure 5-5 Typical pull-up resistor for I2C mode connection at different potential
In this case, VDD ≥ Vb and Vb is either 2.5V (2.3V ~ 2.7V) or 1.8V (1.6V ~ 2.0V). The recommended typical pull-up resistor value 4.7KΩ varies subject to designed communication line (SCL0, SDA0) load capacitance and operation clock frequency at different speed mode. TTL mode is to be used, please contact RFCOM Technologies for more technical information.
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RTBTM01 BLE Module Page 14 of 30
6. Electrical Characteristics
6.1 Absolute Maximum Ratings
Figure 6-1 Absolute maximum ratings
6.2 Input & Output Characteristics
Figure 6-2 Input & Output Characteristics
Parameter Symbol Min Max Rating Unit
VDD -0.5 +4.0 V
VSS -0.5 +0.3 V
Per GPIOs -0.3 VDD+0.3* V
RF_PAD -0.5 +1.4 V
Output voltage Per GPIOs -0.3 VDD+0.3* V
Analog input voltage P6, P9 -0.3 VDD+0.3* V
Per Pin -40 mA
Total Pins -170 mA
Per Pin 40 mA
Total Pins 170 mA
Operating temperature -30 +85 ⁰C
Storage temperature -40 +85 ⁰C
Power Supply
*Must be 4.0 V or lower
Input voltage
Output current, high
Output current, high
Parameter Condition Min Typ. Max Unit
Power Supply VDD 1.6 +3.6 V
High
1.6 V VDD ≤ 3.6 V, IOH = -1.0mA VDD-0.5 V
Low
1.6 V VDD ≤ 3.6 V, IOL = 0.3 mA 0.4 V
High 0.8VDD VDD V
Low 0 0.2VDD V
3.3 V VDD ≤ 3.6 V 2.0 VDD V
1.8 V VDD ≤ 3.3 V 1.5 VDD V
3.3 V VDD ≤ 3.6 V 0 0.5 V
1.8 V VDD ≤ 3.3 V 0 0.32 V
High
1.6 V VDD ≤ 3.6 V, Per pin -10 mA
Low
1.6 V VDD ≤ 3.6 V, Per pin +20 mA
HS (High-speed main) mode VDD = 2.7 to 3.6 V 1 32 MHz HS (High-speed main) mode VDD = 2.4 to 3.6 V 1 16 MHz
LS (Low-speed main) mode VDD = 1.8 to 3.6 V 1 8 MHz
LV (Low-voltage main) mode VDD = 1.6 to 3.6 V 1 4 MHz
High (TTL mode)
Low (TTL mode)
Input voltage
Output voltage
Normal mode (ITHL = 1)
Current
Clock Speed
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RTBTM01 BLE Module Page 15 of 30
6.3 Current Consumption
Tx power = 0dBm
Operation Mode
Peak Current
Average
Current (DC)
Unit
Normal Voltage
(3.0V)
Standby
[1]
-
9
𝜇𝐴
LE Scan (Master Mode)
3.8
see Fig. 6-4
[2]
𝑚𝐴
LE Connected (Slave Mode)
2.5
see Fig. 6-5
[2]
𝑚𝐴
LE Advertise (Slave Mode)
2.5
see Fig. 6-6
[2]
𝑚𝐴
Remarks: [1] Standby mode: RF unit is power down while MCU is idle mode; [2] LE average current consumption depends on the chosen TX interval and scanning window
Table 6-1 Current Consumption of RTBTM01 (Tx = 0dBm)
60ms scan
interval
30ms scan
window
Peak current = 3.8mA; Average current = 2.2mA
Figure 6-3 LE scanning with 30ms scan window, 60ms scan interval (VDD = 3V)
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RTBTM01 BLE Module Page 16 of 30
Peak current = 2.5mA, Average current = 0.6mA
Figure 6-4 LE connected with 70ms interval (VDD= 3V)
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RTBTM01 BLE Module Page 17 of 30
30ms
advertising
interval
Figure 6-5 LE advertising (3 channels) with 30ms interval (VDD= 3V)
Figure 6-6 Peak Current (mA) vs Tx Power (CW) (VDD= 3V)
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RTBTM01 BLE Module Page 18 of 30
7. RF Characteristics
7.1 RF transmission characteristics
Unless specified otherwise, the measurement is performed at normal condition @ TA = +25°C, VDD = 3.0 V.
Table 7-1 RF transmission characteristics
Figure 7-1 CW Output Power (dBm) over channels (0 to 39)
Parameter Condition MIN. TYP. MAX.
BLE Specification Unit
RF frequency range 2402 2480 2400 to 2483.5 MHz RF Transmit Power RF normal mode -3 0 3 20 dBm
Transmitted output power setting 0, -1, -2, -7, -10, -15 dBm -15 0 dBm
RF Power variation over BLE Channels 2 dB Spurious radiation 30 to 1000MHz -74 -36 dBm
1 to 12.75 GHz -42 -30 dBm
1.8 to 1.9 GHz -70 -47 dBm
5.15GHz to 5.3GHz -70 -47 dBm
Harmonics 2nd Harmonics -40 -30 dBm
3rd Harmonics -45 -30 dBm Drift rate 5 +/-25 KHz Carrier Frequency Offset 40 150 KHz
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7.2 RF receiver characteristics
Unless specified otherwise, the measurement is performed at normal condition @ TA = +25°C, VDD= 3.0 V.
Table 7-2 RF receiver characteristics
Figure 7-2 Channel 20 - Input Power (dBm) vs. RSSI reading
Parameter Condition MIN. TYP. MAX. BLE Specification Unit
RF frequency range 2402 2480 2400 to 2483.5 MHz RF sensetivity @ 30.8% RF normal mode
-89
-70 dBm
RSSI -3 3 dBm
RF sensetivity variation over BLE Channels Ch0 to Ch39 2 dB
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Figure 7-3 Receiver sensitivity @RF Normal Mode over Low-Mid-High Channels
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7.3 Antenna characteristics
The antenna is a standard monopole chip antenna. The radiation pattern is strongly dependent on the layout of end-product board. Typically the maximum radiated efficiency is around 30% subject to end-product board.
The 2-D radiated pattern below is measured on adaptor board, for illustration only.
Figure 7-4 2D Radiated Pattern on adaptor board
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8. Design Guideline
BLE firmware refers to the set of software that includes the BLE stacks compliant to the Bluetooth Low Energy protocol. RTBTM01 BLE module has pre-loaded configuration software has the application running on a standalone MCU (hereafter referred to as Modem mode) although the alternative configuration - one has
is also possible.
8.1 BLE Firmware Brief
RTBTM01 loads the Modem mode BLE firmware by default. For embedded mode BLE firmware, please contact RFCOM for assistance.
RTBTM01
Serial Driver
BLE Stack
Serial Interface
Host MCU
OS
Application
rBLE_Host
Serial Driver
Command Request (API Function call)
Event Notification Callback function call
Would be provided by RFCOM as binary file
Would be provided as source code files
Software customer needs to develop, sample code would be provided
Software by customer, but not mandatory
Figure 8-1 RTBTM01 and Host MCU
Figure 8-1 RTBTM01 and Host MCU demonstrates the use case of RTBTM01 module. Host MCU connects to RTBTM01 through serial interface. As promised, rBLE_Host source code would be provided to customer and together comes with sample code of the application. To have full control of the RTBTM01, customer just need customize the application, call rBLE API and handle the event notification reported from rBLE_Host. This could significantly reduce the development cost and speed to market.
For more software details, please refer to RTBTM01 Bluetooth module software user manual”.
integrated the application on R5F11AG (hereafter referred to as Embedded mode)
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8.2 Serial Communication with RTBTM01
Software in Modem mode runs TM01 module and the host MCU. Host MCU and RTBTM01 communicates via serial interface (UART). The exchange data is encapsulated based on the RSCIP (Renesas Serial Communication Interface Protocol). The RSCIP is based on the SLIP (Serial Line Internet Protocol) defined in RFC 1055, and is extended. The RSCIP ensures the reliability and robustness of the data communication using error recovery capabilities by retransmission.
The RSCIP driver performs protocol processing and control of the serial driver. It’s a part of the rBLE_Host software, whose source code would be provided to customer, refer to Figure 8-1 RTBTM01 and Host MCU.
For instruction how to use rBLE_Host, Refer to the Application Note: Renesas rBLE Command Specification for more details.
UART could be configured as follows, as shown in Figure 8-2 Settings of UART .
Setting
Setting Value
Baud Rate
4,800bps ~ 250kbps1
Data length
8bit
Parity
None
Stop bit
1 bit
Flow control
None
Figure 8-2 Settings of UART
In UART connection, the Host MCU and the RTBTM01 communicate using two signal lines (TxD and RxD). If the baud rate is greater than 4800bps, the Sleep function is disabled to reduce power consumption. There is no handshake operation.
Host MCU RTBTM01
TxD
RxD TxD0
RxD0
Figure 8-3 2-wire UART Connection
RTBTM01 Pin Name
Direction
Function
TxD0
BLE -> Host
Serial output data signal
RxD0
Host -> BLE
Serial input data signal
1
If you select the UART connection method and set the baud rate greater than 4,800 bps, the Sleep function is disabled. The Sleep function is always enabled in other connection method. The Sleep function realizes the low current consumption of BLE MCU
on two MCUS, the R5F11AG on RTB
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Figure 8-4 2-wire UART Pin Function
9. Mounting Requirements & Parameters
9.1 Mounting Requirement
RTBTM01 is a sensitive RF module. While using default on-module antenna, it’d better to be mounted at the corner of the application board and reserve some keep out space to the components on the application board. The RTBTM01 antenna is optimized for application board thickness of 1.0 mm. Do not place any metal (traces, components, battery etc.) on all layers within the keep-out area of the antenna. Connect all the GND pins directly to a solid GND plane and punch the GND vias on application board as close to the module GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines.
The figure below illustrates how to mount the RTBTM01 module. Improper mounting will decrease the RF
performance dramatically.
Application Board
Keep Out
Area
Shield Can
Figure 9-1 RTBTM01 Mounting on Application Board
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9.2 RTBTM01 Physical Dimension
10.0mm
14.0mm
25x0.6mm
16x1.3mm
5.3mm
3.9mm
25x1.2mm
Keep Out Area
9x1.2mm
Figure 9-2 RTBTM01 Bottom View
14mm (+/-0.1mm)
1.9mm (+/-0.1mm)
1.8mm (+/-0.1mm)
10mm (+/-0.1mm)
Figure 9-3 External Dimension
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9.3 Recommended Land Pattern
Keep Out Area
25x1.6mm
14mm
10mm
25x
0.6mm
16x
1.3mm
9x1.2mm
1.8mm
2.0mm
Figure 9-4 RTBTM01 Recommended Land Pattern
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9.4 Soldering Profile
Figure 9-5 Recommendable Reflow Profile
Standard soldering profile
Time
Pre-heating
150°C to 180°C
60s to 120s
Heating
220°C above
30s to 60s
Peak temperature
235°C to 245°C, Absolute max reflow temperature is 260ºC
5s
Remark
Please keep the temperature of the re-flow soldering as specified. (Please do not add temperature of more than 260)
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10. Tape and Reel Packaging
The reel is 330mm in diameter and each reel contains 500/1900 modules.
Figure 10-1 Taper and Reel Specification
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11. Certification
11.1 FCC
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired
operation.
Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.
Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device.
The final host device, into which this RF Module is integrated" has to be labelled with an auxilliary lable stating the FCC ID of the RF Module, such as "Contains FCC ID: 2AHUYBM01".
the Integrator will be responsible to satisfy SAR/ RF Exposure requirements
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12. Ordering Information
Number Code
Hardware Revision
On-chip Firmware
RTBTM01-A1-10
Antenna
Flash Memory
Data Flash Memory
default modem firmware
internal
256KB
8 KB
13. Contact Information
RFCOM Technologies Pte. Ltd.
20 Sin Ming Lane, #06-68, Midview City Singapore 573968 Telephone: (+65)6635 4217, (+65) 6570 6522 Email: askrfcom@rfcom-tech.com Website: www.rfcom-tech.com
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