Renesas Synergy AE-CLOUD2 User Manual

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Rev.1.00 Sep 2018

Renesas Synergy™ Platform

Synergy Tools & Kits Tool

www.renesas.com

All information conta ined in these mater ials, includin g products and pr oduct speci fications, represe nts

Application Example for Cloud Connectivity (AE

s Manual

User’s Manual

-CLOUD2)

User’

s: Connectivity

information on the product at the time of publicat ion and is subject t o change by Renesas El ectronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, in cluding the Renesas Electronics Corp. website (htt p://www.renesas.com).

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Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information.

2. Renesas Electronics hereby expressly disclaims any warranties agains t and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.

3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.

4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.

5. Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The intended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below.

"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual

equipment; home electronic appliances; machine tools; personal electronic equipment; industr ial robots; etc.

"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale

communication equipment; key financial terminal systems; safety control equipment; etc.

Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics dat a sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life supp ort devices or systems; surgical implantations; etc.), or may cause serious proper ty damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.

6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, "General Notes for Handling and Using Semiconductor Devices" in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, o perating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges.

7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteris tics, such as the occurr ence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas E lectronics document, Renesas Electronics products are not subject to radiation resistance design . You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.

8. Please contact a Ren es as Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefull y and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicab le laws and regulations. Renesas Electronics di sclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.

11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.

12. Please contact a Ren es as Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electron ics products.

(Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its directly or

indirectly controlled subsidiaries.

(Note 2) "Renesas E lectronics produ ct(s)" means any product d evel oped or manufactured by or for Renesas Electronics.

(Rev.4.0-1 November 2017)

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Renesas Synergy™ Application Example for Cloud Connectivity (AE-CLOUD2) Disclaimer

By using this AE-CLOUD2, the user accepts the following terms, which are in addition to, and control in the event of disagreement, with Renesas’ General Terms and Conditions available at https://www.renesas.com/en-us/legal/disclaimer.html.

The AE-CLOUD2 is not guaranteed to be error free, and the entire risk as to the results and performance of the AE-CLOUD2 is assumed by the User. The AE-CLOUD2 is provided by Renesas on an “as is” basis without warranty of any kind whether express or implied, including but not limited to the implied warranties of satisfactory quality, fitness for a particular purpose, title, and noninfringement of intellectual property rights with regard to the AE-CLOUD2. Renesas e xpressly disclaims all such warranties.

Renesas does not consider the AE-CLOUD2 a finished product and therefore the AE-CLOUD2 may not yet comply with some requirements applicable to finished products, including, but not limited to recycling (WEEE), CE, UL, restricted substances (ROHS), FCC, FEE, and electromagnetic co mpatibility regulations. Renesas or its affiliates shall in no event be liable for any loss of profit, loss of data, loss of contract, loss of business, damage to reputation or goodwill, any economic loss, any reprogramming or recall costs (whether the forego ing losses are direct or indirect) nor shall Renesas or its affiliates be liabl e for any other direct or indirect special, incidental or consequential damages arising out of or in relation to the use of this AE-CLOUD2, even if Renesas or its affiliates have been advised of the possibility of such damages.

Renesas has used reasonable care in preparing the information included in this document, but Renesas does not warrant that such information is error free nor does Renesas guarantee an exact match for every application or parameter to part numbers designated by other vendors listed herein. The information provided in this document is intended solely to enable the use of Renesas products. No express or implied license to any intellectual property right is granted by this document or in connection with the sale of Renesas products. Renesas reserves the right to make changes to specifications and product descriptions at any time without notice. Renesas assumes no liability for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas cannot verify, and assumes no liability for, the accuracy of information available on another company’s website.

Precautions

This Renesas Synergy™ Kit is only intended for use in a laboratory environment under ambient temperature and humidity conditions. A safe separation distance should be used between this and any sensitive equipment. Its use outside the laboratory, classroom, study area, o r similar such area invalidates conformity with the protection requirements of the Electromagnetic Compatibility Directive and could lead to prosecution.

The product generates, uses, and can radiate rad io frequency energy and may cause harmful interference t o radio communications. There is no guarantee that interference will not o ccur in a particular installation. If this equipment causes harmful interference to radio or television reception, which can be determined by turning the equipment off or on, you are encouraged to try to correct the interference by one or more of the following measures:

• Ensure attached cables do not lie across the equip ment .

• Reorient the receiving antenna.

• Increase the distance between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that which the r eceiver is connected.

• Power down the equipment when not in use.

• Consult the dealer or an experienced radio/TV technician for help.

Note: It is recommended that wherever possible shielded interface cables are used. The product is potentially susceptible to certain EMC phenomena. To mitigate against them it is recommended that the following

measures be undertaken:

• The user is advised that mobile phones should not be used within 10 m of the product when in use.

• The user is advised to take ESD precautions when handling the equipment.

The Renesas Synergy™ Kit does not represent an ideal reference design for an end product and does not fulfill the regulatory standards for an end product.

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Wi-Fi Module

USB Data/Power

(Connect to PC USB port)

MCU Boa rd

Cellular Bo ard

GPS Antenna

Ce llular Ant enna

PMOD Conector

USB (Data/ Pow er)

Host Mode Jumpers

GT202 C onnector

GT202 Wi-Fi Modu l e

On-board Wi -Fi Antenna

Power Selection Jumper

1. Overview

The AE-CLOUD2 is an Application Example Kit for Cloud connectivity, intended for fast prototyping of embedded systems, specifically targeting Internet of Things applications. The kit includes all compo nents required for development and debugging of software that can collect information from a variety of sensors and communicate it securely to the Cloud.

The kit incl udes a Wi-Fi board based on the GT202 module that uses Qualcomm board supports 802.11 b/g/n communication standards.

Figure 1 Cloud Connectivity Application Example Kit

QCA4002 system on a chip. The

R12UM0033EU0100 Rev.1.00 Page 4 of 48 Sep 5, 2018

Figure 2 Wi-Fi Board based on the GT202 Module

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Arduino Header

(Power)

Arduino Header

(AD)

Arduino Header

(IOH)

Arduino Header

(IOL)

BG96

Module

Cellular

Antenna

GPS

Antenna

SIM Card

Slot

Micro USB

LED

(G,B,R)

8-pin

Voice Header

6-pin

I/O Header

4-pin

DBG Header

PWRKEY

Pus h B utto n

RESET

Pus h B utto n

USB Boo t

Jumper

Pus h B utto n (Re s et )

Pus h B utto n (Us e r)

HanRun

Low Profil e RJ-45 Connector

Grove (UA RT/AD C )

Grove (I2C)

Renes as Synergy S124 JLOB MCU

Knowles high SNR/AOP Analog Microphone

Realtek 10/100Mbps Ethernet PHY

USB (Device/Pow er )

ISSI QPSI Flash (32MB)

PMOD Conn ec t or

JTAG Connector

USB

(Debug/Power)

Arduino Header

(Power)

Arduino Header

(AD)

Bosch Geomagnetic Sensor

Renesas Di gi tal

Ambient Light Sensor

User LED (Green )

Bosch 3-aixs Accelerometer/3-axis Gyroscope

Bosch Environmental Sensor

Arduino Header

(IOH)

Arduino Header

(IOL)

Power LED (Green )

J-Link LED (Green)

TXC 25MHz Crystal

TXC 12MHz Crystal

User LED (Y ellow)

User LED (Red)

Renesas Synergy S5D9 MCU

The kit also includes a cellular connectivity shield based on the Quectel BG96 module. It provides 4G/LTE Cat-M1 (eMTC) and 4G/LTE Cat-NB1 (NB-IoT) support with fallback to 2G/EGPRS mobile networks. In addition, it integrates a GPS receiver which enables the development of position-tracking applications.

At the heart of the kit is the MCU board based on the Renesas Synergy™ S5D9 Microcontroller. Figure 4 describes the main board components, the interface connectors, and their purpose.

Figure 3 Arduino Shield for Cellular Network Connectivity

Figure 4 S5D9 Synergy MCU Board Components

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

1.1 Board Fe atures

• Synergy S5D 9 Arm® Cortex®-M4 Core

 Arm  Maximum operating frequency: 120 MHz  Secure Crypt o Engine  Memory Protection Unit and Flash Access Window  Floating Point Unit  SWD debugging interface

• Memory

 640 KB SRAM  2 MB Code Flash  64 KB Data Flash  32 MB External QSPI Flash

• Connectivity

 Wired Ethernet (RJ45) 10/100 Mbps  USB 2.0 Full Speed  UART (through the Arduino or Seeed Grove connector)  I  SPI (thro ugh the Ardui no or Digilent PMOD connector)

• Sensors

 Accelerometer and Gyroscope (Bosch BMI160)  Magnetometer (Bosch BMM150)  Environmental – Gas, Pressure, Temperature, Humidity (Bosch BME680)  Ambient Light (Renesas ISL29035)  Acoustic (Knowles MEMS microphone SPM0687LR5H-1)

• General Purpose I/O Ports

 User-defined LE D s  User-defined button  Arduino Shield Headers  Seeed Studio’s Grove Connectors

• Operating Voltage

 5V

v7E-M architecture

C (through t he Arduino or Seeed Grove connector)

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Wi-Fi PMOD

2x 1ft Mi cr o US B Cable

1x 1ft Eth er net Ca ble

S5D9 MCU Board

Cellular Arduino Shield Cellular Antenna GPS Antenna

2. What’s in the Box

The AE-CLOUD2 kit includes the follo wing components:

• Synergy S5D9 MCU board

• Wi-Fi module

• Cellular Arduino Shield

• Two USB cables and one Ethernet cable

• Cellular antenna

• GPS antenna

• Quick Start Guide (back side of packaging box cover)

• Important Notice and Disclaimer Card

Figure 5 AE-CLOUD2 Box Contents

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Micro U SB cable for Power/Debug

Micro USB cable

for Power/Data

Eth er net Cable for

connection to router

C ell ular Antenna

GPS Antenna

PC USB Port

Router LAN Port

Laptop PC

Internet Router

3. Getting Started

Before you start working with your development board, you must obtain the latest version of the Synergy Software Package (SSP), as well as the development tools needed to work with it.

If you are new to Synergy development, we encourage you to use the AE-CLOUD2 Quick Start Guide. This guide will provide detailed instructions on how to register an account on the Synergy Gallery to o btain a developer license, and how to download and install all software & tools that are required. Once you have completed these steps, please return to this section for more in-dep th in formation on ho w to wor k wit h yo ur S5D9 MCU board.

3.1 Connecting the Boards

Plug the Wi-Fi Module to the MCU board through a PMOD connector. Plug the Cellular Arduino Shield into the S5D9 MCU board. Be careful to align the Arduino Shield connector pins correctly.

Connect the USB cables from J6 (for debugging) and from J9 (for communication) on the MCU Board to the host computer. The USB Device connector (J9) provides 5V power to the entire kit. The USB J-Link OB Debug connector (J6) provides 5V power only to the MCU board.

For cellular and GPS operation, connect the cellular antenna and the GPS antenna to their corresponding connectors on the Cellular Arduino Shield. As seen in Figure 6, the cellular antenna goes to the top connector.

3.2 Download Application Software

The kit comes without firmware pre-installed on its MCU board. The user is encouraged to download cloud connectivity example projects of their choice by searching for AE-CLOUD2 at http://renesassynergy.com.

On this kit webpage, the user can find links to the individual application projects for Microsoft Azure, Amazon Web Service (AWS), and Google Cloud Platform as well as Synergy Enterprise Cloud Toolbox demo and Medium One IoT Prototyping Sandbox tutorial.

R12UM0033EU0100 Rev.1.00 Page 8 of 48 Sep 5, 2018

Figure 6 Connecting the Boards from the Kit

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

S5D9

Microcontroller

Serial

NOR Flash

(256Mbits)

QSPI

Knowles

Analog

MIC

Bosch

-axis

Compasss

Bosch

Environmental

Sensor

RJ-45

USB 2.0 (

4. S5D9 MCU Board

4.1 MCU Board Overview

Figure 7 shows the top view of the MC U Board. It is built around the versatile Rene s as Synergy™ S5D9 Microcontroller. The SEGGER J-Link so that no ext ernal programming probes are nee ded. The board is highly integrated with many sensors, external flash memory, Ethernet PHY , Arduino, Grove and PMOD connect ors, buttons and LEDs. The rich functionality of the board makes it ideal for prototyping a wide range of IoT Solutions.

On-board , using the Renesas Syner gy™ S124 MCU, provides a debug interface

Figure 7 MCU Board

Figure 8 shows the MCU board main components. It includes all interfaces – both internal and externa l.

Figure 8 MCU Board System Architecture

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Parameter

Value

Minimum

Maximum

Power Supply Voltage

3.7V

5.5V

Current Consumption

500 mA

Digital Inputs Voltage

3.3V

Digital Outputs Voltage

3.3V

Operating Temperature

0°C

+75°C

PMOD Connector Power Voltage

3.3V

Grove Connectors Power Voltage

3.3V

The MCU board includes the following mai n components:

• The Synergy S5D9 MCU featuring 2 MB code flash/640 KB SRAM/64 KB data flash.

• A power management based on 3.3V LDO voltage regulator required for the operation of the microcontroller.

• Quad SPI flash – the MCU flash memory is expande d with external 256 Mbits (32 M B) memory device connected

over a high -speed QSPI interface. T he external flash can be used for storage of graphics and other digital assets, or for execution of code in place (XIP).

• User-defined LE D s – the user-defined LEDs are useful in indicating the current state of the firmware. The 3 LEDs

have different colors for easy identification.

• USB device interface – the S5D9 MCU includes one USB interface operating at full speed. The USB device

connector is also used to power the board.

• PMOD interface header – the board includes one 12-pin PMOD header that can be configured by a jumper to

provide 3.3V on its power pins. The header enables interfacing with other devices over SPI or UART.

• Grove connectors – the Grove connectors are compatible with the Seeed Studio’s line of peripheral modules that

include a very large selection of sensors and actuators. One of the Grove connectors can be configured to communicate over UART and the other is dedicated for I

• J-Link On-Board SEGGER debugging probe based on Syner gy S124 MCU.

• JTAG interface that is available on a 10-pin connector (J20) compatible with SEGGER debugging probe.

• The board includes a number of sensors described in detail in section 5.3.

C interface.

4.2 Power Requirements

The AE-CLOUD2 is designed to be powered by the USB device interface on J9 connect or. The S5D9 board can supply power to the devices connec ted to it. The PMOD interface and the Grove connectors can

power 3.3V peripherals. The power supply requirements and current consumption specifications are listed in following table.

Table 1 Electrical Speci f icat io ns

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

4.2.1 Power Supply Options

The power supply source is the J9 - USB Micro-B connector providi ng 5 V and up to 500 mA of po wer.

Figure 9 Power Supply Management

Note that the Schottky diodes provided are in series with the power source. This protects them from overload in case both are connected and one has higher voltage than the other.

4.2.2 Power-up Behavior

Upon power up, the MCU is idle until its RESET pin registers transition to logic 1. At this point, the MCU hardware samples the logic level of the MD pin. The MD pin level determines if the MCU will enter ‘Factory Boot Mode’. In this mode, the MCU executes an internal firmware code that initializes the USB interface and prepares the device to communicate with utilities that can upd a te the content of its memory.

The state of the MD pin at startup is defined by S2. If the button is pressed at the time of the RESET signal, then the factory bootloader will execute on startup . If S2 is not pressed at the time o f the RE SE T signal, then the MCU will execute the code previously loaded to the MCU code flash memory.

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Sensor

I2C MCU

Address

ADC

Number

BMI160 Accelerometer

0x68

IRQ9 (INT1), IRQ8 (INT2)

N/A

Bosch

BMM150 Magnetometer

0x10

IRQ4

BME680 Humidity and Temperature

0x76

N/A ISL29035 Light Sensor

0x44

IRQ7

Renesas

SPM0687LR5H-1 Microphone

N/A

1 (P0_1)

Knowles

4.3 Installed Sensors

The on-board sensors provide variety of options when it comes to prototyping IoT applications:

• Accelerometer, Gyroscope and Magnetometer: Bosch Sensortec - BMI160 (U4) and BMM150 (U9)

 BMI160 is an extremely small low power and low noise 6-axis accelerometer and gyroscope.  The integrated accelerometer provides all functionalities of Bosch Sensortec’s leading-edge 12-bit digital

accelerometer, including a 32-frame FIFO buffer storing acceleration data.

 The interface to the MCU is based on the I

• Accelerometer = 0x68

• Magnetometer = 0x10

 Connected to MCU I

C Channel 2 with pins configured to use Port 5 bits 11 and 12:

• Data (SDA) = P5_11

• Clock (SCL) = P5_12

• Environmental Sensor: B o sch Sensortec. – BME680 (U7)

 The BME680 is a digital 4-in 1 senso r with ga s, hu mid i t y, pr e ssur e, and temperature measurement based on

proven sens ing principles

 The interface to the MCU is based on the I  Connected to MCU I

C Channel 2 with pins configured to use Port 5 bits 11 and 12:

• Data (SDA) = P5_11

• Clock (SCL) = P5_12

• Ambient Light Sensor: Renesas - ISL29035 (U6)

 The ISL29035 is an integrated ambient and infrared light-to-digital conver te r with I

advanced self-calibrated photodiode array emulates human eye response with excellent IR rejection. The on-chip 16-bit ADC is capable of rejecting 50 Hz and 60 Hz flicker caused by artificial light sources. The Lux range select feature allows users to program the Lux range for optimized counts/Lux.

 The interface to the MCU is based on the I  Connected to MCU I

C Channel 2 with pins configured to use Port 5 bits 11 and 12:

• Data (SDA) = P5_11

• Clock (SCL) = P5_12

• MEMS Microphone: Knowles SPM0687LR5H-1 (U10)

 The SPM0687LR5H-1 is a miniature, high-performance, low power, top port silicon microphone. It consists of

an acoustic sensor, a low noise input buffer, and an output amplifier.

 The device has the following main features:

• 20 dB of Gain

• Low current consumption

• MaxRF protection

• Ultra-stable performance

• Omnidirectional

 The microphone output is wired t o MCU ADC Channel 1 (P0 _1).

Table 2 Summary of the Sensors and their MCU Interfaces

C protocol. The sensor has hard coded individual addresses:

C protocol. The sensor has hard coded address on the I2C Bus: 0x76.

C bus interface. Its

C protocol. The sensor has hard coded address on the I2C bus: 0x44

R12UM0033EU0100 Rev.1.00 Page 12 of 48 Sep 5, 2018

Ch 2 Bus

Interrupt Request

Channel

Manufacturer

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Pin Number

RJ45 Ethernet Port

TX+

TX-

RX+

neutral

RX-

neutral

Pin Number

PMOD (J5)

SSLB0/CTS9 – P2_5

MOSI/TXD9 – P2_3

MISO/RXD9 – P2_2

RSPCK/SCK9 – P2_4

GND

3.3V

GPIO – P4_9/IRQ6

GPIO – P4_12

GPIO – P3_7

GPIO – P3_6

GND

3.3V

4.4 Connecti vity and Settings

4.4.1 RJ45 Ethernet Connector

The S5D9 MCU Board features standard Ethernet connector RJ45 with built-in magnetics. It is connected to RealTek PHY interface P/N: RTL8189EM-CG. The PHY is connected to the MCU via RMII interface. The RJ45 connector is HanRun Electronics Ltd. P/N: HR915102AE. Its front view is shown in Figure 10.

Figure 10 RJ45 Ethernet Connector

The pin mapping of the co nnector matches the st andard for Ethernet ports. The pi n mapping is shown in the following table.

Table 3 Ethernet RJ45 pin map

4.4.2 PMOD Connector

The S5D9 MCU board includes one PMOD connector. It can interface with modules that require UART, I2C, or SPI interface. The function of the PMOD is dependent on the MCU pin functions initialization. The PMOD connector pin map is shown in the following table.

Table 4 PMOD Pin Functions

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Pins

Grove A (J3) UART

Grove B (J4) I2C

P5_5/SCL6/RXD6/AN118

P1_0/SCL1

P5_6/SDA6/TXD6/AN019

P1_1/SDA1

3.3 V

GND

Figure 11 shows the schematic of the PMOD interface.

Figure 11 PMOD Interface Schematic

4.4.3 Grove A and B Connectors

The Grove connectors offer the following interfaces:

• UART / I

• I

C interface (Grove B – J4)

The pin-mapping of the connectors is described in following table.

C or Analog interface (Grove A – J3)

Table 5 Grove Connector Pin Mapping

Note that the specific function of the Grove A (J3) depends on the pin-muxing configuration controlled by the application specific needs.

Figure 12 shows the schematic of the Grove interfaces.

R12UM0033EU0100 Rev.1.00 Page 14 of 48 Sep 5, 2018

Figure 12 Grove Connectors Schematic

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

LED Number

Color

Designator

Device Port/Pin

Green

LED1

P7_8

Yellow

LED2

P7_10

Red

LED3

P7_11

Green

LED4

N/A (Power indicator)

USB Device Connector

S5D9 Microcontroller

Description

VBUS, +5VDC

P4_7/USB_VBUS

USB Voltage detection

Data-

USB_DM

Negative data line

Data+

USB_DP

Positive data line

USB ID, jack internal switch, cable inserted

(Not connected)

Ground

VSS

Circuit Ground

4.4.4 On-Board LEDs

The S5D9 MCU board provides 3 on-board LEDs for user-defined functions. A fourth LED is used to indicate 3.3V power presence. The LEDs are connected to general purpose output pins through a single resistor. The output active state is 1. The table below describes the mapping between the LEDs and the ports that drive them.

Table 6 LED to Port Mapping

Figure 13 shows the schematic of the user LEDs.

Figure 13 LED Schematic

4.4.5 USB Device

This USB Micro-B connection jack connects the S5D9 MCU to an external USB 2.0 Host, Full Speed capable. The USB power presence (VBUS) is wired to GPIO input P4_7 after it is passed through resistor divider.

Table 7 USB Device Connector to S5D9 MCU Pin Mapping

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Figure 14 shows the USB interface schematic.

Figure 14 USB Interface Schematic

4.5 Arduino-Compatible Expansion Headers

The S5D9 MCU board includes Arduino-compatible headers that enable interfacing with a wide range of Ard ui no Shields and expanding its features. Most of the interface signals are connected directly to the MCU pins. This enables their configuration to change depending on the application needs. Figure 15 indicates the port and pin number for each interface signal along with its primary role. The specific function and pin-muxing depends on the application and the hardware specifics of the S5D9 MCU.

Note that the 5V power brought to the POWER header pin 4 is connected directly to the USB VBUS power rail from the USB device connector (J6).

Figure 15 Parallel I/O expansion Schematic

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Arduino

Number

Arduino Pin

MCU GPIO

Primary Pin Function

Alternative Pin Function

POWER

Vin

N/C

GND

Ground

3 GND

GND

Ground

4 5V USB_VBUS

5 3.3V

3.3V

RESET

3.3V

Reserved

N/C

AD 1 AD0

P5_8

AN020

2 AD1

P5_6

AN019

SDA6 / TXD6

AD2

P5_5

AN118

SCL6 / RXD6

AD3

P5_0

AN016

5 AD4

P5_1

AN116

SDA5 – I2C Data

AD5

P5_2

AN017

SCL5 – I2C Clock

IOL 1 IO0

P6_14

GPIO

RXD7 – UART

IO1

P6_13

GPIO

TXD7 – UART

IO2

P6_12

GPIO

4 IO3

P6_11

GPIO

CTS7 – UART

IO4

P6_9

GPIO

6 IO5

P6_2

GPIO

7 IO6

P6_1

GPIO

8 IO7

P6_13

GPIO

IOH

IO8

P1_11

GPIO

2 IO9

P1_10

GPIO

3 IO10

P1_7

GPIO

SS8 – SPI Slave Select

IO11

P1_5

GPIO

MOSI8 – SPI MOSI

IO12

P1_4

GPIO

MISO8 – SPI MISO

IO13

P1_6

GPIO

SCK8 – SPI Clock

GND

Ground

AREF

3.3V Analog

Analog Power 3.3V 9

SDA

P1_1

GPIO

SDA1

SCL

P1_0

GPIO

SCL1

Table 8 shows the mapping between the Arduino headers pins and the MCU pins connected to them along with their primary and additional functions.

Table 8 Arduino Headers Pin Map

Header Pin

Name

Port

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Reference

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4.6 Electrical Schematics

4.6.1 Power Supply, User LED Schematic

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4.6.2 S5D9 MCU, Reset Circuit, QSPI Flash Memory Schematic

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4.6.3 Ethernet Interface, PHY Schematic

4.6.4 USB Interface Schematic

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4.6.5 Sensors Schematic

4.6.6 Arduino, PMOD and Grove Connectors Schematic

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4.6.7 J-Link On-Board, JTAG Interface Schematic

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Parameter

Value

Size

Area: 24 x 18 x 2.5 mm Height: 3.6 mm

Operating voltage

3.3V ± 10%

Operating humidity

20-70%

Operating temperature range

10°C ~ +65°C

RF connector

U.FL of Hirose

Host interface

UART, SPI

4.7 MCU Board Mechanical Dimensions

(All dimensions are in millimeters)

5. Wi-Fi Board

The Wi-Fi board is based on the GT 202 module. It incorporates the Qualcomm® Atheros QCA4002 device. T he QCA4002 is a system on a chip (SoC), implementing the 802.11 b/g/n communication standards. It is optimized for low-power embedded applications with single-stream capability for both transmit and receive streams. The SoC has an integrated network pr ocessor wit h a large set of TCP/IP with IPv4/IPv6-based services. They can be accessed via highspeed SPI interface that is accessible on a 12-pin PMOD header.

Table 9 Wi-Fi Board Specifications

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PMOD Conector

USB (Data/ Pow er)

Host Mode Jumpers

GT202 C onnector

GT202 Wi-Fi Modu l e

On-board Wi -Fi Antenna

Power Selection Jumper

Figure 16 Main Wi-Fi Board Components

5.1 Wi-Fi Board Block Diagram

Figure 17 shows the Wi-Fi board block diagram. Its main component is the GT202 module that incorporates the QCA4002 SoC. The power options include USB and PMOD header. The 5V USB power is regulated to 3.3V with a step-down converter to 3.3V. A dedicated jumper is used to select the desired power source.

The GT20 2 Wi-Fi module integrates the QCA4002 SoC on a carrier board which brings out three different host connectivity options:

• SPI interface through the PMOD connector – used for interfacing with the AE-CLOUD2 MCU board and power

• SDIO / UART interface – used for rapid prototyping and low communication speeds (not utilized by the AE-

• USB interface / Host-less – used for fast prototyping, diagnostic and alternative power supply (not utilized by the

R12UM0033EU0100 Rev.1.00 Page 24 of 48 Sep 5, 2018

Figure 17 Wi-Fi Board Block Diagram

supply source. This interface provides fast communication speed and access to the full networking functionality.

CLOUD2 kit)

AE-CLOUD2 kit)

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Jumper J2 bridge pins

Jumper J3 bridge pins

Communication Interface

1 - 2

USB

1 - 2

2 - 3

SPI

2 - 3

SDIO/UART

Jumper J6 bridge pins

Power Source

1 - 2

USB

2 - 3

PMOD

Pin Number

Function

Pin Number

Function

CS 7 Interrupt (Out)

MOSI

Power Down (In)

MISO

N.C.

CLK

N.C.

GND

3.3V

1 2 3

  

1 2 3

  

1 2 3



USB

PMOD

5.2 Wi-Fi Board Jumper Settings

The Wi-Fi board includes jumpers that configure the desired host connectivity option. The jumper settings that control these options are described in Table 10.

Table 10 Jumper Settings Controlling Host Connectivity Options

The power selection jumper setting is described in Table 11.

Table 11 Power Selection Jumper Settings

The settings required for the operation of the AE-CLOUD2 kit are defined as follows:

Host mode jumpers (J2 and J3) to select SPI Communication Interface

Power selection jumper (J6) to select PMOD

Wi-Fi Board PMOD Connector pin map is described as follo ws. The PMOD specification allows for configurable voltage. However, this Wi-Fi PMOD board is a 3.3V device. The S5D9 MCU board is configured to provide 3.3V to the PMOD interface.

Table 12 PMOD Pin Map

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5.3 Wi-Fi Board Schematic

Figure 18 Wi-Fi Board Schematic

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1.81in (46mm)

1.89in (48mm)

2.05in (52mm)

5.4 Wi-Fi Board Mechanical Dimensions

Figure 19 Wi-Fi Board Mechanical Dimensions

6. Cellular Connectivity Board

The AE-CLOUD2 provides cellular connectivity by utilizing Quectel BG96 modem, installed on an Arduino Shield board. The BG96 module supports multiple cellular standards as well as a GPS receiver that enables the prototyping of position tracking applications.

Figure 20 Cellular Connectivity Board

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6.1 Cellular Arduino Shield Block Diagram

Figure 21 shows the BG96 module connec tions to the main components and he aders.

Figure 21 BG96 Module Connections

6.2 Cellular Arduino Shield Connectors, Jumper Settings, and LEDs

Figure 22 Cellular Arduino Shield Connectors, Jumper Settings, and LEDs

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Label

Function

Description

Debug UART interface

Serial port (UART2) interface for debug and log output

Analog Input and Digital

2xAnalog input and 2xGPI O

PCM Voice Interface

Interface for an external CO DE C board for voice communication

RESET

RST Key

Reset the BG96 module

PWRKEY

Power Key

Turn the BG96 module on/off

CON1

Micro USB

USB Interface for power and control

USB BOOT

Force the BG96 module to boot from USB port for firmware upgrade

Cellular Antenna

SMA connector for cellular antenna

GPS Antenna

SMA connector for GPS antenna

Pin Number

Name

Description

VCC_5V

+5V supply voltage

DBG_RxD

BG96 Module UART2 RxD

DBG_TxD

BG96 Module UART2 TxD

GND

GROUND

Pin Number

Name

Description

GPIO0

General input/output 0

GPIO1

General input/output 1

ADC0

Analog input 0

ADC1

Analog input 1

GND

GROUND

VCC_5V

+5V supply voltage

Pin Number

Name

Description

I2S_SCL

I2C serial clock

I2S_SDA

I2C serial data

PCM_SYNC

PCM frame sync output

PCM_CLK

PCM clock output

PCM_IN

PCM data input

PCM_OUT

PCM data output

GND

GROUND

VCC_5V

+5V supply voltage

LED Number

Color

Designator

Device Port/Pin

Red

LED1

Indicate the BG96 module’s power status

Blue

LED2

Indicate the BG96 module’s network activity status

Green

LED3

Indicate the BG96 module’s network operation status

Table 13 Summary of Connectors and Switches

I/O interface

Table 14 P1 – Debug UART Interface

Table 15 P2 – Analog Input and Digital I/O interface

Table 16 P3-PCM Voice Interface

On-Board LEDs

The Cellular Arduino Shield provides 3 on-board LEDs to display its working status. Table 17 describes the mapping between the LEDs and the ports that drive them.

Table 17 LED to Port Mapping

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Arduino

BG96 module

Primary Pin Function

POWER

Vin

N/C

2 GND

GND

Ground

GND

Ground

5V Cellular Arduino Shield power supply (+5V)

3.3V

N/C

6 RESET

N/C

7 3.3V

Cellular Arduino Shield I/O reference voltage (+3.3V)

Reserved

N/C

AD 1 AD0

N/C

2 AD1

N/C

3 AD2

N/C

4 AD3

N/C

5 AD4

N/C

6 AD5

N/C

IOL 1 IO0

PIN 35

UART1_RxD

IO1

PIN 34

UART1_TxD

IO2

PIN 39

RI 4 IO3

PIN 30

DTR

IO4

PIN 19

AP_READY

IO5

PIN 16/17

RESET

IO6

PIN 15

PWRKEY

IO7

PIN 20

RESET

IOH

IO8

PIN 18

W_DISABLE

IO9

PIN 1

PSM_IND

IO10

N/C

4 IO11

PIN 28

UART3_RxD

IO12

PIN 27

UART3_TxD

IO13

N/C

7 GND

GND

Ground

AREF

N/C

9 SDA

N/C

SCL

N/C

6.3 Cell ular Arduino Shield Arduino-Compatible Expansion Header s

The Cellular Arduino Shield includ e s Ard ui no -co mpatible header s that enable interfacing with S5D9 MCU board. Most of the interface signals are connected directly to the BG96 module pins. This enables direct control of BG96 module depending on the application needs.

The table below shows the mapping between the Arduino headers pins and the BG96 module pins connected to them along with their primary functions.

Table 18 Arduino Header Pins and BG96 Module Pin Primary Functions

Header Pin Number

Pin Name

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6.4 Cell ul ar Arduino Shield Schematics

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6.5 Cell ul ar Arduino Shield Mechanical Dimensions

(All dimensions are in millimeter s)

6.6 Cell ular Antenna

The cellular ante nna for Cellular Arduino Shield is shown Figure 23. It covers working frequency band from 824 MHz to 2690 MHz.

Figure 23 Cellular Antenna for Ce llular Arduino Shield

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Frequency (MHz)

Voltage Standard Wave Ratio (VSWR)

700

9.3

800

4.6

880

3.6

960

4.9

1,710

9.3

1,880

4.4

2,170

Voltage Standard Wave Ratio (VSWR) plot is shown as follo ws.

VSWR data is shown in the fo llowing table.

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Smith Plot is shown as foll o ws.

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Radiation Pattern H-plane is shown as follows.

Figure 24 Radiation Pattern H-plane

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Radiation Pattern E-plane is shown i n the following graphics.

Figure 25 Radiation Pattern E-plane (E1)

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Frequency [Hz]

Efficiency

Gain [dBi]

7E+08

49%

1.632948

7.1E+08

51%

1.826395

7.2E+08

49%

1.833288

7.3E+08

44%

1.600659

7.4E+08

46%

1.896142

7.5E+08

50%

1.936788

7.6E+08

50%

1.721112

7.7E+08

46%

1.406281

UGAIN and Efficiency is listed in the table below

Table 19 Gain and Efficiency at Different Frequencies

R12UM0033EU0100 Rev.1.00 Page 42 of 48 Sep 5, 2018

Figure 26 Radiation Pattern E-plane (E2)

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7.8E+08

45%

1.491829

7.9E+08

47%

1.8309

8E+08

45%

1.843967

8.06E+08

41%

1.714366

8.1E+08

45%

2.215538

8.24E+08

42%

1.97312

8.34E+08

44%

1.890023

8.44E+08

42%

1.407188

8.54E+08

42%

1.453714

8.64E+08

47%

2.111646

8.74E+08

46%

1.93289

8.8E+08

48%

1.960958

8.84E+08

46%

1.930333

8.94E+08

52%

2.347337

9E+08

50%

2.192946

9.1E+08

50%

2.265394

9.2E+08

49%

2.081987

9.3E+08

48%

2.005751

9.4E+08

49%

2.128994

9.5E+08

49%

2.305449

9.6E+08

48%

2.233022

1.71E+09

35%

0.02584

1.72E+09

35%

0.0088

1.73E+09

36%

0.647356

1.74E+09

44%

0.806863

1.75E+09

35%

0.03676

1.76E+09

46%

0.549059

1.78E+09

34%

0.14522

1.79E+09

35%

0.41562

1.81E+09

36%

0.35094

1.83E+09

34%

0.30882

1.85E+09

38%

0.430313

1.86E+09

35%

0.33059

1.88E+09

37%

0.008792

1.9E+09

43%

0.479122

1.92E+09

40%

0.111459

1.94E+09

46%

0.407999

1.96E+09

44%

0.037526

1.98E+09

48%

0.405617

1.99E+09

48%

0.112167

2E+09

47%

0.144104

2.02E+09

46%

0.14634

2.04E+09

47%

0.033818

2.06E+09

45%

0.112366

2.08E+09

51%

0.672779

2.1E+09

48%

0.291807

2.12E+09

54%

0.939911

2.14E+09

54%

1.161325

2.16E+09

59%

1.631935

2.17E+09

59%

1.967355

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Post

Tolerance

Range of Receiving Frequency

1575.42 ± 1.1

± 2.5

Center Frequency (MHz) (w/ 30mm2 GND plane)

1575.42

± 3.0

Bandwidth (MHz) (Return Loss ≤ -10dB)

≥10

± 0.5

VSWR (in Center Frequency)

≤2.0

± 0.5

Gain (Zenith) (dBi Typ) (w/ 70mm2 GND Plane)

4.5

± 0.5

Axial Ratio (dB) (w/ 70mm2 GND Plane)

3.0

± 0.2

Polarization

Right-Handed Circul ar

Impedance (Ω)

Frequency Temperature Coefficient (ppm/ºC)

0 ± 10

The cellular antenna mechanical dimensions are shown as follows.

Figure 27 Mechanical Dimensions of the Cellular Antenna

6.7 GPS Antenna

The GPS ant enna for Cellular Arduino Shield is shown as foll ows.

Figure 28 Cellular Arduino Shield GPS Antenna

Antenna specifications are listed in the following table.

Table 20 Antenna Specifications

Item Specifications

Environmental

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Item

Specifications

Frequency Range

1575.42 MHz

Gain

27 dB

VSWR

≤2.0

Noise Coefficient

≤2.0 dB

DC Voltage

3 to 5V

DC Current

5 ± 2 mA

Normal Temperature

High Temperature1

Low Temperature2

Amplifier Gain

27 dB ± 2.0

VSWR

≤ 2.0

Noise Coefficient

≤ 2.0

Conditions

Temperature

Humidity

Working

-35ºC to +80ºC

0% to 95%

Storage

-40ºC to +85ºC

0% to 95%

Amplifier Specifications are listed in the following table.

Table 21 Amplifier Specifications

Environmental test performan c e specifications are listed in the following table.

Table 22 Environmental Test Performance Specifications

Notes: 1. High temperature test: soap in temperature (85ºC) and humidity (95%) chamber for 24-hour and return to

normal temperature (at least for 1-hour) without visual shape change.

2. Low temperature test: soap in temperature (-40ºC) chamber for 24-hour and re turn to normal tempera ture (at

least for 1-hour) without visual shape change.

The GPS antenna mechanical dimensions are shown in the follo wing fi gur e.

Figure 29 GPS Antenna Mechanical Dimensions

The antenna environmental requirements are listed in the following table.

Table 23 GPS Antenna Environmental Requirements

7. Certifications

AE-CLOUD2 has been certified to comply with the following standards

7.1 CE

Wireless Coverage:

• Wi-Fi: IEEE 802.11n 2.4G single band

• 2G/EGPRS: 900/1800

• 4G/LTE: B1/3/8/20/28

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Band

Conducted Power

GSM 900

880MHz - 915MHz @ 35 dBm

DCS 1800

1710MHz - 1785MHz @ 32 dBm

LTE Band 1 Cat-M1& Cat-NB1

1920MHz - 1980MHz @ 25.7 dBm

LTE Band 3 Cat-M1& Cat-NB1

1710MHz - 1785MHz @ 25.7 dBm

LTE Band 8 Cat-M1& Cat-NB1

880MHz - 915MHz @ 25.7 dBm

LTE Band 20 Cat-M1& Cat-NB1

832MHz - 862MHz @ 25.7 dBm

LTE Band 28 Cat-M1& Cat-NB1

703MHz - 748MHz @ 25.7 dBm

802.11b/g/n (HT20/40)

2412MHz - 2472 MHz @ 18.5 dBm

Standard Compliance:

• EN 301 489-1/17/19/52

• EN 55032

• EN 55035

• EN 301511

• EN 301 908-1

• EN 300328

• EN 303 413

• EN 62311

• EN 60950-1

7.2 FCC (no FCC ID required)

Standard Compliance

• FCC part 2/15B

7.3 RoHS

Standard Compliance

• RoHS Directive 2015/863/EU amending Annex II to 2011/65/EU

• IEC 62321-2:2013

• IEC 62631-1:2013

• IEC 62631-3-1:2013

• IEC 62631-5:2013

• IEC 62631-4:2013

• IEC 62631-7-1:2015

• IEC 62631-7-2:2017 & ISO 17075-1:2017

• IEC 62631-6:2015

7.4 WEEE

Standard Compliance

• Directive 2012/19/EU

7.5 Japan MIC

Standard Compliance

• Terminal Equipment (T)

 Cellular Module: D180034003  Wi-Fi Module: D180063003

• Radio Equipment (R)

 Cellular Module: 003-180062  Wi-Fi Module: 018-150012

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Website and Support

Visit the following va nity URLs to le arn about key elements of the Synergy Platform, download components and related documentation, and get support.

Synergy Software renesassynergy.com/software Synergy Software Package renesassynergy.com/ssp Software add-ons renesassynergy.com/addons Software glossary renesassynergy.com/softwareglossary

Development tools renesassynergy.com/tools

Synergy Hardware renesassynergy.com/hardware Microcontrollers renesassynergy.com/mcus MCU glossary renesassynergy.com/mcuglossary Parametric search renesassynergy.com/parametric

Kits renesassynergy.com/kits

Synergy Solutions Gallery renesassynergy.com/solutionsgallery Partner projects renesassynergy.com/partnerprojects

Application projects renesassynergy.com/applicationprojects

Self-service support resources:

Documentation renesassynergy.com/docs Knowledgebase renesassynergy.com/knowledgebase Forums renesassynergy.com/forum Training renesassynergy.com/training Videos renesassynergy.com/videos Chat and web ticket renesassynergy.com/support

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Rev.

Date

Description

Page

Summary

1.00

Sep 5, 2018

—

First document release

Revision History

All trademarks and registered trademarks are the property of their respective owners.

R12UM0033EU0100 Rev.1.00 Page 48 of 48 Sep 5, 2018

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Published by: Renesas Electronics Corporation

Application Example for Cloud Connectivity (AE-CLOUD2) User’s Manual

Publication Date: Rev.1.00 Sep 5, 2018

Page 50

http://www.renesas.com

Refer to "http:// www.renesas.com /" for t he latest and detailed infor m ation.

Renesas Electronics America Inc.

1001 Murphy Ranch Road, Milpit as , CA 95035, U.S.A. Tel: +1-408-432-8888, Fax: +1- 408- 434- 5351

Renesas Electronics Canada Limited

9251 Yonge Street, S uite 8309 Richmond Hill, Ontario Canada L4C 9T3 Tel: +1-905-237-2004

Renesas Electronics Euro pe Limited

Dukes Meadow, Millboard Road, B our ne E nd, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-651-700

Renesas Electronics Euro pe GmbH

Arcadiastrass e 10, 40472 Düsseldorf, Germany Tel: +49-211-6503-0, Fax: +49- 211- 6503- 1327

Renesas Electronics (Chi na) Co., Ltd.

Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian Dis trict, Beijing, 100191 P. R. China Tel: +86-10-8235-1155, Fax: +86- 10- 8235- 7679

Renesas Electronics (Shanghai) Co., Ltd.

Unit 301, Tower A, Central Towers , 555 Langao Road, Putuo Dist r ic t, Shanghai, 200333 P. R. China Tel: +86-21-2226-0888, Fax: +86- 21- 2226- 0999

Renesas Electronics Hong Kong L imited

Unit 1601-1611, 16/F ., Tower 2, Grand Century Place, 193 Prince Edward Road W es t, Mongkok, K owloon, Hong Kong Tel: +852-2265-6688, Fax: +852 2886-9022

Renesas Electronics Taiwan Co., Ltd.

13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan Tel: +886-2-8175-9600, Fax: +886 2- 8175- 9670

Renesas Electronics Sin gapore Pte. Ltd.

80 Bendemeer Road, Unit #06-02 Hy flux Innovation Centre, Singapore 339949 Tel: +65-6213-0200, Fax: +65-6213-0300

Renesas Electronics Malaysi a S dn.Bhd .

Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, J ln P er s iar an B ar at, 46050 Petaling Jaya, Selangor Darul Ehsan, M alay s ia Tel: +60-3-7955-9390, Fax: +60- 3- 7955- 9510

Renesas Electronics India Pvt. L t d.

No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India Tel: +91-80-67208700, Fax: +91-80-67208777

Renesas Electronics Korea Co., Ltd.

17F, KAMCO Y angjae Tower, 262, G angnam - daer o, Gangnam-gu, Seoul, 06265 Korea Tel: +82-2-558-3737, Fax: +82- 2- 558- 5338

SALES OFFICES

Colophon 5.1

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Renesas Synergy™ Platform

Application Example for Cloud C onnectivity

R12UM0033EU0100

(AE-CLOUD2)