Renesas Synergy AE-CLOUD2 User Manual

Rev.1.00 Sep 2018

Renesas Synergy™ Platform

Synergy Tools & Kits
Tool

www.renesas.com

All information conta ined in these mater ials, includin g products and pr oduct speci fications, represe nts

Application Example for Cloud Connectivity
(AE

s Manual

User’s Manual

-CLOUD2)

User’

s: Connectivity

information on the product at the time of publicat ion and is subject t o change by Renesas El ectronics
Corp. without notice. Please review the latest information published by Renesas Electronics Corp.
through various means, in cluding the Renesas Electronics Corp. website (htt p://www.renesas.com).

Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the
circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability
for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information.

2. Renesas Electronics hereby expressly disclaims any warranties agains t and liability for infringement or any other claims
involving patents, copyrights, or other intellectual property rights of third parties, by or arising from the use of Renesas
Electronics products or technical information described in this document, including but not limited to, the product data,
drawings, charts, programs, algorithms, and application examples.

3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of
Renesas Electronics or others.

4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas
Electronics disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration,
modification, copying or reverse engineering.

5. Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The
intended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below.

"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual

equipment; home electronic appliances; machine tools; personal electronic equipment; industr ial robots; etc.

"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale

communication equipment; key financial terminal systems; safety control equipment; etc.

Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics dat a sheet
or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or
systems that may pose a direct threat to human life or bodily injury (artificial life supp ort devices or systems; surgical
implantations; etc.), or may cause serious proper ty damage (space system; undersea repeaters; nuclear power control systems;
aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any
damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is
inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.

6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes,
"General Notes for Handling and Using Semiconductor Devices" in the reliability handbook, etc.), and ensure that usage
conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, o perating power supply
voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any
malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges.

7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor
products have specific characteris tics, such as the occurr ence of failure at a certain rate and malfunctions under certain use
conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data
sheet or other Renesas E lectronics document, Renesas Electronics products are not subject to radiation resistance design . You
are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by
fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design
for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate
treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is
very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by
you.

8. Please contact a Ren es as Electronics sales office for details as to environmental matters such as the environmental compatibility
of each Renesas Electronics product. You are responsible for carefull y and sufficiently investigating applicable laws and
regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and
using Renesas Electronics products in compliance with all these applicab le laws and regulations. Renesas Electronics di sclaims
any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose
manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any
applicable export control laws and regulations promulgated and administered by the governments of any countries asserting
jurisdiction over the parties or transactions.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes
of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions
set forth in this document.

11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of
Renesas Electronics.

12. Please contact a Ren es as Electronics sales office if you have any questions regarding the information contained in this document
or Renesas Electron ics products.

(Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its directly or

indirectly controlled subsidiaries.

(Note 2) "Renesas E lectronics produ ct(s)" means any product d evel oped or manufactured by or for Renesas Electronics.

(Rev.4.0-1 November 2017)

Renesas Synergy™ Application Example for Cloud Connectivity (AE-CLOUD2) Disclaimer

By using this AE-CLOUD2, the user accepts the following terms, which are in addition to, and control in the event of disagreement,
with Renesas’ General Terms and Conditions available at https://www.renesas.com/en-us/legal/disclaimer.html.

The AE-CLOUD2 is not guaranteed to be error free, and the entire risk as to the results and performance of the AE-CLOUD2 is
assumed by the User. The AE-CLOUD2 is provided by Renesas on an “as is” basis without warranty of any kind whether express or
implied, including but not limited to the implied warranties of satisfactory quality, fitness for a particular purpose, title, and non­infringement of intellectual property rights with regard to the AE-CLOUD2. Renesas e xpressly disclaims all such warranties.

Renesas does not consider the AE-CLOUD2 a finished product and therefore the AE-CLOUD2 may not yet comply with some
requirements applicable to finished products, including, but not limited to recycling (WEEE), CE, UL, restricted substances (ROHS),
FCC, FEE, and electromagnetic co mpatibility regulations. Renesas or its affiliates shall in no event be liable for any loss of profit,
loss of data, loss of contract, loss of business, damage to reputation or goodwill, any economic loss, any reprogramming or recall
costs (whether the forego ing losses are direct or indirect) nor shall Renesas or its affiliates be liabl e for any other direct or indirect
special, incidental or consequential damages arising out of or in relation to the use of this AE-CLOUD2, even if Renesas or its
affiliates have been advised of the possibility of such damages.

Renesas has used reasonable care in preparing the information included in this document, but Renesas does not warrant that such
information is error free nor does Renesas guarantee an exact match for every application or parameter to part numbers designated by
other vendors listed herein. The information provided in this document is intended solely to enable the use of Renesas products. No
express or implied license to any intellectual property right is granted by this document or in connection with the sale of Renesas
products. Renesas reserves the right to make changes to specifications and product descriptions at any time without notice. Renesas
assumes no liability for any damages incurred by you resulting from errors in or omissions from the information included herein.
Renesas cannot verify, and assumes no liability for, the accuracy of information available on another company’s website.

Precautions

This Renesas Synergy™ Kit is only intended for use in a laboratory environment under ambient temperature and humidity
conditions. A safe separation distance should be used between this and any sensitive equipment. Its use outside the laboratory,
classroom, study area, o r similar such area invalidates conformity with the protection requirements of the Electromagnetic
Compatibility Directive and could lead to prosecution.

The product generates, uses, and can radiate rad io frequency energy and may cause harmful interference t o radio communications.
There is no guarantee that interference will not o ccur in a particular installation. If this equipment causes harmful interference to
radio or television reception, which can be determined by turning the equipment off or on, you are encouraged to try to correct the
interference by one or more of the following measures:

• Ensure attached cables do not lie across the equip ment .

• Reorient the receiving antenna.

• Increase the distance between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that which the r eceiver is connected.

• Power down the equipment when not in use.

• Consult the dealer or an experienced radio/TV technician for help.

Note: It is recommended that wherever possible shielded interface cables are used.
The product is potentially susceptible to certain EMC phenomena. To mitigate against them it is recommended that the following

measures be undertaken:

• The user is advised that mobile phones should not be used within 10 m of the product when in use.

• The user is advised to take ESD precautions when handling the equipment.

The Renesas Synergy™ Kit does not represent an ideal reference design for an end product and does not fulfill the regulatory
standards for an end product.

Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Wi-Fi Module

USB Data/Power

(Connect to PC USB port)

MCU Boa rd

Cellular Bo ard

GPS Antenna

Ce llular Ant enna

PMOD Conector

USB (Data/ Pow er)

Host Mode Jumpers

GT202 C onnector

GT202 Wi-Fi Modu l e

On-board Wi -Fi Antenna

Power Selection Jumper

1. Overview

The AE-CLOUD2 is an Application Example Kit for Cloud connectivity, intended for fast prototyping of embedded
systems, specifically targeting Internet of Things applications. The kit includes all compo nents required for
development and debugging of software that can collect information from a variety of sensors and communicate it
securely to the Cloud.

The kit incl udes a Wi-Fi board based on the GT202 module that uses Qualcomm
board supports 802.11 b/g/n communication standards.

Figure 1 Cloud Connectivity Application Example Kit

®

QCA4002 system on a chip. The

R12UM0033EU0100 Rev.1.00 Page 4 of 48
Sep 5, 2018

Figure 2 Wi-Fi Board based on the GT202 Module

Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Arduino Header

(Power)

Arduino Header

(AD)

Arduino Header

(IOH)

Arduino Header

(IOL)

BG96

Module

Cellular

Antenna

GPS

Antenna

SIM Card

Slot

Micro USB

LED

(G,B,R)

8-pin

Voice Header

6-pin

I/O Header

4-pin

DBG Header

PWRKEY

Pus h B utto n

RESET

Pus h B utto n

USB Boo t

Jumper

Pus h B utto n (Re s et )

Pus h B utto n (Us e r)

HanRun

Low Profil e RJ-45 Connector

Grove (UA RT/AD C )

Grove (I2C)

Renes as Synergy S124 JLOB MCU

Knowles high SNR/AOP Analog Microphone

Realtek 10/100Mbps Ethernet PHY

USB (Device/Pow er )

ISSI QPSI Flash (32MB)

PMOD Conn ec t or

JTAG Connector

USB

(Debug/Power)

Arduino Header

(Power)

Arduino Header

(AD)

Bosch Geomagnetic Sensor

Renesas Di gi tal

Ambient Light Sensor

User LED (Green )

Bosch 3-aixs Accelerometer/3-axis Gyroscope

Bosch Environmental Sensor

Arduino Header

(IOH)

Arduino Header

(IOL)

Power LED (Green )

J-Link LED (Green)

TXC 25MHz Crystal

TXC 12MHz Crystal

User LED (Y ellow)

User LED (Red)

Renesas Synergy S5D9 MCU

The kit also includes a cellular connectivity shield based on the Quectel BG96 module. It provides 4G/LTE Cat-M1
(eMTC) and 4G/LTE Cat-NB1 (NB-IoT) support with fallback to 2G/EGPRS mobile networks. In addition, it integrates
a GPS receiver which enables the development of position-tracking applications.

At the heart of the kit is the MCU board based on the Renesas Synergy™ S5D9 Microcontroller. Figure 4 describes the
main board components, the interface connectors, and their purpose.

Figure 3 Arduino Shield for Cellular Network Connectivity

Figure 4 S5D9 Synergy MCU Board Components

R12UM0033EU0100 Rev.1.00 Page 5 of 48
Sep 5, 2018

Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

1.1 Board Fe atures

• Synergy S5D 9 Arm® Cortex®-M4 Core

 Arm
 Maximum operating frequency: 120 MHz
 Secure Crypt o Engine
 Memory Protection Unit and Flash Access Window
 Floating Point Unit
 SWD debugging interface

• Memory

 640 KB SRAM
 2 MB Code Flash
 64 KB Data Flash
 32 MB External QSPI Flash

• Connectivity

 Wired Ethernet (RJ45) 10/100 Mbps
 USB 2.0 Full Speed
 UART (through the Arduino or Seeed Grove connector)
 I
 SPI (thro ugh the Ardui no or Digilent PMOD connector)

• Sensors

 Accelerometer and Gyroscope (Bosch BMI160)
 Magnetometer (Bosch BMM150)
 Environmental – Gas, Pressure, Temperature, Humidity (Bosch BME680)
 Ambient Light (Renesas ISL29035)
 Acoustic (Knowles MEMS microphone SPM0687LR5H-1)

• General Purpose I/O Ports

 User-defined LE D s
 User-defined button
 Arduino Shield Headers
 Seeed Studio’s Grove Connectors

• Operating Voltage

 5V

®

v7E-M architecture

2

C (through t he Arduino or Seeed Grove connector)

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Wi-Fi PMOD

2x 1ft Mi cr o US B Cable

1x 1ft Eth er net Ca ble

S5D9 MCU Board

Cellular Arduino Shield Cellular Antenna GPS Antenna

2. What’s in the Box

The AE-CLOUD2 kit includes the follo wing components:

• Synergy S5D9 MCU board

• Wi-Fi module

• Cellular Arduino Shield

• Two USB cables and one Ethernet cable

• Cellular antenna

• GPS antenna

• Quick Start Guide (back side of packaging box cover)

• Important Notice and Disclaimer Card

Figure 5 AE-CLOUD2 Box Contents

R12UM0033EU0100 Rev.1.00 Page 7 of 48
Sep 5, 2018

Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Micro U SB cable
for Power/Debug

Micro USB cable

for Power/Data

Eth er net Cable for

connection to router

C ell ular Antenna

GPS Antenna

PC USB Port

PC USB Port

Router LAN Port

Laptop PC

Internet Router

3. Getting Started

Before you start working with your development board, you must obtain the latest version of the Synergy Software
Package (SSP), as well as the development tools needed to work with it.

If you are new to Synergy development, we encourage you to use the AE-CLOUD2 Quick Start Guide. This guide will
provide detailed instructions on how to register an account on the Synergy Gallery to o btain a developer license, and
how to download and install all software & tools that are required. Once you have completed these steps, please return
to this section for more in-dep th in formation on ho w to wor k wit h yo ur S5D9 MCU board.

3.1 Connecting the Boards

Plug the Wi-Fi Module to the MCU board through a PMOD connector. Plug the Cellular Arduino Shield into the S5D9
MCU board. Be careful to align the Arduino Shield connector pins correctly.

Connect the USB cables from J6 (for debugging) and from J9 (for communication) on the MCU Board to the host
computer. The USB Device connector (J9) provides 5V power to the entire kit. The USB J-Link OB Debug connector
(J6) provides 5V power only to the MCU board.

For cellular and GPS operation, connect the cellular antenna and the GPS antenna to their corresponding connectors on
the Cellular Arduino Shield. As seen in Figure 6, the cellular antenna goes to the top connector.

3.2 Download Application Software

The kit comes without firmware pre-installed on its MCU board. The user is encouraged to download cloud
connectivity example projects of their choice by searching for AE-CLOUD2 at http://renesassynergy.com.

On this kit webpage, the user can find links to the individual application projects for Microsoft Azure, Amazon Web
Service (AWS), and Google Cloud Platform as well as Synergy Enterprise Cloud Toolbox demo and Medium One IoT
Prototyping Sandbox tutorial.

R12UM0033EU0100 Rev.1.00 Page 8 of 48
Sep 5, 2018

Figure 6 Connecting the Boards from the Kit

Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

S5D9

Microcontroller

Serial

NOR Flash

(256Mbits)

QSPI

Knowles

Analog

MIC

Bosch

6

-axis

Compasss

Bosch

Environmental

Sensor

RJ-45

USB 2.0 (

4. S5D9 MCU Board

4.1 MCU Board Overview

Figure 7 shows the top view of the MC U Board. It is built around the versatile Rene s as Synergy™ S5D9
Microcontroller. The SEGGER J-Link
so that no ext ernal programming probes are nee ded. The board is highly integrated with many sensors, external flash
memory, Ethernet PHY , Arduino, Grove and PMOD connect ors, buttons and LEDs. The rich functionality of the board
makes it ideal for prototyping a wide range of IoT Solutions.

®

On-board , using the Renesas Syner gy™ S124 MCU, provides a debug interface

Figure 7 MCU Board

Figure 8 shows the MCU board main components. It includes all interfaces – both internal and externa l.

Figure 8 MCU Board System Architecture

R12UM0033EU0100 Rev.1.00 Page 9 of 48
Sep 5, 2018

Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Parameter

Value

Minimum

Maximum

Power Supply Voltage

3.7V

5.5V

Current Consumption

500 mA

Digital Inputs Voltage

0V

3.3V

Digital Outputs Voltage

0V

3.3V

Operating Temperature

0°C

+75°C

PMOD Connector Power Voltage

3.3V

Grove Connectors Power Voltage

3.3V

The MCU board includes the following mai n components:

• The Synergy S5D9 MCU featuring 2 MB code flash/640 KB SRAM/64 KB data flash.

• A power management based on 3.3V LDO voltage regulator required for the operation of the microcontroller.

• Quad SPI flash – the MCU flash memory is expande d with external 256 Mbits (32 M B) memory device connected

over a high -speed QSPI interface. T he external flash can be used for storage of graphics and other digital assets, or
for execution of code in place (XIP).

• User-defined LE D s – the user-defined LEDs are useful in indicating the current state of the firmware. The 3 LEDs

have different colors for easy identification.

• USB device interface – the S5D9 MCU includes one USB interface operating at full speed. The USB device

connector is also used to power the board.

• PMOD interface header – the board includes one 12-pin PMOD header that can be configured by a jumper to

provide 3.3V on its power pins. The header enables interfacing with other devices over SPI or UART.

• Grove connectors – the Grove connectors are compatible with the Seeed Studio’s line of peripheral modules that

include a very large selection of sensors and actuators. One of the Grove connectors can be configured to
communicate over UART and the other is dedicated for I

• J-Link On-Board SEGGER debugging probe based on Syner gy S124 MCU.

• JTAG interface that is available on a 10-pin connector (J20) compatible with SEGGER debugging probe.

• The board includes a number of sensors described in detail in section 5.3.

2

C interface.

4.2 Power Requirements

The AE-CLOUD2 is designed to be powered by the USB device interface on J9 connect or.
The S5D9 board can supply power to the devices connec ted to it. The PMOD interface and the Grove connectors can

power 3.3V peripherals.
The power supply requirements and current consumption specifications are listed in following table.

Table 1 Electrical Speci f icat io ns

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

4.2.1 Power Supply Options

The power supply source is the J9 - USB Micro-B connector providi ng 5 V and up to 500 mA of po wer.

Figure 9 Power Supply Management

Note that the Schottky diodes provided are in series with the power source. This protects them from overload in case
both are connected and one has higher voltage than the other.

4.2.2 Power-up Behavior

Upon power up, the MCU is idle until its RESET pin registers transition to logic 1. At this point, the MCU hardware
samples the logic level of the MD pin. The MD pin level determines if the MCU will enter ‘Factory Boot Mode’. In this
mode, the MCU executes an internal firmware code that initializes the USB interface and prepares the device to
communicate with utilities that can upd a te the content of its memory.

The state of the MD pin at startup is defined by S2. If the button is pressed at the time of the RESET signal, then the
factory bootloader will execute on startup . If S2 is not pressed at the time o f the RE SE T signal, then the MCU will
execute the code previously loaded to the MCU code flash memory.

R12UM0033EU0100 Rev.1.00 Page 11 of 48
Sep 5, 2018

Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Sensor

I2C MCU

Address

ADC

Number

BMI160 Accelerometer

0x68

IRQ9 (INT1), IRQ8 (INT2)

N/A

Bosch

BMM150 Magnetometer

0x10

IRQ4

BME680 Humidity and
Temperature

0x76

N/A
ISL29035 Light Sensor

0x44

IRQ7

Renesas

SPM0687LR5H-1
Microphone

N/A

N/A

1 (P0_1)

Knowles

4.3 Installed Sensors

The on-board sensors provide variety of options when it comes to prototyping IoT applications:

• Accelerometer, Gyroscope and Magnetometer: Bosch Sensortec - BMI160 (U4) and BMM150 (U9)

 BMI160 is an extremely small low power and low noise 6-axis accelerometer and gyroscope.
 The integrated accelerometer provides all functionalities of Bosch Sensortec’s leading-edge 12-bit digital

accelerometer, including a 32-frame FIFO buffer storing acceleration data.

 The interface to the MCU is based on the I

• Accelerometer = 0x68

• Magnetometer = 0x10

 Connected to MCU I

2

C Channel 2 with pins configured to use Port 5 bits 11 and 12:

• Data (SDA) = P5_11

• Clock (SCL) = P5_12

• Environmental Sensor: B o sch Sensortec. – BME680 (U7)

 The BME680 is a digital 4-in 1 senso r with ga s, hu mid i t y, pr e ssur e, and temperature measurement based on

proven sens ing principles

 The interface to the MCU is based on the I
 Connected to MCU I

2

C Channel 2 with pins configured to use Port 5 bits 11 and 12:

• Data (SDA) = P5_11

• Clock (SCL) = P5_12

• Ambient Light Sensor: Renesas - ISL29035 (U6)

 The ISL29035 is an integrated ambient and infrared light-to-digital conver te r with I

advanced self-calibrated photodiode array emulates human eye response with excellent IR rejection. The on-chip
16-bit ADC is capable of rejecting 50 Hz and 60 Hz flicker caused by artificial light sources. The Lux range
select feature allows users to program the Lux range for optimized counts/Lux.

 The interface to the MCU is based on the I
 Connected to MCU I

2

C Channel 2 with pins configured to use Port 5 bits 11 and 12:

• Data (SDA) = P5_11

• Clock (SCL) = P5_12

• MEMS Microphone: Knowles SPM0687LR5H-1 (U10)

 The SPM0687LR5H-1 is a miniature, high-performance, low power, top port silicon microphone. It consists of

an acoustic sensor, a low noise input buffer, and an output amplifier.

 The device has the following main features:

• 20 dB of Gain

• Low current consumption

• MaxRF protection

• Ultra-stable performance

• Omnidirectional

 The microphone output is wired t o MCU ADC Channel 1 (P0 _1).

Table 2 Summary of the Sensors and their MCU Interfaces

2

C protocol. The sensor has hard coded individual addresses:

2

C protocol. The sensor has hard coded address on the I2C Bus: 0x76.

2

C bus interface. Its

2

C protocol. The sensor has hard coded address on the I2C bus: 0x44

R12UM0033EU0100 Rev.1.00 Page 12 of 48
Sep 5, 2018

Ch 2 Bus

Interrupt Request

Channel

Manufacturer

Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Pin
Number

RJ45 Ethernet Port

1

TX+

2

TX-

3

RX+

4

neutral

5

neutral

6

RX-

7

neutral

8

neutral

Pin
Number

PMOD (J5)

1

SSLB0/CTS9 – P2_5

2

MOSI/TXD9 – P2_3

3

MISO/RXD9 – P2_2

4

RSPCK/SCK9 – P2_4

5

GND

6

3.3V

7

GPIO – P4_9/IRQ6

8

GPIO – P4_12

9

GPIO – P3_7

10

GPIO – P3_6

11

GND

12

3.3V

4.4 Connecti vity and Settings

4.4.1 RJ45 Ethernet Connector

The S5D9 MCU Board features standard Ethernet connector RJ45 with built-in magnetics. It is connected to RealTek
PHY interface P/N: RTL8189EM-CG. The PHY is connected to the MCU via RMII interface. The RJ45 connector is
HanRun Electronics Ltd. P/N: HR915102AE. Its front view is shown in Figure 10.

Figure 10 RJ45 Ethernet Connector

The pin mapping of the co nnector matches the st andard for Ethernet ports. The pi n mapping is shown in the following
table.

Table 3 Ethernet RJ45 pin map

4.4.2 PMOD Connector

The S5D9 MCU board includes one PMOD connector. It can interface with modules that require UART, I2C, or SPI
interface. The function of the PMOD is dependent on the MCU pin functions initialization. The PMOD connector pin
map is shown in the following table.

Table 4 PMOD Pin Functions

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Pins

Grove A (J3)
UART

Grove B (J4)
I2C

1

P5_5/SCL6/RXD6/AN118

P1_0/SCL1

2

P5_6/SDA6/TXD6/AN019

P1_1/SDA1

3

3.3 V

3.3 V

4

GND

GND

Figure 11 shows the schematic of the PMOD interface.

Figure 11 PMOD Interface Schematic

4.4.3 Grove A and B Connectors

The Grove connectors offer the following interfaces:

• UART / I

2

• I

C interface (Grove B – J4)

The pin-mapping of the connectors is described in following table.

2

C or Analog interface (Grove A – J3)

Table 5 Grove Connector Pin Mapping

Note that the specific function of the Grove A (J3) depends on the pin-muxing configuration controlled by the
application specific needs.

Figure 12 shows the schematic of the Grove interfaces.

R12UM0033EU0100 Rev.1.00 Page 14 of 48
Sep 5, 2018

Figure 12 Grove Connectors Schematic

Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

LED
Number

Color

Designator

Device Port/Pin

1

Green

LED1

P7_8

2

Yellow

LED2

P7_10

3

Red

LED3

P7_11

4

Green

LED4

N/A (Power indicator)

USB Device Connector

S5D9 Microcontroller

Pin

Description

Pin

Description

1

VBUS, +5VDC

P4_7/USB_VBUS

USB Voltage detection

2

Data-

USB_DM

Negative data line

3

Data+

USB_DP

Positive data line

4

USB ID, jack internal switch, cable inserted

-

(Not connected)

5

Ground

VSS

Circuit Ground

4.4.4 On-Board LEDs

The S5D9 MCU board provides 3 on-board LEDs for user-defined functions. A fourth LED is used to indicate 3.3V
power presence. The LEDs are connected to general purpose output pins through a single resistor. The output active
state is 1. The table below describes the mapping between the LEDs and the ports that drive them.

Table 6 LED to Port Mapping

Figure 13 shows the schematic of the user LEDs.

Figure 13 LED Schematic

4.4.5 USB Device

This USB Micro-B connection jack connects the S5D9 MCU to an external USB 2.0 Host,
Full Speed capable. The USB power presence (VBUS) is wired to GPIO input P4_7 after it
is passed through resistor divider.

Table 7 USB Device Connector to S5D9 MCU Pin Mapping

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Renesas Synergy™ Platform Application Example for Cloud Connectivity (AE-CLOUD2)

Figure 14 shows the USB interface schematic.

Figure 14 USB Interface Schematic

4.5 Arduino-Compatible Expansion Headers

The S5D9 MCU board includes Arduino-compatible headers that enable interfacing with a wide range of Ard ui no
Shields and expanding its features. Most of the interface signals are connected directly to the MCU pins. This enables
their configuration to change depending on the application needs. Figure 15 indicates the port and pin number for each
interface signal along with its primary role. The specific function and pin-muxing depends on the application and the
hardware specifics of the S5D9 MCU.

Note that the 5V power brought to the POWER header pin 4 is connected directly to the USB VBUS power rail from
the USB device connector (J6).

Figure 15 Parallel I/O expansion Schematic

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Sep 5, 2018