Renesas RX Family APPLICATION NOTE

APPLICATION NOTE

RX Family

RX Family MPC Module Using Firm ware Integration Technology Application Note

Introduction

This applicati on note describes the Multi-Functi on Pi n Controller (MPC) module which uses Firm ware Integration Technology (FIT). This module uses MPC to control the routing of a function to a pin. In this document, this module is referred to as the MPC FIT module.

Target Devices

• RX110, RX111, RX113 Groups

• RX130 Group

• RX13T Group

• RX230 Group

• RX231 Group

• RX23T Group

• RX23W Group

• RX23E-A Group

• RX24T Group

• RX24U Group

• RX64M Group

• RX651, RX65N Groups

• RX66T Group

• RX66N Group

• RX71M Group

• RX72T Group

• RX72M Group

• RX72N Group

When using this appli c ation note with other Renesas MCUs, caref ul ev aluation is recommended after m aki ng modificati ons to c om ply with t he alternate MCU.

Target Compilers

• Renesas Electronics C/C++ Compiler Package for RX Family

• GCC for Renesas RX

• IAR C/C++ Compiler for Renesas RX

For details of the confirmed operation contents of each compiler, refer to “6.1 Confirmed Operation Environment".

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RX Family MPC Mod ule Using Firmware Integration Technology Contents

1. Overview ................................................................................................................................. 4

1.1 MPC FIT Module ................................................................................................................................ 4

1.2 Overview of the MPC FIT Modul e ....................................................................................................... 4

1.3 API Overview ..................................................................................................................................... 4

2. API Information ........................................................................................................................ 5

2.1 Hardware Requirements .................................................................................................................... 5

2.2 Software Requirements ...................................................................................................................... 5

2.3 Limitations ......................................................................................................................................... 5

2.3.1 RAM Location Limitations ................................................................................................................. 5

2.4 Supported Tool c hain .......................................................................................................................... 5

2.5 Interrupt V ector .................................................................................................................................. 5

2.6 Header Files ...................................................................................................................................... 5

2.7 Integer Types ..................................................................................................................................... 5

2.8 Configuration Overview ...................................................................................................................... 6

2.9 Code Size .......................................................................................................................................... 6

2.10 Parameters ........................................................................................................................................ 6

2.10.1 MPC Pin Configuration ..................................................................................................................... 6

2.11 Return Values .................................................................................................................................... 7

2.12 Callback Function .............................................................................................................................. 7

2.13 Adding the FIT Module to Your Project ............................................................................................... 7

2.14 “for”, “while” and “do while” statem ents ............................................................................................... 8

3. API Function s .......................................................................................................................... 9

R_MPC_Write .............................................................................................................................................. 9

R_MPC_Read ........................................................................................................................................... 11

R_MPC_GetVersion .................................................................................................................................. 12

4. Pin Setting ............................................................................................................................. 13

5. Demo Projects ....................................................................................................................... 14

5.1 mpc_demo_rskrx113, mpc_demo_rskrx64m, mpc_demo_rskrx71m, mpc_demo_rskrx65n, mpc_demo_rskrx65n_2m, mpc_demo_rskrx113_gcc, mpc_demo_rskrx64m_gcc,

mpc_demo_rskrx71m_gcc, mpc_demo_rskrx65n_gcc, mpc_demo_rskrx65n_2m_gcc ..................... 14

5.2 mpc_demo_rskrx231, mpc_demo_rskrx231_gcc .............................................................................. 14

5.3 mpc_demo_rskrx72m, mpc_demo_rskrx72m_gcc ............................................................................ 14

5.4 Adding a Demo to a Workspace ....................................................................................................... 14

5.5 Downloading Demo Pr ojec ts ............................................................................................................ 14

6. Appendices ............................................................................................................................ 15

6.1 Confirmed Operation Environment ................................................................................................... 15

6.2 Troubleshooting ............................................................................................................................... 22

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7. Reference Documents ........................................................................................................... 23

Related Technical Updates ........................................................................................................... 23

Revision History ............................................................................................................................ 24

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Function

Description

R_MPC_Write()

Sets the function of a pin.

R_MPC_Read()

Reads the function c onfiguration of a pin.

R_MPC_GetVersion()

Returns the current v er si on of t his module.

1. Overview

1.1 MPC FIT Module

The MPC FIT module can be used by being im plem ented in a project as an API. See section 2.13, Adding the FIT Module to Your Project f or details on methods to implement this FIT module into a project.

1.2 Overview of the MPC FIT Module

Modern MCUs have continued to add more peripherals while still maintaining relatively low pin counts. When this occurs, each pin will have multiple functions allocated to it. On RX MCUs, the routing of a f unction to a pin is controlled by the Multi-Function Pin Controller. This driver abstracts this func tionality allowing use of the same pin definitions from the r_gpio_rx module.

1.3 API Overview

Table 1.1 lists the API functions included in this module.

Table 1.1 API Functi ons

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2. API Informa ti o n

This FIT module has been confirmed to operate under the following conditions.

2.1 Hardware Requirements

The MCU used must support the following functions:

 MPC

2.2 Software Requirements

This driver is dependent upon the following FIT modules:

 Renesas Board Support Package (r_bsp) v5.20 or higher  General Purpose Input/Out put Driver (r_gpio_rx)

2.3 Limitations

2.3.1 RAM Location Limitations

In FIT, if a value equivalent to NULL is set as the pointer argument of an API function, error might be returned due to parameter check. Therefore, do not pass a NULL equivalent value as pointer argument to an API function. The NULL value is defined as 0 because of the library function specifications. Theref or e, the above phenomenon would occur when the variable or functi on passed to the API function pointer argum ent is located at the start addres s of RA M (address 0x0). In this case, change the section settings or prepare a dummy variable at t he top of the RAM so that the vari able or function passed to the API function pointer argument is not located at address 0x0. In the case of the CCRX project (e2 studio V7.5.0), the RAM start addr ess is set as 0x4 t o pr ev ent the variable from bei ng loc ated at address 0x0. In the case of the GCC project (e2 studio V7.5.0) and IAR project (EWRX V4. 12.1), the start address of RAM is 0x0, so the abov e measures are necessary. The default settings of the section may be changed due to the IDE version upgrade. P lease check the section setti ngs when using t he latest IDE.

2.4 Supported Toolch ai n

This driver has been confirmed to work with the toolc hain listed in 6.1, Confirmed Operati on E nv ir onm ent.

2.5 Interrupt Vector

None.

2.6 Header Files

All API calls and thei r supporting interface defi nitions are located in “r_mpc_rx_if.h”.

2.7 Integer Types

This project uses ANSI C99. These types are def ined in stdint. h.

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Config ur a tion opti ons in r_ m pc _ r x _ c onfig.h

= 1: Include parameter checking in the buil d.

checking from the build.

ROM, RAM and Stack Code Sizes

Renesas Compiler

GCC

IAR

With

Checking

Without

Checking

With

Checking

Without

Checking

With

Checking

Without

Checking

Maximum usage

2.8 Configuration Overview

The configuration option settings of this module are located in r_mpc_rx_config.h. The option names and setting val ues are listed in the table below:

= 0: Omit parameter checking from the buil d.

MPC_CFG_PARAM_CHECK ING_ENABLE 1

= BSP_CFG_PARAM_CHECKING_ENABLE: Use the system default setting. Note: Code size can be reduc ed by excluding parameter

2.9 Code Size

Typical code sizes associated with this module are listed below. The ROM (code and constants) and RAM ( global data) sizes are determined by the build-time configuration

options described i n 2.8, Configuration Overview. The table lists ref er enc e v alues when the C c om piler’s compile options are set to their default values, as described in 2.4, Support ed Toolchain. The compile option default values are opt im iz ation level: 2, optimizati on type: for size, and data endianness: little-endian. The code size varies dependi ng on the C compiler version and compile options.

Memory Used

Device Category

All devices

Parameter

ROM 125 bytes 107 bytes 312 bytes 280 bytes 431 bytes 399 bytes

RAM 0 bytes 0 bytes 0 bytes 0 bytes 0 bytes 0 bytes

stack

52 bytes 52 bytes - - 52 bytes 52 bytes

Parameter

2.10 Parameters

This section describes the parameter struc ture used by the API functions in this module. T he str uc ture is located in r_mpc _rx_if.h as are the prototype declarations of API functions.

2.10.1 MPC Pin Configuration

This data struct ur e is used f or confi gur ing a pin’s function. To find vali d settings for pin_function, ref er to t he Multi-Function Pin Controller (MPC) section of your MCU’s hardware manual . Select the Pin Function Control Register for the port that y our pi n is on. On thi s page you will fi nd a table with available functi ons for each pin on the selected port .

/* Options for configuring the MPC register of a pin. */ typedef struct { uint8_t pin_function; //Which peripheral function is assigned to this pin bool irq_enable; //This pin is used as IRQ pin

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bool analog_enable; //This pin is used as ADC input, DAC output, or for //LVD (CMPA2) } mpc_config_t;

2.11 Return Values

This section describes return values of API functions. This enumerati on is l oc ated in r_mpc_rx_if.h as are the prototype declarations of API functions.

Below are the available return values for the R_MPC_Write( ) function.

/* Function return type. */ typedef enum { MPC_SUCCESS = 0, MPC_ERR_INVALID_CFG, // The configuration specified cannot be applied to // this pin } mpc_err_t;

2.12 Callback Function

None.

2.13 Adding the F IT Module to Your Project

This module must be added to each pr ojec t in which it is used. Renesas recommends the method usi ng the Smart Configurator described in (1) or (3) below. However, the Smart Configurator only support s some RX devices. Please use the methods of (2) or (4) for RX devices that ar e not supported by the Smart Configurator.

(1) Adding the FIT module to your project using the Smart Configur ator in e

By using the Smart Confi gur ator in e

Refer to “Renesas e

studio Sm art Configurator User Guide (R20A N0451) ” for details.

studio, the FIT module i s autom atically added to your project.

(2) Adding the FIT module to your project using the FIT Confi gur ator in e

By using the FIT Configurator in e

studio, the FIT module is automatically added to your project.

Refer to “Adding Fi rmware Integration Technol ogy Modules to Projects (R01AN1723)” for details.

(3) Adding the FIT module to your project using the Smart Configurator in CS+

By using the Smart Confi gur ator Standalone version in CS+ , t he FIT m odule is automatically added

to your project. Ref er to “Renesas e

studio Sm art Configurator User Guide (R20AN0451) ” for

details.

(4) Adding the FIT module to your project in CS+

In CS+, please manually add the FIT module to your project. Refer to “Adding Firmware Integration

Technology Modules to CS + P r ojec ts (R01AN1826)” for details.

studio

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2.14 “for”, “while” and “do while” statements

In this module, “for ”, “ while” and “do while” statem ents (l oop pr oc essing) ar e used i n pr oc es si ng to wait for register to be reflected and so on. For these loop processing, comments with “WAIT_LOOP” as a keyword are described. Ther efore, if user incorpor ates fail-safe processing int o loop pr oc essing, user can search the corresponding proce ssing with “WAIT_LOOP” .

The following shows example of description.

while statement example : /* WAIT_LOOP */ while(0 == SYSTEM.OSCOVFSR.BIT.PLOVF) { /* The delay period needed is to make sure that the PLL has stabilized. */ }

for statement example : /* Initialize reference counters to 0. */ /* WAIT_LOOP */ for (i = 0; i < B SP_R EG_PROT ECT _T OT AL_ITEM S; i++) { g_protect_counters[i] = 0; }

do while statement ex am ple : /* Reset completion waiting */ do { reg = phy_ read(et her_ch an n el, PHY_REG _C O N T R O L); count++; } while ((reg & PHY_CONTROL_RESET) && (count < ETHER_CFG_PHY_DELAY_RESET)); /* WAIT_LOOP */

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3. API Functions

R_MPC_Write

This function sets the function of a pin.

Format

mpc_err_t R_MPC_Write (

gpio_port_pin_t pin, mpc_config_t * pconfig

)

Parameters

gpio_port_pin_t pin

Whic h pi n to configure.

mpc_config_t *pconfig

Pointer to structure with pin configuration information. See section 2.10.1, MPC Pin Configuration.

Return Values

[MPC_SUCCESS] /* Successful; pin configured. */ [MPC_ERR_INVALID_CFG] /* Err or ; invalid c onfiguration input */

Properties

Prototyped in file “r_mpc_rx_if.h”

Description

This function will c onfigure a pin based on the information in the mpc _c onfig_t structure. Not all pins support the same functionality . F or example, not all pins are able to be configured as anal og pins for ADC or DAC use. Also, not all combinations of functionali ty are capable. For example, a pin cannot be configured as an analog pin and for peripheral use at the same time.

To see what functions are available for a pin, refer to the Mult i-Function Pin Controller (MPC) secti on of your MCU’s hardware manual. Select the Pin Function Control Register for the port that your pin is on. On this page you will find a table with available functions for each pi n on the selec ted port.

Which pin is to be configured by this function is defined using the gpio_port_pin_t type fr om the r _gpio_rx module.

Example

mpc_config_t config; gpio_port_pin_t pin;

/* Set PE0 to be used as analog pin for ADC. */ pin = GPIO_PORT_E_PIN_0;

config.analog_enable = true; config.irq_enable = false; config.pin_function = 0;

if (MPC_SUCCESS != R_MPC_Write(pin, &config)) {

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/* Error, pin does not support this configuration. Handle error. */ … }

/* Set P27 to be used as IRQ pin and for SCI operations. */ pin = GPIO_PORT_2_PIN_7;

config.analog_enable = false; config.irq_enable = true; config.pin_function = 0xA;

if (MPC_SUCCESS != R_MPC_Write(pin, &config)) { /* Error, pin does not support this configuration. Handle error. */ … }

Special Notes:

None.

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RX Family MPC Mod ule Using Firmware Integration Technology R_MPC_Read

This function r eads the function configuration of a pin.

Format

void R_MPC_Read (

gpio_port_pin_t pin, mpc_config_t * pconfig

)

Parameters

gpio_port_pin_t pin

Which pin to read confi gur ation information for.

mpc_config_t *pconfig

Pointer to structure where pin configurati on information will be stored. S ee Section 2.10.1, MPC Pin Configuration.

Return Values

None.

Properties

Prototyped in file “r_mpc_rx_if.h”

Description

This function will r ead the configuration inf ormation for a pin and store it in a structure suppl ied by the user.

Example

mpc_config_t config;

/* See if P03 has already been configured as analog pin for DAC use. */ R_MPC_Read(GPIO_PORT_0_PIN_3, &config);

if (config.analog_enable == true) { /* P03 has already been set as analog pin. */ … } else { /* P03 has not been configured yet. Configure it now. */ … }

Special Notes:

None.

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RX Family MPC Mod ule Using Firmware Integration Technology R_MPC_GetVersion

Returns the current v er si on of t his API.

Format

uint32_t R_MPC_GetVer si on ( void )

Parameters

None.

Return Values

Version of this API.

Properties

Prototyped in file “r_mpc_rx_if.h”

Description

This function will r eturn the version of the currently running API. The version number is encoded where the top 2 bytes are the major v er si on num ber and the bottom 2 bytes are the minor version num ber . For example, Version 4.25 would be retur ned as 0x00040019.

Example

uint32_t cur_version;

/* Get version of running r_mpc_rx API. */ cur_version = R_MPC_GetVersion();

/* Check to make sure version is new enough for this application’s use. */ if (MIN_VERSION > cur_version) { /* This r_mpc_rx version is not new enough and does not have XXX feature that is needed by this application. Alert user. */ … }

Special Notes:

None.

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4. Pin Setting

MPC FIT module don’t use pi n setting.

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5. Demo Projects

Demo projects include function main() that utili z es the FIT m odule and its dependent modules (e. g. r_bsp). This FIT module includes the following demo project s.

5.1 mpc_demo_rskrx113, mpc_demo_rskrx64m, mpc_demo_rskrx71m, mpc_demo_rskrx65n, mpc_demo_rskrx65n_2m, mpc_demo_rskrx113_gcc, mpc_demo_rskrx64m_gcc, mpc_demo_rskrx71m_gcc, mpc_demo_rskrx65n_gcc, mpc_demo_rskrx65n_2m_gcc

These are the demo programs for the RX113, RX64M, RX71M, RX72M, RX65N and RX65N-2MB MPC FIT modules. The program s demonstrate how to use the MPC to configure a port bit as an interrupt input. IRQ2is chosen as the interrupt for these demos and is used to detect k ey-presses on SW2. Once the code is compiled and down-loaded to the target board and running, SW2 can be pr essed to cause IRQ2 (IRQ9 on the RX65N, IRQ13 on the RX65N-2MB) inter r upts to occur. The IRQ2 (IRQ9 on the RX65N, IRQ13 on the RX65N-2MB) interrupt handler in turn toggles the state of LED3.

5.2 mpc_demo_rskrx231, mpc_demo_rskrx231_gcc

This is the demo program f or the RX231 FIT modul e. The description for this program is the same as for the mpc_demo_rskrx113 demo except that IRQ4 is used to detect SW2 key-presses.

5.3 mpc_demo_rskrx72m, mpc_demo_rskrx72m_gcc

This is the demo program f or the RX72M FIT module. The description for this program is the same as for the mpc_demo_rskrx71m demo except that IRQ12 is used to detect SW2 key-presses.

5.4 Adding a Demo to a Workspace

Demo projects are f ound in the FITDemos subdirectory of the distri bution file for this appli c ation note. To add a demo project to a workspace, select File >> Import >> General >> Existing Projects into Workspac e, then click “Next”. From the Import Pr ojec ts dialog, choose the “Select archive file” radio button. “Br owse” to the FITDemos subdirectory , select the desired demo zi p file, then click “Finish”.

5.5 Downloading Demo Projects

Demo projects are not i ncl uded in the RX Driver Package. When using t he dem o proj ect, the FIT module needs to be downloaded. To download t he FIT module, right click on this application note and sel ect “Sample Code (download)” from the context menu in the Smart Browser >> Application Notes tab.

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RX Family MPC Mod ule Using Firmware Integration Technology

Item

Contents

Integrated development environment

Renesas Electronics e2 studio Version 2021-01 IAR Embedded Workbench f or Renesas RX 4.20.1

C compiler

Renesas Electronics C/C++ Compiler Package f or RX Family V3.03.00

-lang = c99

GCC for Renesas RX 8.3.0.202004

discard interrupt functions declared in FIT peripheral module

IAR C/C++ Compiler for Renesas RX version 4.20.1

environment.

Endian

Big endian/li ttl e endian

Revision of the module

Rev.3.80

Board used

Renesas Starter Kit + for RX72M (product No.: RTK5572Mxxxx x x x xxx)

Item

Contents

Integrated development environment

Renesas Electronics e2 studio Version 2021-01

C compiler

Renesas Electronics C/C++ Compiler Package for RX Family V3.03.00

-lang = c99

GCC for Renesas RX 8.3.0.202004

discard interrupt functions declared in FIT peripheral module

Endian

Little endian/ Bi g endian

Revision of the module

Rev.3.70

Board used

Renesas Solution Star ter Kit for RX23W (product No.: RTK5523Wxxxxxxxxxx)

6. Appendices

6.1 Confirmed Operation Environment

This section describes confirmed oper ation environment for the MPC FIT module.

Table 6.1 Confir m e d Ope r a t i on Enviro nment (Rev.3.80)

Compiler option: The f ollowing option is added to the default sett ings of the integrated dev elopment environment.

Compiler option: The following option is added to the default settings of the integrated dev elopment environment.

-std=gnu99 Linker option: The f ollowing user defined option shoul d be added to t he default setti ngs of the integrated development environment, if “Optimize si z e (-Os)” is used:

-WI,--no-gc-sections This is to work around a GCC linker issue whereby the linker erroneously

Compiler option: The def ault settings of the integrated development

Table 6.2 Confir m e d Ope r a t i on Enviro nment (Rev.3.70)

Compiler option: The following option is added to the default settings of the integrated dev elopment environment.

Compiler option: The f ollowing option is added to the default sett ings of the integrated dev elopment environment.

-std=gnu99 Linker option: The f ollowing user defined option shoul d be added to t he default setti ngs of the integrated development environment, if “Optimize si z e (-Os)” is used:

-WI,--no-gc-sections This is to work around a GCC linker issue whereby the linker erroneously

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Item

Contents

Integrated development environment

Renesas Electronics e2 studio Version 7.8.0

C compiler

Renesas Electronics C/C++ Compiler Package f or RX Family V3.02.00

-lang = c99

GCC for Renesas RX 8.3.0.201904

discard interrupt functions declared in FIT peripheral module

Endian

Little endian

Revision of the module

Rev.3.60

Board used

Renesas Starter Kit+ for RX72M (product No.: RTK5572Mxxxxxxxxxx)

Renesas Starter Kit + for RX231 (product No.: RTK505231xxxxxx x x )

Item

Contents

Integrated development environment

Renesas Electronics e2 studio Version 7.7.0 IAR Embedded Workbench f or Renesas RX 4.12.1

C compiler

Renesas Electronics C/C++ Compiler Package for RX Family V3.02.00

-lang = c99

GCC for Renesas RX 8.3.0.201904

discard interrupt functions declared in FIT peripheral module

IAR C/C++ Compiler for Renesas RX version 4.12.1

environment.

Endian

Big endian/little endian

Revision of the module

Rev.3.50

Board used

Renesas Solution Star ter Kit+ for RX23E-A (product No.: RTK0ESXBxxxxxxxxxx)

Table 6.3 Confir m e d Ope r a t i on Enviro nment (Rev.3.60)

Compiler option: The f ollowing option is added to the default sett ings of the integrated dev elopment environment.

Compiler option: The following option is added to the default settings of the integrated dev elopment environment.

-std=gnu99 Linker option: The f ollowing user defined option shoul d be added to t he default setti ngs of the integrated development environment, if “Optimize si z e (-Os)” is used:

-WI,--no-gc-sections This is to work around a GCC linker issue whereby the linker erroneously

Renesas Starter Kit + for RX65N-2MB (product No.: RTK50565N2Cx x x x x B R) Renesas Starter Kit + for RX65N (product No.: RTK50565NCxxxxxB E ) Renesas Starter Kit + for RX64M (product No.: RTK50564Mxxxx x x x x ) Renesas Starter Kit + for RX71M (product No.: RTK50571Mxxxx x x x x ) Renesas Starter Kit + for RX113 (product No.: RTK505113xxxxxx x x )

Table 6.4 Confir m e d Ope r a t i on Environment (Rev.3.50)

Compiler option: The following option is added to t he default settings of the integrated dev elopment environment.

Compiler option: The f ollowing option is added to the default sett ings of the integrated development environment .

-std=gnu99 Linker option: The f ollowing user defined option shoul d be added to t he default setti ngs of the integrated development environment, if “Optimize si z e (-Os)” is used:

-WI,--no-gc-sections This is to work around a GCC linker issue whereby the linker erroneously

Compiler option: The def ault settings of the integrated development

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Item

Contents

Integrated development environment

Renesas Electronics e2 studio Version 7.7.0 IAR Embedded Workbench f or Renesas RX 4.12.1

C compiler

Renesas Electronics C/C++ Compiler Package for RX Family V3.01.00

-lang = c99

GCC for Renesas RX 4.8.4.201902

discard inter r upt functions declared in FIT peripheral module

IAR C/C++ Compiler for Renesas RX version 4.12.1

environment.

Endian

Big endian/li ttl e endian

Revision of the module

Rev.3.40

Board used

Renesas Starter Kit + for RX72N (product No.: RTK5572Nxxxxxx x x x x )

Table 6.5 Confir m e d Ope r a t i on Enviro nment (Rev.3.40)

Compiler option: The f ollowing option is added to the default sett ings of the integrated dev elopment environment.

-std=gnu99 Linker option: The following user defi ned option should be added to the default setti ngs of the integrated development environment, if “Optimize si z e (-Os)” is used:

-WI,--no-gc-sections This is to work around a GCC linker issue whereby the linker erroneously

Compiler option: The def ault settings of the integrated development

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RX Family MPC Mod ule Using Firmware Integration Technology

Item

Contents

Integrated development environment

Renesas Electronics e2 studio Version 7.7.0 IAR Embedded Workbench f or Renesas RX 4.12.1

C compiler

Renesas Electronics C/C++ Compiler Package for RX Family V3.01.00

-lang = c99

GCC for Renesas RX 4.8.4.201902

discard interrupt functions declared in FIT peripheral module

IAR C/C++ Compiler for Renesas RX version 4.12.1

environment.

Endian

Big endian/li ttl e endian

Revision of the module

Rev.3.30

Board used

RX13T CPU Card (product No.: RTK0EMXA10C00000BJ)

Item

Contents

Integrated development environment

Renesas Electronics e2 studio Version 7.5.0 IAR Embedded Workbench f or Renesas RX 4.12.1

C compiler

Renesas Electronics C/C++ Compiler Package for RX Family V3.01.00

-lang = c99

GCC for Renesas RX 4.8.4.201902

discard interrupt functions declared in FIT peripheral module

IAR C/C++ Compiler for Renesas RX version 4.12.1

environment.

Endian

Big endian/li ttl e endian

Revision of the module

Rev.3.20

Board used

Renesas Starter Kit + for RX72M (product No.: RTK5572Mxxxx x x x xxx)

Table 6.6 Confir m e d Ope r a t i on Enviro nment (Rev.3.30)

Compiler option: The f ollowing option is added to the default sett ings of the integrated dev elopment environment.

-std=gnu99 Linker option: The f ollowing user defined option shoul d be added to the default setti ngs of the integrated development environment, if “Optimize si z e (-Os)” is used:

-WI,--no-gc-sections This is to work around a GCC linker issue whereby the linker erroneously

Compiler option: The def ault settings of the integrated development

Table 6.7 Confir m e d Ope r a t i on Enviro nment (Rev.3.20)

Compiler option: The f ollowing option is added to the default sett ings of the integrated dev elopment environment.

Compiler option: The following option is added to the default settings of the integrated dev elopment environment.

-std=gnu99 Linker option: The f ollowing user defined option shoul d be added to t he default setti ngs of the integrated development environment, if “Optimize si z e (-Os)” is used:

-WI,--no-gc-sections This is to work around a GCC linker issue whereby the linker erroneously

Compiler option: The def ault settings of the integrated development

R01AN1724EJ0380 Rev.3.80 Page 18 of 25 Apr.01.2021

RX Family MPC Mod ule Using Firmware Integration Technology

Item

Contents

Integrated development environment

Renesas Electronics e2 studio Version 7.5.0

C compiler

Renesas Electronics C/C++ Compiler Package for RX Family V3.01.00

-lang = c99

Endian

Big endian/li ttl e endian

Revision of the module

Rev.3.10

Board used

Renesas Solution Star ter Kit for RX23W (product No.: RTK5523Wxxxxxxxxxx)

Item

Contents

Integrated development

Renesas Electronics e2 studio Version 7.4.0

C compiler

Renesas Electronics C/C++ Compiler Package for RX Family V3.01.00

-lang = c99

GCC for Renesas RX 4.8.4.201803

discard interrupt functions declared in FIT peripheral module

IAR C/C++ Compiler for Renesas RX version 4.10.1 environment.

Endian

Big endian/li ttl e endian

Revision of the module

Rev.3.00

Board used

Renesas Starter Kit + for RX65N-2MB (product No.: RTK50565Nxxxxxxxxx)

Item

Contents

Integrated development environment

Renesas Electronics C/C++ Compiler Package for RX Family V3.01.00

Compiler option: The f ollowing option is added to the default settings of the

-lang = c99

Endian

Big endian/li ttl e endian

Revision of the module

Rev.2.50

Board used

Renesas Starter Kit for RX72T (product No.: RTK5572Txxxxxxxxxx)

Table 6.8 Confir m e d Ope r a t i on Environment (Rev.3.10)

Compiler option: The f ollowing option is added to the default sett ings of the integrated dev elopment environment.

Table 6.9 Confirmed Operation Environ ment (Rev.3.00)

environment

Endian

Table 6.10 Confirmed Operation Environment (Rev.2.50)

IAR Embedded Workbench f or Renesas RX 4.10.1

Compiler option: The f ollowing option is added to the default sett ings of the integrated dev elopment environment.

-std=gnu99 Linker option: The f ollowing user defined option shoul d be added to t he default setti ngs of the integrated development environment, if “Optimize si z e (-Os)” is used:

-WI,--no-gc-sections

This is to work around a GCC linker issue whereby the linker erroneously

Compiler option: The def ault settings of the integrated development

Renesas Electronics e2 studio Version 7.3.0

C compiler

R01AN1724EJ0380 Rev.3.80 Page 19 of 25 Apr.01.2021

integrated dev elopment environment.

RX Family MPC Mod ule Using Firmware Integration Technology

Item

Contents

Integrated development environment

Renesas Electronics C/C++ Compiler Package for RX Family V3.01.00

Compiler option: The following option is added to the default settings of the

-lang = c99

Endian

Big endian/li ttl e endian

Revision of the module

Rev.2.41

Renesas Starter Kit for RX66T (product No.: RTK50566T0SxxxxxBE)

Item

Contents

Integrated development environment

Renesas Electronics C/C++ Compiler Package for RX Family V3.00.00

Compiler option: The f ollowing option is added to the default sett ings of the

-lang = c99

Endian

Big endian/li ttl e endian

Revision of the module

Rev.2.40

Renesas Starter Kit for RX66T (product No.: RTK50566T0Sxxxx xBE)

Renesas Starter Kit + for RX130-512KB (product No.: RTK5051308Cxx x x x B R)

Item

Contents

Integrated development environment

Renesas Electronics C/C++ Compiler Package for RX Family V2.07.00

Compiler option: The f ollowing option is added to the default sett ings of the

-lang = c99

Endian

Big endian/little endian

Revision of the module

Rev.2.31

Renesas Starter Kit + for RX 65N-2MB (product No.: RTK50565N2Cxxxx x B R)

Table 6.11 Confirmed Operation Environment (Rev.2.41)

Renesas Electronics e2 studio Version 7.3.0

C compiler

Board used

Table 6.12 Confirmed Operation Environment (Rev.2.40)

C compiler

Board used

integrated dev elopment environment.

Renesas Starter Kit + for RX 65N-2MB (product No.: RTK50565N2Cxxxx x B R) Renesas Starter Kit + for RX130-512KB (product No.: RTK5051308Cx x x x x B R)

Renesas Electronics e2 studio Version 7.0.0

integrated dev elopment environment.

Renesas Starter Kit + for RX 65N-2MB (product No.: RTK50565N2CxxxxxBR)

Table 6.13 Confirmed Operation Environment (Rev.2.31)

Renesas Electronics e2 studio Version 6.0.0

C compiler

Board used

integrated dev elopment environment.

Renesas Starter Kit + for RX130-512KB (product No.: RTK5051308Cx x x x x B R)

R01AN1724EJ0380 Rev.3.80 Page 20 of 25 Apr.01.2021

RX Family MPC Mod ule Using Firmware Integration Technology

Item

Contents

Integrated development environment

Renesas Electronics C/C++ Compiler Package for RX Family V2.07.00

Compiler option: The following option is added to the default settings of the

-lang = c99

Endian

Big endian/li ttl e endian

Revision of the module

Rev.2.30

Renesas Starter Kit + for RX 65N-2MB (product No.: RTK50565N2CxxxxxBR)

Table 6.14 Confirmed Operation Environment (Rev.2.30)

Renesas Electronics e2 studio Version 6.0.0

C compiler

Board used

integrated dev elopment environment.

Renesas Starter Kit + for RX130-512KB (product No.: RTK5051308Cx x x x x B R)

R01AN1724EJ0380 Rev.3.80 Page 21 of 25 Apr.01.2021

RX Family MPC Mod ule Using Firmware Integration Technology

6.2 Troubleshooting

(1) Q: I have added the FIT module to the project and built it. Then I got t he er r or: Could not open source fi le

“platform.h”.

A: The FIT module may not be added to the proj ec t properl y . Check if the method for adding FIT modules

is correct with the following documents:

 Using CS+:

Application not e “ A dding Firmware Integration Technology Modules to CS+ Project s

(R01AN1826)”  Using e

Application not e “ A dding Firmware Integration Technology Modules to Project s (R01AN1723) ”

When using a FIT module, the boar d support pac k age FIT m odule (BSP module) must also be added to the project. Refer to the application note “Board S upport Pac k age M odule Usi ng Firmware Integration Technology (R01A N1685) ” .

(2) Q: I have added the FIT module to the proj ect and built it. Then I got the error: This MCU is not supported

by the current r_mpc_rx module.

A: The FIT module you added may not support the t ar get device chosen in your project. Check the

supported devic es of added FI T modules.

studio:

(3) Q: I have added the FIT module to the proj ect and built it. Then I got an error for when the configuration

setting is wrong.

A: The setting in the file “r_mpc_rx_config.h” m ay be wrong. Check the file “r_mpc_rx_config.h”. If there is a wrong setting, set the correct value for that. Refer to 2.8 Configuration Overview for details.

R01AN1724EJ0380 Rev.3.80 Page 22 of 25 Apr.01.2021

RX Family MPC Mod ule Using Firmware Integration Technology

7. Reference Documents

User’s Manual: Hardware The latest version can be downloaded from the Renesas Electr onic s websit e.

Technical Updat e/T ec hnical News The latest inf ormati on c an be downloaded from the Renesas Electr onics website.

User’s Manual: Dev elopm ent T ools RX Family Compiler CC-RX User’s Manual (R20UT3248) The latest versions can be downloade d from the Renesas Electr onic s websit e.

Related Technical Updates

This module reflects the content of the following tec hnic al updates. None

R01AN1724EJ0380 Rev.3.80 Page 23 of 25 Apr.01.2021

RX Family MPC Mod ule Using Firmware Integration Technology

Rev.

Date

Description

Page

Summary

1.00

Nov15, 2013

—

Initial release.

1.20

Apr 17, 2014

1,3

Added support for the RX64M Gr oup.

1.30

Jul 02, 2014

—

Fixed RX63N receive bug. Used latest Colophon.

1.40

Dec 12,2014

Various

Updated to current app-note template

Added a Code Size section.

1.50

Jan 17,2015

—

Added support for the RX71M Group.

1.60

Jun 30,2015

—

Added support for the RX231 Group.

1.70

Sep 30,2015

—

Added support for the RX23T Group.

1.80

Oct 1,2015

—

Added support f or the RX130 Group.

1.90

Dec 1,2015

—

Added support f or the RX24T G r oup.

2.00

Feb 1,2016

— 12

Added support f or the RX230 Group. Added “Related Technical Updates”.

2.01

Jul 29, 2016

Added RSKRX64M to “4. Demo Projects”.

2.10

Oct 1,2016

— 5 Added support for the RX65N Group.

Updated 2.9 Code Size for the RX65N Group.

2.20

Feb 28, 2017

— 4 Added support for the RX24U Group. Added RXC v2.06.00 t o “2.5 Support ed Toolchains”.

2.30

Jul 21, 2017

—

Added support for the RX130-512KB and RX65N-2MB.

2.31

Oct 31, 2017

Added RSKRX65N, RSKRX65N-2MB to “4. Demo Projects”

Added 5. Appendices

2.40

Sep 28, 2018

Added support for the RX66T.

Added code size corresponding to RX66T

6.1 Confirmed Oper ation Environment: Added table for Rev. 2.40

2.41

Nov 16, 2018

—

Added document num ber i n XML

Changed Renesas Starter Ki t Pr oduc t No for RX66T. Added table for Rev. 2.41

2.50

Feb 01, 2019

Program

Added support for RX72T.

8-11

Removed ‘Reentrant’ description in each API function.

6.1 Confirmed Oper ation Environment:

Revision History

1, 6

4 6

Added RX113 to the list of support ed M CUs

Changed the document num ber for the “Board Support Package Firmware Integration Technology Module” application note. Changed the description in section 2. Added “4. Demo Projec ts”.

Changed 2.9 Code Size for the tabular format of Code Size.

Added RXC v2.07.00 t o “2.5 Support ed Toolchains”. Updated “2.12 Addi ng the FIT Module to Your Project”.

R01AN1724EJ0380 Rev.3.80 Page 24 of 25 Apr.01.2021

Added 4.4 Downloading Demo Project

Added Table for Rev 2.50

RX Family MPC Mod ule Using Firmware Integration Technology

3.00

May.20.19

— Supported the following compilers:

- IAR C/C++ Compiler for Renesas RX

Added the section of T ar get com pilers.

Deleted related documents.

Requires r_bsp v5.20 or higher

Updated the secti on of 2. 8 Code Si z e

Table 6.1 Confirmed Operation Environment: Added table for Rev. 3.00

Deleted the section of Website and Support.

Program

Changed below for support G CC and IAR c om piler : Deleted the inline expansion of the R_MPC_GetVer si on function.

3.10

Jun.28.19

Added support for RX23W.

Program

6.1 Confirmed Oper ation Environment:

3.20

Aug.15.19

Added support for RX72M.

Program

6.1 Confirmed Oper ation Environment:

3.30

Nov.25.19

Program

Added support for RX13T.

Change the comment of API f unction to the Doxygen style.

3.40

Dec.30.19

Program

Added support for RX72N, RX66N.

3.50

Mar.31.20

Program

Added support for RX23E-A

3.60

Jun.30.20

Program

Updated and added new demo project

3.70

Apr.01.21

6.1 Confirmed Oper ation Environment:

3.80

Apr.01.21

Program

6.1 Confirmed Oper ation Environment:

- GCC for Renesas RX

5 14

2.2 Software Requir em ents

Added Table for Rev. 3.10 Added support for RX23W.

Added Table for Rev. 3.20 Table 6.2: Corrected boar d name for RX23W Added support for RX72M.

2.3 Limitations Added Limitati ons Updated the section of 2. 9 Code Si z e

6.1 Confirmed Oper ation Environment: Added Table for Rev. 3.30 Added support for RX13T.

5 14

6 15

Program

Updated the section of 2. 9 Code Si z e

6.1 Confirmed Oper ation Environment: Added Table for Rev. 3.40

Added support for RX72N, RX66N.

Updated the section of 2. 9 Code Si z e

6.1 Confirmed Oper ation Environment: Added Table for Rev. 3.50

Added support for RX23E-A.

Added RSKRX72M to “5. Demo Projects”.

6.1 Confirmed Oper ation Environment: Added Table for Rev. 3.60 Updated and added new demo project

Added Table for Rev. 3.70 Added support for RX23W-83pin

Added Table for Rev. 3.80 Added support for RX72M-100pin, 144pin.

R01AN1724EJ0380 Rev.3.80 Page 25 of 25 Apr.01.2021

General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products

The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Precaution against Electrostatic Discharge (ESD)

A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.

2. Processing at power-on

The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level at which resetting is specified.

3. Input of signal during power-off state

Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Follow the guideline for input signal during power-off state as described in your product documentation.

4. Handling of unused pins

Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible.

5. Clock signals

After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6. Voltage application waveform at input pin

Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V (Max.) and V input level is fixed, and also in the transition period when the input level passes through the area between V

7. Prohibition of access to reserved addresses

Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these addresses as the correct operation of the LSI is not guaranteed.

8. Differences between products

Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems. The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.

(Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the

(Max.) and VIH (Min.).

www.renesas.com

of their respective owners.

Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products

and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information.

2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights,

or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.

3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics

or others.

4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any

and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.

5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for

each Renesas Electronics product depends on the product’s quality grade, as indicated below. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home

"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key

Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.

6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for

Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges.

7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific

characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.

8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas

Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is

prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or

transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.

11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas

Electronics products.

(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled

(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

subsidiaries.

electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.

financial terminal systems; safety control equipment; etc.

(Rev.4.0-1 November 2017)

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Contact information

For further information on a product, technology, the most up-to-date

version of a document, or your nearest sales office, please visit:

www.renesas.com/contact/

Renesas RX Family APPLICATION NOTE

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Overview

1.1 MPC FIT Module

1.2 Overview of the MPC FIT Module

1.3 API Overview

2. API Informa ti o n

2.1 Hardware Requirements

2.2 Software Requirements

2.3 Limitations

2.3.1 RAM Location Limitations

2.4 Supported Toolch ai n

2.5 Interrupt Vector

2.6 Header Files

2.7 Integer Types

2.8 Configuration Overview

2.9 Code Size

2.10 Parameters

2.10.1 MPC Pin Configuration

2.11 Return Values

2.12 Callback Function

2.13 Adding the F IT Module to Your Project

2.14 “for”, “while” and “do while” statements

3. API Functions

4. Pin Setting

5. Demo Projects

5.1 mpc_demo_rskrx113, mpc_demo_rskrx64m, mpc_demo_rskrx71m, mpc_demo_rskrx65n, mpc_demo_rskrx65n_2m, mpc_demo_rskrx113_gcc, mpc_demo_rskrx64m_gcc, mpc_demo_rskrx71m_gcc, mpc_demo_rskrx65n_gcc, mpc_demo_rskrx65n_2m_gcc

5.2 mpc_demo_rskrx231, mpc_demo_rskrx231_gcc

5.4 Adding a Demo to a Workspace

5.5 Downloading Demo Projects

6. Appendices

6.1 Confirmed Operation Environment

6.2 Troubleshooting

7. Reference Documents

Revision History

General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products