Renesas RX Series, RX200 Series, RX23W Series User Manual

All information contained in these materials, including products and product specifications, represents
Rev.1.02 Nov 2019
RENESAS 32-Bit MCU
R
RX23W Group
anual
User's Manual
32
www.renesas.com
Target Board for RX23W User’s M
X Family/RX200 Series
information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, including the Renesas Electronics Corp. website (http://www.renesas.com).

Trademarks

Notice
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.
5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.
6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges.
7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.
8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled
(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
subsidiaries.
electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
financial terminal systems; safety control equipment; etc.
(Rev.4.0-1 November 2017)

Corporate Headquarters

TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners.

Contact information

For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit:
www.renesas.com/contact/
© 2019 Renesas Electronics Corporation. All rights reserved.
.
General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1. Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be
touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
2. Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of
register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset
pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in
a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level
at which resetting is specified.
3. Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements.
Follow the guideline for input signal during power-off state as described in your product documentation.
4. Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.
5. Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced
with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
6. Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V
and V
(Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level
IH
is fixed, and also in the transition period when the input level passes through the area between V
7. Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these
addresses as the correct operation of the LSI is not guaranteed.
8. Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of
internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system-
evaluation test for the given product.
(Max.) and VIH (Min.).
IL
(Max.)
IL
Particular attention should be paid to the precautionary notes when using the manual. These notes occur within
Document Type
Description
Document Title
Document No.
User’s manual
Target Board for RX23W hardware specifications
Target Board for
R20UT4634EJ Parts list
Target Board for RX23W parts list
Target Board for
R12TU0071EJ
Application note
Description of sample code for use with the
R01AN4860
User’s manual
Hardware specifications (pin assignments,
RX23W Group
How to Use This Manual

1. Purpose and Target Readers

This manual is intended to give users an understanding of the basic specifications and correct usage of this product. This manual is intended for users who want to use this product to evaluate the MCU and debug programs. The readers of this manual are expected to have knowledge of the MCU functions and debuggers.
the body of the text, at the end of each section, and in the Usage Notes section.
The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to the text of the manual for details.
The following documents apply to the Target Board for RX23W. Be sure to refer to the latest versions of these documents. The newest versions of the listed documents are available on the Renesas Electronics Web site.
RX23W User’s Manual
Circuit schematics Target Board for RX23W circuit schematics
Quick start guide Procedure for checking the initial operation
Target Board for RX23W
for the hardware*
Note: Download the documents for the RX23W from the product page for the RX23W.
memory maps, peripheral function specifications, electrical characteristics, timing charts) and descriptions of operation
Target Board for RX23W Circuit Schematics
RX23W BOM LIST
Target Board for RX23W Quick Start Guide
RX23W Group BLE Module Firmware Integration Technology Application Note
User’s Manual: Hardware
(this manual)
R20UT4635EJ
R20QS0014
R01UH0823EJ
Connectors compatible with the Arduino™ UNO R3 board are mounted on the fast
Bluetooth Low Energy
CPU
Central Processing Unit
DIP
Dual In-line Package
DNF
Do Not Fit
IDE
Integrated Development Environment
IRQ
Interrupt Request
HOCO
High-Speed On-Chip Oscillator
LED
Light Emitting Diode
MCU
Micro-controller Unit
n/a (NA)
Not applicable
n/c (NC)
Not connected
PC
Personal Computer
RAM
Random Access Memory
RFP
Renesas Flash Programmer
ROM
Read Only Memory
SPI
Serial Peripheral Interface

2. List of Abbreviations and Acronyms

Abbreviation Full Form
Arduino™ UNO
BLE
LOCO Low-Speed On-Chip Oscillator
Pmod™
prototyping board.
The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by Renesas Electronics Corporation is under license.
Pmod™ is a trademark of Digilent Inc. The Pmod™ interface specification is the property of Digilent Inc. For the Pmod™ interface specification, refer to the Pmod™ License Agreement page at the Web site of Digilent Inc.
USB Universal Serial Bus
All trademarks and registered trademarks are the property of their respective owners.
Table of Contents
1. Overview ............................................................................................................................ 7
1.1 Package Components ................................................................................................................................ 7
1.2 Purpose ...................................................................................................................................................... 7
1.3 Features ..................................................................................................................................................... 7
1.4 Preparation ................................................................................................................................................ 7
1.5 Target Board for RX23W: Table of Specifications ..................................................................................... 8
1.6 Block Diagram ............................................................................................................................................ 9
2. Board Layout ................................................................................................................... 10
3. Parts Layout .................................................................................................................... 11
4. Operating Environment .................................................................................................... 12
5. User Circuits .................................................................................................................... 13
5.1 Evaluation MCU ....................................................................................................................................... 13
5.2 Bluetooth Low Energy ............................................................................................................................ 13
5.3 Emulator ................................................................................................................................................... 14
5.4 USB-to-Serial Conversion ........................................................................................................................ 15
5.5 ACT LED .................................................................................................................................................. 15
5.6 Power LED ............................................................................................................................................... 15
5.7 User LEDs ................................................................................................................................................ 15
5.8 External Power-Supply Header ............................................................................................................... 16
5.9 Pmod Connector ................................................................................................................................... 17
5.10 ArduinoUNO Headers .......................................................................................................................... 18
5.11 Current Measurement Header ................................................................................................................. 20
5.12 MCU Headers .......................................................................................................................................... 20
5.13 Reset Switch ............................................................................................................................................ 20
5.14 User Switch .............................................................................................................................................. 20
5.15 Patterns for Cutting .................................................................................................................................. 20
6. Configurations ................................................................................................................. 22
6.1 Modifying the Target Board for RX23W ................................................................................................... 22
6.2 Analog Power Supply ............................................................................................................................... 22
6.3 On-Chip Oscillator .................................................................................................................................... 23
7. Handling Precautions ....................................................................................................... 24
7.1 Adding Load ............................................................................................................................................. 24
7.2 Remodeling the Board ............................................................................................................................. 24
7.3 Limitation on the Number of Connected Target Boards for RX23W ....................................................... 24
8. Developing Code ............................................................................................................. 25
8.1 Using the e2 studio ................................................................................................................................... 25
8.2 Using CS+ ................................................................................................................................................ 26
9. Additional Information ...................................................................................................... 27
10. Certification of Compliance ............................................................................................ 28
10.1 Radio-Related Laws ................................................................................................................................. 28
Target Board for RX23W 1. Overview

1. Overview

1.1 Package Components

Thank you for purchasing the Target Board for RX23W evaluation tool from Renesas (hereinafter referred to as “this product”). This product consists of the Target Board for RX23W (RTK5RX23W0C00000BJ).

1.2 Purpose

This product is an evaluation tool for a Renesas MCU. This manual descries hardware specifications, how to set switches, and basic setup procedures.

1.3 Features

Programming of the Renesas MCU
Debugging of user code
Evaluation of Bluetooth
User circuits for switches and LEDs
Sample applications*
Samples of peripheral-function initialization code*
Note: These are available for downloading from the Renesas Web site.
Low Energy (BLE) communications
1
1
https://www.renesas.com/rxtb

1.4 Preparation

Install the integrated development environment (IDE) and required software from the following URL on the host PC.
https://www.renesas.com/development-tools
R20UT4634EJ0102 Rev.1.02 Page 7 of 33 Nov.27.19
Target Board for RX23W 1. Overview
Package: 56-pin QFN
Size: 54.0 mm x 90.0 mm
Power-supply voltage
VDD: 1.8 V to 5.5 V (EVDD is the same voltage as VDD.)
Power-supply IC: 5-V input, 3.3-V output
Current drawn
Max. 200 mA
Crystal oscillator (surface-mount technology (SMT)) for the main system clock
Sub-clock*1
Crystal oscillator (SMT) for the sub-clock
Range of frequency: 2402 to 2480 MHz
Output variation: +2 dB
User switch x 1
User: green x 2
Connector for an on-board emulator: USB Micro-B
Pmod™ connector
Connector: Angle type, 12 pins
MCU headers*1
Headers: 28 pins x 2
Emulator reset switch
DIP switch x 1

1.5 Target Board for RX23W: Table of Specifications

Table 1-1 shows the specifications of this product.
Table 1-1 Target Board for RX23W Specification Table
Item Specification
Part No.: R5F523W8ADNG
Evaluation MCU
On-chip memory: 512-KB ROM, 64-KB RAM, 8-KB E2 data flash memory
Board size
Power-supply circuit*2
Current measurement header*1 Header: 2 pins x 1
Main clock*1
Bluetooth Low Energy
Push switches
LEDs
Thickness: 1.6 mm
USB connector: 5-V input
External power-supply header*1: 3.3-V input, 2 pins x 1
Crystal oscillator or ceramic resonator (lead type) for the main system clock
Bluetooth
Maximum transmission output power: 4 dBm (in 4-dBm output mode)
Reset switch x 1
Power indicator: green x 1
ACT LED: green x 1
Low Energy circuit x 1
USB
Arduino™ UNO connectors A set of 2.54-mm pitch connectors for Arduino™ UNO
Patterns for cutting 21
Note: This part is not mounted.
R20UT4634EJ0102 Rev.1.02 Page 8 of 33 Nov.27.19
Connector for a USB serial-conversion interface: USB Micro-B
Target Board for RX23W 1. Overview
Evaluation MCU
USB
connector
External power
-
supply header
MCU
header x
2
Reset switch
User switch
User LED x
2
Main clock
Sub-
clock
Pmod™
connector
Arduino™
UNO
connector
Note: Gray shading of blocks indicates parts that are not mounted on the board.
USB
serial port
Power
indicator
LED
USB
connector
BLE
a
ntenna
Emulator
circuit

1.6 Block Diagram

Figure 1-1 shows the block diagram of this product.
Figure 1-1 Block Diagram
R20UT4634EJ0102 Rev.1.02 Page 9 of 33 Nov.27.19
Target Board for RX23W 2. Board Layout
MCU headers
Reset switch
User switch
Pmod
TM
connector
Evaluation MCU
ACT LED
Emulator
reset switch
USB connector
(
USB
s
erial
)
External power-
supply header
Power indicator
LED
Current
measurement
header
USB connector
(
e
mulator)
Arduino™ UNO headers
Arduino™ UNO headers
MCU headers
RF block
User LED

2. Board Layout

Figure 2-1 shows the external appearance of the top side of this product.
Figure 2-1 Board Layout (Top Side)
R20UT4634EJ0102 Rev.1.02 Page 10 of 33 Nov.27.19
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